CN217643934U

CN217643934U - Current conversion device and energy storage power supply

Info

Publication number: CN217643934U
Application number: CN202220610096.3U
Authority: CN
Inventors: 陈熙; 邓磊; 欧启珍; 陈玉光
Original assignee: Shenzhen Zhenghao Zhizao Technology Co ltd
Current assignee: Shenzhen Zhenghao Zhizao Technology Co ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-10-21
Anticipated expiration: 2032-03-21

Abstract

The application is suitable for the technical field of power supplies, and provides a current conversion device and an energy storage power supply, wherein the current conversion device comprises a metal shell, a circuit board and an MOS (metal oxide semiconductor) tube assembly; a plurality of radiating fins distributed at intervals are formed on the outer wall of the metal shell; the circuit board is assembled in the metal shell; the MOS tube assembly comprises a radiating strip and an MOS tube, the radiating strip is attached to the inner wall of the metal shell, and the MOS tube is assembled on the radiating strip and electrically connected to the circuit board. The energy storage power supply comprises a current conversion device. So set up, the heat accessible radiator fin strip that the MOS pipe produced transmits to metal casing fast, and rethread metal casing and the radiating fin loss on it are external, on the one hand for current conversion equipment has the heat dispersion of preferred, and on the other hand, with the MOS pipe subsides dress on the radiator fin strip, has avoided the radiator that is exclusively used in the MOS pipe, thereby has saved the space occupancy of MOS pipe subassembly, has reduced current conversion equipment's volume.

Description

Current conversion device and energy storage power supply

Technical Field

The application belongs to the technical field of power supplies, and particularly relates to a current conversion device and an energy storage power supply.

Background

The energy storage power supply can provide high-power stable electric energy for users in outdoor environment and emergency state, thereby being widely favored by users. Recently, energy storage power supplies have begun to exhibit a trend towards modularity, as an integral part of which converters for current conversion can also be sold as stand-alone devices.

In the prior art, the MOS tube in the converter needs to be integrated in a dedicated heat sink to realize heat dissipation of the MOS tube, however, this would make the current converter have a large volume and difficult miniaturization.

SUMMERY OF THE UTILITY MODEL

One of the purposes of the embodiment of the application is as follows: the utility model provides a current conversion device, aims at solving prior art, and MOS pipe needs to integrate in special radiator and leads to the bulky of converter, the technical problem that is difficult to miniaturize.

In order to solve the technical problem, the embodiment of the application adopts the following technical scheme:

there is provided a current conversion device including:

the heat dissipation structure comprises a metal shell, a heat dissipation plate and a heat dissipation plate, wherein a plurality of heat dissipation fins distributed at intervals are formed on the outer wall of the metal shell;

the circuit board is assembled in the metal shell;

the MOS tube assembly comprises a radiating strip and an MOS tube, the radiating strip is attached to the inner wall of the metal shell, and the MOS tube is assembled on the radiating strip and electrically connected to the circuit board.

In one embodiment, the circuit board and the inner wall of the metal shell are spaced to form a spacing space; the MOS tube comprises a tube body assembled on the radiating strip and pins arranged on the tube body, the radiating strip and the tube body are located in the space, and the pins are inserted into the circuit board.

In one embodiment, the radiating strips are arranged along one side edge of the circuit board, the number of the MOS tubes is at least two, and the MOS tubes are arranged at intervals along the length direction of the radiating strips.

In one embodiment, a boss is formed on the end face, facing the circuit board, of the radiating plate strip, and the boss is used for abutting against the circuit board and separating two adjacent MOS tubes.

In one embodiment, the inner wall of the metal shell is provided with a plurality of support posts, and the circuit board is assembled on the top of each support post.

In one embodiment, a thermally conductive silicone layer is formed between the heat sink strips and the MOS transistors.

In one embodiment, the radiating strips are assembled on the inner bottom wall of the metal shell, and radiating fins are distributed on the outer bottom wall and the outer side wall of the metal shell.

In one embodiment, the inner wall of the metal shell is provided with a buffer pad, and the buffer pad is positioned between the metal shell and the circuit board and distributed around the radiating strip.

In one embodiment, the metal shell is configured as an aluminum alloy shell or a magnesium aluminum alloy shell, and the heat sink strips are configured as aluminum alloy strips or magnesium aluminum alloy strips.

The embodiment of the application further provides an energy storage power supply which comprises a current conversion device.

The current conversion device provided by the embodiment of the application has the beneficial effects that:

the embodiment of the application provides a current conversion device, the radiating strip pastes the inner wall in metal casing, the MOS pipe assembly is on the radiating strip, and metal casing's outer wall is formed with a plurality of radiating fin, then the heat accessible radiating strip that the MOS pipe produced transmits to metal casing fast, rethread metal casing and the radiating fin loss on it are external, so set up, on the one hand, make current conversion device have the heat dispersion of preferred, can satisfy the heat dissipation demand of the MOS pipe in it, on the other hand, paste the MOS pipe on the radiating strip, the radiator of MOS pipe has been avoided being exclusively used in, thereby the space occupancy of MOS pipe subassembly has been saved, the volume of current conversion device has been reduced, do benefit to the miniaturized design that realizes current conversion device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic perspective view of a current conversion device according to an embodiment of the present application;

FIG. 2 is a partial schematic view of FIG. 1;

fig. 3 is a schematic diagram of the current converting apparatus shown in fig. 2 after the circuit board is disassembled;

FIG. 4 is an enlarged view of a portion of FIG. 3 at A;

fig. 5 is a schematic perspective view of a MOS tube assembly of the current converting apparatus provided in fig. 1;

FIG. 6 is an exploded view of FIG. 5;

fig. 7 is a partially enlarged view of fig. 2 at B.

Wherein, in the figures, the respective reference numerals:

10-metal shell 11-bottom 12-side

20-radiating fin 30-circuit board 40-MOS tube component

41-radiating strip 411-substrate 412-boss

42-MOS tube 421-body 422-pin

43-heat-conducting silicone layer 50-spacing space 60-support column

70-buffer pad.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1-7 are exemplary and intended to be used to illustrate the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise, wherein two or more includes two.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the prior art, the MOS tube in the converter is usually required to be integrated in a dedicated heat sink to realize heat dissipation of the MOS tube, however, this would make the current converter have a large volume and difficult to miniaturize.

Therefore, the embodiment of the application provides a current conversion device, on one hand, the current conversion device has better heat dissipation performance, and can meet the heat dissipation requirement of an MOS (metal oxide semiconductor) tube in the current conversion device, on the other hand, a radiator special for the MOS tube is omitted, the size of the current conversion device is reduced, and the current conversion device is beneficial to realizing the miniaturization design.

The following detailed description is made with reference to the accompanying drawings and examples:

referring to fig. 1 to 4, a current conversion apparatus according to an embodiment of the present disclosure includes a metal housing 10, a circuit board 30, and a MOS transistor assembly 40. Specifically, the outer wall of metal casing 10 is formed with a plurality of radiating fins 20, and a plurality of radiating fins 20 interval distribution, so set up, be favorable to the heat on the metal casing 10 to pass through radiating fins 20 in the loss to the outside air, help improving current conversion device's radiating effect. The circuit board 30 is mounted in the metal case 10. The MOS tube assembly 40 includes a heat dissipation plate 41 and a MOS tube 42, the heat dissipation plate 41 is attached to the inner wall of the metal housing 10, and the MOS tube 42 is mounted on the heat dissipation plate 41 and electrically connected to the circuit board 30.

It should be noted that, the heat dissipating laths 41 are attached to the inner wall of the metal casing 10, so that the distance between the heat dissipating laths 41 and the inner wall of the metal casing 10 is as zero as possible, which is beneficial to improving the space utilization rate of the MOS tube assembly 40 in the metal casing 10 and to realizing the volume miniaturization design of the current converting apparatus. Moreover, the heat dissipation strips 41 are formed into a strip shape, so that on the basis of realizing the mounting effect of the MOS transistor 42, the volume of the heat dissipation strips 41 is reduced as much as possible, that is, the volume of the MOS transistor assembly 40 is reduced as much as possible, so that the occupied space of the MOS transistor assembly 40 in the metal housing 10 is reduced, and the volume miniaturization design of the current conversion apparatus is also facilitated.

It should be further noted that, in order to achieve the miniaturization design of the current conversion apparatus, the metal casing 10 of the current conversion apparatus is generally configured as a casing with a small thickness, and the metal casing 10 is easily deformed under an external force, so that if the MOS transistor 42 is directly assembled on the inner wall of the metal casing 10, the metal casing 10 is easily damaged by the MOS transistor 42 under the external force driven by the metal casing 10; in the embodiment of the present application, the heat dissipating strip 41 is disposed on the inner wall of the metal casing 10, the MOS tube 42 is assembled on the heat dissipating strip 41, the heat dissipating strip 41 has a certain rigidity, and on the basis of achieving a better heat dissipating effect, the heat dissipating strip 41 can also achieve a rigid protection of the MOS tube 42, which is helpful for prolonging the service life of the MOS tube 42.

Wherein, optionally, the thickness of the heat dissipating lath 41 ranges from 2mm to 3mm.

It should be noted that one side of the heat dissipating strips 41 in the thickness direction is attached to the inner wall of the metal casing 10, and the MOS tube 42 is attached to the other side of the heat dissipating strips 41 in the thickness direction, so that the heat generated by the MOS tube 42 can be transferred to the metal casing 10 through the heat dissipating strips 41, and then dissipated to the outside through the metal casing 10 and the heat dissipating fins 20.

Wherein, optionally, the heat dissipation strips 41 are configured as metal strips, which is beneficial to improve the efficiency of the heat dissipation strips 41 transferring the heat of the MOS tube 42 to the metal casing 10, so as to improve the heat dissipation effect of the MOS tube 42.

In the embodiment of the present application, the heat dissipating strip 41 is attached to the inner wall of the metal casing 10, the MOS tube 42 is assembled on the heat dissipating strip 41, and the outer wall of the metal casing 10 is formed with a plurality of heat dissipating fins 20, so that heat generated by the MOS tube 42 can be quickly transferred to the metal casing 10 through the heat dissipating strip 41, and then dissipated to the outside through the metal casing 10 and the heat dissipating fins 20 thereon, so as to achieve the above-mentioned advantages.

In one embodiment, referring to fig. 2, 5 to 7, the circuit board 30 and the inner wall of the metal shell 10 are spaced apart from each other, and a space 50 is formed therebetween. Due to the arrangement, the circuit board 30 is not in direct contact with the metal shell 10, so that the problem that heat on the metal shell 10 is reversely transferred to the circuit board 30 can be effectively relieved, and the protection effect on the circuit board 30 is facilitated; moreover, the heat generated by the circuit board 30 can be dissipated into the space 50, which is beneficial to improving the heat dissipation effect of the circuit board 30.

The MOS transistor 42 includes a tube 421 and a pin 422 disposed on the tube 421, the tube 421 is assembled on the heat dissipation strip 41, the heat dissipation strip 41 and the tube 421 are both located in the space 50, and the pin 422 is inserted into the circuit board 30. With such an arrangement, on one hand, the tube 421 and the heat dissipating strip 41 are both disposed in the space 50, which is beneficial to improving the space utilization rate in the metal casing 10, thereby being beneficial to reducing the volume of the current conversion device, so as to realize the miniaturized design of the current conversion device; on the other hand, the heat on the tube 421 and the heat dissipating strips 41 can be directly transferred to the metal shell 10 through the heat dissipating strips 41, and can also be dissipated into the space 50, which is favorable for improving the heat dissipating effect of the MOS tube 42.

Optionally, the pins 422 of the tube 421 are inserted into the circuit board 30 and soldered to the circuit board 30, so as to electrically connect the tube 421 and the circuit board 30.

In one embodiment, referring to fig. 2 to 7, the heat dissipating strips 41 are disposed along one edge of the circuit board 30; it can be understood that the heat dissipating strips 41 are attached to the inner wall of the metal casing 10 at a position corresponding to one side edge of the circuit board 30 and extend along the corresponding side edge of the circuit board 30, wherein the extending direction of the heat dissipating strips 41 is the length direction of the heat dissipating strips 41. The number of the MOS transistors 42 is at least two, and the MOS transistors 42 are arranged at intervals along the longitudinal direction of the heat dissipation strip 41. With such a configuration, the heat dissipation strip 41 is disposed along one side edge of the circuit board 30, and the MOS tubes 42 on the heat dissipation strip 41 are disposed at intervals along the length direction of the heat dissipation strip 41, that is, the MOS tubes 42 on the heat dissipation strip 41 are disposed at intervals along the side edge of the circuit board 30 corresponding to the heat dissipation strip 41, so that heat generated by the heat dissipation strip 41 and the MOS tubes 42 can be directly transferred to the metal housing 10, and can also be dissipated to the outside of the circuit board 30 through the side edge of the circuit board 30, which is beneficial to inhibiting heat on the heat dissipation strip 41 and the MOS tubes 42 from being transferred to the circuit board 30, so as to alleviate the problem that heat on the heat dissipation strip 41 and the MOS tubes 42 is transferred to the middle portion of the circuit board 30, so as to achieve the protection effect on the circuit board 30, and thus, the layout scheme of the heat dissipation strip 41 and the MOS tubes 42 can alleviate the influence of the MOS tubes 42 and the heat dissipation strip 41 on the heat dissipation effect of the circuit board 30 on the basis that the MOS tubes 42 have a better heat dissipation effect, thereby being beneficial to improve the heat dissipation effect of the whole current conversion device, and prolong the service life of the circuit board 30.

Alternatively, at least two heat dissipating strips 41 may be provided, at least two heat dissipating strips 41 are respectively provided at least two side edges of the circuit board 30, and each heat dissipating strip 41 is attached to the inner wall of the metal casing 10 and the position of the corresponding one side edge of the circuit board 30; each heat dissipation plate strip 41 has at least two MOS tubes 42, and the at least two MOS tubes 42 on each heat dissipation plate strip 41 are arranged at intervals along the length direction of the heat dissipation plate strip 41. Of course, in other alternative embodiments, at least two heat sink strips 41 are spaced along one edge of the circuit board 30, such that at least two heat sink strips 41 are also spaced along their length.

In one embodiment, referring to fig. 4 to fig. 7, a boss 412 is formed on one end surface of the heat dissipation plate strip 41 facing the circuit board 30, and it can be understood that one end surface of the heat dissipation plate strip 41 is attached to the inner wall of the metal shell 10, and the boss 412 is formed on the other end surface of the heat dissipation plate strip 41. The boss 412 is used for abutting against the circuit board 30 and for separating two adjacent MOS transistors 42.

Specifically, the heat dissipation strip 41 includes a base 411 and a boss 412, wherein one end face of the base 411 is attached to the inner wall of the metal shell 10, and the boss 412 is formed on the other end face of the base 411; wherein the MOS transistor 42 is mounted on the substrate 411.

Alternatively, the base 411 is fixed to the inner wall of the metal case 10 by bolts.

Alternatively, the circuit board 30 is fixed to the boss 412 by bolts.

With such a configuration, on one hand, the circuit board 30 abuts against one end of the boss 412 far away from the heat dissipation strip 41, and then the heat generated by the circuit board 30 can be sequentially transmitted to the substrate 411 and the metal shell 10 through the boss 412, and it can be understood that the heat generated by the circuit board 30 can be transmitted to the metal shell 10 through the heat dissipation strip 41, and then dissipated to the outside through the metal shell 10 and the heat dissipation fins 20 thereon, so that the heat dissipation effect of the circuit board 30 is improved; on the other hand, the circuit board 30 is set up at the end of the boss 412 far away from the heat dissipation strip 41, so that the circuit board 30 is limited in the direction towards the MOS tube 42, the tube body 421 of the MOS tube 42 can be accommodated between the circuit board 30 and the substrate 411 of the heat dissipation strip 41, the phenomenon that the circuit board 30 and the tube body 421 of the MOS tube 42 are damaged due to mutual abutting is prevented, and the protection effect on the circuit board 30 and the MOS tube 42 is improved. In addition, the boss 412 separates two adjacent MOS transistors 42, which helps to alleviate the short circuit problem of the two adjacent MOS transistors 42, thereby improving the safety performance of the current conversion device.

In one embodiment, referring to fig. 2 to 4, a plurality of support pillars 60 are disposed at intervals on an inner wall of the metal housing 10, and the circuit board 30 is mounted on top of each support pillar 60; it should be noted that the circuit board 30 is assembled at one end of each supporting column 60, which faces away from the inner wall of the metal shell 10, and thus, the circuit board 30 is fixed relative to the metal shell 10 through the supporting columns 60, so that a spacing space 50 can be formed between the circuit board 30 and the inner wall of the metal shell 10 at intervals, which is helpful for improving the space utilization rate of the metal shell 10 and realizing the miniaturized design of the current conversion device; moreover, the support columns 60 are provided to help improve the stability of the fixing of the circuit board 30 in the metal housing 10.

Alternatively, the circuit board 30 is bolted to the top of the support column 60.

In one embodiment, referring to fig. 4-7, a thermally conductive silicone layer 43 is formed between the heat sink strips 41 and the MOS transistors 42. It should be noted here that, the heat conduction silicone grease layer 43 is coated on a side end face of the heat dissipation lath 41 departing from the metal casing 10, the MOS tube 42 is assembled on a side end face of the heat dissipation lath 41 having the heat conduction silicone grease layer 43, thus, heat generated by the MOS tube 42 can be more quickly transmitted to the heat dissipation lath 41 through the heat conduction silicone grease, and then transmitted to the metal casing 10, and finally dissipated to the outside through the metal casing 10 and the heat dissipation fins 20 thereon, so that the arrangement is realized, the arrangement of the heat conduction silicone grease layer 43 improves the heat dissipation efficiency of the MOS tube 42.

Specifically, the thermally conductive silicone layer 43 is applied between the substrate 411 of the heat radiating panel 41 and the MOS tube 42.

In one embodiment, referring to fig. 1 to 3, the heat dissipating lath 41 is attached to the inner bottom wall of the metal casing 10, and the heat dissipating fins 20 are distributed on the outer bottom wall and the outer side wall of the metal casing 10. The arrangement is that the radiating fins 20 are distributed on the outer bottom wall and the outer side wall of the metal shell 10, the heat generated by the MOS tube 42 can be transferred to the metal shell 10 through the radiating strips 41, and then dissipated to the outside through the radiating fins 20 on the outer bottom wall and the outer side wall of the metal shell 10, which is helpful for improving the radiating effect of the MOS tube 42.

Specifically, the metal shell 10 includes a bottom 11 and a side 12, the side 12 extends from the edge of the bottom 11 to the bottom 11, the heat dissipating slats 41 are attached to the inner wall of the bottom 11, and the heat dissipating fins 20 are formed on the outer wall of the bottom 11 and the outer portion of the side 12. Wherein, the supporting column 60 is disposed at the bottom 11 of the metal shell 10.

In one embodiment, referring to fig. 2 and 3, the inner wall of the metal housing 10 has a buffer pad 70, and the buffer pad 70 is located between the metal housing 10 and the circuit board 30 and distributed around the heat dissipating strip 41. So configured, the buffer pad 70 is located between the metal shell 10 and the circuit board 30, and can prevent the circuit board 30 from touching the metal shell 10, which helps to achieve the safety protection of the circuit board 30.

Specifically, the cushion pad 70 is disposed on an inner wall of the bottom 11 of the metal housing 10.

Optionally, the cushion pad 70 is made of EVA foam, which is low cost and easy to obtain.

In one embodiment, the metal casing 10 is configured as an aluminum alloy casing or a magnesium aluminum alloy casing, and the heat sink strips 41 are configured as aluminum alloy strips or magnesium aluminum alloy strips. With such an arrangement, the metal shell 10 and the heat dissipation strip 41 both have a better heat conduction effect, which is helpful for improving the efficiency of rapidly transferring the heat of the MOS tube 42 to the heat dissipation strip 41, and also is helpful for improving the efficiency of transferring the heat on the heat dissipation strip 41 to the metal shell 10, so as to be helpful for improving the heat dissipation effect of the current conversion device.

Based on the above concept, the embodiment of the present application further provides an energy storage power supply, which includes a current conversion device. The current converting device in this embodiment is the same as the current converting device in the previous embodiment, and specific reference is made to the description of the current converting device in the previous embodiment, which is not repeated herein.

In the embodiment of the present application, the radiating strip 41 is attached to the inner wall of the metal casing 10, the MOS tube 42 is assembled on the radiating strip 41, and the outer wall of the metal casing 10 is formed with a plurality of radiating fins 20, on the one hand, make the energy storage power supply have the heat dissipation performance of preferred, can satisfy the heat dissipation demand of the MOS tube 42 therein, on the other hand, attach the MOS tube 42 to the radiating strip 41, the radiator special for the MOS tube 42 is avoided, thereby the space occupancy rate of the MOS tube assembly 40 is saved, the volume of the energy storage power supply is reduced, and the miniaturization design of the energy storage power supply is facilitated.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A current converting apparatus, comprising:

the heat dissipation device comprises a metal shell, a heat dissipation plate and a heat dissipation plate, wherein a plurality of heat dissipation fins distributed at intervals are formed on the outer wall of the metal shell;

a circuit board assembled within the metal housing;

2. The current converting device according to claim 1, wherein the circuit board is spaced apart from an inner wall of the metal case to form a space; the MOS tube comprises a tube body assembled on the radiating strip and pins arranged on the tube body, the radiating strip and the tube body are located in the space, and the pins are inserted into the circuit board.

3. The current converting device of claim 1, wherein the heat sink strip is disposed along a side edge of the circuit board, the number of the MOS transistors is at least two, and the MOS transistors are spaced apart along a length direction of the heat sink strip.

4. The current converting device according to claim 3, wherein an end surface of the heat dissipating strip facing the circuit board is formed with a projection for abutting against the circuit board and separating two adjacent MOS transistors.

5. The current converting apparatus according to claim 1, wherein the inner wall of the metal case is provided with a plurality of support posts, and the circuit board is mounted on top of each of the support posts.

6. The current converting device according to claim 1, wherein a thermally conductive silicone layer is formed between the heat sink fins and the MOS transistor.

7. The current converting device according to any one of claims 1 to 6, wherein the heat dissipating strips are attached to an inner bottom wall of the metal case, and the heat dissipating fins are distributed on both outer bottom wall and outer side wall of the metal case.

8. The current converting device according to any one of claims 1 to 6, wherein the inner wall of the metal housing has a cushion, the cushion being located between the metal housing and the circuit board and distributed around the heat dissipating strip.

9. The current converting device according to any one of claims 1 to 6, wherein the metal casing is provided as an aluminum alloy casing or a magnesium aluminum alloy casing, and the heat dissipating fins are provided as aluminum alloy fins or magnesium aluminum alloy fins.

10. An energy storage power supply comprising a current converting device according to any one of claims 1 to 9.