CN218830193U - Image acquisition device, macroscopic defect detection equipment and automatic control system - Google Patents

Abstract

The utility model belongs to the technical field of intelligent control, in particular to an image acquisition device, macroscopic defect detection equipment and an automatic control system; the technical problem to be solved by the utility model comprises finding a proper installation position and carrying out installation, in particular to the optimization of the installation height and the camera pixels; in addition, the quality of image acquisition can be further improved by arranging the environmental light isolation cover and the light reflection control device; furthermore, by arranging the trigger device, the proportion of obtaining effective images is improved; through the association of the image acquisition device and a fault monitoring or automatic control system, the real-time performance of the system is improved, and the defect of the original system in the aspect of detection efficiency is avoided.

Description

Image acquisition device, macroscopic defect detection equipment and automatic control system

Technical Field

The utility model belongs to the technical field of intelligent control, especially, relate to an image acquisition device, macroscopic defect check out test set and automatic control system.

Background

Defects of a wafer or a workpiece can be divided into a macroscopic type and a microscopic type; the micro defects are often closely related to the detailed circuits of the process, and the macro defects are mostly considered in units of wafers or workpieces. The equipment or process for detecting the microscopic defects has low detection efficiency on the macroscopic defects, or needs a special scanning machine to complete related work; in order to improve the efficiency of wafer or similar workpiece/product processing, it is necessary to improve the detection technical solution of macroscopic defects; avoiding unnecessary resource waste caused by missing such defects.

Disclosure of Invention

The inventor finds that: the wafer is subjected to numerous mechanical damage risks in the manufacturing process, and various factors including scratches and collisions cannot be effectively monitored at the execution end of a machine table or a control system; the existing monitoring equipment is limited in detection capability, and more noise signals exist, so that the state of a flaw or a failure product is difficult to effectively detect.

When the wafer or product reaches the special scanner, even if the defect or failure product is detected, the best missed treatment is realized due to the complicated and long process, which is disadvantageous to the improvement of the process and easily causes batch loss.

Through the visual window (or increase visual window) of the specific position of platform, the installation camera is taken a candid photograph, and the image of shooing is analyzed in real time, establishes data model through specific algorithm, discerns the wafer and in process of goods surface unusual (macroscopic defect) to carry out signal feedback (if stop the conveying, the mail is notified, change the platform state etc.), can effectively promote automatic control system's output efficiency and yield.

The technical problem to be solved by the utility model comprises finding a proper installation position and installing, in particular to the optimization of the installation height and the camera pixels; in addition, the quality of image acquisition can be further improved by arranging the environmental light isolation cover and the light reflection control device; and then through setting up trigger device, promote the proportion that effective image acquireed. In addition, go back accessible improvement image recognition algorithm, promote the relevance rate, relevant content has surpassed the utility model discloses a scope, no longer gives unnecessary details here.

The embodiment of the utility model discloses an image acquisition device, which comprises an image acquisition part, an image acquisition device body, a position adjustment part and an illumination adjustment part; the position adjusting component comprises a first base and a second base.

Specifically, the first base is fixedly connected or detachably connected with the image acquisition part; the second base is fixedly connected or detachably connected with the image acquisition device body.

Furthermore, the position adjusting part can also be provided with a third mechanical arm or a detachable fourth machine table; the third mechanical arm can realize the posture or angle adjustment of the position adjusting part; the detachable fourth machine table can also be used for adjusting the initial installation position of the position adjusting component, so that the image acquisition direction of the image acquisition component is matched with the workpiece or the wafer, and effective image capture is achieved.

Specifically, the image acquisition component comprises an image acquisition circuit which transmits the acquired image or related data to the external equipment and/or receives the related data from the external equipment through a first communication line of the communication component so as to adjust the image acquisition or transmission process of the image acquisition component.

Furthermore, the illumination adjusting component also comprises a light source and a light shield; the illumination adjusting part is fixedly connected or detachably connected with the image acquisition device body; the illumination adjusting component adjusts a first path of light projected by the light source onto the wafer or the workpiece; the illumination adjusting component simultaneously adjusts the second path of light rays which are reflected to the wafer or the workpiece by the light source and other light sources.

Further, the image acquisition component is in communication connection with the target system through a fifth communication line of the communication component; the target system is a subsystem of the upper system, and the target system is in communication connection and/or exchanges data with the upper system; the upper system controls the image acquisition process of the image acquisition component or receives data from the image acquisition component.

Specifically, the image acquisition section is communicatively connected to the feature recognition section through a third communication line of the communication section and exchanges data.

Furthermore, the image acquisition device body can be provided with at least one mounting position; the mounting position can be provided with a first mounting position, a second mounting position, a third mounting position, a fourth mounting position, a fifth mounting position, an Mth mounting position and an Nth mounting position; wherein, M and N are both natural numbers larger than 1, and M is not equal to N.

Specifically, the installation positions of the communication subsystems are provided with communication components, and the communication subsystems are in communication connection with the image acquisition components; the communication subsystem exchanges data with the image acquisition component and transmits the data acquired by the image acquisition component to external equipment.

Among them, in order to optimize the image capturing effect, on the basis of experiments, the inventors found that the wavelength of light emitted from the light source of the illumination adjusting unit can be selected to be in the red light range between 620 and 760 nm.

Furthermore, the light shield of the illumination adjustment component can be set as a closed container or an opaque container, and the light source is shielded inside the light shield by the light shield or only projected towards the preset direction, and the proposal can avoid the device of the utility model generates unexpected or undesired interference to the original system or the related optical system.

In particular, the second path of light can transmit light between the inside and the outside of the light shield through the optical fiber or the closed light path.

The first base and the image acquisition component can be fixed by adopting an insulating bonding material; the insulating bonding material comprises a resin material; the image acquisition component comprises a camera and a lens which are assembled; the visual field of the lens is not less than 135mm; the shutter speed of the lens can be selected to be 1/15s.

The communication component can be a vehicle-mounted communication line and/or a vehicle bus; such as a CAN bus; the upper System can be a Manufacturing enterprise production process Execution System MES (Manufacturing Execution System).

Furthermore, through the embodiment, the utility model discloses a macroscopic defect detection equipment of wafer or semiconductor work piece is further disclosed, which is different from the detection aiming at the microscopic defect; often, these defects are visible to the naked eye or, alternatively, there is some manual involvement of the associated work. Therefore, there is a need to improve the efficiency of detection by improving the solution, or to liberate the manual participation process by technical improvement.

Specifically, the detection device may include the image acquisition apparatus as disclosed above or further refine its detection and information processing with the above apparatus as a core; the image acquisition device is in communication connection and/or data exchange with the feature identification component through a third communication line of the communication component, and is used for delivering acquired image information or suspected defect data to the existing identification judgment unit.

Furthermore, the image acquisition device is in communication connection with a target system through a fifth communication line of the communication component, similarly, the target system is a subsystem of the upper system, and the target system and the upper system can also be in communication connection and/or exchange data; the upper system realizes the automatic processing of the equipment by controlling the image acquisition process of the image acquisition component or receiving data from the image acquisition component.

Specifically, the communication component thereof may be an in-vehicle communication line and/or bus; the vehicle-mounted bus comprises a CAN bus; its upper system can also be the manufacturing enterprise production process execution system MES.

Similarly, to improve image capture, the light source of the illumination adjustment component may be selected to emit light in the red wavelength range of 620-760 nm.

Furthermore, the light shield of the illumination adjusting component can be set as a closed container or a light-tight container, so that the light source is shielded inside the light shield by the light shield or only projects towards a preset direction, and the interference of the equipment to the outside or adjacent equipment is reduced as much as possible.

Likewise, the embodiment of the present invention also discloses an automatic control system, which comprises a fault diagnosis and treatment component, an execution component, the image acquisition device as disclosed above and/or the macroscopic defect detection device as disclosed above.

The image acquisition device is in communication connection with the fault diagnosis and treatment component, and the fault diagnosis and treatment component triggers the diagnosis and treatment actions of the fault diagnosis and treatment component according to the image acquired by the image acquisition device.

In particular, the diagnosis and treatment actions include stopping or terminating the operation of the executive component, i.e. intervening in the relevant production process when a macroscopic flaw or a workpiece defect occurs, and avoiding unnecessary subsequent production investment.

Further, the execution component is in communication connection and/or electrical connection with the machine or the production execution system through the communication component or the related circuit; the execution component controls the working state of the machine or the production execution system according to the diagnosis and treatment instruction of the fault diagnosis and treatment component.

Specifically, when the wafer or the workpiece and the position adjusting component accord with a preset relative position relationship, the image acquisition component acquires image information in real time and transmits the image information to the fault diagnosis and treatment component, so that the detection efficiency is further improved, and adverse consequences caused by delayed detection are avoided.

Wherein, the machine or the production execution system can be a manufacturing enterprise production process execution system MES; the manufacturing enterprise production process execution system MES and the fault diagnosis and treatment component are in communication connection and/or electric connection through a communication component or a related circuit; the light source of the light adjusting component can also select the wavelength of the emitted light between 620 nm and 760 nm; the light shield of the illumination adjusting component can also be a closed container or a similar structure, and the light source can also solve the problem of external interference through the shielding of the light shield.

To sum up, the beneficial effects of the present invention mainly include: the capability of accurately finding the macroscopic abnormality of the product under the condition that no obvious parameter abnormality exists at the machine station end; the method can replace human eye/man identification, reduce the detection time of man-made judgment errors or man-power fatigue missing, save the labor cost and ensure higher detection rate.

In addition, the utility model discloses relevant product can inform board or production execution system through communication system after discovering unusually, makes the board stop production, avoids follow-up product to receive the influence; simultaneously, still accessible upgrading software algorithm the utility model discloses on the basis of structure, further promote the detection efficiency of defect.

It should be noted that the terms "first", "second", and the like are used herein only for describing the components in the technical solution, and do not constitute a limitation on the technical solution, and are not understood as an indication or suggestion of the importance of the corresponding component; an element in the similar language "first", "second", etc. means that in the corresponding embodiment, the element includes at least one.

Drawings

In order to more clearly illustrate the technical solution of the present invention, it is beneficial to the further understanding of the technical effects, technical features and objects of the present invention, the following is combined with the drawings to carry out the detailed description of the present invention, and the drawings constitute the necessary components of the description, and together with the embodiments of the present invention, are used for illustrating the technical solution of the present invention, but do not constitute the limitation of the present invention.

The same reference numerals in the drawings denote the same elements, and in particular:

FIG. 1 is a schematic diagram of the structure of an embodiment of the image capturing device of the present invention;

FIG. 2 is a schematic diagram of the structure of the detection apparatus of the present invention;

fig. 3 is a schematic view of a structure of the illumination adjustment component according to an embodiment of the present invention;

fig. 4 is a schematic view of the working state of the embodiment of the present invention;

fig. 5 is a schematic view of the installation layout of the product according to the embodiment of the present invention;

fig. 6 is a schematic diagram of the structure of the automatic control system of the present invention. Wherein:

001-image acquisition device, 002-detection equipment, 003-illumination adjustment component,

004-working state, 005-installation layout, 006-automatic control system,

100-image acquisition device, 101-image acquisition component, 103-image acquisition device body,

105-position adjusting means, 107-illumination adjusting means,

200-communication means, 300-macroscopic defect detection device,

400-a higher level system, 401-a target system,

501-a first communication line, 502-a second communication line, 503-a third communication line,

504-a fourth communication line, 505-a fifth communication line;

600-a fault-diagnosis component for diagnosing faults,

701-light source, 703-protective cover, 705-light shield;

800-workpiece; 900-a machine table, wherein the machine table is provided with a plurality of machine tables,

901-a first mounting location, 902-a second mounting location, 903-a third mounting location,

904-fourth mounting location, 905-fifth mounting location,

90M-M mounting location, 90N-N mounting location.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. Of course, the following description of the specific embodiments is only for the purpose of explaining the technical solution of the present invention, and is not intended to limit the present invention. In addition, the portions shown in the examples or the drawings are merely illustrative of the relevant portions of the present invention, and are not all of the present invention.

As shown in fig. 1, the embodiment of the image capturing device of the present invention comprises an image capturing component 101, an image capturing device body 103, a position adjusting component 105, and a lighting adjusting component 107; the position adjusting component 105 includes a first base and a second base; the first base is fixedly connected or detachably connected with the image acquisition part 101; the second base is fixedly connected or detachably connected with the image acquisition device body 103.

Specifically, the position adjusting component 105 may further include a third robot or a detachable fourth machine; the third mechanical arm can realize the adjustment of the posture of the position adjusting part 105 or the relative angle between the position adjusting part and the workpiece or the wafer; the detachable fourth machine table can be used for adjusting the initial installation position of the position adjusting component 105, so that the related components are more conveniently distributed and maintained or related position change is carried out.

Further, the image capturing part 101 includes an image capturing circuit, which can transmit the captured image or related data to the external device and/or receive the related data from the external device through the first communication line 501 of the communication part 200 to adjust the image capturing or transmitting process of the image capturing part 101.

As shown in fig. 3, the illumination adjustment unit 107 includes a light source 701 and a light shield 705; the illumination adjusting component 107 is fixedly connected or detachably connected with the image acquisition device body 103; the illumination adjusting component 107 adjusts a first path of light projected by the light source 701 onto the wafer or the workpiece; the illumination adjustment component 107 simultaneously adjusts the second path of light reflected by the light source 701 and other light sources onto the wafer or workpiece to meet the requirements of exposure or image acquisition, and obtain the necessary brightness or resolution.

Specifically, as shown in fig. 2, the image capturing part 101 thereof may be communicatively connected to the target system 401 through a fifth communication line 505 of the communication part 200; the target system 401 is a subsystem of the upper system 400, and the target system 401 is in communication connection and/or exchanges data with the upper system 400; the host system 400 controls an image capturing process of the image capturing part 101 or receives data from the image capturing part 101.

Further, as shown in fig. 1 and fig. 2, the image capturing component 101 is communicatively connected to the feature recognition component 301 via a third communication line 503 of the communication component 200 and exchanges data, so as to provide data support for further application or processing of the image.

In order to improve the efficiency of image recognition or ensure the real-time performance of the related signals, the image capturing device body 103 shown in fig. 1 and 5 includes at least one mounting position; the mounting positions include a first mounting position 901, a second mounting position 902, a third mounting position 903, a fourth mounting position 904, a fifth mounting position 905, an mth mounting position 90M, and an nth mounting position 90N; wherein, M and N are both natural numbers larger than 1, and M is not equal to N.

Specifically, the installation positions of the communication subsystems are provided with communication parts 200, and the communication subsystems are in communication connection with the image acquisition part 101; the communication subsystem exchanges data with the image acquisition component 101 and transmits the data acquired by the image acquisition component 101 to external equipment.

Further, as shown in fig. 3, the light source 701 of the illumination adjustment component 107 selects electromagnetic waves with a wavelength between 620 nm and 760 nm; the light shield 705 of the illumination adjustment component 107 is selected as a sealed container or an opaque container, and the light source 701 is shielded inside the light shield 705 by the light shield 705 to ensure that the workpiece or wafer is illuminated with the necessary light.

In addition, light may be transmitted between the interior and exterior of the light shield 705 by a second path of light through an optical fiber or a closed optical path.

Further, the first base and the image acquisition part 101 may be fixed by using an insulating adhesive material; the insulating adhesive material includes a resin material; the image capturing part 101 includes a camera and a lens installed in combination; the visual field of the lens is not less than 135mm; the shutter speed of the lens is 1/15s.

Specifically, the communication component 200 may adopt an on-vehicle communication line or a CAN bus; its upper system 400 can be a manufacturing enterprise production process execution system, MES.

As shown in fig. 2, the macro defect inspection apparatus includes an image capturing device 100; the image acquisition device 100 is in communication connection and/or exchanges data with the feature recognition component 301 through a third communication line 503 of the communication component 200; the image acquisition device 100 is also in communication connection with a target system 401 through a fifth communication line 505 of the communication component 200, the target system 401 is a subsystem of the upper system 400, and the target system 401 is in communication connection and/or exchanges data with the upper system 400; the host system 400 controls an image capturing process of the image capturing part 101 or receives data from the image capturing part 101.

Specifically, the communication section 200 may be implemented by any vehicle-mounted communication unit including a CAN bus; its upper system 400 can be a manufacturing enterprise production process execution system MES; the light source 701 of the illumination adjusting part 107 may be a red light source; the wavelength of the light is between 620 and 760 nm; the light shield 705 of the illumination adjustment component 107 is a closed container or an opaque container, and the light source 701 is shielded inside the light shield 705 by the light shield 705 or projected only in a predetermined direction.

Further, as shown in fig. 6, the automatic control system of the present invention includes a fault diagnosis and treatment component 600, an execution component 666, and further includes an image acquisition apparatus 100 and/or the above macro defect detection device; the image capturing device 100 is connected to the failure diagnosis and treatment unit 600 in a communication manner, and the failure diagnosis and treatment unit 600 triggers a diagnosis and treatment operation of the failure diagnosis and treatment unit 600 according to an image obtained by the image capturing device 100.

Wherein the diagnostic and treatment actions include aborting or terminating the operation of execution unit 666.

Further, the execution unit 666 is communicatively and/or electrically connected with the machine or production execution system via the communication unit 200 or related circuitry; the execution unit 666 controls the operation status of the tool or the production execution system according to the diagnosis and treatment instruction of the fault diagnosis and treatment unit 600.

Specifically, when the wafer or the workpiece and the position adjustment component 105 conform to a preset relative position relationship, the image acquisition component 101 acquires image information and transmits the image information to the fault diagnosis and handling component 600; through image acquisition device and fault monitoring or automatic control system's relevance, the utility model provides the real-time of system has been promoted, the not enough of original system in the aspect of examining efficiency has been avoided.

As shown in fig. 5 and fig. 6, the machine or the production execution system may be an enterprise production process execution system MES; the manufacturing enterprise production process execution system MES and the fault diagnosis and treatment component 600 are connected in communication and/or electric connection through the communication component 200 or related circuits; the light source 701 of the illumination adjustment component 107 selects red light with the wavelength between 620 and 760 nm; the light shield 705 of the illumination adjustment member 107 is a sealed container, and the light source 701 is shielded inside the light shield 705 by the light shield 705.

The embodiment of the utility model also tests above the cabin of the AMAT ENDURA2 machine, and verifies the detection process of the defected Wafer AW (arc Wafer); passing through different test environments, light sources and reflecting scenes; the test process obtains a clear detection image, and the communication component and the related equipment perform effective data exchange, so that the parameter design is optimized for the implementation of related products.

Furthermore, by arranging necessary sensors, the exposure or acquisition time or acquisition mode of the image acquisition device can be improved, a related control system is ensured to obtain key data of a specified position, random factors of a production process are reduced, the reliability of the system is improved, and the relevance of fault diagnosis is improved.

It should be noted that the above embodiments are only for clearly illustrating the technical solutions of the present invention, and those skilled in the art can understand that the embodiments of the present invention are not limited to the above contents, and obvious changes, substitutions or replacements based on the above contents do not exceed the scope covered by the technical solutions of the present invention; other embodiments will fall within the scope of the invention without departing from the inventive concept.

Claims (12)

1. An image acquisition apparatus comprising:

an image acquisition component (101), an image acquisition device body (103), a position adjustment component (105) and an illumination adjustment component (107); wherein,

the position adjusting component (105) comprises a first base and a second base; the first base is fixedly connected or detachably connected with the image acquisition part (101); the second base is fixedly connected or detachably connected with the image acquisition device body (103);

the position adjusting part (105) further comprises a third mechanical arm or a detachable fourth machine table; the third mechanical arm can realize the posture or angle adjustment of the position adjusting component (105); the detachable fourth machine table is used for adjusting the initial installation position of the position adjusting part (105);

the image acquisition component (101) comprises an image acquisition circuit, and the image acquisition circuit transmits the acquired image or related data to an external device and/or receives the related data from the external device through a first communication line (501) of the communication component (200) so as to adjust the image acquisition or transmission process of the image acquisition component (101);

the illumination adjustment component (107) comprises a light source (701) and a light shield (705); the illumination adjusting part (107) is fixedly connected or detachably connected with the image acquisition device body (103); the illumination adjusting component (107) adjusts a first path of light projected by the light source (701) onto a wafer or a workpiece; the illumination adjusting component (107) simultaneously adjusts the second path of light reflected by the light source (701) to the wafer or the workpiece.

2. The image capturing apparatus of claim 1, wherein:

the image acquisition component (101) is in communication connection with a target system (401) through a fifth communication line (505) of the communication component (200);

the target system (401) is a subsystem of an upper system (400), and the target system (401) is in communication connection with the upper system (400) and/or exchanges data; the upper system (400) controls the image acquisition process of the image acquisition component (101) or receives data from the image acquisition component (101).

3. The image acquisition apparatus according to claim 1, wherein:

the image acquisition component (101) is in communication connection with the feature recognition component (301) through a third communication line (503) of the communication component (200) and exchanges data.

4. The image capturing apparatus of claim 1, 2, or 3, wherein:

the image acquisition device body (103) comprises at least one mounting position; the mounting positions comprise a first mounting position (901), a second mounting position (902), a third mounting position (903), a fourth mounting position (904), a fifth mounting position (905), an Mth mounting position (90M) and an Nth mounting position (90N); m and N are both natural numbers larger than 1, and M is not equal to N;

the installation positions are provided with communication subsystems of the communication components (200), and the communication subsystems are in communication connection with the image acquisition components (101); the communication subsystem exchanges data with the image acquisition component (101) and transmits the data acquired by the image acquisition component (101) to external equipment.

5. The image capturing apparatus of claim 4, wherein:

the light source (701) of the illumination adjusting component (107) emits light with the wavelength between 620 and 760 nm;

the light shield (705) of the illumination adjustment component (107) is a closed container or a light-tight container, and the light source (701) is shielded inside the light shield (705) by the light shield (705) or only projects towards a preset direction.

6. The image capturing apparatus of claim 5, wherein:

the second path of light transmits light between the inside and the outside of the light shield (705) through optical fibers or a closed light path; the first base and the image acquisition component (101) are fixed by adopting an insulating bonding material; the insulating adhesive material includes a resin material; the image acquisition part (101) comprises a camera and a lens which are installed in a combined mode; the visual field of the lens is not less than 135mm; the shutter speed of the lens is 1/15s.

7. The image capturing apparatus of claim 2, wherein:

the communication means (200) comprises an onboard communication line and/or bus; the bus comprises a CAN bus;

the host system (400) comprises a manufacturing enterprise production process execution system (MES).

8. A macro defect inspection apparatus, comprising:

the image acquisition apparatus (100) of any of claims 1, 2, 3, 5 or 6;

the image acquisition device (100) is in communication connection and/or exchanges data with the feature recognition component (301) through a third communication line (503) of the communication component (200);

the image acquisition device (100) is in communication connection with a target system (401) through a fifth communication line (505) of a communication component (200), the target system (401) is a subsystem of an upper system (400), and the target system (401) is in communication connection with the upper system (400) and/or exchanges data; the upper system (400) controls the image acquisition process of the image acquisition component (101) or receives data from the image acquisition component (101).

9. The macro defect inspection apparatus of claim 8, wherein:

the communication means (200) comprises an onboard communication line and/or bus; the bus comprises a CAN bus;

the upper system (400) comprises a manufacturing enterprise production process execution system (MES);

the light source (701) of the illumination adjusting component (107) emits light with the wavelength between 620 and 760 nm;

the light shield (705) of the illumination adjustment component (107) is a closed container or an opaque container, and the light source (701) is shielded inside the light shield (705) by the light shield (705) or projects towards a preset direction only.

10. An automatic control system comprising:

a fault diagnosis and handling component (600), an execution component (666), further comprising the image acquisition apparatus (100) as defined in any one of claims 1, 2, 3, 5 or 6;

and or the macro defect inspection apparatus of claim 8; wherein,

the image acquisition device (100) is in communication connection with the fault diagnosis and treatment component (600), and the fault diagnosis and treatment component (600) triggers a diagnosis and treatment action of the fault diagnosis and treatment component (600) according to the image acquired by the image acquisition device (100);

the diagnostic and treatment action includes halting or terminating execution of the execution component (666).

11. The automatic control system of claim 10, wherein:

the execution unit (666) is connected with a machine or a production execution system in a communication way and/or an electric connection way through the communication unit (200) or related circuits;

the execution unit (666) controls the working state of a machine or a production execution system according to the diagnosis and treatment instruction of the fault diagnosis and treatment unit (600);

when the wafer or the workpiece and the position adjusting component (105) accord with a preset relative position relationship, the image acquisition component (101) acquires image information and transmits the image information to the fault diagnosis and treatment component (600).

12. The automatic control system according to claim 10 or 11, wherein:

the machine or the production execution system comprises a manufacturing enterprise production process execution system MES;

the manufacturing enterprise production process execution system MES is communicatively and/or electrically connected with the fault diagnosis and handling component (600) through the communication component (200) or related circuitry;

the light source (701) of the illumination adjusting component (107) emits light with the wavelength between 620 and 760 nm;

the light shield 705 of the illumination adjustment component 107 is a closed container, and the light source 701 is shielded inside the light shield 705 by the light shield 705.

Images