CN205793613U - A kind of high-frequency resistance circuit board - Google Patents
A kind of high-frequency resistance circuit board Download PDFInfo
- Publication number
- CN205793613U CN205793613U CN201620505464.2U CN201620505464U CN205793613U CN 205793613 U CN205793613 U CN 205793613U CN 201620505464 U CN201620505464 U CN 201620505464U CN 205793613 U CN205793613 U CN 205793613U
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- CN
- China
- Prior art keywords
- circuit board
- plug
- aluminium base
- control device
- organic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
nullThis utility model relates to a kind of high-frequency resistance circuit board，Belong to field of circuit boards，Including aluminium base，Described aluminium base top is provided with alumina ceramic plate，Described alumina ceramic plate top is provided with organic resin plate，If described organic resin plate top is provided with stem plug groove，Described plug-in unit groove intracavity bottom is provided with plug-in unit anode Interface Terminal and plug-in unit negative electrode Interface Terminal，Described organic resin plate top connects heat abstractor by support，Described heat abstractor top is provided with radiating control device，Described radiating control device side is provided with temperature sensor，Described radiating control device opposite side is provided with temperature controller，Heat conductivity is good、Stability is high，Will not be by high frequency breakdown，Do not affect signal transmission，Simultaneously by heat abstractor is configured on circuit board，By radiator, heat is discharged，For obtaining effective radiating effect，Plug-in unit groove is set and can efficiently separate the distance of electronic component，Practical.
Description
Technical field
This utility model relates to a kind of high-frequency resistance circuit board, belongs to field of circuit boards.
Background technology
Along with developing rapidly of electronics industry, the raising of integrated circuit integrated level and the progress of package technique, electronic product changes
Making rapid progress especially, ceaselessly tend to light, thin, short, little, high frequency development, pcb board high-density interconnection technology becomes must
Right development trend, the pcb board supported as electronic component, is the most no longer a simple electrical interconnection devices, PCB demand
Just be no longer satisfied with " open ' & " short " quality local, the circuit on PCB more needs to possess signal transfer functions, and aobvious
Obtain more and more important, as resistance value is bigger than normal, then make signal transmission lose, and need to prevent insulating barrier breakdown, electricity simultaneously
The caloric value of sub-components and parts is the most increasing so that the packing density of circuit board constantly rises, thus produced heat dissipation problem
Increasingly severe, good cooling measure can promote the heat dissipation of circuit board effectively, and the life-span of lift elements, due to electronics
Small product size reduces and the continuous rising of chip frequency day by day, along with the highly integrated and fast development of high performance electronics, electricity
Sub-components and parts volume is more and more less, and speed and the efficiency requirements of work are more and more higher, and accordingly, the caloric value of electronic devices and components is also
Increasing so that the packing density of circuit board constantly rises, thus produced heat dissipation problem is increasingly severe, good
Cooling measure can promote the heat dissipation of circuit board, the life-span of lift elements, the circuit board that prior art provides effectively, it is impossible to
Enough operating temperatures to circuit board monitor in real time, and carry out in time, effectively dispel the heat, and the working environment of circuit board is more disliked
Bad, job stability and reliability are the highest, accordingly, it would be desirable to improve further.
Summary of the invention
The technical problems to be solved in the utility model overcomes existing defect, it is provided that a kind of high-frequency resistance circuit board, heat conductivity is good,
Stability is high, will not affected signal transmission by high frequency breakdown, simultaneously by heat abstractor is configured on circuit board, by
Heat is discharged by radiator, is used for obtaining effective radiating effect, arranges plug-in unit groove and can efficiently separate the distance of electronic component,
Can effectively solve the problem in background technology.
In order to solve above-mentioned technical problem, this utility model provides following technical scheme:
A kind of high-frequency resistance circuit board, including aluminium base, described aluminium base top is provided with alumina ceramic plate, described alumina ceramic plate
Top is provided with organic resin plate, if described organic resin plate top is provided with stem plug groove, described plug-in unit groove intracavity bottom is provided with
Plug-in unit anode Interface Terminal and plug-in unit negative electrode Interface Terminal, described organic resin plate top connects heat abstractor by support, described
Heat abstractor top is provided with radiating control device, and described radiating control device side is provided with temperature sensor, described radiating control device another
Side is provided with temperature controller, and described heat abstractor top is additionally provided with power anode interface and power cathode interface, at the bottom of described aluminium base
Portion is provided with fin, is additionally provided with support protrusion bottom described fin.
Furthermore, described aluminium base is fixed by bolt and alumina ceramic plate and is connected, and between scribble thermoconductive glue.
Furthermore, blue glue-line is scribbled between described aluminium base and described fin.
Furthermore, described power anode interface and power cathode interface are all electrically connected with circuit board interface end.
Furthermore, described support protrusion uses quality of rubber materials, and the number of described support protrusion is at least provided with four.
This utility model beneficial effect: heat conductivity is good, stability is high, will not affected signal transmission by high frequency breakdown, with
Time by heat abstractor is configured on circuit board, by radiator by heat discharge, be used for obtaining effective radiating effect, if
Putting plug-in unit groove and can efficiently separate the distance of electronic component, not by the elements affect that temperature is higher during use, support protrusion is at electricity
Road plate can go to put when using easily, and simple in construction is reasonable in design, practical.
Accompanying drawing explanation
Accompanying drawing is used for providing being further appreciated by of the present utility model, and constitutes a part for description, with this utility model
Embodiment be used for together explaining this utility model, be not intended that restriction of the present utility model.
Fig. 1 is this utility model one high-frequency resistance circuit board sectional view.
Fig. 2 is this utility model one high-frequency resistance circuit board top view.
Label in figure: 1, aluminium base；2, alumina ceramic plate；3, organic resin plate；4, plug-in unit groove；5, plug-in unit sun
Pole Interface Terminal；6, plug-in unit negative electrode Interface Terminal；7, heat abstractor；8, radiating control device；9, temperature sensor；10、
Temperature controller；11, power anode interface；12, power cathode interface；13, fin；14, support protrusion；15, spiral shell
Bolt；16, thermoconductive glue；17, blue glue-line.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is illustrated, it will be appreciated that preferred reality described herein
Execute example be merely to illustrate and explain this utility model, be not used to limit this utility model.
As Figure 1-Figure 2, a kind of high-frequency resistance circuit board, including aluminium base 1, described aluminium base 1 top is provided with oxidation
Aluminum ceramic wafer 2, uses alumina ceramic plate 2 to have the advantages such as high temperature resistant, corrosion-resistant, antioxidation, and described aluminium base 1 passes through
Bolt 15 and alumina ceramic plate 2 is fixing to be connected, makes circuit board firmer, reduces and shakes the impact brought, and between scribble and lead
Hot adhesion agent 16, can be used to dispel the heat by thermoconductive glue 16, and described alumina ceramic plate 2 top is provided with organic resin plate 3,
If described organic resin plate 3 top is provided with stem plug groove 4, can be to grafting electronic device by plug-in unit groove 4, described plug-in unit is recessed
Groove 4 intracavity bottom is provided with plug-in unit anode Interface Terminal 5 and plug-in unit negative electrode Interface Terminal 6, anode and the correct grafting of negative electrode, prevents from inserting
Instead, described organic resin plate 3 top connects heat abstractor 7 by support, can be to heat dissipation for circuit board, described heat abstractor 7
Top is provided with radiating control device 8, can be controlled heat radiation, and described radiating control device 8 side is provided with temperature sensor 9, permissible
Aware circuit plate Current Temperatures, described radiating control device 8 opposite side is provided with temperature controller 10, can with the temperature of control circuit plate,
Described heat abstractor 8 top is additionally provided with power anode interface 11 and power cathode interface 12, prevents power supply from connecing instead, described power supply sun
Pole interface 11 and power cathode interface 12 are all electrically connected with circuit board interface end, by being connected with interface end, convenient to heat radiation
The power supply of device,
It is provided with fin 13 bottom described aluminium base 1, can in time heat be shed, between described aluminium base 1 and described fin 13
Scribble blue glue-line 17, can effectively prevent the circuit welding damage to circuit board by blue glue-line 17, bottom described fin 13 also
Be provided with support protrusion 14, board support can be left space, beneficially the shedding of heat, described support protrusion 14
Number, at least provided with four, can be facilitated by support protrusion 14 and pick and place circuit board, and described support protrusion 14 uses rubber material
Matter, can carry out anti-skidding.
In use, by arranging thermoconductive glue 16 and fin 13, heat conductivity is good, stability is high, will not in this practicality
By high frequency breakdown, not affecting signal transmission, simultaneously by heat radiation being filled, 7 are configured on circuit board, by heat abstractor 7 by heat
Amount is discharged, and is used for obtaining effective radiating effect, arranges plug-in unit groove 4 and can efficiently separate the distance of electronic component, during use
Not by the elements affect that temperature is higher, support protrusion 14 can go to put when circuit board uses easily, and simple in construction is reasonable in design,
Practical.
Being more than this utility model preferably embodiment, this utility model those skilled in the art can also be to above-mentioned reality
The mode of executing changes and revises, and therefore, this utility model is not limited to above-mentioned detailed description of the invention, every this area skill
Any conspicuously improved, replacement or modification that art personnel are made on the basis of this utility model belong to of the present utility model
Protection domain.
Claims (5)
- null1. a high-frequency resistance circuit board，Including aluminium base (1)，It is characterized in that，Described aluminium base (1) top is provided with alumina ceramic plate (2)，Described alumina ceramic plate (2) top is provided with organic resin plate (3)，Described organic resin plate (3) is if top is provided with stem plug groove (4)，Described plug-in unit groove (4) intracavity bottom is provided with plug-in unit anode Interface Terminal (5) and plug-in unit negative electrode Interface Terminal (6)，Described organic resin plate (3) top connects heat abstractor (7) by support，Described heat abstractor (7) top is provided with radiating control device (8)，Described radiating control device (8) side is provided with temperature sensor (9)，Described radiating control device (8) opposite side is provided with temperature controller (10)，Described heat abstractor (7) top is additionally provided with power anode interface (11) and power cathode interface (12)，Described aluminium base (1) bottom is provided with fin (13)，Described fin (13) bottom is additionally provided with support protrusion (14).
- A kind of high-frequency resistance circuit board, it is characterised in that: described aluminium base (1) is fixed with alumina ceramic plate (2) by bolt (15) and is connected, and between scribble thermoconductive glue (16).
- A kind of high-frequency resistance circuit board, it is characterised in that: scribble blue glue-line (17) between described aluminium base (1) and described fin (13).
- A kind of high-frequency resistance circuit board, it is characterised in that: described power anode interface (11), power cathode interface (12) are all electrically connected with circuit board interface end.
- A kind of high-frequency resistance circuit board, it is characterised in that: described support protrusion (14) uses quality of rubber materials, and the number of described support protrusion (14) is at least provided with four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620505464.2U CN205793613U (en) | 2016-05-27 | 2016-05-27 | A kind of high-frequency resistance circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620505464.2U CN205793613U (en) | 2016-05-27 | 2016-05-27 | A kind of high-frequency resistance circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793613U true CN205793613U (en) | 2016-12-07 |
Family
ID=59979727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620505464.2U Expired - Fee Related CN205793613U (en) | 2016-05-27 | 2016-05-27 | A kind of high-frequency resistance circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793613U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
-
2016
- 2016-05-27 CN CN201620505464.2U patent/CN205793613U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
| CN112399705B (en) * | 2020-11-10 | 2022-09-30 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20200527 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |