CN220733091U

CN220733091U - Double-sided radiating PCB circuit board

Info

Publication number: CN220733091U
Application number: CN202322388720.7U
Authority: CN
Inventors: 陶继宏; 许成桥; 李二姣; 赵明
Original assignee: Guangde Wanzheng Electronic Technology Co ltd
Current assignee: Guangde Wanzheng Electronic Technology Co ltd
Priority date: 2023-09-04
Filing date: 2023-09-04
Publication date: 2024-04-05
Anticipated expiration: 2033-09-04

Abstract

The utility model relates to the technical field of circuit boards, in particular to a double-sided radiating PCB (printed Circuit Board), which comprises a substrate, wherein an electronic element is welded on the substrate, a heat conduction silicone grease is coated on the electronic element, a first heat conduction sheet is arranged on one side of the heat conduction silicone grease, which is far away from the electronic element, a radiating hole is further formed in the substrate, the first heat conduction sheet is arranged at one end of the radiating hole, an annular heat conduction sheet is coaxially arranged in the radiating hole, one end of the annular heat conduction sheet is abutted against the first heat conduction sheet, the other end of the annular heat conduction sheet is connected with the first heat conduction sheet, mounting plates are arranged on two sides of the substrate, and the first heat dissipation sheet is fixedly arranged on the mounting plates.

Description

Double-sided radiating PCB circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a double-sided heat dissipation PCB.

Background

Along with the development trend of high density of printed circuit boards, the production requirements of the circuit boards are higher and higher. The PCB circuit board is poor in heat dissipation treatment, and the service life of the circuit board can be influenced.

In the prior art, the application number is as follows: 202220295709.9 is disclosed by the name: the utility model provides a heat dissipation circuit board, includes base plate, radiating piece and base, is provided with the heat absorption membrane, the heat absorption membrane bond in on the base plate, the radiating piece is installed the heat absorption membrane, the radiating piece is by supreme heat absorption layer and the heat dissipation layer of including in proper order down, the heat dissipation layer is provided with first thermovent.

However, in the prior art, the application number is as follows: 202220295709.9, the circuit board can only perform single-sided heat dissipation, and when the temperature of the circuit board rises in a short time, the single-sided heat dissipation effect is poor, so the utility model provides a double-sided heat dissipation PCB.

Disclosure of Invention

The utility model aims to provide a double-sided heat dissipation PCB (printed Circuit Board) to solve the problems in the prior art.

The aim of the utility model can be achieved by the following technical scheme: the utility model provides a two-sided radiating PCB circuit board, PCB circuit board includes the base plate, the welding has electronic component on the base plate, scribble heat conduction silicone grease on the electronic component, one side that electronic component was kept away from to heat conduction silicone grease is provided with the conducting strip first, still offered the louvre on the base plate, the conducting strip first sets up the one end of louvre.

Annular heat conducting fin is coaxially installed in the heat dissipation hole, annular heat conducting fin one end is connected with heat conducting fin one in a butt way, and the other end is connected with heat radiating fin one, and the mounting panel is all installed to the base plate both sides, heat radiating fin one fixed mounting is in on the mounting panel, and still the joint has heat radiating fin two on the mounting panel, heat radiating fin two sets up in the base plate one side of keeping away from heat radiating fin one.

Further, a plurality of through holes are formed in the annular heat conducting fin and the first heat radiating fin so as to increase the contact area with air.

Further, a plurality of arc-shaped sheets are arranged on one side of the first radiating sheet, and the arc-shaped sheets are arranged on one side of the through hole on the first radiating sheet.

Further, a clamping rod is clamped on the mounting plate, a connecting rod is connected to the clamping rod, the connecting rod is connected to the second radiating fin, and the second radiating fin is abutted to the mounting plate.

Further, a plurality of copper columns are slidably arranged on one side of the second radiating fin, and the copper columns are abutted with non-electronic elements on the substrate.

Further, a plurality of heat dissipation columns are respectively abutted to two sides of the substrate, the heat dissipation columns are arranged on the mounting plate, and a plurality of round holes are formed in the heat dissipation columns.

The utility model has the beneficial effects that:

1. the utility model is provided with the first heat conducting fin, the heat conducting silicone grease and the heat conducting fin which are smeared on the electronic element transfer the heat generated by the electronic element to the first heat radiating fin to radiate the back of the substrate, and meanwhile, the copper column clamped on the second heat radiating fin on the mounting plate is arranged on the place without the electronic element on the substrate in a sliding way, so that the synchronous heat radiation is also carried out on the surface of the substrate, and the double-sided heat radiation is realized;

2. the utility model also provides the radiating holes on the substrate, the inner wall of the radiating holes is provided with the annular heat conducting fin which takes copper as a raw material, the copper can quickly absorb heat on the first heat conducting fin, and the annular heat conducting fin is also provided with a plurality of through holes, so that the contact area with air is increased, and the heat radiation is promoted.

Drawings

The utility model is further described below with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is an enlarged schematic view of the structure of FIG. 1 at A;

FIG. 3 is an enlarged schematic view of the structure of FIG. 1 at B;

fig. 4 is a schematic diagram of a circuit board structure according to the present utility model.

The reference numerals are as follows:

1. a substrate; 2. an electronic component; 3. a first heat conductive sheet; 4. annular heat conducting fin; 5. a first radiating fin; 6. a mounting plate; 7. a second radiating fin; 8. an arc-shaped sheet; 9. a clamping rod; 10. a connecting rod; 11. copper columns; 12. a heat radiation column; 13. and (5) heat-conducting silicone grease.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Please combine fig. 1, fig. 2 and fig. 3, a double-sided radiating PCB circuit board, the PCB circuit board includes a substrate 1, an electronic component 2 is soldered on the substrate 1, a heat-conducting silicone grease 13 is coated on the electronic component 2, the heat-conducting silicone grease 13 is used for filling a gap between the first heat-conducting sheet 3 and the electronic component 2, and the heat-conducting silicone grease 13 can also assist in conducting heat, a first heat-conducting sheet 3 is disposed on a side of the heat-conducting silicone grease 13 away from the electronic component 2, a heat-dissipating hole is further opened on the substrate 1, and the first heat-conducting sheet 3 is disposed at one end of the heat-dissipating hole.

Annular heat conducting fin 4 that adopts the copper material is coaxial to install in the louvre, annular heat conducting fin 4 one end and the first 3 butt of heat conducting fin, the other end is connected with fin one 5, mounting panel 6 is all installed to base plate 1 both sides, fin one 5 fixed mounting is on mounting panel 6, and still the joint has fin two 7 on the mounting panel 6, fin two 7 set up in base plate 1 keep away from one side of fin one 5, a plurality of through-holes have all been seted up on annular heat conducting fin 4 and the fin one 5 to increase and air area of contact is supplementary dispel the heat.

A plurality of arc pieces 8 are installed to one side of fin one 5, and the through-hole one side on fin one 5 is installed to arc piece 8, and arc piece 8 is used for increasing the radiating area of fin one 5, promotes the giving off of heat.

The mounting plate 6 is clamped with the clamping rod 9, the clamping rod 9 is connected with the connecting rod 10, the connecting rod 10 is connected to the second cooling fin 7, the second cooling fin 7 is abutted to the mounting plate 6, one side of the second cooling fin 7 is slidably provided with a plurality of copper columns 11, and the copper columns 11 are abutted to the positions, on the substrate 1, where the electronic elements 2 are not arranged.

The second cooling fin 7 is connected with the base plate 1 through the copper column 11, when the cooling requirement is higher, the second cooling fin 7 is clamped on the mounting plates 6 on two sides of the base plate 1, and then the copper column 11 on the second cooling fin 7 is slid to be positioned at the position on the base plate 1 where the electronic element 2 is not arranged, so that the surface of the base plate 1 is cooled.

Please combine fig. 3, both sides of the substrate 1 are all abutted with a plurality of heat dissipation columns 12, the heat dissipation columns 12 are mounted on the mounting plate 6, a plurality of round holes are formed in the heat dissipation columns 12, the heat dissipation columns 12 can also dissipate heat to the side face of the substrate 1, and the round holes are formed to increase the contact area between the heat dissipation columns 12 and air, so that heat dissipation is promoted.

The working principle is that when the circuit board is used, the electronic element 2 on the surface of the circuit board can generate more heat, so that the temperature of the circuit board is increased, at the moment, the heat generated by the electronic element 2 is guided out into the heat dissipation holes formed in the base plate 1 by the heat conduction silicone grease 13 coated on the electronic element 2 and the heat conduction sheet I3 coated on the heat conduction silicone grease 13, and the annular heat conduction sheet 4 is arranged in the heat dissipation holes, so that the heat on the heat conduction sheet I3 is guided out onto the heat dissipation sheet I5, and the heat dissipation holes are formed in the heat dissipation sheet I5 and the annular heat conduction sheet 4, so that the ventilation area is increased, and the heat dissipation is promoted.

If the heat dissipation needs to be higher, the second heat dissipation plate 7 is clamped on the mounting plate 6 through the clamping rod 9, and meanwhile, the copper column 11 on the second heat dissipation plate 7 is slid, so that the copper column is positioned on the substrate 1 where the electronic element 2 does not exist, the surface of the substrate 1 is conducted, and the heat on the surface of the substrate 1 is led out to the second heat dissipation plate 7 through the copper column 11 to dissipate the heat, so that the double-sided heat dissipation of the circuit board is realized.

In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. The PCB circuit board with double-sided heat dissipation is characterized by comprising a substrate (1), wherein an electronic element (2) is welded on the substrate (1), heat conduction silicone grease (13) is coated on the electronic element (2), a first heat conduction sheet (3) is arranged on one side, far away from the electronic element (2), of the heat conduction silicone grease (13), a heat dissipation hole is further formed in the substrate (1), and the first heat conduction sheet (3) is arranged at one end of the heat dissipation hole;

annular conducting strip (4) are coaxially installed in the radiating hole, annular conducting strip (4) one end and conducting strip one (3) butt, and the other end is connected with radiating strip one (5), mounting panel (6) are all installed to base plate (1) both sides, radiating strip one (5) fixed mounting is in on mounting panel (6), and still the joint has radiating strip two (7) on mounting panel (6), radiating strip two (7) set up in one side that radiating strip one (5) was kept away from to base plate (1).

2. The double-sided radiating PCB of claim 1, wherein the annular heat-conducting fin (4) and the first heat-conducting fin (5) are provided with a plurality of through holes to increase the contact area with air.

3. A double-sided heat dissipating PCB according to claim 2, wherein a plurality of arcuate fins (8) are mounted on one side of the first heat sink (5), the arcuate fins (8) being mounted on one side of the through holes in the first heat sink (5).

4. The double-sided radiating PCB of claim 1, wherein the mounting board (6) is clamped with a clamping rod (9), the clamping rod (9) is connected with a connecting rod (10), the connecting rod (10) is connected to the second radiating fin (7), and the second radiating fin (7) is abutted to the mounting board (6).

5. The double-sided radiating PCB circuit board according to claim 1, wherein a plurality of copper columns (11) are slidably arranged on one side of the second radiating fin (7), and the copper columns (11) are abutted with non-electronic components (2) on the substrate (1).

6. The double-sided radiating PCB circuit board according to claim 1, wherein a plurality of radiating columns (12) are abutted to two sides of the substrate (1), the radiating columns (12) are arranged on the mounting plate (6), and a plurality of round holes are formed in the radiating columns (12).