CN216650098U

CN216650098U - Printed circuit board structure and electronic device

Info

Publication number: CN216650098U
Application number: CN202123235844.9U
Authority: CN
Inventors: 付刚伟; 袁海江
Original assignee: HKC Co Ltd; Mianyang HKC Optoelectronics Technology Co Ltd
Current assignee: HKC Co Ltd; Mianyang HKC Optoelectronics Technology Co Ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-05-31
Anticipated expiration: 2031-12-21

Abstract

The application relates to a printed circuit board structure and an electronic device with the same. The printed circuit board structure comprises at least one wiring layer and at least one medium layer which are sequentially staggered and stacked, the number of the wiring layers is equal to or more than that of the medium layers, each medium layer comprises at least two insulating layers and at least one heat conducting layer, the insulating layers and the heat conducting layers are sequentially staggered and stacked, the two opposite sides of each heat conducting layer are adjacent to the insulating layers, and the insulating layers on the outermost sides of the medium layers are adjacent to the wiring layers. The utility model provides a printed circuit board structure forms the dielectric layer with the crisscross range upon range of setting of insulating layer and heat-conducting layer, and the dielectric layer borders on with the routing layer, realizes printed circuit board structure self high-efficient heat conduction to directly conduct the heat that produces to quick-witted case, through quick-witted case fan conduction to the environment in, need not additionally to use heat abstractor such as radiator or fin to dispel the heat, promote the inside space utilization of electron device by a wide margin.

Description

Printed circuit board structure and electronic device

Technical Field

The present application relates to the field of heat dissipation technologies, and in particular, to a printed circuit board structure with high thermal conductivity and an electronic device having the same.

Background

A Printed Circuit Board (PCB) is an important electronic component support and is also a provider of electrical connection of electronic components. Along with the functions of electronic products (such as notebook computers, desktop computers and the like) tend to be diversified and the volume is continuously reduced, the integration level of microelectronic technology is higher and higher, which inevitably affects the heat dissipation problem of the PCB inside the electronic products, and if the heat generated by electronic components mounted on the PCB can not be diffused out in time, the reliability of the devices and even the functions of the products can be affected.

The heat dissipation of the traditional electronic product is mainly realized by connecting a radiator or a radiating fin inside the electronic product, transferring heat generated by a large number of electronic components to a case and then dissipating the heat to the environment through a radiating fan of the case. However, the installation of the heat sink or the heat sink occupies a large internal space of the electronic product, so that the utilization rate of the internal space of the electronic product is greatly reduced.

SUMMERY OF THE UTILITY MODEL

In view of the deficiencies of the prior art, an object of the present application is to provide a printed circuit board structure and an electronic device having the same, wherein the printed circuit board structure is configured to sequentially overlap and stack at least two insulating layers and at least one heat conducting layer, and the insulating layers are adjacent to opposite sides of the heat conducting layer, so that the heat conduction and heat transfer functions of the printed circuit board structure are realized, and the space utilization rate inside the electronic device is improved.

In a first aspect, the present application provides a printed circuit board structure, where the printed circuit board structure includes at least one routing layer and at least one dielectric layer that are stacked in sequence in a staggered manner, the number of the routing layers is equal to or more than one than the number of the dielectric layers, each dielectric layer includes at least two insulating layers and at least one heat conduction layer, at least two insulating layers and at least one heat conduction layer are stacked in sequence in a staggered manner, opposite sides of the heat conduction layers are adjacent to the insulating layers, and the insulating layer on the outermost side of each dielectric layer is adjacent to the routing layer.

Optionally, the printed circuit board structure includes two routing layers and one dielectric layer, the dielectric layer includes three heat conduction layers and four insulation layers, the four insulation layers and the three heat conduction layers are sequentially stacked in a staggered manner, opposite sides of the heat conduction layers are adjacent to the insulation layers, and two insulation layers on the outermost side of the dielectric layer are adjacent to the two routing layers respectively.

Optionally, the printed circuit board structure further includes an adhesive layer disposed between each of the insulating layers and the heat conducting layer to adhere the respective insulating layers and the respective heat conducting layers together to form the dielectric layer.

Optionally, the printed circuit board structure further includes an adhesive layer disposed between the two insulating layers on the outermost side of each dielectric layer and the routing layers to adhere the respective dielectric layers and the respective routing layers together.

Optionally, the bonding layer comprises at least one epoxy layer.

Optionally, an electronic component is mounted on the routing layer, the routing layer includes at least one layer of copper foil, and the copper foil is electrically connected with the electronic component.

Optionally, the thermally conductive layer comprises at least one graphite film.

Optionally, the printed circuit board structure is a self-conducting printed circuit board.

In a second aspect, the present application further provides an electronic device, where the electronic device includes a chassis and the printed circuit board structure, and the printed circuit board structure is installed in the chassis.

Optionally, the electronic device further includes a fixing frame, and the fixing frame is used for fixing the printed circuit board structure in the chassis.

Optionally, the electronic device further includes a heat dissipation fan, and the heat dissipation fan is installed in the chassis and is configured to conduct heat generated by the electronic components on the printed circuit board structure to an external environment.

Optionally, the electronic device further includes a heat dissipation air duct, the heat dissipation air duct is communicated between the printed circuit board structure and the chassis, and is used for conducting heat generated by the printed circuit board structure to the chassis.

In summary, in the printed circuit board structure and the electronic device of the present application, at least one wiring layer and at least one dielectric layer are stacked in an interlaced manner in sequence, the number of the routing layers is equal to or more than one of the number of the medium layers, each medium layer comprises at least two insulating layers and at least one heat conduction layer, at least two insulating layers and at least one heat conduction layer are sequentially staggered and stacked, the two opposite sides of any heat conduction layer are adjacent to the insulating layers, the insulating layer at the outermost side of each medium layer is adjacent to the wiring layer, the shock absorption and the high-efficiency heat conduction of the printed circuit board structure are realized, the heat generated by the printed circuit board structure is directly conducted to the case, the heat dissipation path of the printed circuit board structure is effectively shortened by conducting the chassis fan to the environment, and the heat dissipation efficiency of the printed circuit board structure is greatly improved. In addition, the heat generated by the printed circuit board structure is directly conducted to the case and conducted to the environment through the case fan, and the electronic device does not need to be internally connected with a heat radiator or a heat radiating fin and other heat radiating devices, so that the space utilization rate in the electronic device is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic overall structure diagram of a printed circuit board structure disclosed in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a dielectric layer in the printed circuit board structure shown in FIG. 1;

FIG. 3 is a schematic view of a layer structure of the printed circuit board structure shown in FIG. 1;

fig. 4 is a schematic flow chart of a method for manufacturing a printed circuit board structure according to an embodiment of the present disclosure.

Description of reference numerals:

100-PCB structure;

10-a routing layer;

20-a dielectric layer;

21-an insulating layer;

23-thermally conductive layer.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). Directional phrases used in this application, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer only to the orientation of the appended drawings and are, therefore, used herein for better and clearer illustration and understanding of the application and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular order.

The embodiment of the application provides a high heat conduction Printed Circuit Board (PCB) structure, and this PCB structure mainly adopts graphite composite material (graphite composite material) preparation, and it will through self thermal conductivity the heat that electronic components on the PCB structure produced is direct, in time conduct to quick-witted case and is diffused away. Referring to fig. 1 and fig. 2, fig. 1 is a schematic diagram of an overall structure of a printed circuit board according to an embodiment of the present disclosure, and fig. 2 is a schematic diagram of a structure of a dielectric layer in the printed circuit board shown in fig. 1.

As shown in fig. 1 and fig. 2, in the PCB structure 100 provided in the present application, the PCB structure 100 includes at least one routing layer 10 and at least one dielectric layer 20 stacked in an interlaced manner in sequence, the number of the routing layers 10 is equal to or more than the number of the dielectric layers 20, each dielectric layer 20 includes at least two insulating layers 21 and at least one heat conducting layer 23, at least two insulating layers 21 and at least one heat conducting layer 23 are stacked in an interlaced manner in sequence, opposite sides of the heat conducting layer 23 are adjacent to the insulating layers 21, an outermost insulating layer 21 of each dielectric layer 20 is adjacent to the routing layer 10, and the dielectric layers 20 achieve heat conduction of the PCB structure 100.

In an embodiment of the present application, the printed circuit board structure may be a self-thermally conductive printed circuit board.

To sum up, dielectric layer 20 in the PCB structure 100 that this application provided is through with at least two insulating layer 21 and at least one heat-conducting layer 23 is crisscross range upon range of setting in proper order, and arbitrary the relative both sides of heat-conducting layer 23 all adjoin insulating layer 21 has realized the heat conduction function of PCB structure 100's self can be directly, in time will the heat conduction that electronic components on the PCB structure 100 produced is gone out, has effectively shortened the radiating heat-conduction route of PCB structure 100 has improved the radiating efficiency greatly. Moreover, the PCB structure 100 can directly transmit heat generated by electronic components on the PCB structure to the chassis through its own thermal conductivity, so that it is not necessary to additionally install heat dissipation devices such as a heat sink or a heat dissipation sheet in the electronic device, the thickness of the PCB structure can be reduced, the space utilization rate in the electronic device can be improved, and meanwhile, a certain cost can be reduced.

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following embodiments of the present application will be described by taking the PCB structure 100 including two routing layers 10 and one dielectric layer 20, and the dielectric layer 20 including three heat conductive layers 23 and four insulation layers 21 as an example, with reference to the relevant drawings.

Referring to fig. 3, fig. 3 is a schematic layer structure diagram of the printed circuit board structure shown in fig. 1. In an embodiment of the present application, the PCB structure 100 includes two routing layers 10 and one dielectric layer 20 stacked in a staggered manner in sequence, the dielectric layer 20 includes four insulating layers 21 and three heat conducting layers 23, the four insulating layers 21 and the three heat conducting layers 23 are stacked in a staggered manner in sequence, opposite sides of the heat conducting layers 23 are adjacent to the insulating layers 21, two insulating layers 21 on the outermost sides of the dielectric layer 20 are adjacent to the two routing layers 10, respectively, and the dielectric layer 20 realizes heat conduction of the PCB structure 100.

In one embodiment, the number of the insulating layer 21 and the heat conducting layer 23 may be two and one, three and two, five and four, and the like, which is not limited in this application.

In the embodiment of the present application, the dielectric layer 20 is made of a graphite composite material, and includes two wiring layers 10 and one dielectric layer 20, which are sequentially stacked in a staggered manner, where the dielectric layer 20 includes four insulating layers 21 and three heat conduction layers 23, the four insulating layers 21 and the three heat conduction layers 23 are sequentially stacked in a staggered manner, and any two opposite sides of the heat conduction layer 23 are adjacent to the insulating layer 21, and the two insulating layers 21 on the outermost sides of the dielectric layer 20 are adjacent to the two wiring layers 10, respectively, so as to directly and timely conduct heat generated by electronic components on the PCB structure 100.

In one embodiment, the four insulating layers 21 may be plates as a whole, and the four insulating layers 21 may be made of glass fiber reinforced epoxy resin. It is three the heat-conducting layer 23 is whole all can be the plate, every the heat-conducting layer 23 can include at least one deck graphite membrane, the graphite membrane has high thermal conductivity, is rich in elasticity, thereby can realize PCB structure 100 avoids self vibrations, effectively improves self heat conductivility. Meanwhile, because the graphite film is soft in texture, the thickness of the graphite film between every two insulating layers 21 is not too thick, and the mechanical strength of the PCB structure 100 can be ensured to be mounted on the reliability of electronic components on the PCB structure 100.

In one embodiment, the glass fiber reinforced epoxy resin used to form the insulating layer 21 has insulating properties, so that the insulating between the routing layers 10 and the heat conductive layer 23 is achieved, and short circuit between the routing layers 10 is prevented, thereby improving the reliability of the electronic components mounted on the PCB structure 100. Meanwhile, the glass fiber reinforced epoxy resin for preparing the insulating layer 21 has the characteristic of high specific strength, so that the mechanical strength of the dielectric layer 20 is effectively ensured, and the stability of the PCB structure 100 is realized.

In one embodiment, the graphite composite material comprises glass fiber reinforced epoxy resin and the graphite film is made in a composite mode, so that the PCB structure 100 can be subjected to self shock absorption and high-efficiency heat conduction, and meanwhile, the insulation between the routing layers 10 and the heat conduction layer 23 are achieved.

In one embodiment, the PCB structure 100 further includes an adhesive layer (not shown), which may include at least one epoxy layer, for adhering the insulating layers 21 and the conductive layers 23 together to form the dielectric layer 20, and adhering the dielectric layers 20 and the routing layers 10 together. Specifically, the bonding layers are arranged between the insulating layers 21 and the heat conducting layers 23, and the bonding layers are arranged between the insulating layer 21 on the outermost side of the dielectric layer 20 and the routing layers 10, so that the dielectric layer 20 is formed, and the dielectric layer 20 and the two routing layers 10 are bonded and fixed.

In the embodiment of the application, the number of the wiring layers 10 is two, and the wiring layers 10 are used for laying out circuits and are electrically connected with electronic components, so that the normal use of the electronic components is realized. The routing layer 10 includes at least one layer of copper foil, and the number of layers of the copper foil is determined by the actual routing requirement of the PCB structure 100, specifically, the more the number of electronic components to be mounted on the PCB structure 100 is, the more the number of layers of the copper foil is.

In one embodiment, the number of the routing layers 10 may be one, three, four or other, and the present application is not limited thereto.

Based on the same concept, with respect to the PCB structure 100 described above, the embodiment of the present application further provides an electronic device, which includes the PCB structure 100 described above.

In this embodiment, the electronic device further includes a fixing frame and a chassis, where the fixing frame is used to fix the PCB structure 100 in the chassis.

The electronic device further includes a heat dissipation fan installed in the chassis for transferring heat generated by the electronic components on the PCB structure 100 to the external environment.

In this embodiment, the electronic device further includes a heat dissipation air duct, the heat dissipation air duct is communicated between the PCB structure 100 and the chassis, and is configured to conduct heat generated by the PCB structure 100 to the chassis, so that the heat dissipation fan conducts heat generated by electronic components on the PCB structure 100 to an external environment.

In one embodiment, the electronic device includes, but is not limited to, a tablet computer, a notebook computer, a desktop computer, and the like. According to the embodiment of the present invention, the specific type of the electronic device is not particularly limited, and those skilled in the art can design the electronic device accordingly according to the specific requirements of the electronic device, which will not be described herein again.

In one embodiment, the electronic device further includes other necessary components and compositions such as a hard disk, an indicator light, a circuit control board or a power line, and those skilled in the art can supplement the electronic device accordingly according to the specific type and actual functions of the electronic device, and details are not described herein.

In summary, the present application provides a PCB structure and an electronic device, which comprises at least one routing layer 10 and at least one dielectric layer 20 stacked in a staggered manner in turn, wherein the number of the routing layers 10 is equal to or more than one than the number of the dielectric layers 20, each dielectric layer 20 comprises at least two insulating layers 21 and at least one heat conducting layer 23, at least two insulating layers 21 and at least one heat conducting layer 23 are stacked in a staggered manner in turn, opposite sides of any heat conducting layer 23 are adjacent to the insulating layers 21, the insulating layer 21 on the outermost side of each dielectric layer 20 is adjacent to the routing layer 10, so as to realize shock absorption and efficient heat conduction of the PCB structure 100, directly conduct heat generated by the PCB structure 100 to a case, conduct the heat to the environment through a case fan, and effectively shorten a heat conduction path for heat dissipation of the PCB structure 100, the heat dissipation efficiency of the PCB structure 100 is greatly improved. Meanwhile, the dielectric layer 20 comprises the insulating layer 21, so that the faults such as short circuit and the like cannot occur between the wiring layers 10, the reliability of electronic components mounted on the PCB structure 100 is influenced, the safety performance of the PCB structure 100 is improved, and the practicability and the safety of the electronic device are enhanced. In addition, the heat generated by the PCB structure 100 is directly transferred to the chassis and transferred to the environment through the chassis fan, and there is no need to connect heat dissipation devices such as a heat sink or a heat dissipation plate to the inside of the electronic device, thereby greatly improving the space utilization rate inside the electronic device.

The embodiment of the present application further provides a method for manufacturing a PCB structure, which is used to manufacture the PCB structure 100 with high thermal conductivity shown in fig. 1 to 3. Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a method for manufacturing a printed circuit board structure according to an embodiment of the present disclosure. In the application examples, the preparation method may include at least the following steps.

S1, a material for forming the adhesive layer is arranged.

In one embodiment, the material of the adhesive layer may be epoxy resin.

And S2, coating the prepared material of the bonding layer on the surfaces of the insulating layer 21, the heat conduction layer 23 and the routing layer 10 to be bonded.

And S3, exhausting gas among the insulating layer, the heat conducting layer and the wiring layer.

And S4, bonding the insulating layer, the heat conducting layer and the wiring layer under the preset temperature and pressure.

In one embodiment, the time for attaching the insulating layer, the heat conducting layer and the routing layer at the preset temperature and pressure can be 30 minutes, so that the insulating layer and the heat conducting layer are in full contact and closely attached, and the heat conducting performance of the heat conducting layer is effectively enhanced.

S5, cooling the attached insulating layer, the heat conducting layer and the wiring layer to a preset temperature, and curing the material of the bonding layer to form the bonding layer.

The flow chart described in this application is just one example, and there may be many variations to this diagram or the steps in this application without departing from the spirit of the application. For instance, the steps may be performed in a differing order, or steps may be added, deleted or modified. It will be understood by those skilled in the art that all or part of the above-described embodiments may be implemented and equivalents thereof may be made to the claims of the present application while remaining within the scope of the present invention.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. All possible combinations of the respective technical features in the above embodiments are described, however, the combination of the technical features should be considered as the scope of the present specification as long as there is no contradiction therebetween.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A printed circuit board structure comprises at least one routing layer and at least one medium layer which are sequentially staggered and stacked, and is characterized in that the number of the routing layers is equal to or more than one of the number of the medium layers, each medium layer comprises at least two insulating layers and at least one heat conducting layer, the at least two insulating layers and the at least one heat conducting layer are sequentially staggered and stacked, the insulating layers are adjacent to the two opposite sides of the heat conducting layers, and the insulating layer on the outermost side of each medium layer is adjacent to the routing layer.

2. The printed circuit board structure of claim 1, wherein said printed circuit board structure includes two of said routing layers and one of said dielectric layers, said dielectric layer including three of said heat conductive layers and four of said dielectric layers, four of said dielectric layers and three of said heat conductive layers being stacked in an alternating sequence, and wherein opposite sides of said heat conductive layers are adjacent to said dielectric layers, and wherein the outermost two of said dielectric layers are adjacent to two of said routing layers, respectively.

3. A printed circuit board structure according to claim 1, further comprising an adhesive layer disposed between each of said insulating layers and said thermally conductive layer to adhere each of said insulating layers and each of said thermally conductive layers together to form said dielectric layer.

4. A printed circuit board structure as claimed in claim 1 wherein said printed circuit board structure further comprises an adhesive layer disposed between the outermost two of said dielectric layers and said routing layer to bond each of said dielectric layers and each of said routing layers together.

5. A printed circuit board structure as claimed in claim 3 or 4 wherein the adhesive layer comprises at least one epoxy layer.

6. A printed circuit board structure according to any of claims 1-4, wherein electronic components are mounted on the routing layer, the routing layer comprising at least one copper foil, the copper foil being electrically connected to the electronic components.

7. A printed circuit board structure according to any of claims 1 to 4, wherein the thermally conductive layer comprises at least one graphite film.

8. An electronic device comprising a housing and a printed circuit board structure according to any of claims 1-7, said printed circuit board structure being mounted in said housing.

9. The electronic device of claim 8, further comprising a heat dissipation fan mounted in the housing for conducting heat generated by the electronic components on the printed circuit board structure to an external environment.

10. The electronic device of claim 9, further comprising a heat dissipation duct communicating between the printed circuit board structure and the chassis for conducting heat generated by the printed circuit board structure to the chassis.