CN1286175C - 大功率发光二极管发光装置 - Google Patents
大功率发光二极管发光装置 Download PDFInfo
- Publication number
- CN1286175C CN1286175C CNB011353929A CN01135392A CN1286175C CN 1286175 C CN1286175 C CN 1286175C CN B011353929 A CNB011353929 A CN B011353929A CN 01135392 A CN01135392 A CN 01135392A CN 1286175 C CN1286175 C CN 1286175C
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- light emitting
- radiator
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011353929A CN1286175C (zh) | 2001-09-29 | 2001-09-29 | 大功率发光二极管发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011353929A CN1286175C (zh) | 2001-09-29 | 2001-09-29 | 大功率发光二极管发光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1341966A CN1341966A (zh) | 2002-03-27 |
CN1286175C true CN1286175C (zh) | 2006-11-22 |
Family
ID=4673138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011353929A Expired - Fee Related CN1286175C (zh) | 2001-09-29 | 2001-09-29 | 大功率发光二极管发光装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1286175C (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100379034C (zh) * | 2003-03-10 | 2008-04-02 | 高陆股份有限公司 | 高效散热的发光二极管模块 |
CN1601768A (zh) * | 2003-09-22 | 2005-03-30 | 福建省苍乐电子企业有限公司 | 一种发光二极管结构 |
US6942360B2 (en) * | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
WO2005067064A1 (en) * | 2003-11-25 | 2005-07-21 | Shichao Ge | Light emitting diode and light emitting diode lamp |
US6966674B2 (en) * | 2004-02-17 | 2005-11-22 | Au Optronics Corp. | Backlight module and heat dissipation structure thereof |
US10575376B2 (en) | 2004-02-25 | 2020-02-25 | Lynk Labs, Inc. | AC light emitting diode and AC LED drive methods and apparatus |
WO2011143510A1 (en) | 2010-05-12 | 2011-11-17 | Lynk Labs, Inc. | Led lighting system |
US10499465B2 (en) | 2004-02-25 | 2019-12-03 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
CN1848463A (zh) * | 2005-04-15 | 2006-10-18 | 南京汉德森科技股份有限公司 | 基于金属线路板的led白光光源 |
JP2008539577A (ja) * | 2005-04-28 | 2008-11-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 陥凹内に配置されるledを含む光源 |
CN100409440C (zh) * | 2005-08-08 | 2008-08-06 | 佰鸿工业股份有限公司 | 矩阵式发光二极管及其制造方法 |
CN100594623C (zh) | 2005-09-20 | 2010-03-17 | 松下电工株式会社 | 发光二极管照明器具 |
CN100572908C (zh) | 2006-11-17 | 2009-12-23 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US8444299B2 (en) | 2007-09-25 | 2013-05-21 | Enertron, Inc. | Dimmable LED bulb with heatsink having perforated ridges |
US11317495B2 (en) | 2007-10-06 | 2022-04-26 | Lynk Labs, Inc. | LED circuits and assemblies |
US11297705B2 (en) | 2007-10-06 | 2022-04-05 | Lynk Labs, Inc. | Multi-voltage and multi-brightness LED lighting devices and methods of using same |
CN101216156A (zh) * | 2007-12-30 | 2008-07-09 | 佛山市国星光电股份有限公司 | 应用于通用照明的led面光源 |
US7972037B2 (en) | 2008-11-26 | 2011-07-05 | Deloren E. Anderson | High intensity replaceable light emitting diode module and array |
CN102032475A (zh) * | 2009-08-23 | 2011-04-27 | 彭云滔 | 一种组合式大功率led灯 |
CN102437266B (zh) * | 2010-09-29 | 2016-05-11 | 王树生 | Led封装结构 |
CN101949502B (zh) * | 2010-10-07 | 2012-02-08 | 苏州盟泰励宝光电有限公司 | 一种led反射灯具 |
CN101963315B (zh) * | 2010-10-14 | 2016-01-20 | 友达光电股份有限公司 | 光源模块与液晶显示器 |
CN102299235A (zh) * | 2011-06-13 | 2011-12-28 | 协鑫光电科技(张家港)有限公司 | 高发光效率的发光二极管 |
US20140239809A1 (en) | 2011-08-18 | 2014-08-28 | Lynk Labs, Inc. | Devices and systems having ac led circuits and methods of driving the same |
WO2013082609A1 (en) | 2011-12-02 | 2013-06-06 | Lynk Labs, Inc. | Color temperature controlled and low thd led lighting devices and systems and methods of driving the same |
US11079077B2 (en) | 2017-08-31 | 2021-08-03 | Lynk Labs, Inc. | LED lighting system and installation methods |
-
2001
- 2001-09-29 CN CNB011353929A patent/CN1286175C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1341966A (zh) | 2002-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: HANGZHOU FUYANG NOVELTY ELECTRONICS CO., LTD. Free format text: FORMER OWNER: GE SHICHAO Effective date: 20040106 |
|
C10 | Entry into substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20040106 Address after: Hangzhou City, Zhejiang province 311404 Fuyang New Economic Development Zone Applicant after: Hangzhou Fuyang Novel Electronics Co., Ltd. Address before: Two road 310012 Zhejiang city in Hangzhou Province, the Qiuzhi Lane room 2-203 Applicant before: Ge Shichao |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: ZHEJIANG MANELUX LIGHTING CO., LTD. Free format text: FORMER NAME: HANGZHOU FUYANG XINYING ELECTRONICS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Hangzhou City, Zhejiang province Fuyang New Economic Development Zone Patentee after: Zhejiang Manelux Lighting Co., Ltd. Address before: Hangzhou City, Zhejiang province Fuyang New Economic Development Zone Patentee before: Hangzhou Fuyang Novel Electronics Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061122 Termination date: 20110929 |