CN100428514C - 在导热部分中具有凹部的led封装 - Google Patents
在导热部分中具有凹部的led封装 Download PDFInfo
- Publication number
- CN100428514C CN100428514C CNB2006101106884A CN200610110688A CN100428514C CN 100428514 C CN100428514 C CN 100428514C CN B2006101106884 A CNB2006101106884 A CN B2006101106884A CN 200610110688 A CN200610110688 A CN 200610110688A CN 100428514 C CN100428514 C CN 100428514C
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- Prior art keywords
- thermal conduction
- conduction portions
- recess
- led package
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002184 metal Substances 0.000 claims abstract description 64
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 238000004806 packaging method and process Methods 0.000 claims description 51
- 238000007789 sealing Methods 0.000 claims description 36
- 238000003466 welding Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
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- 238000000034 method Methods 0.000 abstract description 12
- 150000002739 metals Chemical class 0.000 abstract 2
- 239000008393 encapsulating agent Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 83
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 238000005516 engineering process Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000004080 punching Methods 0.000 description 7
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- 239000000758 substrate Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
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- 230000005540 biological transmission Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 235000013351 cheese Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0072435 | 2005-08-08 | ||
KR1020050072435 | 2005-08-08 | ||
KR1020050072435A KR100632003B1 (ko) | 2005-08-08 | 2005-08-08 | 열전달부에 오목부가 형성된 led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1913187A CN1913187A (zh) | 2007-02-14 |
CN100428514C true CN100428514C (zh) | 2008-10-22 |
Family
ID=37127869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101106884A Active CN100428514C (zh) | 2005-08-08 | 2006-08-08 | 在导热部分中具有凹部的led封装 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8169128B2 (zh) |
EP (1) | EP1753038A3 (zh) |
JP (2) | JP4758301B2 (zh) |
KR (1) | KR100632003B1 (zh) |
CN (1) | CN100428514C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386176A (zh) * | 2010-09-02 | 2012-03-21 | 三星Led株式会社 | 发光二极管封装件及其制造方法 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100629496B1 (ko) * | 2005-08-08 | 2006-09-28 | 삼성전자주식회사 | Led 패키지 및 그 제조방법 |
WO2007054847A2 (en) * | 2005-11-09 | 2007-05-18 | Koninklijke Philips Electronics N.V. | Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device |
DE102006048230B4 (de) * | 2006-10-11 | 2012-11-08 | Osram Ag | Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung |
KR100818518B1 (ko) * | 2007-03-14 | 2008-03-31 | 삼성전기주식회사 | Led 패키지 |
JP5233170B2 (ja) * | 2007-05-31 | 2013-07-10 | 日亜化学工業株式会社 | 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法 |
CN101688657B (zh) * | 2007-06-28 | 2012-06-20 | 夏普株式会社 | 背光装置、液晶显示装置以及照明装置 |
KR101088910B1 (ko) * | 2008-05-29 | 2011-12-07 | 삼성엘이디 주식회사 | Led 패키지 및 그 제조방법 |
US20100059783A1 (en) * | 2008-09-08 | 2010-03-11 | Harry Chandra | Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation |
CN201307605Y (zh) * | 2008-12-05 | 2009-09-09 | 弘凯光电(深圳)有限公司 | Led封装结构 |
JP5195678B2 (ja) * | 2009-07-29 | 2013-05-08 | 豊田合成株式会社 | 発光装置の搭載構造及び搭載方法 |
KR20130036737A (ko) * | 2010-01-25 | 2013-04-12 | 비쉐이 스프라그, 인코포레이티드 | 금속계 전자 구성요소 및 그 제조 방법 |
CN102185082B (zh) * | 2011-04-08 | 2013-03-27 | 深圳市华星光电技术有限公司 | 发光二极管构造及其制造方法 |
JP2012238830A (ja) * | 2011-05-09 | 2012-12-06 | Lumirich Co Ltd | 発光ダイオード素子 |
CN102252299B (zh) * | 2011-06-27 | 2014-04-16 | 成都曙光光纤网络有限责任公司 | Led灯具的散热***和led灯具 |
DE102012107547B4 (de) * | 2011-08-22 | 2020-12-31 | Samsung Electronics Co., Ltd. | Gehäuse für eine lichtabgebende Vorrichtung |
CN103094450A (zh) * | 2011-11-03 | 2013-05-08 | 广东德豪润达电气股份有限公司 | Led封装支架、led器件及led器件的制造方法 |
FI20125932A (fi) * | 2012-09-08 | 2014-03-09 | Lighttherm Oy | Menetelmä LED valaisinlaitteiden valmistamiseksi ja LED valaisinlaitteet |
JP6481349B2 (ja) | 2014-12-02 | 2019-03-13 | 日亜化学工業株式会社 | パッケージの製造方法及び発光装置の製造方法 |
JP6387824B2 (ja) | 2014-12-25 | 2018-09-12 | 日亜化学工業株式会社 | パッケージ、発光装置及びそれらの製造方法 |
KR102674066B1 (ko) * | 2016-11-11 | 2024-06-13 | 삼성전자주식회사 | 발광 소자 패키지 |
KR102261288B1 (ko) * | 2017-03-14 | 2021-06-04 | 현대자동차 주식회사 | 자동차 외장용 발광다이오드 패키지 |
KR102425807B1 (ko) * | 2017-09-25 | 2022-07-28 | 엘지전자 주식회사 | 디스플레이 디바이스 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020076849A1 (en) * | 2000-12-07 | 2002-06-20 | Bily Wang | Focusing cup on a folded frame for surface mount optoelectric semiconductor package |
US20040075100A1 (en) * | 2001-04-10 | 2004-04-22 | Georg Bogner | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53108871U (zh) | 1977-02-08 | 1978-08-31 | ||
DE2709601C2 (de) * | 1977-03-03 | 1978-07-27 | Mannesmann Ag, 4000 Duesseldorf | Anwendung des Verfahrens nach DT-AS 1237241 zum elektrischen Nahtschweißen von Stahlrohren |
JP2711345B2 (ja) * | 1987-07-07 | 1998-02-10 | 株式会社リコー | 基礎体温測定方法 |
JP2981370B2 (ja) * | 1993-07-16 | 1999-11-22 | シャープ株式会社 | Midチップ型発光素子 |
DE4446566A1 (de) * | 1994-12-24 | 1996-06-27 | Telefunken Microelectron | Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement |
JPH11214754A (ja) * | 1998-01-28 | 1999-08-06 | Rohm Co Ltd | 半導体発光装置 |
US6184544B1 (en) * | 1998-01-29 | 2001-02-06 | Rohm Co., Ltd. | Semiconductor light emitting device with light reflective current diffusion layer |
US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
JP3310955B2 (ja) * | 1999-01-05 | 2002-08-05 | 日亜化学工業株式会社 | 発光ダイオード及びその製造方法、並びにそれを用いた表示装置 |
JP4366767B2 (ja) * | 1999-07-15 | 2009-11-18 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
JP3964590B2 (ja) * | 1999-12-27 | 2007-08-22 | 東芝電子エンジニアリング株式会社 | 光半導体パッケージ |
JP2002252372A (ja) * | 2001-02-26 | 2002-09-06 | Nichia Chem Ind Ltd | 発光ダイオード |
JP3736366B2 (ja) * | 2001-02-26 | 2006-01-18 | 日亜化学工業株式会社 | 表面実装型発光素子およびそれを用いた発光装置 |
US20020163001A1 (en) * | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
CN100533723C (zh) * | 2002-08-05 | 2009-08-26 | 奥斯兰姆奥普托半导体有限责任公司 | 电引线架的制造方法,表面安装的半导体器件的制造方法和引线架带 |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
JP2004119610A (ja) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Ind Co Ltd | リードフレーム、それを用いた樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法 |
JP3910144B2 (ja) * | 2003-01-06 | 2007-04-25 | シャープ株式会社 | 半導体発光装置およびその製造方法 |
JP4975946B2 (ja) * | 2003-09-01 | 2012-07-11 | Necトーキン株式会社 | チップ型固体電解コンデンサ及びその製造方法 |
JP2005116937A (ja) * | 2003-10-10 | 2005-04-28 | Matsushita Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
KR100587020B1 (ko) * | 2004-09-01 | 2006-06-08 | 삼성전기주식회사 | 고출력 발광 다이오드용 패키지 |
US7977698B2 (en) * | 2005-03-18 | 2011-07-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | System and method for surface mountable display |
-
2005
- 2005-08-08 KR KR1020050072435A patent/KR100632003B1/ko active IP Right Grant
-
2006
- 2006-08-07 JP JP2006214617A patent/JP4758301B2/ja active Active
- 2006-08-08 CN CNB2006101106884A patent/CN100428514C/zh active Active
- 2006-08-08 US US11/500,361 patent/US8169128B2/en active Active
- 2006-08-08 EP EP06254175A patent/EP1753038A3/en not_active Withdrawn
-
2011
- 2011-02-07 JP JP2011024230A patent/JP5246893B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020076849A1 (en) * | 2000-12-07 | 2002-06-20 | Bily Wang | Focusing cup on a folded frame for surface mount optoelectric semiconductor package |
US20040075100A1 (en) * | 2001-04-10 | 2004-04-22 | Georg Bogner | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386176A (zh) * | 2010-09-02 | 2012-03-21 | 三星Led株式会社 | 发光二极管封装件及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100632003B1 (ko) | 2006-10-09 |
JP2007049149A (ja) | 2007-02-22 |
JP4758301B2 (ja) | 2011-08-24 |
JP5246893B2 (ja) | 2013-07-24 |
EP1753038A3 (en) | 2012-11-21 |
JP2011101053A (ja) | 2011-05-19 |
US20070030703A1 (en) | 2007-02-08 |
US8169128B2 (en) | 2012-05-01 |
CN1913187A (zh) | 2007-02-14 |
EP1753038A2 (en) | 2007-02-14 |
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