CN202284230U - Plating bath - Google Patents
Plating bath Download PDFInfo
- Publication number
- CN202284230U CN202284230U CN2011203341118U CN201120334111U CN202284230U CN 202284230 U CN202284230 U CN 202284230U CN 2011203341118 U CN2011203341118 U CN 2011203341118U CN 201120334111 U CN201120334111 U CN 201120334111U CN 202284230 U CN202284230 U CN 202284230U
- Authority
- CN
- China
- Prior art keywords
- electroplate
- cell body
- negative electrode
- plating tank
- electroplate liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A plating bath comprises a bath body, an anode electroplate and a cathode electroplate. The bath body can be used for containing a plating solution. The anode electroplate is arranged in the bath body. The cathode electroplate is arranged in the bath body, and comprises a hanger rod and a supporting body of the electroplate, the supporting body of the electroplate is hung on the hanger rod, when the cathode electroplate is inserted in the bath body, the bath body can be separated into two areas, so the plating solution cannot flow from the front side to the back side of the electroplate to be plated, the plating thickness of the back side of the electroplate is reduced, and the consumption of plating materials is saved.
Description
Technical field
A kind of electroplanting device is meant a kind of plating tank especially.
Background technology
In general plating operations, promptly refer to a kind ofly by the galvanic effect in the external world, in solution, carry out electrolytic reaction, so that electrical conductor surface deposition metal or alloy layer.And when electroplating operations, mainly utilize the positive pole (anode) of electrode to be connected in the electroplate liquid, and the negative pole (negative electrode) of electrode is continued with the machined object of tool electroconductibility mutually; When current lead-through; Can circuit loop be connected, and the metals ion (positively charged ion) that has positive electricity in the solution is moved about towards the negative pole of circuit by the effect of plate conductor; And, constitute the electrolytic coating that is enough to the machined object surface coverage down with the effect between in due course in the surface of machined object (negative electrode) reduction.
Yet; Because in general plating tank; The negative pole of its electric current (negative electrode) and machined object together are immersed in central position, and the positive pole of electric current (anode) is connected in the outer fix place that corresponds to machined object in the plating tank, to such an extent as to can't effectively control the cationic direction of vacillating during current lead-through; And easily because the effect of edge effect; Make electrolytic coating concentrate on machined object and the anodal nearest position of electric current, and cause the uneven phenomenon of electrolytic coating, the whole quality of electroplating processing of influence.
In addition; Because being used in the main plating material of circuit card is gold or copper; Rise year by year because of the supply and demand demand deficiency along with electroplating the material price; Its function be can bring into play and electroplate the material front that is plated on circuit card that mainly supplies power,, the consume of electroplating material and the rising of cost then only caused if be plated on the back side of circuit card.
Summary of the invention
The main purpose of the utility model aims to provide a kind of plating tank, and the spacing that it can be adjusted negative electrode electroplate and anodization plate by the adjustment element makes electrolytic coating ability uniformly-coating on circuit card.
For reaching above-mentioned purpose, the plating tank of the utility model, it comprises a cell body, an anodization plate and a negative electrode electroplate.This cell body supplies a ccontaining electroplate liquid.The dual-side of this cell body forms a slot respectively.This anodization plate is arranged in this cell body.This negative electrode electroplate is arranged in this cell body, and this cathode circuit plate comprises a suspension rod and a circuit board bearing body.The two ends of this suspension rod are set up in respectively in this slot.This circuit board bearing body hang on this suspension rod, and when this negative electrode electroplate placed in this cell body, this negative electrode electroplate was separated into two zones with this cell body.
A kind of plating tank comprises: a cell body, supply a ccontaining electroplate liquid, and the dual-side of this cell body forms a slot respectively; One anodization plate is arranged in this cell body; And a negative electrode electroplate, being arranged in this cell body, this cathode circuit plate comprises: a suspension rod, the two ends of this suspension rod are set up in respectively in this slot; And a circuit board bearing body, hang on this suspension rod, when this negative electrode electroplate placed in this cell body, this negative electrode electroplate was separated into two zones with this cell body.
Wherein, this plating tank has more at least one electroplate liquid guiding device, and this electroplate liquid guiding device is located at a side of this anodization plate.
Wherein, this electroplate liquid guiding device has a nozzle and a port lid, and this port lid is covered on a side of this nozzle.
The utility model plating tank; Its effect is when making the negative electrode electroplate insert plating tank; Plating tank is separated into two zones, most electrolysis base material all is plated on the front of circuit card, reduce the back of circuit board thickness of plating layer; With expending of minimizing plating substrate, and then reduce manufacturing cost.
Description of drawings
Fig. 1 is the structural representation of the utility model plating tank.
Fig. 2 is its cathode circuit plate synoptic diagram of the utility model plating tank.
Fig. 3 is the circuit liquid guiding device synoptic diagram of the utility model cathode circuit groove.
Fig. 4 is the utility model plating tank user mode synoptic diagram.
Fig. 5 is the drain inclined-plane synoptic diagram of the utility model plating tank negative electrode electroplate.
Description of reference numerals
The 1-plating tank; The 11-cell body; 12-anodization plate; 13-negative electrode electroplate; The 131-suspension rod; 132-circuit board bearing body; The 1321-framework; 14-electroplate liquid guiding device; The 141-nozzle; The 142-port lid; 1421-water conservancy diversion curved surface; The 2-electroplate liquid; The 3-anode bar; The 4-cathode bar; The 5-circuit card
Embodiment
For making the inspector can know the content of understanding the utility model, sincerely graphic with the description collocation, please consult.
See also Fig. 1, Fig. 2 and shown in Figure 3, it is structural representation, its cathode circuit plate synoptic diagram and the electroplate liquid guiding device synoptic diagram thereof of the utility model plating tank.Among the figure, this plating tank 1 comprises a cell body 11, a plurality of anodization plate 12, a negative electrode electroplate 13 and a plurality of electroplate liquid guiding device 14.
This cell body 11 supplies a ccontaining electroplate liquid 2, and the dual-side of this cell body 21 forms a slot 111 respectively.
These anodization plates 12 are arranged in this cell body 11, and partly are soaked in this electroplate liquid 2, and these plate circuit plates 12 hang on the anode bar 3.Wherein, each these anodization plate 12 is provided with an electrical network 121, and this electrical network 121 is latticed.
This cathode circuit plate 13 is located in this cell body 11, partly is soaked in this electroplate liquid 2, and between these anodization plates 12, and this cathode circuit plate 13 and a cathode bar 4 electric connections.Wherein, this negative electrode electroplate 13 comprises a suspension rod 131 and a circuit board bearing body 132.Wherein, this anode bar 3 and this cathode bar 4 electrically connects on the power-supply units (figure does not show), to provide this anodization plate 12 and this negative electrode electroplate 13 required electric power.
This suspension rod 131 hang on this cathode bar 4.132 of this circuit board bearing bodies hang on this suspension rod 131, can supply to carry a circuit card 5, and this circuit board bearing body 132 has more a framework 1321.Wherein, the width of this circuit board bearing body 132 approximates or is slightly less than the width of this cell body 11, and can supply in this circuit board bearing body 132 is inserted in this cell body 11 time, is in harmony and can this cell body 11 be separated into two zones.
Each these electroplate liquid 2 guiding device, a side of these electroplate liquid guiding device 14 located therein one these anodization plates 12.Wherein, each this electroplate liquid guiding device 14 has a nozzle 141 and a port lid 142.This port lid 142 is covered on a side of this nozzle 141, and the side wall surface of these port lid 142 relative these nozzles 141 forms a water conservancy diversion curved surface 1421.
Please in the lump with reference to Fig. 4 and Fig. 5, it is the utility model plating tank illustrative view and negative electrode electroplate discharge opeing synoptic diagram.When this plating tank 1 came into operation, then the nozzle of this electroplate liquid guiding device 14 made these electroplate liquid 2 Modelling of Flow with Recirculation in this plating tank 1 towards this anodization plate 12 and this negative electrode electroplate 13 jet electro-plating liquid.At this moment, the metallic cation in the electroplate liquid 1 receives the electrode electrical function of these anodization plates 12 and this negative electrode electroplate 13, vacillates towards this negative electrode electroplate 13, is positioned on this circuit card and be electroplated to.Because this electroplate supporting body 132 is separated into two zones with this cell body 11; To avoid being positioned at the back side that these circuit card 5 positive electroplate liquids are back to this circuit card 5; To reduce the thickness that plating substrate is plated on these circuit card 5 back sides, electroplate consumptive material with Xie Sheng, reduce production costs.
In addition,, and can bring into play the flow-disturbing effect because the electrical network that is arranged at this anodization plate 12 is latticed, make the electroplate liquid that is sprayed by this electroplate liquid guiding device 14 receive evenly to diffuse to behind the flow-disturbing this circuit card 5 around.
In sum; The utility model plating tank, its effect are plating tank to be separated into two zones when making the negative electrode electroplate insert plating tank; Most electrolysis base material all is plated on the front of circuit card; Reduce the back of circuit board thickness of plating layer,, and then reduce manufacturing cost with expending of minimizing plating substrate.
More than be illustrative to the description of the utility model; And it is nonrestrictive; Those skilled in the art is understood, and the spirit and the interior of scope that limit in claim can carry out many modifications, variation or equivalence to it, but they all will fall in the protection domain of the utility model.
Claims (3)
1. a plating tank is characterized in that, comprises:
One cell body supplies a ccontaining electroplate liquid, and the dual-side of this cell body forms a slot respectively;
One anodization plate is arranged in this cell body; And
One negative electrode electroplate is arranged in this cell body, and this cathode circuit plate comprises:
One suspension rod, the two ends of this suspension rod are set up in respectively in this slot; And
One circuit board bearing body hang on this suspension rod, and when this negative electrode electroplate placed in this cell body, this negative electrode electroplate was separated into two zones with this cell body.
2. plating tank as claimed in claim 1 is characterized in that, has more at least one electroplate liquid guiding device, and this electroplate liquid guiding device is located at a side of this anodization plate.
3. plating tank as claimed in claim 2 is characterized in that, this electroplate liquid guiding device has a nozzle and a port lid, and this port lid is covered on a side of this nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203341118U CN202284230U (en) | 2011-09-07 | 2011-09-07 | Plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203341118U CN202284230U (en) | 2011-09-07 | 2011-09-07 | Plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202284230U true CN202284230U (en) | 2012-06-27 |
Family
ID=46295758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203341118U Expired - Fee Related CN202284230U (en) | 2011-09-07 | 2011-09-07 | Plating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202284230U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105420797A (en) * | 2015-11-26 | 2016-03-23 | 扬中市宏飞镀业有限公司 | Novel electroplating bath |
| CN107190307A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating anode device |
| CN107190306A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating system |
-
2011
- 2011-09-07 CN CN2011203341118U patent/CN202284230U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105420797A (en) * | 2015-11-26 | 2016-03-23 | 扬中市宏飞镀业有限公司 | Novel electroplating bath |
| CN107190307A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating anode device |
| CN107190306A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201574206U (en) | Electroplating bath with shielding plate | |
| CN105088323B (en) | Board-like Electropolating hangers | |
| CN102605397A (en) | Electroplating system and electroplating method | |
| CN202284230U (en) | Plating bath | |
| CN104005077A (en) | Electroplating device with optimized temperature field distribution and electroplating method thereof | |
| CN102732938A (en) | Electroplating device for dynamically adjusting anode power-supply area and method thereof | |
| CN102453939A (en) | Cabinet for roll-to-roll conveying selective electroplating flexible printed circuit board and manufacturing process of cabinet | |
| CN203754843U (en) | Arc metal anode used for small electroplating equipment | |
| CN102534733B (en) | Electroplanting device and electro-plating method | |
| CN102011159B (en) | Device and method for implementing local electroplating of parts | |
| CN201924097U (en) | Electroplating device | |
| CN210314518U (en) | Plastic part electroplating pre-dipping device | |
| CN200985363Y (en) | Electroplating liquid container | |
| CN203625518U (en) | Improved chrome plating anode | |
| CN217378068U (en) | Electroplating equipment | |
| CN103628105A (en) | Electroplating device | |
| CN102392292B (en) | Electroplating method for encapsulation substrates | |
| CN202509147U (en) | Electroplating bath | |
| CN201990752U (en) | Anode for improving electroplating uniformity | |
| CN202626340U (en) | Partial electroplate equipment for column-shaped part | |
| CN205529104U (en) | Plating device | |
| CN114790567A (en) | Electroplating equipment | |
| CN110528054B (en) | Device and method for electrodepositing nickel on PCB without stopping groove | |
| CN204661855U (en) | With the plating tank of shielding unit | |
| CN203474935U (en) | Metal product inner cavity surface treatment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20140907 |
|
| EXPY | Termination of patent right or utility model |