CN2255682Y - 半导体激光塑料成型封装装置 - Google Patents

半导体激光塑料成型封装装置 Download PDF

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CN2255682Y
CN2255682Y CN96211640U CN96211640U CN2255682Y CN 2255682 Y CN2255682 Y CN 2255682Y CN 96211640 U CN96211640 U CN 96211640U CN 96211640 U CN96211640 U CN 96211640U CN 2255682 Y CN2255682 Y CN 2255682Y
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李秉杰
陈宏年
许荣宗
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Abstract

一种半导体激光塑料成型封装装置，其包括：一第一接脚，及其两侧的一第二接脚和一第三接脚；一次平台，一半导体激光芯片设置于其上；一监控光检测器，且电连接至第三接脚上；一塑料头座，用以固定第一接脚，第二接脚及第三接脚；及一透明帽盖，用以封装所有塑料头座上的元件。本实用新型成本低，具高度的产业上的利用价值。另外，本实用新型散热性好，光输出功率高，同时由于塑料头座为黑色，可减小挠射现象的影响，并可增加其安全性。

Description

半导体激光塑料成型封装装置
本实用新型涉及一种半导体激光装置，特别涉及一种半导体激光塑料成型封装装置。
一般而言，半导体激光装置虽然因其光特性较佳而被广泛地使用，但其价格昂贵的问题也始终困扰着使用者。造成半导体激光装置价格无法下降的原因，除了产率的问题之外，其使用的材料和构件过于昂贵也是一个问题。
在传统的半导体激光装置的封装方式中，最常见的是金属罐封装方式。请参阅图1，其是以金属合金为基材1，并于其上设置一硅化物次平台(silicon submount)2及一激光芯片3，然后再以一具有玻璃窗口4的金属盖5加以封装。在此种半导体激光装置中，由于除了激光芯片外，金属基材及金属盖均较昂贵，所以其整体成本便难以降低。况且，就结构上而言，因激光芯片发出的光会发散，所以其仍需在光束射出的窗口外设置一聚焦的透镜***，这也造成整个***成本的提高。
为了改进前述现有装置的缺点，在美国专利第5,068,866号中便提出了一种可降低成本的半导体激光装置，其主要是利用发光二极管的树脂封装技术来封装半导体激光装置。请参阅图2，其中，标号11表示导电接脚，标号12为激光芯片，标号13为次平台，标号14为监控光检测器，标号11A′为主平台，此主平台11A′与接脚11A的前端相连接。激光芯片12设置于次平台13，再安装于主平台11A′上，此外，监控光检测器14也安装于主平台11A′上。激光芯片12及监控光检测器14并分别经导线15连接于两根接脚11B及11C上，最后再利用树脂16将所有的元件覆盖封装。此外，在树脂前缘可设计成透镜的形状，从而将激光芯片发出的光加以聚焦。
前述以树脂封装的方式制作的半导体激光装置，其成本确实较为低廉，但是又导致了另外一些问题。首先，由于其整体元件均被树脂覆盖，所以其散热性差，这会直接影响到半导体激光的发光寿命。再者，因结构限制，在树脂前缘仅能设计单边的透镜形状，且无法调整焦距，故其聚焦性不佳。最后，由于其需先制作主平台，然后再将此主平台连接于接脚上，制作上较为复杂。
有鉴于此，为改进现有半导体激光装置的缺点，本实用新型的主要目的即在于提供一种半导体激光塑料成型封装装置。其利用塑料模成形塑料头座(header)于导架(lead frame)上，以取代前述现有技术所使用的金属罐，从而降低成本。同时塑料头座为深色，可吸收背向光，以减少折射现象，并增加安全性。
本实用新型的另一目的乃在于提供一种半导体激光塑料成型封装装置，其利用塑料模成形的帽盖(cap)来进行封装，从而降低成本，适于批量生产，且可达到轻和短小的目的。
本实用新型的再一目的在于提供一种散热性好的半导体激光塑料成型封装装置，其可在导架上设计散热片，从而将半导体激光所产生的热引导到塑料头座外面。
本实用新型的又一目的在于提供一种高装配效率的半导体激光塑料成型封装装置。其可将半导体激光及光聚焦元件的装配工序提前于封盖前完成，从而使得激光装置具有高良率及高光功率输出。
为了达成前述各项目的，根据本实用新型的半导体激光塑料成型封装装置包括一半导体激光芯片、一监控光检测器、一基板部分、一次平台和接脚，
所述次平台设置于所述基板部分的前缘，所述半导体激光芯片设置于所述次平台上，所述监控光检测器紧靠着所述次平台设置于基板部分上，所述基板部分是所述第一接脚的较宽的一端，所述第二接脚和第三接脚分别位于第一接脚的两侧，且第二接脚与所述半导体激光芯片电连接，第三接脚与所述监控光检测器电连接；
还包括：一塑料头座，所述第一接脚、第二接脚和第三接脚固定于该塑料头座上；
一透明帽盖，与所述塑料头座相配合封装所有塑料头座上的元件。
在所述基板部分上还安装有散热片，该散热片延伸至塑料头座的另一侧，从而将半导体激光芯片产生的热能引导至外部。
所述帽盖前端的内外两侧可形成为各种透镜，如球面、非球面及菲涅耳透镜等。
所述帽盖与塑料头座的接触面为一凹凸卡榫，可相互卡住。
所述帽盖底面具有凸缘，可利用热压方式进行封盖。
所述塑料头座为深色，用来吸收所述半导体激光芯片的背向光。
所述塑料头座可与形成有透镜且经焦距调整的帽盖之间利用固定胶粘合固定。
下面再对本发明及现有技术就成本及特性上作一比较，请参阅下表：
本实用新型 金属罐的封装方式 美国专利5,068,866号
材料成本 便宜，可完全自制 昂贵，依赖国外进口 便宜
封装成本 便宜，可利用IC或LED的自动化设备 复杂，成本高不易自动化 便宜，可用LED封装自动化设备
散热性 利用散热片散热性好 好 差，只靠吸热
挠射现象 微量，因塑料黑色吸收大部分背光 明显，因背光反射而和主光源产生挠射 无
安全性 中 好 差，背光向装置后面射出
监控光检测器特性 好 好 不好，受树脂影响
聚焦性(须进行光耦合的) 好，可设计双透镜且Z轴可调整 好，可设计双透镜但Z轴无法调整 不好，只能设计单一透镜
其中，Z轴是指激光光束的行进方向。由上表的比较可知，整体而言，本实用新型确实具有增进的功效性。
为让本实用新型的上述目的、特征、和优点能更明显易懂，下文特举一最佳实施例，并配合附图，作详细说明如下：
图1是一种现有的半导体激光装置的简图；
图2是另一种现有的半导体激光装置的简图；
图3a是本实用新型的一最佳实施例的简图；
图3b是图3a的最佳实施例的另一简图；
图4a及图4b是说明本实用新型的最佳实施例中帽盖和头座结合的方式的简图；
图5a至图5c是在本实用新型的最佳实施例的帽盖上端制作各种透镜的方式的简图；
图6a至图6e是本实用新型的一生产方式的流程图。
请参阅图3a，本实用新型的半导体激光塑料成形封装装置包括：一第一接脚21A，此第一接脚的一端为较宽的基板部分21A′，且在第一接脚两侧分别有第二接脚21B及第三接脚21C；一次平台25，设置于前述基板部分21A′的前缘；一半导体激光芯片26，设置于所述次平台25上，且电连接至第二接脚21B；一监控光检测器27，紧靠着前述次平台25而设置于基板21A′，且电连接至第三接脚21C，用以接收来自半导体激光芯片26的背向光源；一塑料头座22，用以固定前述三只接脚21A，21B及21C；一透明帽盖23，配合前述塑料头座22，用以将前述塑料头座22上的所有元件封装起来。
请参阅图3b，前述基板部分21A′上还具有两块散热片21A″。由半导体激光芯片产生的热能便可经由基板部分21A′上的散热片21A″引导散逸至外界。此两块散热片在使用时，配合半导体激光装置的组装，可拆弯90度，如图3a所示。
图3a所示的装置的封装方式是使帽盖23的内缘紧贴于塑料头座22的外凸缘，然后在帽盖23的边缘利用固定胶(epoxy)24，将由帽盖23及塑料头座22形成的内腔体加以密封，在内腔体内可充满氮气，以防止激光芯片氧化。
若是在帽盖前端并未制作透镜，则在封装时便无需为光耦合进行调焦。因此，封装的方式便可更为简单。请参阅图4a，可分别在帽盖内缘23A及塑料头座外缘22A设计对应的内外卡榫，则封装时，只需使内外卡榫直接互相卡住即可。或者，可如图4b所示，使帽盖底面具有凸缘23B(flange)，此一凸缘23B可利用热压的方式，粘于头座22上，这样就不需使用固定胶了。然而，图4a和图4b所示的方式中，由于帽盖前端在光轴方向上无法移动，因而一般均是使用于无需调焦的半导体激光装置上。
请参阅图5a至图5c，至于需要进行光耦合的半导体激光装置，利用本实用新型的架构更可轻易地直接在帽盖前端制作出所需要的透镜，如图5a所示，可在帽盖23前端的内外侧均制作成一球面或非球面的凸透镜23c。或如图5b所示，在帽盖23前端内侧形成一球面或非球面的凸透镜23c′，同时在帽盖23前端外侧上形成一全像片23c″。另外，也可如图5c所示，仅在帽盖23的一侧上形成一菲涅耳透镜23c。
在前述的实施例中，不论在帽盖前端是否形成透镜，均可在其内侧及外侧镀上抗反射膜(AR coating)，以防止激光反射。
接下来再说明本实用新型的实际生产过程，请参阅图6a至图6e。首先如图6a所示，将导架30置入射出成型机中；接着，如图6b所示，在导架30上成型塑料头座31及塑料连条32；然后，如图6c所示，将图6b中的金属连结33切断，以隔绝金属接脚间的电连接；接下来，如图6d所示，可利用现有的LED或IC设备将激光芯片及监控光检测器放置于基板部分33上，同时在其和其他的接脚间打线；最后，如图6e所示，进行半成品测试及调焦，亦即在金属接脚36上加上电压，以激发激光，并在激光束前加上帽盖35以调整焦距，焦距调好后再于帽盖35和头座31接触处上固定胶，以密封帽盖35与塑料头座31之内腔体，然后再切断塑料连条32，便可完成如图3b所示的成品。
对于帽盖上未制有透镜的半导体激光装置，则是在激光芯片及监控光检测器和金属接脚间的打线完成后，直接将帽盖套入塑料头座，再切断金属连结，然后折弯散热片，便可得到如图3a所示的成品。
虽然本实用新型已以一最佳实施例公开，然而其并非用以限定本发明，任何本专业的技术人员，在不脱离本实用新型的精神和范围内，可以作一些变化和改进，因此本实用新型的保护范围应当以所附的权利要求为准。

Claims (10)

1、一种半导体激光塑料成型封装装置，包括一半导体激光芯片、一监控光检测器、一基板部分、一次平台和接脚，其特征在于：
所述次平台设置于所述基板部分的前缘，所述半导体激光芯片设置于所述次平台上，所述监控光检测器紧靠着所述次平台设置于基板部分上，所述基板部分是所述第一接脚的较宽的一端，所述第二接脚和第三接脚分别位于第一接脚的两侧，且第二接脚与所述半导体激光芯片电连接，第三接脚与所述监控光检测器电连接；
还包括：一塑料头座，所述第一接脚、第二接脚和第三接脚固定于该塑料头座上；
一透明帽盖，与所述塑料头座相配合封装所有所述塑料头座上的元件。
2、根据权利要求1所述的封装装置，其特征在于，在所述基板部分上安装散热片，该散热片延伸至塑料头座的另一侧，从而将半导体激光芯片产生的热能引导至外部。
3、根据权利要求1所述的封装装置，其特征在于，所述帽盖前端的内外两侧形成为平面。
4、根据权利要求1所述的封装装置，其特征在于，所述帽盖前端的内外两侧形成为球面，即为一球面透镜。
5、根据权利要求1所述的封装装置，其特征在于，所述帽盖形成为一单一透镜及一全像片。
6、根据权利要求1所述的封装装置，其特征在于，所述帽盖前端形成为一菲涅耳透镜。
7、根据权利要求1所述的封装装置，其特征在于，所述帽盖与塑料头座的接触面为一凹凸卡榫，可互相卡住。
8、根据权利要求1所述的封装装置，其特征在于，所述帽盖底面具有凸缘，利用热压的方式进行封盖。
9、根据权利要求1所述的封装装置，其特征在于，所述塑料头座为深色，用以吸收所述半导体激光芯片的背向光。
10、根据权利要求1所述的封装装置，其特征在于，所述塑料头座与形成有透镜且经焦距调整的帽盖之间利用固定胶粘合固定。
CN96211640U 1995-12-29 1996-05-05 半导体激光塑料成型封装装置 Expired - Lifetime CN2255682Y (zh)

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