CN100375300C - 大功率发光二极管 - Google Patents
大功率发光二极管 Download PDFInfo
- Publication number
- CN100375300C CN100375300C CNB2003101137821A CN200310113782A CN100375300C CN 100375300 C CN100375300 C CN 100375300C CN B2003101137821 A CNB2003101137821 A CN B2003101137821A CN 200310113782 A CN200310113782 A CN 200310113782A CN 100375300 C CN100375300 C CN 100375300C
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- Prior art keywords
- light
- chip
- emitting diode
- metab
- little
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910003460 diamond Inorganic materials 0.000 claims abstract description 38
- 239000010432 diamond Substances 0.000 claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000011324 bead Substances 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000010931 gold Substances 0.000 claims abstract description 21
- 229910052737 gold Inorganic materials 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003292 glue Substances 0.000 claims description 34
- 150000002739 metals Chemical class 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 2
- 239000004332 silver Substances 0.000 abstract description 11
- 229910052709 silver Inorganic materials 0.000 abstract description 11
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000004411 aluminium Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000004033 diameter control Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
- H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101137821A CN100375300C (zh) | 2003-11-25 | 2003-11-25 | 大功率发光二极管 |
PCT/CN2004/001353 WO2005067064A1 (en) | 2003-11-25 | 2004-11-25 | Light emitting diode and light emitting diode lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101137821A CN100375300C (zh) | 2003-11-25 | 2003-11-25 | 大功率发光二极管 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1545148A CN1545148A (zh) | 2004-11-10 |
CN100375300C true CN100375300C (zh) | 2008-03-12 |
Family
ID=34336968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101137821A Expired - Fee Related CN100375300C (zh) | 2003-11-25 | 2003-11-25 | 大功率发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100375300C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102142489A (zh) * | 2011-01-11 | 2011-08-03 | 北京易光天元半导体照明科技有限公司 | 一种将led封装与应用相结合的新型散热方法和装置 |
WO2013139058A1 (zh) * | 2012-03-22 | 2013-09-26 | 深圳市华星光电技术有限公司 | 散热基板及其制造方法 |
US9205515B2 (en) | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100367522C (zh) * | 2005-07-25 | 2008-02-06 | 财团法人工业技术研究院 | 具有热电器件的发光二极管封装结构 |
TWI442595B (zh) | 2007-07-25 | 2014-06-21 | Everlight Electronics Co Ltd | 發光二極體裝置 |
CN101364626B (zh) * | 2007-08-07 | 2010-09-29 | 亿光电子工业股份有限公司 | 发光二极管装置 |
WO2009055964A1 (fr) * | 2007-10-31 | 2009-05-07 | Zhigang Zhao | Détecteur de température de thermomètre |
JP5104385B2 (ja) * | 2008-02-20 | 2012-12-19 | 豊田合成株式会社 | Ledランプモジュール |
CN101465399B (zh) * | 2008-12-30 | 2010-06-02 | 吉林大学 | 用金刚石膜作热沉材料的led芯片基座及制作方法 |
WO2010083758A1 (zh) * | 2009-01-20 | 2010-07-29 | Liu Xuefeng | 一种大功率led散热发光一体管的真空封装方法及应用该方法封装的大功率led散热发光一体管 |
CN101893177A (zh) * | 2010-07-19 | 2010-11-24 | 中节能(上海)城市照明节能管理有限公司 | 半导体光源及其发光结构 |
CN101998758B (zh) * | 2010-10-28 | 2012-07-25 | 哈尔滨工业大学 | Led印刷电路板的非晶金刚石散热绝缘膜层的制备方法 |
CN102062312A (zh) * | 2010-11-01 | 2011-05-18 | 上海宏源照明电器有限公司 | 半导体发光结构以及半导体光源 |
US8730855B2 (en) * | 2010-12-22 | 2014-05-20 | Motorola Solutions, Inc. | Method and device for detecting a channel |
CN102184915B (zh) * | 2011-04-06 | 2013-05-08 | 周波 | 线路板与散热器高效整合的大功率基板的制作方法 |
CN102339933B (zh) * | 2011-10-08 | 2013-04-03 | 滨州市甘德电子科技有限公司 | 基于金刚石微观图形结构散热的led |
CZ2016433A3 (cs) * | 2016-07-14 | 2017-07-07 | Západočeská Univerzita V Plzni | Mezivrstva pro pájené spojení |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1264181A (zh) * | 1999-01-29 | 2000-08-23 | 丰田合成株式会社 | 发光二极管 |
JP2001358371A (ja) * | 2000-06-16 | 2001-12-26 | Nichia Chem Ind Ltd | 光半導体素子 |
JP2002057373A (ja) * | 2000-08-08 | 2002-02-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US6514782B1 (en) * | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
CN2540685Y (zh) * | 2002-06-03 | 2003-03-19 | 葛世潮 | 高效率大功率发光二极管 |
-
2003
- 2003-11-25 CN CNB2003101137821A patent/CN100375300C/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1264181A (zh) * | 1999-01-29 | 2000-08-23 | 丰田合成株式会社 | 发光二极管 |
US6514782B1 (en) * | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
JP2001358371A (ja) * | 2000-06-16 | 2001-12-26 | Nichia Chem Ind Ltd | 光半導体素子 |
JP2002057373A (ja) * | 2000-08-08 | 2002-02-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
CN2540685Y (zh) * | 2002-06-03 | 2003-03-19 | 葛世潮 | 高效率大功率发光二极管 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102142489A (zh) * | 2011-01-11 | 2011-08-03 | 北京易光天元半导体照明科技有限公司 | 一种将led封装与应用相结合的新型散热方法和装置 |
WO2013139058A1 (zh) * | 2012-03-22 | 2013-09-26 | 深圳市华星光电技术有限公司 | 散热基板及其制造方法 |
US9205515B2 (en) | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN1545148A (zh) | 2004-11-10 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HANGZHOU TELIANG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: GE SHICHAO Effective date: 20101115 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 310012 ROOM 2-203, QIUZHI LANE, WENER ROAD, XIHU DISTRICT, HANGZHOU CITY, ZHEJIANG PROVINCE TO: 310012 ROOM 218, NO.628, WENSAN WEST ROAD, HANGZHOU CITY, ZHEJIANG PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20101115 Address after: Hangzhou City, Zhejiang province 310012 Wensan Road No. 628, room 218 Patentee after: Hangzhou Teliang Technology Co., Ltd. Address before: Hangzhou City, Zhejiang province Xihu District two road 310012 2--203 room Qiuzhi Wen Xiang Patentee before: Ge Shichao |
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ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG CHENGJIAN CONSTRUCTION GROUP CO., LTD. Free format text: FORMER OWNER: HANGZHOU TELIANG TECHNOLOGY CO., LTD. Effective date: 20120330 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 310012 HANGZHOU, ZHEJIANG PROVINCE TO: 311100 HANGZHOU, ZHEJIANG PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20120330 Address after: 21, 311100 floor, East China Sea creative center, No. 1 Tianmu Road, Hangzhou, Zhejiang, Xihu District Patentee after: Zhejiang Chengjian Construction Group Co., Ltd. Address before: Hangzhou City, Zhejiang province 310012 Wensan Road No. 628, room 218 Patentee before: Hangzhou Teliang Technology Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080312 Termination date: 20151125 |
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CF01 | Termination of patent right due to non-payment of annual fee |