CN217378068U - Electroplating equipment - Google Patents
Electroplating equipment Download PDFInfo
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- CN217378068U CN217378068U CN202221044990.5U CN202221044990U CN217378068U CN 217378068 U CN217378068 U CN 217378068U CN 202221044990 U CN202221044990 U CN 202221044990U CN 217378068 U CN217378068 U CN 217378068U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
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Abstract
The utility model relates to the technical field of electroplating, in particular to electroplating equipment, which comprises a supply device and an electroplating device, wherein the electroplating device comprises an electroplating pool, a deplating component, a conductive roller, an electroplating anode, an electroplating power supply and a deplating power supply; the deplating component comprises a deplating cathode; the electroplating anode comprises an anode plate; the electroplating power supply is connected with the anode plate and the conductive roller; the deplating power supply is connected with the deplating cathode and the conductive roller; the supply device is used for supplying metal ions into the electroplating pool. The utility model provides an electroplating device which comprises a low-cost electroplating metal ion supply device, an electroplating anode which can enable the electroplating solution to evenly cover a cathode plate, and an electroplating device which can carry out real-time deplating.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to electroplating equipment.
Background
The electroplating process adopted by the electroplating equipment is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing an electrolysis effect, thereby playing roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
Along with the high-speed development of global electronic products, the requirement on the manufacturing precision of circuit boards is higher and higher, and the electroplating of the buried pore plates adopts insoluble anode electroplating lines, so that the hole filling capacity is high, and the electroplating uniformity is good. And insoluble anode plating is also adopted in the fields of new energy and copper foil manufacturing. Has wide market prospect.
The existing industry adopts electroplating-grade oxidized metal powder (such as copper oxide) to stir and dissolve to provide metal ion consumption during electroplating, the dissolving speed is general, and the cost is high; in addition, the consumption of the oxidized metal powder and the consumption of the plating metal ions cannot be precisely controlled, and the plating quality is unstable due to more or less metal ions. Therefore, there is a need to develop a method for providing metal ions for electroplating, which can effectively reduce the cost and satisfy the requirements of the process and quality.
Meanwhile, the traditional electroplating equipment is of a structure with an independent anode and an independent spray pipe, so that the electroplating equipment is complex in assembly and disassembly steps, inconvenient to maintain and high in energy consumption. The prior anode device for spraying current also has the problem that the sprayed electroplating solution can not uniformly and comprehensively cover the cathode plate, thereby influencing the electroplating quality. Therefore, the drawbacks are obvious, and a solution is needed.
In addition, the conductive roller and the plating anode of the conventional plating apparatus form a loop, that is, the conductive roller is plated simultaneously, and the plating metal is plated on the conductive roller during a long time operation to make the surface of the conductive roller uneven, thereby generating a hump effect, affecting the plating quality and increasing the maintenance frequency.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide an electroplating device's electroplating equipment including low-cost metal ion supply device, the electroplating positive pole that makes the plating solution can evenly cover the negative plate, the electroplating device that can carry out real-time deplating.
In order to solve the technical problem, the utility model discloses a following technical scheme:
an electroplating apparatus includes a supply device and an electroplating device;
the electroplating device comprises an electroplating pool, a deplating component, a conductive roller, an electroplating anode, an electroplating power supply and a deplating power supply; the deplating component, the conductive roller and the electroplating anode are all positioned in the electroplating pool;
the deplating component comprises a deplating cathode;
the electroplating power supply is connected with the electroplating anode and the conductive roller;
the deplating power supply is connected with the deplating cathode and the conductive roller;
the supply device is used for supplying metal ions into the electroplating pool.
Preferably, the supply device comprises a metal ion supply mechanism, a first pumping pump, a circulating pump and an overflow pipe;
the metal ion supply mechanism comprises a cathode chamber, an anode chamber and a first diaphragm positioned between the cathode chamber and the anode chamber, and the first diaphragm can block metal ions;
the input end of the first pumping pump is communicated with the anode chamber through a pipeline, and the output end of the first pumping pump is communicated with the electroplating pool through a pipeline;
the input end of the circulating pump is communicated with the electroplating pool through a pipeline, and the output end of the circulating pump is communicated with the anode chamber through a pipeline;
and two ends of the overflow pipe are respectively communicated with the electroplating pool and the anode chamber.
Preferably, the metal ion supply means is provided with an exhaust port communicating with the cathode chamber.
Preferably, the deplating assembly further comprises a deplating box and a second diaphragm, the deplating box is provided with an accommodating cavity and an opening communicated with the accommodating cavity, the deplating cathode is installed in the accommodating cavity, the second diaphragm is covered on the opening, the second diaphragm can separate metal ions, and the opening faces the conductive roller.
Preferably, the deplating cathode is arranged on the inner bottom surface of the accommodating cavity and is opposite to the second diaphragm.
Preferably, the electroplating device further comprises a liquid storage tank and a second pumping pump; the accommodating cavity is respectively communicated with the liquid storage tank and the second pumping pump through pipelines, and the liquid storage tank is communicated with the second pumping pump through pipelines.
Preferably, the conductive rollers are arranged in two rows and are symmetrically arranged, the electroplating anode is arranged between two adjacent conductive rollers in the same row of conductive rollers, and the conductive rollers and the deplating assemblies are arranged in a one-to-one correspondence manner.
Preferably, the anode of the electroplating power supply is connected with the electroplating anode, and the cathode of the electroplating power supply is connected with the conductive roller;
the positive pole of the deplating power supply is connected with the conductive roller, and the negative pole of the deplating power supply is connected with the deplating cathode.
Preferably, the electroplating anode comprises a jet flow frame, an anode plate connected to the jet flow frame, a cavity surrounded by the side wall of the anode plate and the inner side wall of the jet flow frame, a jet flow inlet arranged on the jet flow frame and communicated with the cavity, and a plurality of jet flow outlets respectively penetrating through the anode plate;
the anode plate is connected with the electroplating power supply.
Preferably, a plurality of the jet outlets are arranged on the anode plate in an inclined and equidistant arrangement, wherein projections of adjacent jet outlets in the length direction are overlapped.
Preferably, the surface of the anode plate is coated with an insoluble anodic oxide layer.
Preferably, the jet flow frame is connected with the anode plate in a screwing or welding mode.
Preferably, one end of the jet flow frame close to the anode plate is a bottom end of the jet flow frame, the other end of the jet flow frame is a top end of the jet flow frame, and the width of the jet flow frame is gradually reduced from the top end of the jet flow frame to the bottom end of the jet flow frame.
Preferably, a flow guide plate is arranged in the cavity, a flow guide hole is formed in the flow guide plate, the flow guide plate divides the cavity into an upper cavity and a lower cavity, the upper cavity is communicated with the jet flow inlet, the lower cavity is communicated with the jet flow outlet, and the upper cavity is communicated with the lower cavity through the flow guide hole.
Preferably, the metal ion supply mechanism further comprises a first filter and/or a stirring mechanism; the input end and the output end of the first filter are respectively communicated with the anode chamber through pipelines; the stirring mechanism comprises an air stirring pipe positioned in the anode chamber.
Preferably, the metal ion supply mechanism further comprises a second filter, and the input end and the output end of the second filter are respectively communicated with the cathode chamber through pipelines.
The beneficial effects of the utility model reside in that:
there is provided an electroplating apparatus, wherein the metal ion supply mechanism comprises a cathode chamber, an anode chamber, and a first diaphragm located between the cathode chamber and the anode chamber; in the anode chamber, metal is continuously dissolved into metal ions, because the metal ions in the anode chamber are positive ions which cannot penetrate through the first diaphragm, the metal ions are completely dissolved in the anode chamber, the electroplating solution in the anode chamber and the electroplating solution in the electroplating pool are circulated, the metal ions required by electroplating are continuously provided, and the cost of the electroplating metal raw materials is reduced by 20-30%. And the utility model provides a metal ion supply mechanism can utilize the consumption and the supply of faraday's law's electrochemical reaction accurate control metal ion that electroplates, guarantees product quality's stability.
The electroplating solution sprayed out of the plurality of spray outlets of the anode plate can uniformly and comprehensively spray and cover the plated object, so that the problem that the electroplating solution sprayed to the plated object by the traditional spray device is not uniform or partially covers the plated object is avoided, and a natural and uniform electroplating layer is quickly separated out from the surface of the plated object; meanwhile, the spraying speed of the electroplating solution is high, the electroplating solution flowing at high speed can quickly supplement metal ions to the position near the plated object, and the electroplating efficiency and quality are improved. The jet flow frame and the anode plate are combined together, and a jet flow device is not required to be arranged between the anode plate and the plated object, so that the distance between the anode plate and the plated object in the electroplating bath is reduced, the work of the electroplating solution which is jetted to the plated object to overcome the fluid resistance is correspondingly reduced, and the time required by electroplating is shortened.
The electroplating device comprises an electroplating assembly and a conductive roller which are arranged in an electroplating pool and matched with each other, an electroplating power supply is connected with an anode plate and the conductive roller, the conductive roller is contacted with an object to be plated, so that the object to be plated and the anode plate form an electroplating loop, the electroplating power supply is connected with an electroplating stripping cathode and the conductive roller to form a stripping loop, namely, the conductive roller forms two loops, the conductive roller can be electroplated with metal in the electroplating loop, and the electroplated metal on the conductive roller in the stripping loop is electrolyzed and reduced again to form metal ions to return to the electroplating solution, thereby effectively realizing the effect of electroplating while stripping.
Drawings
Fig. 1 is a schematic side sectional view of a first embodiment of the present invention.
Fig. 2 is a schematic view of a cross-sectional side structure of a supply device according to a first embodiment of the present invention.
Fig. 3 is a schematic sectional view of a side structure of an electroplating apparatus according to a first embodiment of the present invention.
Fig. 4 is a schematic view of a cross section of the side structure of the deplating assembly and the conductive roller in the first embodiment of the present invention.
Fig. 5 is a schematic view illustrating a connection between the deplating assembly and the liquid storage tank and the pumping pump according to an embodiment of the present invention.
Fig. 6 is a schematic sectional view of a side structure of an electroplating anode according to a first embodiment of the present invention.
FIG. 7 is a schematic sectional view of another side of the electroplating anode according to the first embodiment of the present invention.
Fig. 8 is a schematic bottom structure view of an anode plate according to an embodiment of the present invention.
Fig. 9 is a schematic sectional view of a side structure of a jet flow stand according to a second embodiment of the present invention.
Detailed Description
In order to facilitate the understanding of those skilled in the art, the present invention will be further described with reference to the following examples, which are not intended to limit the scope of the present invention.
As shown in fig. 1 to 8, an electroplating apparatus according to a first embodiment of the present invention includes a supply device 1 and an electroplating device 2;
the electroplating device 2 comprises an electroplating pool 21, a deplating component 3, a conductive roller 22, an electroplating anode 4, an electroplating power supply U1 and a deplating power supply U2; the deplating component 3, the conductive roller 22 and the electroplating anode 4 are all positioned in the electroplating pool 21;
the deplating assembly 3 comprises a deplating cathode 31;
the electroplating power supply U1 is connected with the electroplating anode 4 and the conductive roller 22;
the deplating power supply U2 is connected with the deplating cathode 31 and the conductive roller 22;
the supply device is used for supplying metal ions into the electroplating pool.
In this embodiment, the supply device 1 includes a metal ion supply mechanism 5, a first pump 11, a circulation pump 12, and an overflow pipe 13;
the metal ion supply mechanism 5 includes a cathode chamber 51, an anode chamber 52, and a first diaphragm 53 positioned between the cathode chamber 51 and the anode chamber 52;
the input end of the first pumping pump 11 is communicated with the anode chamber 52 through a pipeline, and the output end of the first pumping pump 11 is communicated with the electroplating pool 21 through a pipeline;
the input end of the circulating pump 12 is communicated with the electroplating pool 21 through a pipeline, and the output end of the circulating pump 12 is communicated with the anode chamber 52 through a pipeline;
two ends of the overflow pipe 13 are respectively communicated with the electroplating tank 21 and the anode chamber 52.
The electroplating apparatus of the present embodiment further comprises, in actual operation, an electroplating liquid tank 6 and a third pump 61, wherein the third pump is preferably a pump;
the input end of the first pumping pump 11 is communicated with the anode chamber 52 through a pipeline, and the output end of the first pumping pump 11 is communicated with the electroplating solution tank 6 through a pipeline;
the input end of the circulating pump 12 is communicated with the electroplating solution tank 6 through a pipeline, and the output end of the circulating pump 12 is communicated with the anode chamber 52 through a pipeline;
two ends of the overflow pipe 13 are respectively communicated with the electroplating solution tank 6 and the anode chamber 52.
The input end of the third pumping pump 61 is communicated with the electroplating solution tank 6 through a pipeline, and the output end of the third pumping pump 61 is communicated with the electroplating anode 4 through a pipeline;
the electroplating solution tank 6 is communicated with the electroplating tank 21 through a pipeline.
The specific operation of the supply device 1 and the plating device 2 is as follows;
a metal ion supply unit anode which is plated with metal and can be columnar, granular and not limited to shape is arranged in the anode chamber 52, a metal ion supply unit cathode which is at least one of materials which can be used as a cathode, such as titanium, stainless steel and the like which are flaky and not limited to shape is arranged in the cathode chamber 51, the first diaphragm 53 is made of an ionic material, the first diaphragm 53 can isolate metal ions, the metal ions are larger than the pores of the first diaphragm 53 and can not pass through the first diaphragm 53, and hydrogen ions are smaller than the ions of the first diaphragm 53 and can freely pass through the first diaphragm 53; the first diaphragm 53 is used to separate the plating solution in the anode chamber 52 from the electrolyte in the cathode chamber 51 so that no crossover is formed between them, and the anode metal is ionized to the anode chamber 52 to provide the metal ions required for plating when the rectifier U3 is turned on.
In the present embodiment, the metal ion supply mechanism 5 is provided with an exhaust port 58 communicating with the cathode chamber 51. The cathode chamber 51 of the metal ion supply unit generates a large amount of gas during the electrolysis reaction, and the gas is discharged through the gas outlet 58.
In this embodiment, the metal ion supply mechanism 5 further includes a first filter 54 and/or a stirring mechanism 55; the input end and the output end of the first filter 54 are respectively communicated with the anode chamber 52 through pipelines; the agitation mechanism 55 includes an air agitation tube 56 located within the anode chamber 52.
The anode chamber 52 can generate anode by-products during the electrolytic reaction, the first filter 54 filters the anode by-products circularly through a pipeline, the inlet and outlet pipelines of the first filter 54 can be uniformly arranged in the metal ion unit to fully stir the plating solution to prevent the electrode polarization of the metal ion supply unit with overlarge anode current density, and the air stirring pipe 56 can also be arranged to stir air to prevent the electrode polarization of the overlarge density.
In this embodiment, the metal ion supply mechanism 5 further includes a second filter 57, and an input end and an output end of the second filter 57 are respectively communicated with the cathode chamber 51 through a pipeline. The second filter 57 filters impurities in the use of the cathode chamber 51 of the metal ion supply unit through a pipe circulation while stirring the electrolyte.
In this embodiment, the deplating assembly 3 further includes a deplating box 32 and a second diaphragm 33, the deplating box 32 is provided with an accommodating cavity 34 and an opening communicated with the accommodating cavity 34, the deplating cathode 31 is installed in the accommodating cavity 34, the second diaphragm 33 covers the opening, and the opening faces the conductive roller 22.
The deplating cathode 31 is at least one of titanium and stainless steel which are flaky and net-shaped and can be used as electroplating cathode materials.
In the deplating loop, the electroplated metal on the surface of the conductive roller 22 is electrolyzed and reduced again into metal ions which return to the electrolyte and move towards the deplating cathode 31, but due to the obstruction of the second diaphragm 33, the metal ions can only stay in the electroplating solution outside the deplating box 32 and then are electroplated on the plated object 7 again by the electroplating loop, and the metal ions electrolytically separated from the surface of the conductive roller 22 are recycled while the electroplating and deplating are realized, so that the problem of frequent maintenance is solved, wherein the frequent maintenance comprises replacing the deplating cathode 31, because if the electroplated metal on the surface of the conductive roller 22 is only transferred onto the deplating cathode 31, the deplating cathode 31 needs to be replaced every certain time to ensure the deplating effect.
In this embodiment, the deplating cathode 31 is installed on the inner bottom surface of the accommodating cavity 34 and is opposite to the second diaphragm 33. The deplating cathode 31 is opposite to the second diaphragm 33, that is to say the deplating cathode 31 is also opposite to the conductive roller 22 towards the opening.
In this embodiment, the second separator 33 can block metal ions. The second diaphragm 33 is made of an ionic material, metal ions are larger than diaphragm ions and do not pass through the diaphragm, and hydrogen ions are smaller than the diaphragm ions and can freely pass through the diaphragm.
In this embodiment, the electroplating apparatus 2 further includes a liquid storage tank 23 and a second pump 24; the accommodating cavity 34 is respectively communicated with the liquid storage tank 23 and the second pumping pump 24 through pipelines, and the liquid storage tank 23 is communicated with the second pumping pump 24 through pipelines.
The second pumping pump 24 is preferably a pump; the accommodating cavity 34 is filled with electrolyte; the electrolytic reduction reaction of the conductive roller 22 generates gas in the accommodating cavity 34, the second pumping pump 24 pumps the electrolyte from the liquid storage tank 23 through a pipeline and conveys the electrolyte into the accommodating cavity 34, the electrolyte in the accommodating cavity 34 is pumped by the second pumping pump 24 and flows back to the liquid storage tank 23 through another pipeline to form circulation, and the gas is also taken out from the accommodating cavity 34 through circulation.
In this embodiment, the conductive rollers 22 are arranged in two rows and symmetrically arranged, wherein the electroplating anode 4 is arranged between two adjacent conductive rollers 22 in the same row of conductive rollers 22, and the conductive rollers 22 and the deplating assemblies 3 are arranged in a one-to-one correspondence manner.
Two rows of symmetrically arranged conductive rollers 22 are arranged in a plating pool 21, a plated object 7 enters between the two rows of conductive rollers 22, each conductive roller 22 in the two rows of conductive rollers 22 respectively rotates to enable the plated object 7 to advance, meanwhile, the negative electrode of a plating power supply U1 is connected with the conductive roller 22, the positive electrode of a plating power supply U1 is connected with the plating anode 4, and the conductive roller 22 contacts the plated object 7, so that the plated object 7 and the plating anode 4 form a plating loop to enable metal ions in the plating solution to be plated on the plated object 7;
the deplating assemblies 3 correspond to the conductive rollers 22 one by one, and one side of each conductive roller 22, which is far away from the plated object 7, is provided with the deplating assemblies 3; the positive electrode of the stripping power supply U2 is connected with the conductive roller 22, the negative electrode of the stripping power supply U2 is connected with the stripping cathode 31, one side surface of the conductive roller 22 close to the stripping cathode 31 and the stripping cathode 31 form a stripping loop, the stripping loop electrolytically reduces the plated metal plated on the conductive roller 22 into metal ions which return to the electrolyte and move towards the stripping cathode 31, but due to the arrangement of the second diaphragm 33, the metal ions cannot pass through the second diaphragm 33, and then the metal ions are electroplated on the plated object 7 by the electroplating loop, so that the metal ions can be recycled.
In this embodiment, the plating anode 4 includes a jet flow holder 41, an anode plate 42 connected to the jet flow holder 41, a cavity 43 defined by a side wall of the anode plate 42 and an inner side wall of the jet flow holder 41, a jet flow inlet 44 provided on the jet flow holder 41 and communicating with the cavity 43, and a plurality of jet flow outlets 45 respectively penetrating through the anode plate 42;
the anode plate 42 is connected with the electroplating power supply U1.
In this embodiment, a plurality of the jet outlets 45 are arranged on the anode plate 42 in an inclined and equally spaced arrangement, wherein projections of adjacent jet outlets 45 in the length direction overlap; the electroplating anode 4 further comprises a jet pipe, one end of which is communicated with the jet inlet 44, and the other end of which is communicated with the pump. In the practical use process, the anode plate 42 is arranged opposite to the object to be plated 7, the electroplating solution conveyed by the anode chamber 52 enters the jet flow pipe and flows into the cavity 43 from the jet flow inlet 44 at a high speed, and then is respectively sprayed out from the plurality of jet flow outlets 45 to the object to be plated 7, because the projections of the adjacent jet flow outlets 45 in the length direction are overlapped, the electroplating solution sprayed out from the plurality of jet flow outlets 45 can uniformly and completely jet and cover the object to be plated 7, the problem that the electroplating solution sprayed onto the object to be plated 7 by the traditional jet flow device is not uniform or partially covers the object to be plated 7 is avoided, and a natural and uniform electroplating layer is quickly deposited on the surface of the object to be plated 7; meanwhile, the spraying speed of the electroplating solution is high, the electroplating solution flowing at high speed can quickly supplement metal ions to the position near the plated object 7, and the electroplating efficiency and quality are improved. The jet flow frame 41 and the anode plate 42 are combined together, and a jet flow device is not required to be arranged between the anode plate 42 and the plated object 7, so that the distance between the anode plate 42 and the plated object 7 in the plating tank is reduced, the work of the plating solution jetted to the plated object 7 to overcome the fluid resistance is correspondingly reduced, and the time required by plating is shortened.
The anode of the electroplating power supply U1 is connected with the anode plate 42, the cathode of the electroplating power supply U1 is connected with the conductive roller 22, and the conductive roller 22 contacts the plated object 7, so that the plated object 7 and the anode plate 42 form an electroplating loop; the positive electrode of the deplating power supply U2 is connected with the conductive roller 22, and the negative electrode of the deplating power supply U2 is connected with the deplating cathode 31, so that the deplating cathode 31 and the conductive roller 22 form a deplating loop; that is, the conductive roller 22 forms two loops in which the conductive roller 22 is electroplated with electroplated metal, and in which the electroplated metal on the conductive roller 22 is electrolytically reduced back to metal ions back to the electroplating solution.
In this embodiment, the surface of the anode plate 42 is coated with an insoluble anodic oxide layer. Specifically, the insoluble anodic oxide may employ an insoluble metal oxide. The insoluble anode oxide is added, so that the loading capacity of the anode is improved, and the energy-saving effect and the stability in the electroplating process are better.
In this embodiment, the jet rack 41 and the anode plate 42 are connected by screwing or welding. The jet flow and the anode plate are simple in connection structure, low in production cost and convenient to produce.
In this embodiment, one end of the jet rack 41 close to the anode plate 42 is a bottom end of the jet rack 41, the other end of the jet rack 41 is a top end of the jet rack 41, and the width of the jet rack 41 gradually decreases from the top end of the jet rack 41 to the bottom end of the jet rack 41. Preferably, the bottom end of the spray frame 41 has an inverted trapezoidal shape. When the electrolyte is closer to the bottom end of the cavity 43, the smaller the volume of the cavity 43, the higher the pressure of the electrolyte in the bottom end of the cavity 43, and the higher the flow speed of the electrolyte sprayed from the jet flow outlet 45 onto the cathode plate, thereby further improving the electroplating efficiency.
As shown in fig. 9, the second embodiment of the present invention is different from the first embodiment in that: a guide plate 46 is arranged in the cavity 43, a guide hole 47 is formed in the guide plate 46, the guide plate 46 divides the cavity 43 into an upper cavity 48 and a lower cavity 49, the upper cavity 48 is communicated with the jet flow inlet 44, the lower cavity 49 is communicated with the jet flow outlet 45, and the upper cavity 48 is communicated with the lower cavity 49 through the guide hole 47.
Specifically, the cross-section of the baffle 46 is linear or V-shaped. Preferably, the cross section of the deflector 46 is V-shaped, and the deflector hole 47 is arranged at the bottom end of the deflector 46. In the actual use process, the guide plate 46 guides the electrolyte in the upper cavity 48, the pressure of the electrolyte near the bottom end of the upper cavity 48 is gradually increased, the electrolyte with increased pressure flows into the lower cavity 49 through the guide hole 47 and is sprayed out of the jet flow outlet 45 onto the cathode plate, and the electroplating efficiency is further improved.
In the description of the present invention, it should be noted that, for the orientation words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, the definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected", if any, are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The above-mentioned embodiments only express a plurality of embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An electroplating apparatus comprising a supply device (1) and an electroplating device (2), characterized in that:
the electroplating device (2) comprises an electroplating pool (21), a deplating component (3), a conductive roller (22), an electroplating anode (4), an electroplating power supply (U1) and a deplating power supply (U2); the deplating component (3), the conductive roller (22) and the electroplating anode (4) are all positioned in the electroplating pool (21);
the deplating component (3) comprises a deplating cathode (31);
the electroplating power supply (U1) is connected with the electroplating anode (4) and the conductive roller (22);
the deplating power supply (U2) is connected with the deplating cathode (31) and the conductive roller (22);
the supply device (1) is used for supplying metal ions into the electroplating pool (21).
2. An electroplating apparatus according to claim 1, wherein: the supply device (1) comprises a metal ion supply mechanism (5), a first pumping pump (11), a circulating pump (12) and an overflow pipe (13);
the metal ion supply mechanism (5) comprises a cathode chamber (51), an anode chamber (52) and a first diaphragm (53) positioned between the cathode chamber (51) and the anode chamber (52), wherein the first diaphragm (53) can block metal ions;
the input end of the first pumping pump (11) is communicated with the anode chamber (52) through a pipeline, and the output end of the first pumping pump (11) is communicated with the electroplating pool (21) through a pipeline;
the input end of the circulating pump (12) is communicated with the electroplating pool (21) through a pipeline, and the output end of the circulating pump (12) is communicated with the anode chamber (52) through a pipeline;
two ends of the overflow pipe (13) are respectively communicated with the electroplating pool (21) and the anode chamber (52).
3. An electroplating apparatus according to claim 1, wherein: the deplating component (3) further comprises a deplating box (32) and a second diaphragm (33), wherein the deplating box (32) is provided with an opening for accommodating the cavity (34) and communicating the accommodating cavity (34), the deplating cathode (31) is installed in the accommodating cavity (34), the second diaphragm (33) is covered with the opening, the second diaphragm (33) can separate metal ions, and the opening faces the conductive roller (22).
4. A plating apparatus according to claim 3, wherein: the deplating cathode (31) is arranged on the inner bottom surface of the accommodating cavity (34) and is opposite to the second diaphragm (33).
5. A plating apparatus according to claim 3, characterized in that: the electroplating device (2) also comprises a liquid storage tank (23) and a second pumping pump (24); the accommodating cavity (34) is respectively communicated with the liquid storage tank (23) and the second pumping pump (24) through pipelines, and the liquid storage tank (23) is communicated with the second pumping pump (24) through pipelines.
6. An electroplating apparatus according to claim 1, wherein: the electroplating anode (4) comprises a jet flow frame (41), an anode plate (42) connected to the jet flow frame (41), a cavity (43) enclosed by the side wall of the anode plate (42) and the inner side wall of the jet flow frame (41), a jet flow inlet (44) arranged on the jet flow frame (41) and communicated with the cavity (43), and a plurality of jet flow outlets (45) respectively penetrating through the anode plate (42);
the anode plate (42) is connected with the electroplating power supply (U1).
7. An electroplating apparatus according to claim 6, wherein: the jet outlets (45) are arranged on the anode plate (42) in an inclined and equidistant arrangement, wherein projections of adjacent jet outlets (45) in the length direction are overlapped.
8. An electroplating apparatus according to claim 6, wherein: the surface of the anode plate (42) is coated with an insoluble anodic oxide layer.
9. An electroplating apparatus according to claim 6, wherein: one end of the jet flow frame (41) close to the anode plate (42) is the bottom end of the jet flow frame (41), the other end of the jet flow frame (41) is the top end of the jet flow frame (41), and the width of the jet flow frame (41) is gradually reduced from the top end of the jet flow frame (41) to the bottom end of the jet flow frame (41).
10. An electroplating apparatus according to claim 6, wherein: the jet flow type jet flow device is characterized in that a guide plate (46) is arranged in the cavity (43), a guide hole (47) is formed in the guide plate (46), the cavity (43) is divided into an upper cavity (48) and a lower cavity (49) by the guide plate (46), the upper cavity (48) is communicated with the jet flow inlet (44), the lower cavity (49) is communicated with the jet flow outlet (45), and the upper cavity (48) is communicated with the lower cavity (49) through the guide hole (47).
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024067514A1 (en) * | 2022-09-26 | 2024-04-04 | 隆基绿能科技股份有限公司 | Solar cell electroplating device and solar cell electroplating method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024067514A1 (en) * | 2022-09-26 | 2024-04-04 | 隆基绿能科技股份有限公司 | Solar cell electroplating device and solar cell electroplating method |
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