CN220579429U - Film water electroplating device with function of deplating conductive roller coating - Google Patents
Film water electroplating device with function of deplating conductive roller coating Download PDFInfo
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- CN220579429U CN220579429U CN202321931150.5U CN202321931150U CN220579429U CN 220579429 U CN220579429 U CN 220579429U CN 202321931150 U CN202321931150 U CN 202321931150U CN 220579429 U CN220579429 U CN 220579429U
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- plating
- conductive roller
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- thin film
- roller
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- 238000009713 electroplating Methods 0.000 title claims abstract description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 238000007761 roller coating Methods 0.000 title claims description 7
- 238000007747 plating Methods 0.000 claims abstract description 111
- 239000010408 film Substances 0.000 claims description 103
- 239000007788 liquid Substances 0.000 claims description 69
- 238000005520 cutting process Methods 0.000 claims description 54
- 239000010409 thin film Substances 0.000 claims description 24
- 230000000149 penetrating effect Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052802 copper Inorganic materials 0.000 abstract description 22
- 239000010949 copper Substances 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 9
- 229910001431 copper ion Inorganic materials 0.000 description 9
- 230000005611 electricity Effects 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a film water electroplating device with a plating function of a conductive roller for plating, which comprises a conductive roller, wherein the conductive roller is in contact with a film, and the film water electroplating device with the plating function of the conductive roller for plating further comprises an unreeling mechanism, a reeling mechanism, an electroplating bath and a containing groove which are arranged between the unreeling mechanism and the reeling mechanism, a first power supply, an electroplating anode arranged in the electroplating bath, a second power supply arranged outside the containing groove and a cathode part arranged in the containing groove. The utility model solves the problems that in the hydropower plating production process, plating solution attached to the surface of the film contacts with the conductive roller, so that the surface of the conductive roller is crystallized and plated with copper, and the surface of the film is easy to damage.
Description
Technical Field
The utility model relates to the technical field of water electroplating, in particular to a thin film water electroplating device, and especially relates to a thin film water electroplating device with a plating function of a conductive roller.
Background
In the conventional film water electroplating production process, the film is generally conducted through a conductive roller, the film passes through plating solution, and a layer of plating solution is attached to the surface to contact the conductive roller, so that the surface of the conductive roller is crystallized and plated with copper, and the surface of the film is easily damaged. This is unacceptable for a production line with high film quality requirements and severely impacts the overall production efficiency of the enterprise.
In summary, the following problems exist in the prior art: in the water electroplating production process, when a film with plating solution attached to the surface contacts the conductive roller, crystallization and copper plating on the surface of the conductive roller are caused, and the surface of the film is easily damaged.
Disclosure of Invention
The utility model provides a film water electroplating device with a function of deplating a conductive roller coating, which aims to solve the problems that in the hydropower plating production process in the prior art, when a film with plating solution attached to the surface contacts the conductive roller, crystallization and copper plating are caused on the surface of the conductive roller, and damage is easily caused on the surface of the film.
Therefore, the utility model provides a film water electroplating device with a function of electroplating a conductive roller coating, which adopts the following technical scheme:
the film water electroplating device with the plating function of the conductive roller comprises a conductive roller, wherein the conductive roller is in contact with a film, and the film water electroplating device with the plating function of the conductive roller further comprises an unreeling mechanism, a reeling mechanism, an electroplating tank and a containing tank which are arranged between the unreeling mechanism and the reeling mechanism, a first power supply, an electroplating anode arranged in the electroplating tank, a second power supply arranged outside the containing tank and a cathode part arranged in the containing tank;
the conductive roller is arranged in the accommodating groove;
the first power supply comprises a first positive electrode and a first negative electrode, the electroplating anode is connected with the first positive electrode, and the conductive roller is connected with the first negative electrode;
the second power supply comprises a second positive electrode and a second negative electrode, the conductive roller is connected with the second positive electrode, and the cathode part is connected with the second negative electrode.
Further, the number of the conductive rollers is two, and the two conductive rollers are respectively arranged on the upper side and the lower side of the film.
Further, the number of the cathode parts is two, and the two cathode parts and the two conductive rollers are respectively and correspondingly arranged.
Further, the number of the second power supplies is two, the conductive roller arranged above the film is connected with the second positive electrode of one of the second power supplies, and the cathode part arranged above the film is connected with the second negative electrode of one of the second power supplies; the conductive roller arranged below the film is connected with a second positive electrode of the other second power supply, and the cathode part arranged below the film is connected with a second negative electrode of the other second power supply.
Further, the plating tank and the accommodating tank are alternately arranged.
Further, the number of the first power supplies is two, the number of the electroplating anodes is two, the electroplating anode arranged above the film is connected with the first positive electrode of one of the first power supplies, and the conductive roller arranged above the film is connected with the first negative electrode of one of the first power supplies; the electroplating anode arranged below the film is connected with the first anode of the other first power supply, and the conductive roller arranged below the film is connected with the first cathode of the other first power supply.
Further, the electroplating bath comprises a first left side plate and a first right side plate, the first left side plate and the first right side plate are arranged in parallel, a first gap or a slit capable of penetrating through the film is formed in the first left side plate, and a first gap capable of penetrating through the film is formed in the first right side plate.
Further, the accommodating groove comprises a second left side plate and a second right side plate, the second left side plate and the second right side plate are arranged in parallel, a second notch capable of penetrating through the film is formed in the second left side plate, and a second notch or a gap capable of penetrating through the film is formed in the second right side plate.
Further, a first liquid cutting roller is arranged at the first notch and comprises a first upper liquid cutting roller and a first lower liquid cutting roller, and the first upper liquid cutting roller and the first lower liquid cutting roller are arranged on two sides of the film and are in contact with the film.
Further, a second liquid cutting roller is arranged at the second notch and comprises a second upper liquid cutting roller and a second lower liquid cutting roller, and the second upper liquid cutting roller and the second lower liquid cutting roller are arranged on two sides of the film and are in contact with the film.
The utility model has the following beneficial effects: film water electroplating device with function of releasing and plating conductive roller coating is through unreeling mechanism with set up plating bath and holding tank between the winding mechanism, hold electroplating positive pole in the plating bath, hold negative pole portion and conductive roller in the holding tank, then correspond to the connection with first power and second power respectively with electroplating positive pole, negative pole portion and conductive roller, concretely connected relation is: the first power supply comprises a first positive electrode and a first negative electrode, the electroplating anode is connected with the first positive electrode, the conductive roller is connected with the first negative electrode, the conductive roller can be used as a cathode, the film is contacted with the conductive roller, the cathode is electrified, a film is plated (taking copper plating as an example), and copper plating can be carried out on the conductive roller; the second power supply comprises a second positive electrode and a second negative electrode, the conductive roller is connected with the second positive electrode, and the cathode part is connected with the second negative electrode, so that the conductive roller can be used as an anode at the same time, copper ions on the conductive roller can be peeled off and deposited on the cathode part, and thus, the deposition of copper ions on the conductive roller can be reduced or avoided.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a front view of the plating cell of the utility model;
FIG. 3 is a left side view of the plating cell of the utility model;
fig. 4 is a left side view of the receiving groove of the present utility model.
Reference numerals illustrate: 1. a film; 2. a conductive roller; 3. an unreeling mechanism; 4. a winding mechanism; 5. plating bath; 6. a receiving groove; 7. a first power supply; 8. electroplating an anode; 9. a second power supply; 10. a cathode portion; 11. a second positive electrode; 12. a second negative electrode; 13. a first reservoir; 14. a first positive electrode; 15. a first negative electrode; 16. a first left side plate; 17. a first right side plate; 18. a first notch; 19. a second left side plate; 20. a second right side plate; 21. a second notch; 22. a first upper liquid cutting roller; 23. a first lower liquid cutting roller; 24. a second upper liquid cutting roller; 25. a second lower liquid cutting roller; 26. a second reservoir.
Detailed Description
The present utility model will now be described for a clearer understanding of technical features, objects, and effects of the present utility model.
The film water electroplating device with the function of plating the conductive roller plating layer by means of the stripping is shown in fig. 1, and comprises a conductive roller 2, wherein the conductive roller 2 is in contact with a film 1, and the film water electroplating device with the function of plating the conductive roller plating layer by means of the stripping further comprises an unreeling mechanism 3, a reeling mechanism 4, an electroplating bath 5, a containing tank 6, a first power supply 7, an electroplating anode 8, a second power supply 9, a cathode part 10, a first liquid storage tank 13 and a second liquid storage tank 26; wherein, when the number of the first power supply 7, the second power supply 9, the electroplating anode 8, the conductive roller 2 and the cathode part 10 is one, and the electroplating anode 8, the conductive roller 2 and the cathode part 10 are all on the same side of the film 1, electroplating is single-sided film plating;
plating tank 5 and holding tank 6 are provided between unreeling mechanism 3 and reeling mechanism 4 and alternately arranged at intervals, for example, plating tank 5 is in front, holding tank 6 is in back alternately or plating tank 5 is in back, holding tank 6 is in front alternately. The plating solution in the plating tank 5 and the plating solution in the containing tank 6 cannot be mixed, otherwise streaming is easily caused, and the effect of the copper stripping of the conductive roller 2 to the cathode part is affected; the bottom of the electroplating bath 5 is provided with a first liquid storage tank 13, the plating solution in the electroplating bath 5 flows out to the first liquid storage tank 13 at the bottom of the electroplating bath 5, and the plating solution in the first liquid storage tank 13 can be pumped to the electroplating bath 5; the bottom of the accommodating groove 6 is provided with a second liquid storage groove 26, the plating solution in the accommodating groove 6 flows out to the second liquid storage groove 26 at the bottom of the accommodating groove 6, and the plating solution in the second liquid storage groove 26 can be pumped to the accommodating groove 6;
the first power supply 7 is arranged outside the electroplating bath 5, the electroplating anode 8 is arranged in the electroplating bath 5, the first power supply 7 comprises a first positive electrode 14 and a first negative electrode 15 during electroplating, the electroplating anode 8 is connected with the first positive electrode 14, and the conductive roller 2 is connected with the first negative electrode 15; the electroplating anode 8 is also positioned in the plating solution, in the electroplating process, the conductive roller 2 can be used as a cathode, the film 1 is contacted with the conductive roller 2, the cathode is electrified, a plated film (taking copper plating as an example) is plated, and copper can be plated on the conductive roller 2;
the second power supply 9 is arranged outside the accommodating groove 6, the cathode part 10 and the conductive roller 2 are arranged in the accommodating groove 6, the material of the cathode part 10 is preferably consistent with the metal material plated on the film 1, the cathode part 10 is a copper bar, the cathode part 10 is arranged in the plating solution, copper ions can be deposited on the cathode part 10, the second power supply 9 comprises a second positive electrode 11 and a second negative electrode 12, the conductive roller 2 is connected with the second positive electrode 11, and the cathode part 10 is connected with the second negative electrode 12; in the electroplating, the conductive roller 2 can be used as an anode, copper ions on the conductive roller can be stripped and deposited on the cathode part 10, so that copper ion deposition on the conductive roller 2 can be reduced or avoided.
The negative electrode of the first power supply 7 and the positive electrode of the second power supply 9 are connected to the two ends of the conductive roller 2, so that the current on the conductive roller 2 is uniform, and the thickness of the plating layer is uniform.
Because the conductive roller 2 can be electrified with cathode electricity and anode electricity, the film 1 is contacted with the conductive roller 2, and can be electrified with the cathode electricity and the anode electricity, but the current of film electroplating is very large, and is hundreds of amperes, the current of the conductive roller 2 for deplating is smaller, only 1-2 amperes are needed, and a copper rod (taking the copper rod as an example) is close to the conductive roller 2 and is thinner than the film 1, copper on the conductive roller 2 can be electrolyzed preferentially, so that the copper of the film 1 can not be stripped almost.
Further, the plating tank 5 includes a first left side plate 16 and a first right side plate 17, as shown in fig. 1, 2 and 3, the first left side plate 16 and the first right side plate 17 are disposed in parallel, a first notch 18 capable of passing through the film 1 is provided on the first left side plate 16, and in addition, the left side plate of the plating tank 5 may not be provided with the first notch 18, but a slit is used for passing through the film 1. The first right side plate 17 is provided with a first notch 18 which can pass through the film 1; the first notch 18 is provided with a first liquid cutting roller, so as to squeeze the plating liquid on the surface of the film 1, and prevent the film from bringing the plating liquid of the plating tank 5 to the containing tank 6. The first liquid cutting roller comprises a first upper liquid cutting roller 22 and a first lower liquid cutting roller 23, the first upper liquid cutting roller 22 and the first lower liquid cutting roller 23 are arranged on two sides of the film 1 and are in contact with the film 1, and the first upper liquid cutting roller and the first lower liquid cutting roller are matched with each other to squeeze the film 1 so as to squeeze plating liquid on the surface of the film 1. With the first notch 18, the plating solution in the plating tank 5 overflows largely, and the two solution cutting rolls can also block the first notch 18, so that the plating solution can be prevented from flowing out to the greatest extent.
Further, the accommodating tank 6 includes a second left side plate 19 and a second right side plate 20, as shown in fig. 1 and 4, the left view of the accommodating tank refers to the left view of the plating tank in fig. 3, the second left side plate 19 and the second right side plate 20 are arranged in parallel, a second notch 21 capable of penetrating the film is provided on the second left side plate 19, a second notch 21 capable of penetrating the film 1 is provided on the second right side plate 20, and in addition, a slit is not provided on the second right side plate 20, but a slit is used for penetrating the film 1. The second notch 21 is provided with a second liquid cutting roller for squeezing the plating liquid on the surface of the film 1, so that the film 1 is prevented from bringing the plating liquid in the containing tank 6 to the plating tank 5. The second liquid cutting roller comprises a second upper liquid cutting roller 24 and a second lower liquid cutting roller 25, the second upper liquid cutting roller 24 and the second lower liquid cutting roller 25 are arranged on two sides of the film 1 and are in contact with the film 1, and the second upper liquid cutting roller 24 and the second lower liquid cutting roller are matched with each other to squeeze the film so as to squeeze plating liquid on the surface of the film 1. With the second notch 21, the plating solution in the accommodating groove 6 overflows largely, so that the two solution cutting rollers can also block the second notch 21, and the plating solution can be prevented from flowing out to the greatest extent. The conductive roller 2 can be, for example, higher than the height of the second cut-off roller, but it is necessary to ensure that the conductive roller 2 is in the plating solution.
The film 1 passes through the first liquid cutting roller on the right side of the electroplating bath 5 and the second liquid cutting roller on the left side of the containing groove 6, and the plating liquid on the film 1 can be almost squeezed out after two liquid cutting processes. If there are no two cuts, the plating solutions in the plating tank 5 and the containing tank 6 are mixed, which easily causes series flow, and further affects the effect of the conductive roller 2 that the copper is deplated to the cathode portion 10.
Further, when the number of the first power supply 7, the second power supply 9, the plating anode 8, the conductive roller 2, and the cathode portion 10 is two and the plating anode 8, the conductive roller 2, and the cathode portion 10 are respectively disposed on the upper and lower sides of the film 1, the plating is a double-sided plating film, and when it is a double-sided plating film:
the cathode part 10 arranged above the film 1 is arranged corresponding to the conductive roller 2 arranged above the film 1, and the cathode part 10 arranged below the film 1 is arranged corresponding to the conductive roller 2 arranged below the film 1;
two first power supplies 7 are all arranged outside the electroplating bath 5, two second power supplies 9 are all arranged outside the containing tank 6, and the specific structure setting and connection relation are as follows:
the conductive roller 2 arranged above the film 1 is connected with a second positive electrode 11 of one of the second power supplies 9, and the cathode part 10 arranged above the film 1 is connected with a second negative electrode 12 of one of the second power supplies 9, so that the conductive roller 2 and the cathode part 10 which are correspondingly arranged are connected with the same second power supply 9; the conductive roller 2 arranged below the film 1 is connected with the second positive electrode 11 of the other second power supply 9, and the cathode part 10 arranged below the film 1 is connected with the second negative electrode 12 of the other second power supply 9, so that the two conductive rollers are guaranteed to be electrified, and the conductive roller 2 and the cathode part 10 which are correspondingly arranged are guaranteed to be connected with the same second power supply 9. The two conductive rollers 2 are made to be electrified as above.
The electroplating anode 8 above the film 1 is connected with the first positive electrode 14 of one of the first power supplies 7, and the conductive roller 2 above the film 1 is connected with the first negative electrode 15 of one of the first power supplies 7, so that the electroplating anode 8 above the film and the conductive roller 2 are connected with the same first power supply 7; the electroplating anode 8 arranged below the film 1 is connected with the first positive electrode 14 of the other first power supply 7, and the conductive roller 2 arranged below the film 1 is connected with the first negative electrode 15 of the other first power supply 7, so that the electroplating anode 8 arranged below the film and the conductive roller 2 are connected with the same first power supply 7. The two conductive rollers 2 are made to be electrified by the cathode as set forth above.
The cathodes of the two first power supplies 7 and the anodes of the two second power supplies 9 are respectively connected to the two ends of the two conductive rollers 2, so that the current on the two conductive rollers 2 is uniform, and the thickness of the plating layer is uniform. In the case of double-sided plating, if there is only one plating tank 5 and one containing tank 6, two first power sources 7 and two second power sources 9 are required, and if there are two plating tanks 5 and two containing tanks 6, four first power sources 7 and four second power sources 9 are required.
The conductive roller 2 can be used as a cathode, the film 1 is contacted with the conductive roller 2, the cathode is electrified, the coated film (for example, copper plating) is coated on the conductive roller 2, but the conductive roller 2 can be used as an anode at the same time, copper ions on the conductive roller can be stripped and deposited on the cathode part 10, so that the copper ion deposition on the conductive roller 2 can be reduced or avoided. Because the conductive roller 2 can be electrified with cathode electricity and anode electricity, the film 1 can be electrified with cathode electricity and anode electricity, but the electric current for electroplating the film 1 is very large, and hundreds of amperes are high, the electric current for unplating the conductive roller 2 is smaller, only 1-2A is needed, and the copper rod is close to the conductive roller 2 than the film 1, copper on the conductive roller 2 can be electrolyzed preferentially, so that the copper of the film 1 can not be stripped almost.
The utility model provides a film water electroplating device with a function of deplating a conductive roller coating, which has the following technical effects:
1. the conductive roller in the device can be used as a cathode or an anode, when the conductive roller is electrified, the film is contacted with the conductive roller, copper plating is taken as an example on the conductive roller, copper ions on the conductive roller can be stripped and deposited on the cathode part when the conductive roller is used as the anode, and thus, the deposition of copper ions on the conductive roller can be reduced or avoided. By electrifying the anode of the conductive roller, the cathode part is increased, and copper plating of the conductive roller is reduced or avoided, so that the film is prevented from being punctured or scratched, and the high-quality film can be obtained.
2. The plating bath and the holding tank of the device are respectively provided with a first liquid cutting roller and a second liquid cutting roller, and when the device works, a film can be almost squeezed out of the plating solution on the film through the first liquid cutting roller on the right side of the plating bath and the second liquid cutting roller on the left side of the holding tank and through liquid cutting twice. If the liquid is not cut twice, the plating liquids of the plating tank and the containing tank are mixed, so that series flow is easily caused, and the effect of the conductive roller that copper is deplated to the cathode part is further affected. In addition, the first notch and the second notch on the electroplating bath and the containing tank can be blocked by the arrangement of the first liquid cutting roller and the second liquid cutting roller, so that the outflow of the plating solution can be avoided to the greatest extent.
3. The device comprises a single-sided coating and a double-sided coating, and when the device is a double-sided coating: if there is only one plating tank and one containing tank, two first power sources and two second power sources are required; if two plating tanks and two holding tanks are provided, four first power sources and four second power sources are required.
The foregoing is illustrative of the present utility model and is not to be construed as limiting the scope of the utility model. In order that the components of the utility model may be combined without conflict, any person skilled in the art shall make equivalent changes and modifications without departing from the spirit and principles of the utility model.
Claims (10)
1. The film water electroplating device with the function of electroplating the conductive roller coating comprises a conductive roller (2), wherein the conductive roller (2) is in contact with a film (1), and is characterized by further comprising an unreeling mechanism (3), a reeling mechanism (4), an electroplating tank (5) and a containing tank (6) which are arranged between the unreeling mechanism (3) and the reeling mechanism (4), a first power supply (7), an electroplating anode (8) arranged in the electroplating tank (5), a second power supply (9) arranged outside the containing tank (6) and a cathode part (10) arranged in the containing tank (6);
the conductive roller (2) is arranged in the accommodating groove (6);
the first power supply (7) comprises a first positive electrode (14) and a first negative electrode (15), the electroplating anode (8) is connected with the first positive electrode (14), and the conductive roller (2) is connected with the first negative electrode (15);
the second power supply (9) comprises a second positive electrode (11) and a second negative electrode (12), the conductive roller (2) is connected with the second positive electrode (11), and the cathode part (10) is connected with the second negative electrode (12).
2. The thin film hydropower plating device with the function of deplating the conductive roller plating layer according to claim 1, wherein the number of the conductive rollers (2) is two, and the two conductive rollers (2) are respectively arranged on the upper side and the lower side of the thin film (1).
3. The thin film hydropower plating device with the function of plating stripping the conductive roller plating according to claim 2, wherein the number of the cathode parts (10) is two, and the two cathode parts (10) are respectively arranged corresponding to the two conductive rollers (2).
4. The thin film hydropower plating device with the function of plating the conductive roller plating layer according to claim 3, wherein the number of the second power supplies (9) is two, the conductive roller (2) arranged above the thin film (1) is connected with the second positive electrode (11) of one of the second power supplies (9), and the cathode part (10) arranged above the thin film (1) is connected with the second negative electrode (12) of one of the second power supplies (9); the conductive roller (2) arranged below the film (1) is connected with a second positive electrode (11) of another second power supply (9), and the cathode part (10) arranged below the film (1) is connected with a second negative electrode (12) of the other second power supply (9).
5. The thin film hydropower plating device with a plating function of a conductive roller according to any one of claims 1 to 4, wherein the plating tank (5) and the accommodating tank (6) are alternately arranged.
6. The thin film hydropower plating device with the function of plating the conductive roller plating layer according to claim 4, wherein the number of the first power supplies (7) is two, the number of the plating anodes (8) is two, the plating anodes (8) arranged above the thin film (1) are connected with the first positive electrode (14) of one of the first power supplies (7), and the conductive roller (2) arranged above the thin film (1) is connected with the first negative electrode (15) of one of the first power supplies (7); the electroplating anode (8) arranged below the film (1) is connected with the first positive electrode (14) of the other first power supply (7), and the conductive roller (2) arranged below the film (1) is connected with the first negative electrode (15) of the other first power supply (7).
7. The thin film hydropower plating device with the function of plating stripping conductive roller plating according to any one of claims 1-4 and 6, characterized in that the plating tank (5) comprises a first left side plate (16) and a first right side plate (17), the first left side plate (16) and the first right side plate (17) are arranged in parallel, a first notch (18) or a gap capable of penetrating through the thin film (1) is arranged on the first left side plate (16), and a first notch (18) capable of penetrating through the thin film (1) is arranged on the first right side plate (17).
8. The thin film hydropower plating device with the function of plating stripping conductive roller plating according to any one of claims 1-4 and 6, characterized in that the accommodating groove (6) comprises a second left side plate (19) and a second right side plate (20), the second left side plate (19) and the second right side plate (20) are arranged in parallel, a second notch (21) capable of penetrating through the thin film is arranged on the second left side plate (19), and a second notch (21) or a slit capable of penetrating through the thin film (1) is arranged on the second right side plate (20).
9. The thin film hydropower plating device with the function of deplating the conductive roller plating layer according to claim 7, wherein a first liquid cutting roller is arranged at the first notch (18), the first liquid cutting roller comprises a first upper liquid cutting roller (22) and a first lower liquid cutting roller (23), and the first upper liquid cutting roller (22) and the first lower liquid cutting roller (23) are arranged at two sides of the thin film (1) and are in contact with the thin film (1).
10. The thin film hydropower plating device with the function of deplating the conductive roller plating layer according to claim 8, wherein a second liquid cutting roller is arranged at the second notch (21), the second liquid cutting roller comprises a second upper liquid cutting roller (24) and a second lower liquid cutting roller (25), and the second upper liquid cutting roller (24) and the second lower liquid cutting roller (25) are arranged at two sides of the thin film (1) and are in contact with the thin film (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321931150.5U CN220579429U (en) | 2023-07-21 | 2023-07-21 | Film water electroplating device with function of deplating conductive roller coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321931150.5U CN220579429U (en) | 2023-07-21 | 2023-07-21 | Film water electroplating device with function of deplating conductive roller coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220579429U true CN220579429U (en) | 2024-03-12 |
Family
ID=90107597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321931150.5U Active CN220579429U (en) | 2023-07-21 | 2023-07-21 | Film water electroplating device with function of deplating conductive roller coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220579429U (en) |
-
2023
- 2023-07-21 CN CN202321931150.5U patent/CN220579429U/en active Active
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