CN205694034U - Electronic equipment spontaneous-heating type electric radiator - Google Patents
Electronic equipment spontaneous-heating type electric radiator Download PDFInfo
- Publication number
- CN205694034U CN205694034U CN201620589072.9U CN201620589072U CN205694034U CN 205694034 U CN205694034 U CN 205694034U CN 201620589072 U CN201620589072 U CN 201620589072U CN 205694034 U CN205694034 U CN 205694034U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- substrate
- electronic equipment
- cooling piece
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
This utility model relates to a kind of electronic equipment spontaneous-heating type electric radiator, including heat pipe, heat pipe evaporation ends substrate, condensation end of heat pipe substrate and fan, heat pipe is installed between heat pipe evaporation ends substrate and condensation end of heat pipe substrate, heat pipe evaporation ends substrate and condensation end of heat pipe substrate are mounted on radiating fin, radiating fin on heat pipe evaporation ends substrate is interlaced arrangement with the radiating fin on condensation end of heat pipe substrate, heat pipe evaporation ends substrate connects thermo-electric generation sheet, thermo-electric generation sheet is connected with electronic equipment by hot extension block, it is inlaid with cooling piece on condensation end of heat pipe substrate, cooling piece is electrically connected with controller, controller electrically connects with thermo-electric generation sheet and fan respectively.This utility model can effectively be accelerated heat dissipation capacity and reduce cooling piece cold junction temperature, and cooling piece can be prevented effectively from heat bridge phenomenon simultaneously, improves radiating effect, easy for installation and radiating effect is notable.
Description
Technical field
This utility model belongs to technical field of electronic equipment, relates to a kind of electronic device heat abstractor, specifically, relates to
And a kind of can spontaneous driving the electric radiator accurately lowered the temperature.
Background technology
Along with encapsulation electronic technology fast development, various electronic device products (such as: CPU, LED, sensor etc.) in
Revealing miniaturization, integrated development trend, the heat flow density causing electronic device is increasing.The normal work of electronic device
The reliability made is the most sensitive to temperature, and research shows, it is all owing to variations in temperature causes that the electronic device more than 55% damages
, meanwhile, electronic device material often raises 10 DEG C, and the reliability of electronic device just reduces by 2%.As can be seen here, electronic device pair
The requirement of operating temperature is the strictest.Owing to people are increasing to the demand of electronic device commodity, the development of high hot-fluid device
Adding the probability that electronic device is lost because temperature is too high, further resulting in electronic device product can not effectively work.At present,
Electronic device is widely used in the every field such as automobile, space flight, military affairs, therefore, it is necessary to consider the thermal design aspect of electronic device
Require to ensure the normal work of electronic device.
Electronic-device radiator both domestic and external mostly is air-cooled radiator and water-filled radiator, also has some by cooling piece and water
The heat abstractor of combination cold, air-cooled, has good radiating effect.But, above-mentioned electronic-device radiator is active
Radiating mode, needs outside energy to drive, and outwardly discharges substantial amounts of heat, has both caused the secondary of heat to waste, and again may
Produce thermal pollution.Additionally, due to heat-sinking capability is limited, heat radiation cannot be met for the electronic device that some heat flow densities are excessive and want
Ask.
Spontaneous-heating type heat dissipation technology is to utilize the heat energy of electronic device itself to be converted into electric energy, and electrical energy drive spreads thermal work
Make, have that reaction is fast, energy-conserving and environment-protective and a strong advantage of temperature control effect ability.Spontaneous-heating type electric radiator technology is by thermo-electric generation
Sheet is connected with electronic device pyrotoxin, forms the temperature difference at the two ends of thermo-electric generation sheet, and generating sheet is sent out after hot junction absorbs heat
Electricity stores or resupplies heat abstractor.When utilizing this technology to dissipation from electronic devices, owing to energy source is in electronic device
Itself, on the one hand take away the heat energy of high-temperature electronic device and realize cooling, and on the other hand from the perspective of energy, heat energy is changed
For electric energy, reduce the thermal pollution discharged into the atmosphere because of heat, energy-saving and emission-reduction cause is served positive impetus.
Existing spontaneous-heating type radiator, converts heat energy into electricity owing to thermo-electric generation sheet directly contacts with electronic device
Can, heat bridge phenomenon can be formed and reduce generating efficiency, and only with heat pipe or fin during heat radiation, outside radiation processes needs to consume
Energy, radiating effect is the most notable.
Authorization Notice No. is that the Chinese utility model patent of CN 203014716 U discloses a kind of high heat flux device
Exhaust system, including high heat flux heater members 1, soaking plate 2, temperature-difference power generation module 3, heat-pipe radiator 4 and electric power storage
Pond 5, wherein high heat flux heater members 1 is arranged on below soaking plate 2 and is in close contact with soaking plate 2；The described temperature difference is sent out
Electricity module 3 is arranged on the top of soaking plate 2；The evaporation ends of described heat-pipe radiator 4 is closely coupled with temperature-difference power generation module 3, heat
Tube radiator 4 condensation end is arranged in the environment, and uses fin mode enhanced heat exchange.This Patent design has thermo-electric generation mould
Block, is connected with high heat flux heater members by soaking plate, converts heat into electric energy and stores, and the electric energy after storage can
Recycling, the used heat flowing through semi-conductor thermo-electric generation module 3 arrives air by row after the evaporation ends of heat-pipe radiator 4, condensation end
The middle function realizing waste heat discharge.The heat-pipe radiator used in this patent is combined by a series of single parallel heat pipes
Becoming, heat pipe structure form is capillary heat pipe, gravity assisted heat pipe, pulsating heat pipe, at the condensation end of heat pipe equipped with enhanced heat exchange fin, though
So it is capable of the function of heat radiation, but its radiating effect is the most notable.
Need not external energy accordingly, it is considered to design a kind of not only having can guarantee that, but also the spontaneous-heating type of heat-sinking capability can be increased dissipate
Hot device, it is achieved the heat radiation to high hot-fluid electronic equipment.
Utility model content
The purpose of this utility model is that the radiating effect existed for existing radiating device for electronic equipment is poor, causes secondary
The problems referred to above such as waste, it is provided that a kind of electronic equipment spontaneous-heating type electric radiator.The heat utilizing electronic equipment generates electricity, and gives
Cooling piece and fan are powered, and both can guarantee that and need not external energy, can increase again and spread heat energy power, good heat dissipation effect, decrease two
Secondary waste.
According to this utility model one embodiment, it is provided that a kind of electronic equipment spontaneous-heating type electric radiator, including heat pipe,
Heat pipe evaporation ends substrate, condensation end of heat pipe substrate and fan, heat pipe is installed on heat pipe evaporation ends substrate and condensation end of heat pipe substrate
Between, heat pipe evaporation ends substrate connects thermo-electric generation sheet, and thermo-electric generation sheet is connected with electronic equipment by hot extension block, heat pipe
Connecting on condensation end substrate has cooling piece, one end that cooling piece is connected with condensation end of heat pipe substrate to be referred to as the cold end of cooling piece, refrigeration
The other end of sheet is referred to as cooling piece hot junction, and heat pipe evaporation ends substrate and cooling piece hot junction are mounted on radiating fin, and heat pipe evaporates
Radiating fin on end group plate is interlaced arrangement with the radiating fin on cooling piece hot junction；Cooling piece is electrically connected with controller, control
Device processed electrically connects with thermo-electric generation sheet and fan respectively.When electronic equipment temperature is too high, heat is passed to temperature by hot extension block
One end of difference generating sheet, makes the two ends of thermo-electric generation sheet form the temperature difference, produces electric energy, and electric energy is transferred to controller, by controller
Powering to cooling piece and fan, cooling piece accelerates heat transmission in heat pipe, and fan produces air-flow and takes away in radiating fin
Heat, it is ensured that heat can be pulled away rapidly.Radiating fin is interlaced arrangement, effectively expands heat exchange area, strengthens heat exchange
Effect.
Further, in the electric radiator provided according to this utility model above-described embodiment, described heat pipe is provided with 1
Or multiple, when heat pipe is provided with multiple, multiple heat pipes are arranged side by side, and the radiating fin that adjacent heat pipe is corresponding is interlaced arrangement, just
In heat radiation.
Further, for the ease of heat pipe and the connection of controller, provide according to this utility model above-described embodiment
In electric radiator, described electric radiator is additionally provided with for connecting heat pipe and the connecting plate for static controller.
As preferably, in the electric radiator provided according to this utility model above-described embodiment, heat pipe is set to U-tube,
The bent tube section of heat pipe is embedded on connecting plate.
As preferably, in the electric radiator provided according to this utility model above-described embodiment, controller is fixed on connection
The bottom of plate.
Further, in the electric radiator provided according to this utility model above-described embodiment, controller connects thermoelectricity
Amphitene, thermocouple wire is installed between hot extension block and electronic equipment.When electronic equipment temperature is too high exceed limiting temperature time, heat
Temperature information can be transferred to controller by galvanic couple line, and controller is started working according to temperature information, thus carried out temperature control.
As preferably, in the electric radiator provided according to this utility model above-described embodiment, fan is fixed on heat extension
On block and condensation end of heat pipe substrate.
As preferably, in the electric radiator provided according to this utility model above-described embodiment, described radiator is additionally provided with
Thermal insulation board, heat pipe evaporation ends substrate and condensation end of heat pipe substrate are installed on thermal insulation board, it is to avoid heat radiation.
The electronic equipment spontaneous-heating type electric radiator that this utility model above-described embodiment provides, simple and compact for structure, cloth
Rationally, volume is little in office.Compared with existing electric radiator, the electronic equipment spontaneous-heating type electric radiator that this utility model provides,
Utilize the heat of electronic equipment itself, passed to one end of thermo-electric generation sheet by hot extension block, make the two ends of thermo-electric generation sheet
Form the temperature difference, produce electric energy, and powered to cooling piece and fan by controller, heat pipe and radiating fin in radiation processes not
Need external energy, it is possible to spontaneous-heating type dispels the heat, energy-conserving and environment-protective；Interlaced arrangement fin, area of dissipation in limited space
Expand more than 2 times, and the structural behaviour of cooling piece is optimized, can effectively accelerate heat dissipation capacity and reduce cooling piece cold end temperature
Degree, cooling piece can be prevented effectively from heat bridge phenomenon simultaneously, improves radiating effect, easy for installation and radiating effect is notable.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model specific embodiment one electronic equipment spontaneous-heating type electric radiator.
Fig. 2 is the A-A sectional view of this utility model Fig. 1.
Fig. 3 is the top view of this utility model specific embodiment one electronic equipment spontaneous-heating type electric radiator.
Fig. 4 is the structural representation of this utility model specific embodiment two electronic equipment spontaneous-heating type electric radiator.
Fig. 5 is that this utility model specific embodiment electronic equipment spontaneous-heating type electric radiator is in different cooling piece hot junctions
Heat transfer property parameter UhAhUnder the conditions of cooling piece cold end refrigerating capacity QCWith electric current I changing trend diagram.
Fig. 6 is that this utility model specific embodiment electronic equipment spontaneous-heating type electric radiator is in different cooling piece hot junctions
Heat transfer property parameter UhAhUnder the conditions of condensation end of heat pipe surface temperature ThcWith electric current I changing trend diagram.
Fig. 7 is that this utility model specific embodiment electronic equipment spontaneous-heating type electric radiator is at different condensation end of heat pipe bases
Cooling piece cold end refrigerating capacity Q under the conditions of plate thickness LCWith condensation end of heat pipe substrate area thickness than f changing trend diagram.
Fig. 8 is that this utility model specific embodiment electronic equipment spontaneous-heating type electric radiator is at different condensation end of heat pipe bases
Condensation end of heat pipe surface temperature T under the conditions of plate thickness LhcWith condensation end of heat pipe substrate area thickness than f changing trend diagram.
Fig. 9 is that this utility model specific embodiment electronic equipment spontaneous-heating type electric radiator is at different condensation end of heat pipe bases
Plate Area length is than condensation end of heat pipe surface temperature T under the conditions of fhcHeat transfer property parameter U with cooling piece hot junctionhAhVariation tendency
Figure.
Figure 10 is that this utility model specific embodiment electronic equipment spontaneous-heating type electric radiator is at different condensation end of heat pipes
Substrate area length end colder than cooling piece under the conditions of f refrigerating capacity QCHeat transfer property parameter U with cooling piece hot junctionhAhVariation tendency
Figure.
1, heat pipe, 2, heat pipe evaporation ends substrate, 3, condensation end of heat pipe substrate, 4, fan, 5, radiating fin, 6, thermo-electric generation
Sheet, 7, hot extension block, 8, cooling piece, 9, controller, 10, connecting plate, 11, screw hole, 12, thermal insulation board, 13, thermocouple wire.
Detailed description of the invention
Detailed description of the invention of the present utility model is described below in conjunction with the accompanying drawings:
Embodiment one: seeing Fig. 1, a kind of electronic equipment spontaneous-heating type electric radiator, including heat pipe 1, heat pipe evaporation ends
Substrate 2, condensation end of heat pipe substrate 3 and fan 4, heat pipe 1 is installed between heat pipe evaporation ends substrate 2 and condensation end of heat pipe substrate 3,
Heat pipe evaporation ends substrate 2 and condensation end of heat pipe substrate 3 are mounted on radiating fin 5, the radiating fin on heat pipe evaporation ends substrate 2
Being interlaced arrangement with the radiating fin on condensation end of heat pipe substrate 3, heat pipe evaporation ends substrate 2 connects thermo-electric generation sheet 6, the temperature difference
Generating sheet 6 is connected with electronic equipment by hot extension block 7, and condensation end of heat pipe substrate 3 is inlaid with cooling piece 8, and cooling piece 8 is electrically connected
Being connected to controller 9, controller 9 electrically connects with thermo-electric generation sheet 6 and fan 4 respectively.When electronic equipment temperature is too high, heat by
Hot extension block passes to one end of thermo-electric generation sheet, makes the two ends of thermo-electric generation sheet form the temperature difference, produces electric energy, and electric energy is transferred to
Controller, is powered to cooling piece and fan by controller, and cooling piece accelerates heat transmission in heat pipe, and fan produces air-flow band
Walk the heat in radiating fin, it is ensured that heat can be pulled away rapidly.Radiating fin is interlaced arrangement, effectively expands heat exchange
Area, strengthens heat transfer effect.
In the electric radiator provided according to this utility model above-described embodiment, seeing Fig. 2, described heat pipe 1 is provided with three
Individual, three heat pipes are arranged side by side, and the radiating fin that adjacent heat pipe is corresponding is interlaced arrangement, it is simple to heat radiation.
Further, for the ease of heat pipe and the connection of controller, see Fig. 1, according to the above-mentioned enforcement of this utility model
In the electric radiator that example provides, described electric radiator is additionally provided with for connecting heat pipe 1 and the connection for static controller 9
Plate 10.
In the electric radiator that the present embodiment provides, seeing Fig. 1, heat pipe 1 is set to U-tube, the bent tube section edge of heat pipe 1
It is embedded on connecting plate 10.
In the electric radiator that the present embodiment provides, seeing Fig. 1 and Fig. 2, controller 9 is fixed on the bottom of connecting plate 10.
In the electric radiator that the present embodiment provides, see Fig. 1 and Fig. 2, on hot extension block 7 and condensation end of heat pipe substrate 3
Being provided with screw hole 11, fan 4 is fixed on hot extension block 7 and condensation end of heat pipe substrate 3 by screw hole 11.
In the electric radiator that the present embodiment provides, seeing electric radiator described in Fig. 1 and be additionally provided with thermal insulation board 12, heat pipe evaporates
End group plate 2 and condensation end of heat pipe substrate 3 are installed on thermal insulation board 12, it is to avoid heat radiation.
The electronic equipment spontaneous-heating type electric radiator that the present embodiment provides, its operation principle is as follows:
After electronic equipment heating, heat is delivered to one end of thermo-electric generation sheet by hot extension block, makes thermo-electric generation sheet two
End forms the temperature difference, it is possible to producing electric energy and export to controller, controller one end is connected by electrical wiring to cooling piece, powers it
To accelerate heat transmission in heat pipe, the cold end of cooling piece absorbs the energy from condensation end of heat pipe substrate, and is conveyed
To radiating fin；The other end of controller is connected with fan, makes fan produce air-flow and takes away the heat in staggered radiating fin,
Ensure that heat can be pulled away rapidly.
Embodiment two: unlike specific embodiment one, in a kind of electronic equipment spontaneous heating that the present embodiment provides
In formula electric radiator, see Fig. 4, controller 9 connect have thermocouple wire, thermocouple wire be installed on hot extension block and electronic equipment it
Between.When electronic equipment temperature is too high exceed limiting temperature time, temperature information can be transferred to controller, controller root by thermocouple wire
Start working according to temperature information, thus carry out temperature control.
Its operation principle is with embodiment one, but in the present embodiment, thermo-electric generation sheet can not only be produced by controller
Electric energy is stable respectively powers to cooling piece and fan, it is ensured that cooling piece and the normal work of fan, controller can be with intelligence simultaneously
The surface temperature of electronic equipment can be controlled, by being arranged on the thermocouple wire between electronic equipment and hot extension block by electronic equipment
Surface temperature feed back to controller, temperature reaches ceiling temperature, and controller is started working, reduce electronic equipment surface temperature
Degree.
This utility model above-mentioned electronic equipment spontaneous-heating type electric radiator, it is also possible to be optimized design, its optimization sets
The step of meter is: under conditions of electronic equipment surface fixed temperature or fixing heat dissipation capacity, optimizes by optimizing formula (1)-(8)
Heat transfer property parameter UA in cooling piece hot junction, condensation end of heat pipe substrate area thickness are than f, fan inlet flow V, described heat pipe cold
Solidifying end group plate area x thickness is defined as A than fe/Le, wherein, AeRepresent the surface area of condensation end of heat pipe substrate, LeRepresent heat pipe cold
Solidifying end group plate thickness, the expression formula of described optimization formula (1)-(8) is as follows:
Ths=Qc (Rhp+Rex+2Rint)+Thc (4)
Ch=c ρ V (8)
In formula, QCRepresenting the refrigerating capacity of the cold end of cooling piece, COP represents the radiating efficiency in cooling piece hot junction, ThcRepresent heat pipe
Condensation end substrate surface temperature, K, S, R represent the thermal conductivity of cooling piece, Seebeck coefficient, resistance respectively, and I represents cooling piece
Control electric current, UhAhRepresent the heat transfer property parameter in cooling piece hot junction, ChRepresent air specific heat capacity parameter, Mhc、ChcRepresent respectively
The quality of condensation end of heat pipe substrate and thermal content parameter, ε,Represent the efficiency parameters of efficiency elements method, σTE、σexRepresent respectively
Cooling piece loss coefficient, cooling piece warm end losses coefficient, RcRepresent the thermal resistance between the cold end of cooling piece and condensation end of heat pipe substrate,
TinRepresent wind inlet of fan temperature, ThsRepresent the temperature on electronic equipment surface, RhpRepresent heat pipe thermal resistance, RexRepresent hot extension block
Thermal resistance, RintRepresent thermal contact resistance, KeRepresenting the heat conductivity of condensation end of heat pipe substrate, c, ρ, V represent the ratio of air respectively
Heat, density, flow.
Above-mentioned eight optimize in formula, and formula (1)-(4) represent refrigerating capacity Q of the cold end of cooling pieceCWith electronic equipment surface
The optimization formula of temperature, the derived expression of parameter in formula (5)-(8) representation formula (1)-(4).
In fixing surface temperature ThsUnder restriction, formula (1), (2) and formula (4)-(7) can be passed through and solve optimum refrigeration
Refrigerating capacity Q of the cold end of sheetC, air air quantity V, heat transfer property parameter U in cooling piece hot junctionhAh。
Refrigerating capacity Q at the cold end of fixing cooling pieceCUnder restriction, formula (2)-(7) can be passed through and solve optimum electronic equipment
Surface temperature Ths, air air quantity V, heat transfer property parameter U in cooling piece hot junctionhAh.Wherein, formula (4) indicates electronic equipment
Surface temperature ThsWith condensation end of heat pipe substrate surface temperature ThcBecome positive line sexual relationship, therefore ThsAnd ThcThere is corresponding relation.
Its Optimizing Flow is as follows:
Refrigerating capacity Q of the cold end of cooling piece is setC, electronic equipment surface temperature ThsInitial value be respectively Q0、T0, can be any
Selected, QstAnd TstFor the maximum cooling capacity allowed under the operating mode of needs and minimum electronic equipment surface temperature.
Assume refrigerating capacity Q of the given cold end of cooling pieceCLimit, given parameters K, S, R, Tin, by optimize formula (2),
(3), (4) are drawn, and are determined parameter I, f, UhAhEnd refrigerating capacity Q cold to cooling pieceCImpact, given any refrigerating capacity Q0, by scheming
5, Fig. 7, Fig. 9 draw in cooling piece cold end refrigerating capacity QCUnder the conditions of optimized parameter I, f, the U that can meethAh, by formula (2), (3),
(4) COP, T are calculatedhcAnd Ths, simultaneously by parameter K, S, R, Tin、ThcSubstitute into formula (1) and solve QC, the Q obtained will be solvedCAnd Ths
With the maximum cooling capacity allowed under the operating mode needed and minimum electronic device surface temperature QstAnd TstContrast, if meeting QC
≥Qst、Ths≤Tst, the most exportable obtain parameter I, f, UhAh, choose arrangement finally by the parameters optimization obtained, enter
The condition that arranges of mouth air and the service condition of cooling piece, assemble electric radiator.
Assume surface temperature T of given electronic equipmenthsLimit, given parameters K, S, R, Tin, by optimize formula (2),
(3), (4) are drawn, and are determined parameter I, f, UhAhOpposite heat tube condensation end substrate surface temperature ThcImpact, given arbitrary surfaces temperature
Degree T0, Fig. 6, Fig. 8, Figure 10 draw in cooling piece cold end refrigerating capacity QCUnder the conditions of optimized parameter I, f, the U that can meethAh, by public affairs
Formula (1), (2), (4) calculate QC, COP and Ths, simultaneously by parameter K, S, R, Tin、QCSubstitute into formula (3) and solve Thc, will solve and obtain
QCAnd ThsWith the maximum cooling capacity allowed under the operating mode needed and minimum electronic device surface temperature QstAnd TstContrast,
If meeting QC≥Qst、Ths≤Tst, the most exportable obtain parameter I obtained, f, UhAh, finally by the parameters optimization obtained
Choose arrangement, the condition that arranges of inlet air and the service condition of cooling piece, assemble electric radiator.
See Fig. 5, in heat transfer property parameter U in different cooling piece hot junctionshAhUnder the conditions of, cooling piece cold end refrigerating capacity QCWith
Electric current I increases the variation tendency in first increases and then decreases.
See Fig. 6, in heat transfer property parameter U in different cooling piece hot junctionshAhUnder the conditions of, condensation end of heat pipe surface temperature Thc
Increasing in first reducing the variation tendency increased afterwards with electric current I.
See Fig. 7, under the conditions of different condensation end of heat pipe substrate thickness L, cooling piece cold end refrigerating capacity QCCondense with heat pipe
The end group plate area x thickness increase than the f variation tendency in first increases and then decreases.
See Fig. 8, under the conditions of different condensation end of heat pipe substrate thickness L, condensation end of heat pipe surface temperature ThcWith heat pipe cold
Solidifying end group plate area x thickness increasing in first reducing the variation tendency increased afterwards than f.
See Fig. 9, under the conditions of different condensation end of heat pipe substrate area thickness are than f, condensation end of heat pipe surface temperature ThcWith
Heat transfer property parameter U in cooling piece hot junctionhAhIncrease in first strongly reducing the variation tendency tended to be steady to certain value.
See Figure 10, under the conditions of different condensation end of heat pipe substrate area thickness are than f, cooling piece cold end refrigerating capacity QCWith system
Heat transfer property parameter U in cold hot junctionhAhIncrease in the variation tendency that to certain value tend to be steady first is increased dramatically.
From Fig. 5, Fig. 7, Fig. 9, in given minimum electronic equipment surface temperature ThcTime, there is optimum electric current in it
Make refrigerating capacity Q of the cold end of cooling pieceCReach maximum.Meanwhile, along with the area x thickness of condensation end of heat pipe substrate increases than f, system
Refrigerating capacity Q of cold cold endCFirst increases and then decreases, and be about 0.44 to have at the area x thickness of condensation end of heat pipe substrate than f
Refrigerating capacity Q of the cold end of bigger cooling pieceC, the area x thickness of condensation end of heat pipe substrate directly affects heat conduction than f, when area is excessive
Time, owing to the surface area of cooling piece limits, heat can not effectively derive, and time too small, the hot junction of cooling piece can not and heat pipe cold
Solidifying end group plate preferably contacts, and therefore affects heat conduction.And heat transfer property parameter U to cooling piece hot junctionhAh, only 50W/K with
In, optimal value occurs, has continued to increase heat transfer property parameter U in cooling piece hot junctionhAh, the refrigerating capacity of end cold to cooling piece
QCNot having any impact, this is due to this body structure of device and the restriction of cooling piece power consumption, causes radiating mode not act as
With, therefore so that refrigerating capacity Q of the cold end of cooling pieceCReach heat transfer property parameter U in the cooling piece hot junction of maximumhAhI.e. set
Put required thermal resistance structure, expand heat transfer property parameter U in cooling piece hot junction according to staggered-meshhAh。
From Fig. 6, Fig. 8, Figure 10, in given refrigeration power consumption one timing, it yet suffers from optimal current and makes electronics
Equipment surface temperature ThcMinimum.Meanwhile, along with the area x thickness of condensation end of heat pipe substrate increases than f, its electronic equipment surface temperature
Degree ThcFirst reduce and increase afterwards, and be about 0.4 to have relatively low condensation end of heat pipe at the area x thickness of condensation end of heat pipe substrate than f
Surface temperature Thc.For there being the electronic equipment of fixing power consumption requirements, it selects condensation end of heat pipe substrate size to tackle its face, surface
Amass and account for thickness and heat conductivity.
The control electric current I of parameter cooling piece that is given according to Fig. 5 to Figure 10, the area x thickness of condensation end of heat pipe substrate than f,
Heat transfer property parameter U in cooling piece hot junctionhAhOn cooling piece refrigerating capacity and the impact of condensation end of heat pipe surface temperature.The present embodiment
Above-mentioned optimization method, makes including that cooling piece running current and radiating fin, air quantity are optimized according to above-mentioned optimization formula
The above-mentioned radiator of this utility model can reach optimum working condition.
As the extension of above-described embodiment, to this optimization method about thermal contact resistance Rint, heat pipe thermal resistance RhpDeng excellent based on this
Change the optimization method within formula all within the method.
As the extension of above-described embodiment, heat pipe can be provided with 1 or two and more than three, with specific reference to electricity
The volume size of radiator arranges the number of heat pipe.
Above-described embodiment is used for explaining this utility model rather than limiting this utility model, at this utility model
Spirit and scope of the claims in, any modifications and changes that this utility model is made, both fall within this practicality new
The protection domain of type.
Claims (8)
1. an electronic equipment spontaneous-heating type electric radiator, it is characterised in that: include heat pipe, heat pipe evaporation ends substrate, heat pipe
Condensation end substrate and fan, heat pipe is installed between heat pipe evaporation ends substrate and condensation end of heat pipe substrate, heat pipe evaporation ends substrate
Connecting and have thermo-electric generation sheet, thermo-electric generation sheet is connected with electronic equipment by hot extension block, and condensation end of heat pipe substrate connects to be had
Cooling piece, one end that cooling piece is connected with condensation end of heat pipe substrate is referred to as the cold end of cooling piece, and the other end of cooling piece is referred to as refrigeration
Sheet hot junction, heat pipe evaporation ends substrate and cooling piece hot junction are mounted on radiating fin, the radiating fin on heat pipe evaporation ends substrate
It is interlaced arrangement with the radiating fin on cooling piece hot junction；Cooling piece is electrically connected with controller, controller respectively with thermo-electric generation
Sheet and fan electrical connection.
2. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: described heat pipe is provided with 1
Individual or multiple, when heat pipe is provided with multiple, multiple heat pipes are arranged side by side, and the radiating fin that adjacent heat pipe is corresponding is interlaced arrangement.
3. the electronic equipment spontaneous-heating type electric radiator as described in claim 1 or 2 any one, it is characterised in that: described
Electric radiator be additionally provided with for connecting heat pipe and the connecting plate for static controller.
4. electronic equipment spontaneous-heating type electric radiator as claimed in claim 3, it is characterised in that: heat pipe is set to U-tube,
The bent tube section of heat pipe is embedded on connecting plate.
5. electronic equipment spontaneous-heating type electric radiator as claimed in claim 3, it is characterised in that: controller is fixed on connection
The bottom of plate.
6. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: controller connects thermoelectricity
Amphitene, thermocouple wire is installed between hot extension block and electronic equipment.
7. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: fan is fixed on heat extension
On block and condensation end of heat pipe substrate.
8. electronic equipment spontaneous-heating type electric radiator as claimed in claim 1, it is characterised in that: described electric radiator also sets
Thermal insulation board, heat pipe evaporation ends substrate and condensation end of heat pipe substrate is had to be installed on thermal insulation board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620589072.9U CN205694034U (en) | 2016-06-16 | 2016-06-16 | Electronic equipment spontaneous-heating type electric radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620589072.9U CN205694034U (en) | 2016-06-16 | 2016-06-16 | Electronic equipment spontaneous-heating type electric radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205694034U true CN205694034U (en) | 2016-11-16 |
Family
ID=57428111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620589072.9U Expired - Fee Related CN205694034U (en) | 2016-06-16 | 2016-06-16 | Electronic equipment spontaneous-heating type electric radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205694034U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916359A (en) * | 2016-06-16 | 2016-08-31 | 中国石油大学(华东) | Spontaneous heating electric heat dissipating device for electronic device and optimization method therefor |
| CN110509461A (en) * | 2019-08-16 | 2019-11-29 | 合肥通泰光电科技有限公司 | A kind of antistatic shows the production mold and preparation method thereof of glue frame |
-
2016
- 2016-06-16 CN CN201620589072.9U patent/CN205694034U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916359A (en) * | 2016-06-16 | 2016-08-31 | 中国石油大学(华东) | Spontaneous heating electric heat dissipating device for electronic device and optimization method therefor |
| CN110509461A (en) * | 2019-08-16 | 2019-11-29 | 合肥通泰光电科技有限公司 | A kind of antistatic shows the production mold and preparation method thereof of glue frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105916359B (en) | Electronic equipment spontaneous-heating type electric radiator and its optimization method | |
| CN105934139B (en) | The working medium cooling system by contact and its method of work of high power device | |
| CN107612426B (en) | Ship Waste Heat recycles two-stage temperature difference electricity generation device | |
| CN104253565B (en) | A kind of air-conditioning waste heat cogeneration device | |
| CN107611519A (en) | A kind of TEC temperature controls module and its application method for electrokinetic cell bag | |
| CN103424018A (en) | Liquid phase-change heat transfer type pumping cooling system with booster pump | |
| CN205694034U (en) | Electronic equipment spontaneous-heating type electric radiator | |
| CN103449543A (en) | Method and equipment for improving latent heat utilization rate in seawater desalination | |
| CN201336789Y (en) | Electronic device radiator and electronic device provided with same | |
| RU2345294C1 (en) | Cooling unit for heat-producing hardware | |
| Hameed et al. | Thermoelectric cooler performance enhancement using thermoelectric generators and their use as a single model to improve the performance of thermal battery management systems for electric vehicles | |
| CN202648481U (en) | Liquid phase change heat transfer type pumping cooling system with booster pump | |
| CN209326136U (en) | A kind of semiconductor cooler | |
| CN207117506U (en) | A kind of stacked heat energy electric energy conversion module and its TRT | |
| CN208939848U (en) | Heat recovery apparatus and engine assembly | |
| CN111219908A (en) | Semiconductor wafer based plug-in heat transfer device and apparatus employing the same | |
| CN113555492B (en) | Electronic waste heat collecting device and control method thereof | |
| CN203083195U (en) | Sealed box body imperforated silencing heat dissipating device | |
| CN2921938Y (en) | Radiating device | |
| CN112164746B (en) | Thermoelectric power generation device | |
| CN204923552U (en) | A semiconductor refrigerator for circulative cooling system | |
| CN210835978U (en) | Computer hardware temperature control device | |
| JP2000009361A (en) | Thermoelectric conversion system | |
| CN101533808B (en) | Energy dissipation device | |
| CN201306803Y (en) | Semiconductor hot and cold adjusting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161116 Termination date: 20180616 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |