CN2713636Y - 散热器扣合装置 - Google Patents
散热器扣合装置 Download PDFInfo
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- CN2713636Y CN2713636Y CNU2004200470583U CN200420047058U CN2713636Y CN 2713636 Y CN2713636 Y CN 2713636Y CN U2004200470583 U CNU2004200470583 U CN U2004200470583U CN 200420047058 U CN200420047058 U CN 200420047058U CN 2713636 Y CN2713636 Y CN 2713636Y
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种散热器扣合装置,可预组装在一散热器上,该散热器具有一基板,该基板上设有通孔,该扣合装置包括一杆体和一弹性元件,该杆体上端为一较大的头部,该弹性元件装设于该杆体的头部下方,该扣合装置还包括一中空套筒,该套筒可套置并固定于杆体上,其下部挡止于散热器通孔下方,杆体的下端突伸出套筒的底端。本实用新型散热器扣合装置具有一可挡止于散热器的通孔下方的套筒,使扣合装置预组装在散热器上,方便运输携带。
Description
【技术领域】
本实用新型关于一种扣合装置,特别是指一种用来固定散热器的扣合装置。
【背景技术】
随着电子信息业的不断发展,高频高速电子元件的推出便成为必然的趋势,但是,高频高速将使电子元件产生的热量也随之增多,如果不及时将其产生的热量排出将导致其温度不断升高,进而严重影响其运行的性能,为确保电子元件能正常运行,通常在其表面安装一散热器以将热量快速地散发出去。而为使散热器与电子元件表面能够紧密稳固的接触,通常需要使用一扣合装置将散热器固定而与电子元件表面紧贴。
现有技术中,多种散热器扣合装置应用于电子元件散热器的固定,中国专利第02200386.X号的揭露便为其中的一种,该散热器扣合装置为两端略微上翘的长片状弹片,在弹片的两端各装设一插销,该插销的***端具有两凸片,在电路板上设有相对应的穿孔,该扣合装置跨置在散热器上两散热鳍片之间的沟槽中,使两端的插销穿过电路板后,通过其凸片钩扣在电路板底面,从而使弹片抵压在散热器上,而实现将散热器紧密贴合在安装于电路板的电子元件上。该散热器扣合装置有扣合方便简单的优点,但在运输携带时,该散热器扣合装置和散热器分离,无法实现散热器与扣合装置的预组装。
【发明内容】
本实用新型的目的在于提供一种具有预组装功能、携带方便的散热器扣合装置。
本实用新型的目的是通过以下技术方案实现的:本实用新型散热器扣合装置,可预组装在一散热器上,该散热器具有一基板,该基板上设有通孔,该扣合装置包括一杆体和一弹性元件,该杆体上端为一较大的头部,该弹性元件装设于该杆体的头部下方,该扣合装置还包括一中空套筒,该套筒可套置并固定于杆体上,其下部挡止于散热器通孔下方,杆体的下端突伸出套筒的底端。
与现有技术相比,本实用新型散热器扣合装置具有一套筒,该套筒下部可挡止于散热器的通孔下方,从而可使扣合装置预组装在散热器上,方便运输携带。
下面参照附图结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型散热器扣合装置的立体分解图。
图2是本实用新型散热器扣合装置与散热器组装前的示意图。
图3是本实用新型散热器扣合装置与散热器组装后的示意图。
【具体实施方式】
请同时参阅图1和图2,本实用新型散热器扣合装置10用来将散热器20固定到位于电路板(图未示)上的电子元件(图未示)顶面。
散热器20具有一基板22和位于该基板22上的若干散热鳍片24,基板22于相对两侧的中部各预留一放置扣合装置10的容置空间,该基板22上在该容置空间的中央各开设一通孔222,该通孔222下方的基板22内凹形成一凹槽224。
该扣合装置10包括一杆体12、一弹片14及一套筒18。该杆体12上端为一较大的头部121,该头部121上方还设有一便于操作工具施力的凸起122,在杆体12的头部121的下方形成一安置部123,而在杆体12的安置部123的下方形成一铆合部124,其中,安置部123的直径大于铆合部124的直径,铆合部124的直径大于杆体12的直径,该杆体12的最下端攻设有螺纹125。弹片14用于提供抵靠散热器20的弹力,其具有一基部142,该基部142中央开设一内径略大于安置部123直径的开孔143,弹片14沿基部142相对两侧斜向下延伸有弹性臂146。套筒18由一与杆体12的铆合部124配合的上下贯通的空心柱体182与形成于该柱体182底部的一凸台184组成,该柱体182的外径小于或等于散热器20上的通孔222的直径,而其内径略小于铆合部124的直径,该凸台184的外径大于散热器20上的通孔222的直径。
该扣合装置10还包括一用于将弹片14固定在安置部123的垫片16,该垫片16的形状与弹片14的基部142配合,中央开设一与安置部123配合的圆孔162,该圆孔162边缘设有一凸块163,弹片14的基部142的开孔143边缘进一步形成一与垫片16的凸块163相配合的缺口145。
请参阅图2和图3,扣合装置10与散热器20组装时,杆体12的最下端依次穿过开孔143和圆孔162,使弹片14和垫片16套置在安置部123上,且使垫片16的凸块163卡制在弹片14的缺口145内,再将杆体12的下端部穿过散热器20的通孔222,使弹片14容置在散热器20的基板22上的容置空间内,且弹性臂146抵压在散热器20的基板22上,而后,将套筒18从散热器20的下方套穿在杆体12上,并将柱体182穿过通孔222且铆合固定在铆合部124,此时,杆体12的最下端突伸出凸台184的底端。
本实用新型中,垫片16套置固定在安置部123上,垫片16的凸块163卡制在弹片14的缺口145内,且弹片14的内径略大于安置部123的直径,这样,垫片16支撑弹片14套穿在安置部123上,且在旋转杆体12时,弹片14不随之旋转;套筒18的凸台184可容置在凹槽224内,增大扣合装置10沿通孔222的轴线方向移动的范围。
在对散热器20进行组装时,将已组装有扣合装置10的散热器20置于电子元件顶面,借助工具作用于杆体12的凸起122而将杆体12的下端螺锁固定于电路板上,从而将散热器20紧贴固定在电子元件上。
本实用新型中,扣合装置10可预组装在散热器20上,方便运输携带。
可以理解,弹片14可为其它弹性元件,如弹簧等;杆体12的下端不局限为螺纹,可设置弹性钩扣结构而钩扣于电路板的底面,当然,也不局限于与电路板固定,也可与电路板的配件如背板等实现固定;套筒18与杆体12不局限于铆合固定,可以使用其它方式如螺锁或焊接等。
Claims (10)
1.一种散热器扣合装置,可预组装在一散热器上,该散热器具有一基板,该基板上设有通孔,该扣合装置包括一杆体和一弹性元件,该杆体上端为一较大的头部,该弹性元件装设于该杆体的头部下方,其特征在于:该扣合装置还包括一中空套筒,该套筒可套置并固定于杆体上,其下部挡止于散热器通孔下方,杆体的下端突伸出套筒的底端。
2.如权利要求1所述的散热器扣合装置,其特征在于:该套筒具有一柱体及形成于该柱体底部的凸台。
3.如权利要求2所述的散热器扣合装置,其特征在于:该凸台的外径大于散热器通孔的直径。
4.如权利要求3所述的散热器扣合装置,其特征在于:该散热器通孔下方的基板内凹形成一凹槽,该套筒的凸台容置在该凹槽内。
5.如权利要求1所述的散热器扣合装置,其特征在于:突伸出套筒底端的杆体上设有螺纹。
6.如权利要求1所述的散热器扣合装置,其特征在于:该弹性元件为一弹片,其具有一中央开孔的基部及由基部相对两侧斜向下延伸用于抵压散热器基板的弹性臂。
7.如权利要求6所述的散热器扣合装置,其特征在于:该杆体上头部下方形成一安置部,弹片的开孔套设安装在该安置部上。
8.如权利要求7所述的散热器扣合装置,其特征在于:该杆体上安置部下方形成一铆合部,该套筒穿过散热器的通孔铆合固定在该铆合部。
9.如权利要求7所述的散热器扣合装置,其特征在于:该扣合装置还包括一垫片,该垫片安装在安置部上,位于弹片基部的下方。
10.如权利要求9所述的散热器扣合装置,其特征在于:该弹片的开孔边缘具有一缺口,该垫片具有一与该缺口配合的凸块。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CNU2004200470583U CN2713636Y (zh) | 2004-06-11 | 2004-06-11 | 散热器扣合装置 |
US11/065,387 US7310229B2 (en) | 2004-06-11 | 2005-02-24 | Heat dissipating device |
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CNU2004200470583U CN2713636Y (zh) | 2004-06-11 | 2004-06-11 | 散热器扣合装置 |
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CN2713636Y true CN2713636Y (zh) | 2005-07-27 |
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CNU2004200470583U Expired - Fee Related CN2713636Y (zh) | 2004-06-11 | 2004-06-11 | 散热器扣合装置 |
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CN (1) | CN2713636Y (zh) |
Cited By (2)
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---|---|---|---|---|
CN101123859B (zh) * | 2006-08-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 散热装置组合及其组装方法 |
CN101460034B (zh) * | 2007-12-12 | 2012-06-13 | 富准精密工业(深圳)有限公司 | 散热装置 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7561433B2 (en) * | 2004-04-09 | 2009-07-14 | Texas Instruments Incorporated | Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system |
US7870888B2 (en) * | 2005-08-26 | 2011-01-18 | Illinois Tool Works Inc. | Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same |
TWM291035U (en) * | 2005-12-22 | 2006-05-21 | Inventec Corp | Heat-dissipating device |
TW200732579A (en) * | 2006-02-27 | 2007-09-01 | Benq Corp | Supporting structure and display device using the same |
US7554809B2 (en) * | 2007-02-09 | 2009-06-30 | Inventec Corporation | Heatsink assembly structure |
US7558067B2 (en) * | 2007-05-01 | 2009-07-07 | Asia Vital Conponents Company Ltd. | Retaining tool for a heat sink |
US7656668B2 (en) * | 2007-05-01 | 2010-02-02 | Asia Vital Components Co., Ltd. | Secure device for a heat sink and CPU |
US20090151897A1 (en) * | 2007-12-18 | 2009-06-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
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CN101662919B (zh) * | 2008-08-27 | 2012-07-25 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20100220443A1 (en) * | 2009-02-27 | 2010-09-02 | Li-Hua Li | Structure improvement for a fixing element |
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US9169856B2 (en) * | 2012-02-02 | 2015-10-27 | Asia Vital Components Co., Ltd. | Fastening structure for thermal module |
JP5998890B2 (ja) * | 2012-12-06 | 2016-09-28 | 富士通株式会社 | バネ付座金及び固定具 |
WO2016005088A1 (de) | 2014-07-09 | 2016-01-14 | Abb Technology Ag | Halbleitermodul mit federbelasteter basisplatte |
DE102017002357A1 (de) * | 2017-03-10 | 2018-09-13 | Wabco Gmbh | Befestigungsanordnung zur Befestigung wenigstens einer Komponente an einem Gerät |
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TWI669480B (zh) * | 2019-01-22 | 2019-08-21 | 奇鋐科技股份有限公司 | 固定結構之承載單元及散熱總成之固定結構 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2200386Y (zh) | 1994-06-29 | 1995-06-14 | 谭复忠 | 变色窗帘 |
FR2729045B1 (fr) * | 1994-12-29 | 1997-01-24 | Bull Sa | Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes |
US5603374A (en) * | 1996-04-05 | 1997-02-18 | Malico Inc. | Heat sink assembly for an integrated circuit |
US5757621A (en) * | 1996-06-06 | 1998-05-26 | Lucent Technologies Inc. | Heat sink assembly employing spring-loaded standoffs |
US6585534B2 (en) * | 1998-08-20 | 2003-07-01 | Intel Corporation | Retention mechanism for an electrical assembly |
US5969950A (en) * | 1998-11-04 | 1999-10-19 | Sun Microsystems, Inc. | Enhanced heat sink attachment |
TW406824U (en) | 1999-01-27 | 2000-09-21 | Shen Tsan Rung | Fixing structure of heat dissipation base |
US6157539A (en) * | 1999-08-13 | 2000-12-05 | Agilent Technologies | Cooling apparatus for electronic devices |
TW460109U (en) * | 2000-03-15 | 2001-10-11 | Foxconn Prec Components Co Ltd | Cooling device |
US6374906B1 (en) * | 2000-04-11 | 2002-04-23 | Hewlett-Packard Company | Heat sink having a captive handle |
TW585387U (en) * | 2000-04-20 | 2004-04-21 | Foxconn Prec Components Co Ltd | Heat sink locking device |
TW468941U (en) * | 2000-05-25 | 2001-12-11 | Foxconn Prec Components Co Ltd | Fastening device of thermal dissipative device |
US6404634B1 (en) * | 2000-12-06 | 2002-06-11 | Hewlett-Packard Company | Single piece heat sink for computer chip |
JP2002261476A (ja) * | 2001-02-28 | 2002-09-13 | Toshiba Corp | 冷却モジュールの接地構造及び方法並びに該構造を有する電子機器 |
US6317328B1 (en) * | 2001-04-05 | 2001-11-13 | Compal Electronics, Inc. | Heat-radiating module structure |
US6667885B2 (en) * | 2001-07-20 | 2003-12-23 | Hewlett-Packard Development Company, L.P. | Attachment of a single heat dissipation device to multiple components with vibration isolation |
US6633489B2 (en) * | 2001-07-31 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | Dynamic isolating mount for processor packages |
US6392889B1 (en) * | 2001-08-21 | 2002-05-21 | Foxconn Precision Components Co., Ltd. | Fastener for heat sink |
TW578981U (en) | 2001-11-30 | 2004-03-01 | Foxconn Prec Components Co Ltd | Heat dissipating assembly |
CN2519998Y (zh) | 2002-01-07 | 2002-11-06 | 李明隆 | Cpu散热器的扣具构造 |
US6752577B2 (en) * | 2002-02-27 | 2004-06-22 | Shu-Chen Teng | Heat sink fastener |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
US6826054B2 (en) * | 2002-09-09 | 2004-11-30 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip assembly |
US6697256B1 (en) * | 2003-02-06 | 2004-02-24 | Sunonwealth Electric Machine Industry Co., Ltd. | Fastening device for attaching a heat sink to heat producer |
TWM248206U (en) * | 2003-10-17 | 2004-10-21 | Hon Hai Prec Ind Co Ltd | Clip for heat sink |
US7019979B2 (en) * | 2003-11-21 | 2006-03-28 | Waffer Technology Corp. | Heat dissipating device having improved fastening structure |
-
2004
- 2004-06-11 CN CNU2004200470583U patent/CN2713636Y/zh not_active Expired - Fee Related
-
2005
- 2005-02-24 US US11/065,387 patent/US7310229B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123859B (zh) * | 2006-08-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 散热装置组合及其组装方法 |
CN101460034B (zh) * | 2007-12-12 | 2012-06-13 | 富准精密工业(深圳)有限公司 | 散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US20060098408A1 (en) | 2006-05-11 |
US7310229B2 (en) | 2007-12-18 |
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