CN213977940U - Auxiliary groove for preventing copper plating of conductive roller at lower side of coating film - Google Patents
Auxiliary groove for preventing copper plating of conductive roller at lower side of coating film Download PDFInfo
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- CN213977940U CN213977940U CN202022903370.XU CN202022903370U CN213977940U CN 213977940 U CN213977940 U CN 213977940U CN 202022903370 U CN202022903370 U CN 202022903370U CN 213977940 U CN213977940 U CN 213977940U
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Abstract
The utility model discloses a prevent copper-plated auxiliary tank of coating film downside conducting roller among the manufacturing technical field of copper-plated membrane, install in the downside of conducting roller, the coating film product is walked around by the conducting roller upside, the conducting roller is connected with the negative pole output of first power, the anodal output of first power is connected with electroplating positive pole, it includes upper end open-ended cell body, be equipped with the auxiliary tank plating solution in the cell body, the plating bath intercommunication in the electroplating bath at auxiliary tank plating solution and electroplating positive pole place, the downside of conducting roller floods in the auxiliary tank plating solution, its upper end exposes outside the auxiliary tank plating solution, be equipped with the auxiliary electrode side by side with the conducting roller in the cell body, the auxiliary electrode is connected with the negative pole output of second power, another end connection of the anodal output of second power and conducting roller. The utility model discloses when copper facing to non-metallic film, produce the copper facing easily on the conducting roller, influence the problem of copper film quality, through newly-increased auxiliary electrode, carry out the electrolysis to the copper electroplating on the conducting roller, guaranteed that no copper remains on the conducting roller, improvement copper film product quality.
Description
Technical Field
The utility model relates to a manufacturing technical field of electro-coppering film, specific theory relates to a prevent copper-plated auxiliary tank of coating film downside conducting roller.
Background
In the process of copper film electroplating, the surface of a plated film can have certain plating solution, and in the process of electroplating when the plated film bypasses the upper side of the conductive roller, the plating solution can also contact with the conductive roller when the plated film contacts with the conductive roller, so that the plating solution and the conductive roller are subjected to electroplating reaction, large-area copper is deposited on the surface of the conductive roller, and the large-area copper deposition can cause great influence on the production of the film. For example, copper particles or copper burrs deposited at a certain point can puncture or scratch the film, affecting the quality of the coated product.
In order to solve the problem, the copper removal method commonly used in the industry is a physical method, and the conductive roller is sprayed and cleaned by a physical method, or a scraper is used for scraping copper on the surface of the conductive roller. For example, chinese patent publication No. CN202898572U discloses an apparatus for preventing copper plating on a conductive roller, which prevents copper plating on the conductive roller by providing a shower pipe at the bottom of the conductive roller to clean copper powder remaining on the conductive roller.
However, the existing physical methods can only remove the deposited copper formed on the surface of the conductive roller, so that the residual copper particles on the surface of the conductive roller cannot be completely removed, the requirement of the non-metal coated copper cannot be met, and the effective components of the plating solution can be influenced, thereby further influencing the copper plating effect of the coated film.
The above-mentioned drawbacks, worth improving.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides an auxiliary groove for preventing the conductive roller at the lower side of a coating film from being plated with copper.
The utility model discloses technical scheme as follows:
an auxiliary tank for preventing a conductive roller at the lower side of a coated film from being plated with copper is arranged at the lower side of the conductive roller, a coated product is wound by the upper side of the conductive roller, the end part of the conductive roller is connected with the negative electrode output end of a first power supply, and the positive electrode output end of the first power supply is connected with an electroplating anode;
the lower side of the conductive roller is submerged in the plating solution of the auxiliary tank, and the upper end of the conductive roller is exposed out of the plating solution of the auxiliary tank;
still be equipped with in the cell body with the auxiliary electrode that the conducting roller is side by side, the auxiliary electrode is connected with the negative pole output of second power, the anodal output of second power with another tip of conducting roller is connected.
According to the above scheme the utility model discloses, its characterized in that, the cell body is made by the PVC board.
According to above-mentioned scheme the utility model discloses, a serial communication port, the cell body includes bottom plate and curb plate, the curb plate is located around the bottom plate, and with bottom plate fixed connection.
According to the above scheme the utility model discloses, its characterized in that, auxiliary electrode is located under the conducting roller.
According to the above scheme the utility model discloses, a serial communication port, be equipped with branch liquid pipe in the cell body, be equipped with a plurality of minutes liquid holes on dividing the liquid pipe.
Furthermore, one end of the liquid separating pipe is communicated with a liquid inlet arranged on the tank body, and the plating bath of the plating tank is communicated with the plating bath of the auxiliary tank through the liquid inlet, the liquid separating pipe and an upper end opening of the auxiliary tank.
Further, the one end of dividing the liquid pipe with the inlet that sets up on the cell body communicates, still be equipped with the liquid outlet on the cell body, plate the pond plating solution with by between the auxiliary tank plating solution the inlet divide the liquid pipe and the liquid outlet communicates.
Furthermore, the auxiliary tank and the electroplating tank are fixed above the main tank, a main tank plating solution is arranged in the main tank, and the auxiliary tank plating solution, the electroplating tank plating solution and the main tank plating solution are communicated.
According to the above scheme the utility model discloses, its characterized in that, the tip of conducting roller is passed through the conducting rod and is connected with the conducting slip ring, the tip and the electrode connection of electric lines of auxiliary electrode.
According to the above scheme the utility model discloses, its characterized in that, auxiliary electrode is bar copper, titanium stick, stainless steel stick, or titanium package bar copper.
According to the above scheme the utility model discloses, its beneficial effect lies in, the utility model discloses install on the conducting roller of coating film product downside, through the auxiliary electrode that increases and conducting roller series connection for the plating bath in the auxiliary tank forms the return circuit, and makes the conducting roller as electrolytic positive pole, the negative pole of electroplating, electrolytic copper and electrolytic copper's balance on the realization conducting roller, copper residue appears on avoiding the conducting roller, and then improves the copper-plated quality of coating film product.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the present invention after being installed in a coating apparatus;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is an enlarged view of portion B of FIG. 3;
FIG. 5 is an enlarged view of portion C of FIG. 3;
fig. 6 is a circuit diagram for implementing the present invention.
In the figure, 01 — first rectifier; 02-a second rectifier;
101-auxiliary bath plating solution; 11-a base plate; 12-side plates; 13-a conductive roller; 131-a bearing; 132-a conductive rod; 133-a conductive slip ring; 134-electrode wires; 14-an auxiliary electrode; 15-liquid separating pipe; 151-liquid separation holes; 152-a liquid inlet;
20-coating the film product;
30-a body groove; 301-main bath plating solution; 31-a first main trough riser; 32-a second main trough riser; 33-a third main groove vertical plate;
40-an electroplating pool; 401-plating bath of plating bath; 41-electroplating of anode.
Detailed Description
The invention is further described with reference to the following figures and embodiments:
in the electroplating process of the coated product, the coated product bypasses from the upper side of the conductive roller and enters the electroplating pool, and the electroplating pool and the electroplating anode are arranged in the electroplating pool. One end of the conductive roller is connected with the negative output end of the first power supply, the electroplating anode is connected with the positive output end of the first power supply, and the positive output end of the first power supply, the electroplating anode, the plating solution, the conductive roller and the negative output end of the first power supply are sequentially connected to form an electroplating loop, so that electroplating of a coated product is realized.
In order to avoid copper particles from depositing on the surface of the conductive roller in the electroplating process, an auxiliary tank for electrolysis is arranged at the front end of the electroplating tank.
As shown in fig. 1 to 6, an auxiliary groove for preventing the conductive roller 13 from being plated with copper on the lower side of the plating film is installed on the lower side of the conductive roller 13. Specifically, the auxiliary tank comprises a tank body with an opening at the upper end, the conductive roller 13 is positioned at the opening of the tank body, the upper end of the conductive roller is exposed out of the upper surface of the tank body, and the coated product 20 is wound around the upper side of the conductive roller 13.
Preferably, the trough body comprises a bottom plate 11 and side plates 12, and the side plates 12 are positioned around the bottom plate 11 and fixedly connected with the bottom plate 11. The utility model provides a cell body is made by the PVC board, can also be made by other acid and alkali corrosion resistance material except PVC.
In order to realize the electrolysis of the conductive roller 13, an auxiliary electrode 14 which is parallel to the conductive roller 13 is arranged in the tank body, the auxiliary electrode 14 is connected with the negative electrode output end of a second power supply, and the positive electrode output end of the second power supply is connected with the other end part of the conductive roller 13; meanwhile, an auxiliary tank plating solution 101 is arranged in the tank body, and the auxiliary tank plating solution 101 is communicated with a plating tank plating solution 401 in the plating tank 40 where the plating anode 41 is positioned. The positive output end of the second power supply, the conductive roller 13, the auxiliary tank plating solution 101, the auxiliary electrode 14 and the negative output end of the second power supply are sequentially connected to form an electrolytic loop, so that copper deposition is prevented from occurring in the process of electroplating the coated product 20 by the conductive roller 13.
The utility model discloses in, auxiliary electrode 14's tip is connected with electrode wire 134, and auxiliary electrode 14 passes through electrode wire 134 to be connected with the negative pole output of second power. Preferably, the auxiliary electrode 14 is a copper rod, and a copper rod, a titanium rod, a stainless steel rod, a titanium-clad copper rod, or the like can also be used.
The utility model discloses insert conducting roller 13 respectively the negative pole output of first power, the anodal output of second power for conducting roller 13 acts as the negative pole, acts as the positive pole among the electrolysis process at electroplating process respectively, realizes the balance of copper facing and electrolytic copper on conducting roller 13, and then does not have the remaining purpose of copper on the conducting roller 13.
Preferably, the lower side of the conductive roller 13 is submerged in the auxiliary bath plating solution 101, and the upper end thereof is exposed outside the auxiliary bath plating solution 101. In the embodiment shown in FIG. 1, the lower half of the conductive roller 13 is submerged in the auxiliary bath 101, and the upper half thereof is exposed to the outside of the auxiliary bath 101.
Preferably, the auxiliary electrode 14 is positioned right below the conductive roller 13, so that the current distribution in the tank body can be ensured to be more uniform, and the balance between the electroplating process and the electrolysis process can be ensured.
The utility model discloses a be equipped with branch liquid pipe 15 in the cell body, be equipped with a plurality of branch liquid holes 151 auxiliary tank plating solution 101 on branch liquid pipe 15 and from dividing liquid hole 151 entering auxiliary tank behind branch liquid pipe 15. In one embodiment, one end of the liquid separating tube 15 is connected to the liquid inlet 152 disposed on the tank body, and the plating bath 401 is connected to the plating bath 101 of the auxiliary tank through the liquid inlet 152, the liquid separating tube 15 and the upper end opening of the auxiliary tank. In another embodiment, one end of the liquid-separating tube 15 is connected to a liquid inlet 152 disposed on the tank body, a liquid outlet is disposed on the tank body, and the plating bath 401 and the auxiliary tank plating bath 101 are connected by the liquid inlet 152, the liquid-separating tube 15 and the liquid outlet.
As shown in fig. 2 to 5, the utility model discloses after being applied to electroplating device, in order to realize the circulation of plating bath in auxiliary tank and the electroplating bath 40, install auxiliary tank and electroplating bath 40 in the upper end of main part groove 30, the main groove plating bath 301 intercommunication in auxiliary tank plating bath 101 and the electroplating bath 401 in the auxiliary tank and the electroplating bath 40 all with the main part groove 30, and then realize the intercommunication of plating bath in the whole equipment, guarantee the accurate realization of coating film product 20 electroplating process.
The main body groove 30 includes a fixed plate, and a first main groove vertical plate 31, a second main groove vertical plate 32, and a third main groove vertical plate 33 fixed on the fixed plate, wherein the first main groove vertical plate 31 is located on the inner side of the second main groove vertical plate 32, and the second main groove vertical plate 32 is located on the inner side of the third main groove vertical plate 33. The end of the conductive roller 13 is sleeved on the first main groove vertical plate 31 through a bearing 131, the end of the conductive roller 13 is connected with the conductive slip ring 133 through the conductive rod 132, the end of the inner side of the conductive rod 132 passes through the second main groove vertical plate 32 to be connected with the conductive roller 13, the end of the outer side of the conductive rod 132 passes through the third main groove vertical plate 33 to be connected with the conductive slip ring 133, the conductive slip ring 1331 at the end of one side of the conductive roller 13 is connected with the negative output end of the first power supply, and the conductive slip ring 133 at the end of the other side of the conductive roller is connected with the positive output end of the second power supply.
The main body groove 30 provides an intermediate passage for the circulation of the plating solution in the auxiliary groove and the main body groove 30, and simultaneously, the support of the auxiliary groove and the main body groove 30 can be realized.
As shown in fig. 6, in the implementation process of the present invention: the positive output end V1+ of the first power supply is connected with the electroplating anode, and the negative output end V1-of the first power supply is connected with one end of the conductive roller 13. The positive output end V1+ of the first power supply, the electroplating anode, the plating solution, the conductive roller and the negative output end V1-of the first power supply are sequentially connected to form a complete current loop, so that the process of electroplating copper on the surface of a coated product is realized.
The positive output end V2+ of the second power supply is connected with the other end of the conductive roller 13, and the negative output end V2-of the second power supply is connected with the auxiliary electrode. The positive output end V2+ of the second power supply, the conductive roller, the plating solution, the auxiliary electrode and the negative output end V2-of the second power supply are sequentially connected to form a complete current loop, so that the electrolytic process of the copper on the surface of the conductive roller 13 is realized.
And because the current of the electroplating process is far larger than that of the electrolysis process, the connection of the conductive roller 13 to the second power supply does not influence the connection of the conductive roller and the first power supply and the realization of the copper electroplating process.
By this circuit connection is achieved: the conductive roller 13 acts as a cathode in the process of realizing copper plating of a coated product in cooperation with the electroplating anode, and acts as an anode in the process of cooperating with the auxiliary electrode to electrolyze copper, so that the balance between the electroplated copper on the surface of the conductive roller 13 and the electrolyzed copper is ensured on the premise of realizing copper plating, and no copper residue is left on the conductive roller 13.
In this embodiment, the first power supply includes a first rectifier 01 connected to a three-phase power supply, the second power supply includes a second rectifier 02 connected to the three-phase power supply, and a power-off protector is provided on a path where the two rectifiers are located to perform circuit protection. In other embodiments, the first power supply and the second power supply may also be implemented using pulsed power supplies.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.
Claims (10)
1. An auxiliary tank for preventing a conductive roller at the lower side of a coated film from being plated with copper is arranged at the lower side of the conductive roller, a coated product is wound by the upper side of the conductive roller, the end part of the conductive roller is connected with the negative electrode output end of a first power supply, and the positive electrode output end of the first power supply is connected with an electroplating anode;
the lower side of the conductive roller is submerged in the plating solution of the auxiliary tank, and the upper end of the conductive roller is exposed out of the plating solution of the auxiliary tank;
still be equipped with in the cell body with the auxiliary electrode that the conducting roller is side by side, the auxiliary electrode is connected with the negative pole output of second power, the anodal output of second power with another tip of conducting roller is connected.
2. The auxiliary tank for preventing the copper plating of the conductive roller at the lower side of the plated film as claimed in claim 1, wherein the tank body is made of a PVC plate.
3. The auxiliary tank for preventing the copper plating of the conductive roller at the lower side of the coated film as claimed in claim 1, wherein the tank body comprises a bottom plate and side plates, and the side plates are positioned around the bottom plate and fixedly connected with the bottom plate.
4. The auxiliary tank for preventing the copper plating of the conductive roller on the lower side of the coated film as claimed in claim 1, wherein the auxiliary electrode is located right below the conductive roller.
5. The auxiliary tank for preventing the copper plating of the conductive roller at the lower side of the coated film as claimed in claim 1, wherein a liquid separating pipe is arranged in the tank body, and a plurality of liquid separating holes are arranged on the liquid separating pipe.
6. The auxiliary tank for preventing the conductive roller at the lower side of the plated film from being plated with copper as claimed in claim 5, wherein one end of the liquid distribution pipe is communicated with a liquid inlet arranged on the tank body, and the plating solution in the plating tank is communicated with the plating solution in the auxiliary tank through the liquid inlet, the liquid distribution pipe and an upper opening of the auxiliary tank.
7. The auxiliary tank for preventing the conductive roller at the lower side of the plated film from being plated with copper as claimed in claim 5, wherein one end of the liquid dividing pipe is communicated with a liquid inlet arranged on the tank body, a liquid outlet is also arranged on the tank body, and the plating bath of the plating tank and the plating bath of the auxiliary tank are communicated through the liquid inlet, the liquid dividing pipe and the liquid outlet.
8. The auxiliary tank for preventing the conductive roller on the lower side of the plated film from being plated with copper according to claim 6 or 7, wherein the auxiliary tank and the plating tank are both fixed above a main tank, a main tank plating solution is arranged in the main tank, and the auxiliary tank plating solution, the plating tank plating solution and the main tank plating solution are all communicated.
9. The auxiliary tank for preventing the copper plating of the conductive roller on the lower side of the coated film as claimed in claim 1, wherein the end of the conductive roller is connected with the conductive slip ring through a conductive rod, and the end of the auxiliary electrode is connected with an electrode wire.
10. The auxiliary tank for preventing the copper plating of the coated lower conductive roller as claimed in claim 1, wherein the auxiliary electrode is a copper rod, a titanium rod, a stainless steel rod or a titanium-clad copper rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022903370.XU CN213977940U (en) | 2020-12-04 | 2020-12-04 | Auxiliary groove for preventing copper plating of conductive roller at lower side of coating film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022903370.XU CN213977940U (en) | 2020-12-04 | 2020-12-04 | Auxiliary groove for preventing copper plating of conductive roller at lower side of coating film |
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| CN213977940U true CN213977940U (en) | 2021-08-17 |
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| CN202022903370.XU Active CN213977940U (en) | 2020-12-04 | 2020-12-04 | Auxiliary groove for preventing copper plating of conductive roller at lower side of coating film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113930820A (en) * | 2021-09-29 | 2022-01-14 | 重庆金美新材料科技有限公司 | Production line and production method for electroplating conductive film |
| CN114717623A (en) * | 2022-02-07 | 2022-07-08 | 昆山鑫美源电子科技有限公司 | Conductive film production equipment and production method |
-
2020
- 2020-12-04 CN CN202022903370.XU patent/CN213977940U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113930820A (en) * | 2021-09-29 | 2022-01-14 | 重庆金美新材料科技有限公司 | Production line and production method for electroplating conductive film |
| CN113930820B (en) * | 2021-09-29 | 2023-04-28 | 重庆金美新材料科技有限公司 | Production line and production method for electroplating conductive film |
| CN114717623A (en) * | 2022-02-07 | 2022-07-08 | 昆山鑫美源电子科技有限公司 | Conductive film production equipment and production method |
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