CN203432016U - Desk-type portable semiconductor refrigeration air conditioner - Google Patents
Desk-type portable semiconductor refrigeration air conditioner Download PDFInfo
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- CN203432016U CN203432016U CN201320510060.9U CN201320510060U CN203432016U CN 203432016 U CN203432016 U CN 203432016U CN 201320510060 U CN201320510060 U CN 201320510060U CN 203432016 U CN203432016 U CN 203432016U
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Abstract
The utility model provides a desk-type portable semiconductor refrigeration air conditioner which comprises a main air flue. The main air flue is composed of five partition boards inside and five cooling fins in contact with the cold ends of four refrigerating pieces and is snakelike, so that air introduced by a fan flows up and down in the air flue, the heat transmission area is increased, air outlet temperature of the air conditioner is lowered, the refrigerating process is prolonged, and the air outlet temperature of the air conditioner is uniform. The hot ends of the refrigerating pieces are in contact with two sets of water-cooling plates respectively, so that heat dissipation efficiency of the hot ends of the refrigerating pieces is greatly improved, and meanwhile refrigerating efficiency is improved. The fan is arranged on the inlet of the air flue, and a temperature sensor is arranged on the outlet of the air flue so as to adjust refrigerating temperature. Parts of the semiconductor refrigeration air conditioner are reasonably arranged in a machine case, and the semiconductor refrigeration air conditioner is small in size, convenient to carry and capable of being used on various occasions.
Description
Technical field
The utility model relates to a kind of table portable Water-cooling thermoelectricity refrigeration air-conditioning.
Background technology
The air-conditioning of prior art is when making refrigerating operaton, after the R22 refrigerant gas of low-temp low-pressure is sucked by compressor, pressurization becomes the R22 refrigerant gas of HTHP, R22 refrigerant gas heat release in outdoor heat exchanger (passing through condenser condenses) of HTHP becomes the liquid (heat is taken away by outdoor circulated air) of middle temperature high pressure, the liquid of middle temperature high pressure becomes the liquid of low-temp low-pressure again after throttle part reducing pressure by regulating flow, the liquid refrigerant of low-temp low-pressure absorbs heat and becomes the gas of low-temp low-pressure after evaporation (room air is through the heat exchanger surface cooling that is cooled in indoor heat exchanger, reach the object that indoor temperature is declined), the R22 refrigerant gas of low-temp low-pressure is sucked by compressor again, so circulation.The air conditioner of realizing above-mentioned functions not only self structure is complicated, but also will be divided into indoor set and off-premises station, is not easy to install, and energy waste is large, and can destroy atmosphere, contaminated environment because cold-producing medium is used freon.
The semiconductor refrigerating air-conditioning of prior art is mainly the design for refrigeration module, does not form a set of complete semiconductor refrigeration air conditioning system, and relatively portable design.In prior art, the radiating mode of semiconductor refrigerating air-conditioning be take air-cooled and heat pipe heat radiation substantially as main.Although wind-cooling heat dissipating mode is simple and convenient, its efficiency is very low; Heat pipe heat radiation is originated without additional energy, but efficiency is still lower.With regard to semiconductor refrigerating, the refrigeration of water cooled heat radiating compares better.Under water cooled heat radiating pattern, as long as reduce cooling water temperature, just can increase substantially refrigerating efficiency and effect.The cold of the semiconductor chilling plate of prior art is to be directly passed to air by air channel wall, and is through type, changes cold effective contact area little, changes cold efficiency lower.
Prior art because of semiconductor cold junction cooled plate be integral structure, can not make the performance of every block semiconductor refrigerating sheet give full play to, because being affixed on the cooled plate of semiconductor freezer cold end, only have a water inlet and a delivery port again, heat dump is integrated, the hot junction of the refrigerator of close water inlet will flow to the hot junction near the refrigerator of delivery port after water heating, make the cold junction temperature of the refrigerator of close delivery port higher than the cold junction temperature of the refrigerator near water inlet, to cause integrally cooling performance to reduce.
In prior art, the heat exchanging air duct of cold junction is short, and this just makes the outlet and inlet temperature difference of air-conditioner less, obtain the larger temperature difference and air output, will use more semiconductor cooler, and cost is higher, and efficiency is low.
Utility model content
The purpose of this utility model is to provide and has a kind ofly adopted cooled plate mode in parallel to dispel the heat, and has improved refrigerating efficiency, is convenient for carrying, simple in structure, easy to use, the desk-top semiconductor air-conditioner of the high and energy-conserving and environment-protective of the thermal efficiency.
For achieving the above object, can use following technical scheme:
The utility model provides a kind of table portable semiconductor refrigerating air-conditioning, comprise: be arranged on the main air duct in cabinet, semiconductor refrigerating module, water-cooling radiating module, temperature sensor and blower fan, casing surface is installed control circuit and is provided with air inlet and air outlet, water-cooling radiating module dispels the heat to semiconductor refrigeration module, power supply is to semiconductor refrigeration module, water-cooling radiating module, control circuit and blower fan power supply, assembling is in the import of the air channel of main air duct, air inlet by cabinet is undertaken cooling by outside air intake semiconductor refrigerating module, ducting outlet by main air duct is sent cooling air from the air outlet of cabinet, temperature sensor is arranged on ducting outlet, it is characterized in that: semiconductor refrigerating module comprises plural block semiconductor cooling piece and the plural piece cooling fins that contact corresponding to semiconductor chilling plate, main air duct inside is provided with multiple plurality of partitions, and is provided with air channel import and ducting outlet, and water-cooling radiating module is by two groups of cooled plate, water of radiation row, radiator fan, circulating pump, pipeline forms, wherein, multiple plurality of partitions is the both sides that are arranged on main air duct inner surface of staggered inclination respectively, the outer surface of the relative both sides that dividing plate is installed of main air duct posts respectively plural block semiconductor cooling piece, be two groups of semiconductor chilling plates, plural number piece cooling fins contacts and is distributed in the both sides of main air duct inner surface with the cold junction of two groups of semiconductor chilling plates, and cooling fins is contacted with adjacent separator transversally, multiple plurality of partitions and plural piece cooling fins form the snakelike air channel of UNICOM in main air duct, the hot junction of two groups of cooled plate is connected to water of radiation row's water inlet by the pipeline of a road parallel connection, water of radiation row's delivery port is connected to the water inlet of circulating pump by a road pipeline, and connect respectively from the pipeline that the delivery port of circulating pump connects a road parallel connection cold junction of getting back to two groups of cooling piece cooled plate, form circulation line.
Further, semiconductor chilling plate distributes at main air duct spaced surface with cooling wing piece, hot junction by two groups of semiconductor chilling plates contacts with the cold junction of two groups of cooled plate respectively, thereby semiconductor refrigerating module is connected to water-cooling radiating module, realize the heat radiation of water-cooling radiating module to two groups of semiconductor chilling plates.
The effect of utility model and effect
The related table portable semiconductor refrigerating air-conditioning of the utility model adopts snakelike air channel and coordinates cooling fins, cooling piece is spaced apart, therefore during refrigeration work, the temperature that prime cool end heat exchanger is higher can directly not conducted and have influence on rear class cool end heat exchanger by metal, the cool end heat exchanger of each heat exchange unit has different temperature, and air can further be lowered the temperature step by step in air channel.Under certain air quantity and blast, adopt less semiconductor cooler can reach the larger air inlet/outlet temperature difference.Take cooled plate mode in parallel to dispel the heat, greatly improve refrigerating efficiency.
Accompanying drawing explanation
Fig. 1 is the overall appearance schematic diagram of table portable semiconductor refrigerating air-conditioning;
Fig. 2 is the semiconductor refrigerating modular structure schematic diagram of table portable semiconductor refrigerating air-conditioning;
Fig. 3 is the water-cooling radiating module connection diagram of table portable semiconductor refrigerating air-conditioning;
Fig. 4 is the cabinet inside part position distribution map of table portable semiconductor refrigerating air-conditioning.
The specific embodiment
Below in conjunction with accompanying drawing, the details of the embodiment of the related a kind of table portable semiconductor refrigerating air-conditioning of the utility model has been made to specific description.Fig. 1 is the overall appearance schematic diagram of table portable semiconductor refrigerating air-conditioning.
As shown in Figure 1, table portable semiconductor refrigerating air-conditioning 100 is by the main air duct 105 being arranged in cabinet, semiconductor refrigerating module 106, water-cooling radiating module 107, temperature sensor 108, the compositions such as blower fan 109 and power supply 110, the casing 101 of table portable semiconductor refrigerating air-conditioning 100 has been installed control circuit 104 and has been provided with air inlet 103 and air outlet 102 on upper surface.
Fig. 2 is the semiconductor refrigerating modular structure schematic diagram of table portable semiconductor refrigerating air-conditioning.
As shown in Figure 2, main air duct 105 inside are provided with five dividing plates 503 and four cooling fins 602, and are provided with air channel import 501 and ducting outlet 502.Blower fan 109 is arranged on air channel import 501, and temperature sensor 108 is arranged on ducting outlet 502.Extraneous air enters flow direction after air channel import 506 and represents as arrow by being located at the air inlet 103 of cabinet 101.
Five dividing plates 502 are the staggered both sides that are arranged on main air duct 105 inner surfaces that tilt respectively, four cooling fins 602 are arranged on the both sides of main air duct inner surface, and cooling fins 602 is contacted with adjacent separator 502 transversally, five dividing plates 502 and four cooling fins 602 are in the interior snakelike air channel that forms UNICOM of main air duct 105, the outer surface of the relative both sides that dividing plate is installed of main air duct 105 posts respectively four block semiconductor cooling pieces 601, be two groups of semiconductor chilling plates 601, the cold junction of semiconductor chilling plate 601 contacts with cooling wing piece 602 respectively, and semiconductor chilling plate 601 is distributed at main air duct 105 spaced surfaces with cooling wing piece 602, the hot junction of two groups of semiconductor chilling plates 601 contacts with the cold junction of two groups of cooled plate 701 respectively.Semiconductor refrigerating module 106 is connected to water-cooling radiating module 107, realizes the heat radiation in the hot junction of 106 pairs of two groups of semiconductor chilling plates 601 of water-cooling radiating module.
Main air duct 105 adopts snakelike air channel and coordinates cooling fins 602, semiconductor chilling plate 601 is spaced apart, therefore during refrigeration work, the temperature that semiconductor chilling plate 601 prime cool end heat exchangers are higher can directly not conducted and have influence on rear class cool end heat exchanger by metal, the cool end heat exchanger of each heat exchange unit has different temperature, and air can further be lowered the temperature step by step in air channel.Under certain air quantity and blast, adopt less semiconductor chilling plate 601 can reach the larger air inlet/outlet temperature difference.
Fig. 3 is the water-cooling radiating module connection diagram of table portable semiconductor refrigerating air-conditioning.
As shown in Figure 3, water-cooling radiating module 107 is by two groups of cooled plate 701, pipeline 702, and water of radiation row 703, circulating pump 704, radiator fan forms.The hot junction of two groups of cooled plate 701 is connected to water of radiation row 703 water inlet by the pipeline 702 of a road parallel connection, water of radiation row 703 delivery port is connected to the water inlet of circulating pump 704 by a road pipeline 702, and connect respectively from the pipeline 702 that the delivery port of circulating pump 704 connects a road parallel connection cold junction of getting back to two groups of cooling piece cooled plate 701, form circulation line, realize the heat radiation of 107 pairs of semiconductor chilling plates 601 of water-cooling radiating module.
Because two groups of cooled plate 701 access water of radiation row 703 by mode in parallel, the water temperature that makes to enter each hot junction cooled plate is identical, each hot junction water-cooled, 701 water that flow out are arranged 703 by water of radiation and are dispelled the heat, the heat that each semiconductor chilling plate 601 is produced can directly not affect other semiconductor chilling plate 601, so greatly improve the radiating efficiency in semiconductor chilling plate 601 hot junctions, also improved refrigerating efficiency simultaneously.
Fig. 4 is the cabinet inside part position distribution map of table portable semiconductor refrigerating air-conditioning.
As shown in Figure 4, the control circuit 104 of table portable semiconductor refrigerating air-conditioning 100, main air duct 105 and be installed on the semiconductor refrigerating module 106 in main air duct 105, power supply 110, water-cooling radiating module 107, comprise water of radiation row 703, radiator fan and circulating pump 704, the placement of blower fan 109 in cabinet distributes.
110 pairs of power supplys are arranged on the semiconductor refrigerating module 106 in cabinet 101, water-cooling radiating module 107, blower fan 109, sending out the hot fan, the power supplies such as circulating pump 704 and control circuit 104.
Claims (2)
1. a table portable semiconductor refrigerating air-conditioning, comprise: be arranged on the main air duct in cabinet, semiconductor refrigerating module, water-cooling radiating module, temperature sensor and blower fan, described casing surface is installed control circuit and is provided with air inlet and air outlet, water-cooling radiating module dispels the heat to described semiconductor refrigerating module, power supply is to semiconductor refrigeration module, water-cooling radiating module, control circuit and blower fan power supply, described assembling is in the import of the air channel of described main air duct, air inlet by cabinet is undertaken cooling by semiconductor refrigerating module described in outside air intake, ducting outlet by main air duct is sent cooling air from the air outlet of cabinet, described temperature sensor is arranged on described ducting outlet, it is characterized in that:
Described semiconductor refrigerating module comprises plural block semiconductor cooling piece and the plural piece cooling fins that contact corresponding to described semiconductor chilling plate;
Main air duct inside is provided with multiple plurality of partitions, and is provided with air channel import and ducting outlet; And
Water-cooling radiating module is by two groups of cooled plate, and water of radiation is arranged, radiator fan, and circulating pump, pipeline forms;
Wherein, described multiple plurality of partitions is the both sides that are arranged on described main air duct inner surface of staggered inclination respectively, the outer surface of the relative both sides that dividing plate is installed of described main air duct posts respectively plural block semiconductor cooling piece, be two groups of semiconductor chilling plates, plural number piece cooling fins contacts and is distributed in the both sides of described main air duct inner surface with the cold junction of described two groups of semiconductor chilling plates, and described cooling fins is contacted with adjacent separator transversally, described multiple plurality of partitions and described plural piece cooling fins form the snakelike air channel of UNICOM in described main air duct
The hot junction of two groups of cooled plate is connected to described water of radiation row's water inlet by the pipeline of a road parallel connection, water of radiation row's delivery port is connected to the water inlet of described circulating pump by a road pipeline, and connect respectively from the pipeline that the delivery port of described circulating pump connects a road parallel connection cold junction of getting back to two groups of cooling piece cooled plate, form circulation line.
2. table portable semiconductor refrigerating air-conditioning according to claim 1, is characterized in that:
Wherein, described semiconductor chilling plate distributes at main air duct spaced surface with cooling wing piece, hot junction by described two groups of semiconductor chilling plates contacts with the cold junction of described two groups of cooled plate respectively, thereby semiconductor refrigerating module is connected to described water-cooling radiating module, realize the heat radiation of water-cooling radiating module to two groups of semiconductor chilling plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320510060.9U CN203432016U (en) | 2013-08-20 | 2013-08-20 | Desk-type portable semiconductor refrigeration air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320510060.9U CN203432016U (en) | 2013-08-20 | 2013-08-20 | Desk-type portable semiconductor refrigeration air conditioner |
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| Publication Number | Publication Date |
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| CN203432016U true CN203432016U (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320510060.9U Expired - Fee Related CN203432016U (en) | 2013-08-20 | 2013-08-20 | Desk-type portable semiconductor refrigeration air conditioner |
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| CN (1) | CN203432016U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279661A (en) * | 2014-09-11 | 2015-01-14 | 青岛海尔空调器有限总公司 | Desktop air conditioner |
| CN105588229A (en) * | 2015-02-15 | 2016-05-18 | 海信（山东）空调有限公司 | Radiator and air conditioner |
| CN104279660B (en) * | 2014-09-11 | 2017-03-22 | 青岛海尔空调器有限总公司 | Desktop air conditioner |
| CN107296420A (en) * | 2017-07-06 | 2017-10-27 | 宜宾学院 | A kind of new cold-warm chair |
| CN108107157A (en) * | 2017-12-19 | 2018-06-01 | 广东立佳实业有限公司 | A kind of power battery environment storehouse toxic gas detection system |
| CN108518754A (en) * | 2018-04-28 | 2018-09-11 | 珠海格力电器股份有限公司 | A kind of control method of desktop air-conditioning and desktop air-conditioning |
| CN108784919A (en) * | 2018-08-20 | 2018-11-13 | 童奕萌 | The wearable constant regulating device of shell temperature |
| CN110455009A (en) * | 2019-09-12 | 2019-11-15 | 赵进洲 | A kind of weather adjustment device and air-conditioning |
| WO2020038444A1 (en) * | 2018-08-24 | 2020-02-27 | 郑敏发 | Portable air conditioner based on semiconductor refrigeration sheet |
-
2013
- 2013-08-20 CN CN201320510060.9U patent/CN203432016U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279661A (en) * | 2014-09-11 | 2015-01-14 | 青岛海尔空调器有限总公司 | Desktop air conditioner |
| CN104279661B (en) * | 2014-09-11 | 2017-03-22 | 青岛海尔空调器有限总公司 | Desktop air conditioner |
| CN104279660B (en) * | 2014-09-11 | 2017-03-22 | 青岛海尔空调器有限总公司 | Desktop air conditioner |
| CN105588229A (en) * | 2015-02-15 | 2016-05-18 | 海信（山东）空调有限公司 | Radiator and air conditioner |
| CN107296420A (en) * | 2017-07-06 | 2017-10-27 | 宜宾学院 | A kind of new cold-warm chair |
| CN108107157A (en) * | 2017-12-19 | 2018-06-01 | 广东立佳实业有限公司 | A kind of power battery environment storehouse toxic gas detection system |
| CN108107157B (en) * | 2017-12-19 | 2020-06-16 | 广东立佳实业有限公司 | Toxic gas detection system for power battery environment bin |
| CN108518754A (en) * | 2018-04-28 | 2018-09-11 | 珠海格力电器股份有限公司 | A kind of control method of desktop air-conditioning and desktop air-conditioning |
| CN108784919A (en) * | 2018-08-20 | 2018-11-13 | 童奕萌 | The wearable constant regulating device of shell temperature |
| WO2020038444A1 (en) * | 2018-08-24 | 2020-02-27 | 郑敏发 | Portable air conditioner based on semiconductor refrigeration sheet |
| CN110455009A (en) * | 2019-09-12 | 2019-11-15 | 赵进洲 | A kind of weather adjustment device and air-conditioning |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20140820 |
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| EXPY | Termination of patent right or utility model |