CN217741984U

CN217741984U - Combined type circuit board

Info

Publication number: CN217741984U
Application number: CN202221446410.5U
Authority: CN
Inventors: 王皓吉; 滕浩宇
Original assignee: Tianjin Tianke Yunchuang Technology Co ltd
Current assignee: Tianjin Tianke Yunchuang Technology Co ltd
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2022-11-04
Anticipated expiration: 2032-06-10

Abstract

The utility model provides a composite circuit board, which comprises an upper radiating fin and a lower radiating fin; the upper surface of the upper radiating fin is provided with an upper groove, the upper circuit board is attached and fixed in the upper groove, and the lower surface of the upper radiating fin is provided with fins; the lower surface of the lower radiating fin is provided with a lower groove, the lower circuit board is fixedly attached in the lower groove, and the upper surface of the lower circuit board is provided with a fin; the four corners of the upper radiating fin and the four corners of the lower radiating fin are respectively supported and fixedly connected through connecting columns correspondingly. The utility model relates to a combined type circuit board can effectively strengthen the inter-plate radiating effect of combined type circuit board, can carry out the auxiliary cooling to the high position that generates heat of circuit board simultaneously to can improve the cooling effect of quick-witted incasement fan to combined type circuit board.

Description

Combined type circuit board

Technical Field

The utility model belongs to the circuit board field especially relates to a combined type circuit board.

Background

Along with the continuous development of scientific technology, the functions of electronic products are more and more abundant, and the volume of products is required to be smaller and smaller, and the composite circuit board is widely applied because the composite circuit board has the advantages of integrating a plurality of circuit boards, being convenient to install and maintain and effectively reducing the volume of the products. Under the condition of the prior art, the combined circuit board can be generally stacked up and down, and in this way, because the distance between the circuit boards is relatively short, the space between adjacent circuit boards is relatively narrow, the heat dissipation problem between the boards becomes a focus of attention, and the existing cooling mode of the fan in the case can not achieve a good cooling effect on the combined circuit board.

Disclosure of Invention

In view of this, the utility model aims at providing a combined type circuit board can effectively strengthen the inter-plate radiating effect of combined type circuit board, can carry out supplementary cooling to the circuit board high position that generates heat simultaneously to can improve the cooling effect of quick-witted incasement fan to combined type circuit board.

In order to achieve the above purpose, the technical scheme of the utility model is realized like this:

a composite circuit board comprises an upper heat sink and a lower heat sink; the upper surface of the upper radiating fin is provided with an upper groove, the upper circuit board is attached and fixed in the upper groove, and the lower surface of the upper radiating fin is provided with fins; the lower surface of the lower radiating fin is provided with a lower groove, the lower circuit board is fixedly attached in the lower groove, and the upper surface of the lower circuit board is provided with a fin; the four corners of the upper radiating fin and the four corners of the lower radiating fin are correspondingly supported and fixedly connected through connecting columns respectively; through holes are respectively formed in the corresponding positions of the upper radiating fin and the lower radiating fin, and a connector plug of the upper circuit board and a connector socket of the lower circuit board are connected after penetrating through the corresponding through holes respectively; the fin is internally provided with a mounting groove, and the semiconductor refrigeration piece is attached to the mounting groove.

Further, the upper groove and the lower groove are both rectangular in shape.

Furthermore, four corners of the upper circuit board are fixed in threaded holes in four corners in the upper groove through bolts.

Furthermore, four corners of the lower circuit board are fixed in threaded holes at four corners in the lower groove through bolts.

Further, the distance between the two fins is one centimeter.

Furthermore, the mounting groove is rectangular, and the shape of the semiconductor refrigeration sheet is matched with that of the mounting groove.

Compared with the prior art, the utility model relates to a combined type circuit board has following advantage:

first, the utility model discloses a combined type circuit board through last fin and the setting of lower fin, constitutes the circulation of air passageway between two fins that set up relatively, can effectively strengthen combined type circuit inter-board radiating effect to make things convenient for the air current that quick-witted incasement fan drove to pass the circulation of air passageway and realize the effective cooling to combined type circuit board.

Second, the utility model discloses a combined type circuit board bears the formula installation to the circuit board through the upper groove of last fin and the low groove of lower fin, has the convenient and sturdy structure's of installation characteristics.

Third, the utility model discloses a combined type circuit board through the semiconductor refrigeration piece of setting in fin mounting groove, can assist the cooling to the high heat dissipation part of circuit board, further improves the cooling radiating effect of combined type circuit board.

Drawings

The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation.

In the drawings:

fig. 1 is a schematic structural diagram of a composite circuit board according to an embodiment of the present invention;

fig. 2 is a schematic front view of a composite circuit board according to an embodiment of the present invention;

fig. 3 is a schematic top view of a composite circuit board according to an embodiment of the present invention;

fig. 4 is a schematic view of a semiconductor cooling plate of a composite circuit board according to an embodiment of the present invention.

Description of reference numerals:

1-upper radiating fin; 2-lower heat sink; 3-an upper circuit board; 4-a connector receptacle; 5-a connector plug; 6-lower circuit board; 7-semiconductor refrigerating sheet.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1-4, a composite circuit board includes an upper heat sink 1 and a lower heat sink 2; the upper surface of the upper radiating fin 1 is provided with an upper groove, the upper circuit board 3 is attached and fixed in the upper groove, and the lower surface of the upper radiating fin 1 is provided with fins; the lower surface of the lower radiating fin 2 is provided with a lower groove, the lower circuit board 6 is attached and fixed in the lower groove, and the upper surface of the lower circuit board 6 is provided with fins; four corners of the upper radiating fin 1 and four corners of the lower radiating fin 2 are correspondingly supported and fixedly connected through connecting columns respectively; through holes are respectively formed in the corresponding positions of the upper radiating fin 1 and the lower radiating fin 2, and a connector plug 5 of the upper circuit board 3 and a connector socket 4 of the lower circuit board 6 are respectively connected after penetrating through the corresponding through holes; the fin is internally provided with a mounting groove, and the semiconductor refrigerating sheet 7 is attached to the mounting groove.

In this embodiment, the through holes respectively formed in the upper heat sink 1 and the lower heat sink 2 not only realize the connection between the connector plug 5 and the connector socket 4 belonging to the two circuit boards, but also play a role in positioning the two circuit boards when the two circuit boards are assembled up and down, thereby improving the assembly efficiency of the composite circuit board.

In this embodiment, the cooling surface of the semiconductor cooling plate 7 is attached to the heat sink, and the heating surface faces the air flow channel formed by the two fins.

In this embodiment, because go up circuit board 3 and lower circuit board 6 respectively with last fin 1 and lower fin 2 contact, the heat that the chip dispersed on the circuit board collects the circulation of air passageway that two fins are constituteed through the fin, this combined type circuit board sets up the direction that the fan air current flows through in the machine case this moment, the circulation of air passageway that the fan air current of machine incasement constitutes through two fins, take away the heat of last fin 1 and lower fin 2, the radiating effect between combined type circuit board has effectively been improved, the combined type circuit board of current closed assembly formula has been improved, because blockking between the chip on the circuit board, or blockking between the circuit board, the problem that the fan cooling effect is than poor in the machine case.

In this embodiment, the wiring end of the semiconductor refrigeration piece 7 is connected with the external power supply controller through the channel on the fin, and the semiconductor refrigeration piece 7 can assist cooling to the high-heat position of the circuit board, so that the inter-board heat dissipation and cooling effect of the composite circuit board is further improved.

The upper groove and the lower groove are both rectangular in shape.

As shown in fig. 3, four corners of the upper circuit board 3 are fixed in the threaded holes at four corners in the upper groove by bolts.

Four corners of the lower circuit board 6 are fixed in threaded holes of the four corners in the lower groove through bolts.

In this embodiment, the composite circuit board can be conveniently assembled by the arrangement of the upper groove and the lower groove.

As shown in fig. 2, the spacing between the two fins is one centimeter.

As shown in fig. 4, the mounting recess is rectangular in shape, and the shape of the semiconductor chilling plate 7 is matched with the shape of the mounting recess.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A kind of hybrid circuit board, its characterized in that: comprises an upper radiating fin (1) and a lower radiating fin (2); an upper groove is formed in the upper surface of the upper radiating fin (1), the upper circuit board (3) is fixedly attached to the upper groove, and fins are arranged on the lower surface of the upper radiating fin (1); the lower surface of the lower radiating fin (2) is provided with a lower groove, the lower circuit board (6) is fixedly attached in the lower groove, and the upper surface of the lower circuit board (6) is provided with a fin; four corners of the upper radiating fin (1) are correspondingly supported and fixedly connected with four corners of the lower radiating fin (2) through connecting columns respectively; through holes are respectively formed in the corresponding positions of the upper radiating fin (1) and the lower radiating fin (2), and a connector plug (5) of the upper circuit board (3) and a connector socket (4) of the lower circuit board (6) are connected after penetrating through the corresponding through holes; the fin is internally provided with a mounting groove, and a semiconductor refrigerating sheet (7) is attached to the mounting groove.

2. The composite circuit board of claim 1, wherein: the upper groove and the lower groove are both rectangular in shape.

3. The composite circuit board of claim 1, wherein: and four corners of the upper circuit board (3) are fixed in threaded holes of the four corners in the upper groove through bolts.

4. The composite circuit board of claim 1, wherein: and four corners of the lower circuit board (6) are fixed in the threaded holes at the four corners in the lower groove through bolts.

5. The composite circuit board of claim 1, wherein: the distance between the two fins is one centimeter.

6. The composite circuit board of claim 1, wherein: the mounting groove is rectangular, and the shape of the semiconductor refrigeration piece (7) is matched with that of the mounting groove.