CN210168291U - Power management circuit board, battery pack, electric equipment and movable platform - Google Patents
Power management circuit board, battery pack, electric equipment and movable platform Download PDFInfo
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- CN210168291U CN210168291U CN201921092174.XU CN201921092174U CN210168291U CN 210168291 U CN210168291 U CN 210168291U CN 201921092174 U CN201921092174 U CN 201921092174U CN 210168291 U CN210168291 U CN 210168291U
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- circuit board
- heat dissipation
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- management circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model provides a power management circuit board, battery pack, consumer and movable platform, wherein, the power management circuit board includes: the circuit board is used for bearing the heating element; the heat dissipation part is arranged on the circuit board and at least one side of the heating element so that the heat of the heating element can be conducted to the heat dissipation part through the circuit board; the heat dissipation member is provided with at least one bent part to divide the heat dissipation member into a connecting part and a supporting part, the connecting part is arranged on the circuit board and is attached and connected with the circuit board, the supporting part protrudes out of the circuit board, and the supporting part is used for providing supporting force for the connecting part. The structure of the heat dissipation piece is optimized, on one hand, the heat dissipation area of the heat dissipation piece is increased, and the use safety and the service life of the power management circuit board are ensured; on the other hand, the flatness of the heat dissipation piece is guaranteed, and the requirements on the structure and the weight of the power management circuit board are met.
Description
Technical Field
The utility model relates to a battery heat dissipation technical field particularly, relates to a power management circuit board, battery pack, consumer and movable platform.
Background
In the conventional technology, batteries of unmanned aerial vehicles and 3C digital products (a combination of Computer, Communication and Consumer Electronics, also known as information appliances) are mostly smart batteries, and a power management circuit board of the smart battery generates a large amount of heat during operation, so that a heat dissipation structure needs to be added to a PCBA (printed circuit board after an electrical module is installed in printed circuit board + Assembly). The battery of the unmanned aerial vehicle has higher requirements on weight and volume, and needs to be as small as possible, and the related technology can not solve the problem.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least.
Therefore, the utility model discloses the first aspect provides a power management circuit board.
The utility model discloses the second aspect provides a battery pack.
The utility model discloses the third aspect provides a consumer.
The utility model discloses the fourth aspect provides a movable platform.
In view of this, the utility model discloses the first aspect provides a power management circuit board, includes: the circuit board is used for bearing the heating element; the heat dissipation part is arranged on the circuit board and at least one side of the heating element so that the heat of the heating element can be conducted to the heat dissipation part through the circuit board; the heat dissipation member is provided with at least one bent part to divide the heat dissipation member into a connecting part and a supporting part, the connecting part is arranged on the circuit board and is attached and connected with the circuit board, the supporting part protrudes out of the circuit board, and the supporting part is used for providing supporting force for the connecting part.
The utility model provides a power management circuit board, which is provided with a heat dissipation part on the circuit board, and the heat dissipation part is divided into a connection part and a support part by at least one bending part, the connection part and the support part are not in the same plane, and the connection part is arranged on the circuit board and is jointed with the circuit board; the supporting part deviates from the circuit board and protrudes out of the circuit board, namely, the connecting part is contacted with the circuit board, and the supporting part is not contacted with the circuit board. During use of the power management circuit board, heat generated by the heat generating components is conducted to the circuit board and then conducted through the circuit board to the heat sink. At this time, the heat conducted to the heat sink is simultaneously dissipated through the connection part and the support part; the connecting part is connected with the circuit board, the connecting part simultaneously plays the roles of heat conduction and heat dissipation, and the supporting part is not contacted with the circuit board and plays the role of heat dissipation; furthermore, the heat dissipation piece is manufactured in a bending mode, the processing technology is simple and reliable, and the processing efficiency of the heat dissipation piece is improved and the processing cost is reduced.
The utility model optimizes the structure of the heat radiation part on the circuit board, ensures that the support part is not contacted with the circuit board, on one hand, increases the heat radiation area of the heat radiation part, and improves the air circulation area, thereby reducing the temperature of the circuit board to the maximum extent, and ensuring the use safety and the service life of the power management circuit board; on the other hand, due to the optimization of the whole structure of the radiating piece, the strength of the radiating piece is increased, the flatness of the radiating piece is guaranteed, meanwhile, the thickness of the radiating piece is reduced, the weight and the size of the radiating piece are reduced, and the requirements on the structure and the weight of the power management circuit board are met.
According to the utility model discloses foretell power management circuit board can also have following additional technical characterstic:
in the above technical solution, preferably, the connection portion is attached to the circuit board through a heat conducting medium.
In this technical scheme, connecting portion pass through the heat-conducting medium laminating setting with the circuit board. On the one hand, the stable installation of the heat dissipation piece is ensured, and on the other hand, the heat conduction can be ensured. Specifically, the connecting portion is attached to the circuit board by Surface Mount Technology (SMT), and a bonding medium required by the SMT process is a heat-conducting medium with a high heat-conducting coefficient, so as to ensure a heat-dissipating effect.
In any one of the above technical solutions, preferably, the heat sink further includes a bending portion, and the bending portion is used for connecting the connecting portion and the supporting portion; wherein, under the condition that the heat sink receives external force, the supporting part provides the supporting force for the connecting part through the kink to avoid the connecting part to take place to warp.
In the technical scheme, the heat dissipation piece further comprises a bending part used for connecting the connecting part and the supporting part, and the bending part is produced by a bending process in the process of manufacturing and processing the heat dissipation piece. When the heat sink is arranged on the circuit board, the connecting part is attached to the circuit board, and the supporting part protrudes out of the circuit board. Thus, when external force acts on the heat dissipation piece, the external force acts on the supporting portion, and the supporting portion can provide supporting force for the connecting portion through the bending portion, so that deformation of the connecting portion is resisted, and the integral structure of the heat dissipation piece is guaranteed. Specifically, by the arrangement of the support portion and the bent portion, mechanical deformation and thermal deformation of the connection portion can be resisted at the same time.
In any of the above technical solutions, preferably, the number of the support portions is one, and one support portion is located at a middle portion or an end portion of the connection portion.
In this technical scheme, further inject the quantity of supporting part and be one, a supporting part can set up in the middle part or the tip of connecting portion for supporting part and connecting portion do not influence each other. The connecting part can conduct heat to the supporting part, and meanwhile, the exposed part of the connecting part can also dissipate heat, so that the heat dissipation efficiency of the heat dissipation part is improved to the maximum extent; in addition, the arrangement of the supporting part ensures the most simplification of the whole structure of the heat radiating piece, is convenient for processing and manufacturing the heat radiating piece and reduces the manufacturing cost of the heat radiating piece.
In any one of the above technical solutions, preferably, the number of the support portions is at least two, and the at least two support portions are distributed at intervals along the length direction or the width direction of the connecting portion.
In this technical scheme, the quantity of supporting part is at least two, and at least two supporting parts are along the length or the width direction of connecting portion, are interval distribution at connecting portion. The plurality of connecting parts are not in contact with each other and are independent of each other. In the use process of the power management circuit board, heat generated by the circuit board is conducted to the at least two supporting parts through the connecting part at the same time, and the at least two supporting parts and the exposed part of the connecting part are cooled at the same time, so that the heat dissipation area is effectively increased, and the heat dissipation efficiency of the heat dissipation part is improved to the maximum extent. Specifically, at least two support portions are distributed at intervals in the width direction of the connecting portion.
In any of the above technical solutions, preferably, the cross-sectional shape of the support portion includes at least one of: straight line shape, zigzag shape, arc shape and wave shape.
In this embodiment, the cross-sectional shape of the support portion may be various, including but not limited to the following: straight line shape, zigzag shape, arc shape and wave shape. The supporting part with the linear cross section is simplest in structure and convenient to process and manufacture; the supporting part with the sawtooth-shaped, arc-shaped or wave-shaped cross section has larger heat dissipation area and better heat dissipation effect.
In any of the above technical solutions, preferably, the cross-sectional shape of the heat sink includes at least one of: l-shaped, T-shaped, U-shaped, circular, oval and polygonal.
In this embodiment, the cross-sectional shape of the heat sink may be various, including but not limited to the following: l-shaped, T-shaped, U-shaped, circular, oval and polygonal. The heat dissipation piece with the L-shaped or T-shaped cross section is provided with a supporting part, the structure is simplest, and the processing and the manufacturing are convenient; the heat dissipation part with the U-shaped or polygonal cross section is provided with two or more than two supporting parts, so that the heat dissipation area is larger, and the heat dissipation effect is better; the heat dissipation piece with the circular or oval cross section has the advantages of the two heat dissipation pieces.
In any of the above technical solutions, preferably, the connecting portion and the supporting portion are of an integral structure.
In the technical scheme, the connecting part and the supporting part are of an integrated structure, and the connecting part and the supporting part jointly form the heat radiating piece, so that the whole structure of the heat radiating piece is simple; the heat dissipation piece is integrally processed, so that the structure of the heat dissipation piece is simplified to the greatest extent, and the service life of the heat dissipation piece is prolonged.
In any of the above solutions, preferably, the distribution area of the heat dissipation member is adapted to the distribution area of the heat generation elements.
In the technical scheme, on the basis of ensuring the heat dissipation efficiency, the distribution area of the heat dissipation element is ensured to be matched with the distribution area of the heating element, the using number of the heat dissipation element is reduced, and meanwhile, the structure minimization and the weight minimization of the power management circuit board are realized.
In any of the above technical solutions, preferably, the number of the heat dissipation members is at least two, and the at least two heat dissipation members are located on the peripheral side of the heat generation element.
In the technical scheme, in the using process of the power management circuit board, the heat generated by the heating element is far higher than that generated by the circuit board, and the heat generated by the two opposite ends of the heating element is the largest. Therefore, at least two radiating pieces are adopted and distributed on the peripheral side of the heating element, so that the optimal radiating effect is achieved.
In any of the above technical solutions, preferably, the heat sink includes one or a combination of the following: red copper heat sinks, brass heat sinks, or aluminum alloy heat sinks.
In this embodiment, the heat sink includes, but is not limited to, the following types: red copper radiating element, brass radiating element, aluminum alloy radiating element. The heat conductivity of the red copper is second to that of silver, the red copper radiating piece is adopted, so that the radiating piece has the best radiating efficiency, the temperature of the circuit board is effectively reduced, and the red copper radiating piece can be used independently or combined according to actual conditions. In addition, the red copper can be replaced by other materials with higher heat dissipation coefficients, and a brass heat dissipation piece, an aluminum alloy heat dissipation piece or other heat dissipation pieces with higher heat dissipation performance are adopted.
The utility model discloses a second aspect provides a battery pack, include: an electric core; and if the utility model discloses the power management circuit board of any one of first aspect, power management circuit board and electric connection of electric core for control electric core work.
The utility model provides a battery pack, reach including electric core the utility model discloses the power management circuit board of the arbitrary one of first aspect, consequently, have above-mentioned power management circuit board's whole beneficial effect, no longer state one by one here. Specifically, the battery assembly is a smart battery.
The utility model discloses the third aspect provides a consumer, include: including the utility model discloses the power management circuit board of any one of first aspect, or the utility model discloses any one of second aspect's battery pack.
The utility model provides an electric equipment, include the utility model discloses the power management circuit board of any one of the first aspect, or the utility model discloses battery pack of any one of the second aspect, consequently, have above-mentioned power management circuit board's whole beneficial effect, no longer state one by one here. Specifically, the electric equipment is a 3C digital product.
The utility model discloses a fourth aspect provides a movable platform, include: the utility model discloses the power management circuit board of any one of the first aspect, or the utility model discloses the battery pack of any one of the second aspect.
The utility model provides a movable platform, include if the utility model discloses the power management circuit board of any one of the first aspect, or the utility model discloses the battery pack of any one of the second aspect, consequently, have above-mentioned power management circuit board's whole beneficial effect, no longer state one by one here.
In the above technical solution, preferably, the movable platform includes at least one of: unmanned vehicles, handheld cloud platform, motion camera.
In the technical scheme, the movable platform can be an unmanned aerial vehicle, a handheld cloud platform and a motion camera.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a power management circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a heat sink structure in the power management circuit board of the embodiment shown in FIG. 1;
FIG. 3 is a front view of the heat sink of the embodiment shown in FIG. 2;
fig. 4 is a side view of the heat sink of the embodiment shown in fig. 2.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 4 is:
100 power management circuit board, 12 circuit board, 14 heat sink, 142 connecting part, 144 supporting part, 146 bending part, 16 heating element.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
Power management circuit board 100, battery pack, consumer and unmanned aerial vehicle provided in accordance with some embodiments of the present invention are described below with reference to fig. 1-4.
Electronic equipment of the existing unmanned aerial vehicle and 3C digital products has large heat productivity, and a circuit board contained in the electronic equipment can generate large heat during working. For example, batteries in unmanned aerial vehicles and 3C digital products are mostly smart batteries, and the power management circuit board 100 of the smart batteries generates a large amount of heat during operation, so that a heat dissipation structure needs to be added to the PCBA. For the unmanned aerial vehicle, the structure and the weight of the battery assembly are required to be high, and the weight and the structure of the battery assembly are required to be small enough.
In view of the above requirements, the present invention provides the heat sink 14 around the heating element 16, and the heat sink 14 is divided into the connecting portion 142 and the supporting portion 144, and the heat sink 14 is a U-shaped structure. The connecting portion 142 is attached to the circuit board 12, and the supporting portion 144 protrudes from the circuit board 12. In the use process, the heat generated by the heating element 16 can be conducted to the supporting portion 144 through the circuit board 12 and the connecting portion 142, and the supporting portion 144 and the connecting portion 142 together play a role of heat dissipation, thereby effectively increasing the heat dissipation area of the heat dissipation member 14. In addition, when an external force is applied to the heat sink 14, the external force is applied to the supporting portion 144, and the supporting portion 144 provides a supporting force to the connecting portion 142 to resist the deformation of the connecting portion 142, thereby ensuring the overall structure of the heat sink 14. Further, in order to ensure that the heat sink 14 has the best heat dissipation efficiency and effectively reduce the temperature of the circuit board 12, the red copper heat sink 14 is adopted.
The utility model discloses a first aspect provides a power management circuit board 100, as shown in fig. 1 to 4, include: a circuit board 12 for carrying a heat generating element 16; a heat sink 14 disposed on the circuit board 12 and disposed on at least one side of the heat generating element 16 such that heat of the heat generating element 16 can be conducted to the heat sink 14 via the circuit board 12; the heat sink 14 has at least one bent portion to divide the heat sink 14 into a connection portion 142 and a support portion 144, the connection portion 142 is disposed on the circuit board 12 and attached to the circuit board 12, the support portion 144 protrudes from the circuit board 12, and the support portion 144 is used for providing a supporting force to the connection portion 142.
The power management circuit board 100 of the present invention is shown in fig. 1, wherein the heat dissipation member 14 is disposed on the circuit board 12, as shown in fig. 2 and 3, the heat dissipation member 14 is bent at least and is divided into a connection portion 142 and a support portion 144, the connection portion 142 and the support portion 144 are not located on the same plane, and the connection portion 142 is disposed on the circuit board 12 and attached to the circuit board 12; the supporting portion 144 is disposed away from the circuit board 12 and protrudes from the circuit board 12, i.e., the connecting portion 142 is in contact with the circuit board 12, and the supporting portion 144 is not in contact with the circuit board 12. During use of the power management circuit board 100, heat generated by the heat generating components 16 is conducted to the circuit board 12 and then conducted through the circuit board 12 to the heat sink 14. At this time, the heat conducted to the heat sink 14 is radiated through the connection portion 142 simultaneously with the support portion 144; the connecting portion 142 is connected to the circuit board 12, the connecting portion 142 serves the purpose of heat conduction and heat dissipation, and the supporting portion 144 does not contact the circuit board 12 and plays a role of heat dissipation; further, the heat dissipation member 14 is bent, for example, the heat dissipation member can be processed and manufactured in a bending manner, the processing process is simple and reliable, and the processing efficiency of the heat dissipation member 14 is improved and the processing cost is reduced.
The utility model optimizes the structure of the heat sink 14 on the circuit board 12, and ensures that the supporting part 144 is not contacted with the circuit board 12, thereby on one hand, increasing the heat dissipation area of the heat sink 14 and improving the air circulation area, thereby reducing the temperature of the circuit board 12 to the maximum extent and ensuring the use safety and the service life of the power management circuit board 100; on the other hand, due to the optimization of the overall structure of the heat sink 14, the support portion 144 can provide a supporting force to the connection portion 142 during the process of manufacturing the heat sink 14, preventing the deformation of the connection portion 142. Therefore, the strength of the heat sink 14 is increased, the flatness of the heat sink 14 is ensured, the thickness of the heat sink 14 is reduced, the weight and the volume of the heat sink 14 are reduced, and the requirements on the structure and the weight of the power management circuit board 100 are met.
In an embodiment of the present invention, the connecting portion 142 is attached to the circuit board 12 through a heat conducting medium.
In this embodiment, the connecting portion 142 and the circuit board 12 are attached to each other through a heat conducting medium. On the one hand a stable mounting of the heat sink 14 is ensured and on the other hand a heat conduction can be ensured. Specifically, the connecting portion 142 may be directly attached to the circuit board 12 by a heat conductive adhesive, for example, a heat conductive silicone grease. The connecting portion 142 is further attached to the circuit board 12 by SMT, and the adhesive medium required by the SMT process is a heat-conducting medium with a high thermal conductivity, such as solder paste, to ensure the heat dissipation effect.
In an embodiment of the present invention, preferably, the heat sink 14 further includes a bent portion 146, the bent portion 146 is used for connecting the connecting portion 142 and the supporting portion 144; in the case that the heat sink 14 is subjected to an external force, the supporting portion 144 provides a supporting force to the connecting portion 142 through the bent portion 146, so as to prevent the connecting portion 142 from being deformed.
In this embodiment, the heat sink 14 further includes a bent portion 146 for connecting the connection portion 142 and the support portion 144, the bent portion 146 being generated by a bending process during manufacturing the heat sink 14. When the heat sink 14 is disposed on the circuit board 12, the connecting portion 142 is attached to the circuit board 12, and the supporting portion 144 protrudes from the circuit board 12. Thus, when an external force acts on the heat sink 14, the external force acts on the supporting portion 144, and the supporting portion 144 provides a supporting force to the connecting portion 142 through the bent portion 146, so as to resist the deformation of the connecting portion 142, thereby ensuring the overall structure of the heat sink 14. Specifically, the support portion 144 and the bent portion 146 are disposed to resist both the mechanical deformation of the connecting portion 142 caused by external force and the deformation caused by heat.
In an embodiment of the present invention, preferably, the number of the supporting portions 144 is one, and one supporting portion 144 is located in the middle or the end of the connecting portion 142.
In this embodiment, the number of the supporting portions 144 is further limited to one, and one supporting portion 144 may be disposed at the middle or the end of the connecting portion 142, so that the supporting portion 144 and the connecting portion 142 do not interfere with each other. While the connecting portion 142 conducts heat to the supporting portion 144, the exposed portion of the connecting portion 142 can also dissipate heat, so as to improve the heat dissipation efficiency of the heat sink 14 to the maximum extent; in addition, the provision of the support portion 144 ensures the most simplification of the entire structure of the heat sink 14, facilitates the manufacture of the heat sink 14, and reduces the manufacturing cost thereof.
In an embodiment of the present invention, it is preferable that the number of the supporting portions 144 is at least two, and the at least two supporting portions 144 are spaced apart from each other along the length direction or the width direction of the connecting portion 142.
In this embodiment, the number of the supporting portions 144 is at least two, and the at least two supporting portions 144 are distributed at intervals along the length direction or the width direction of the connecting portion 142 at the connecting portion 142. The plurality of connection portions 142 are not in contact with each other and are independent of each other. For example, the number of the supporting portions 144 is two, and the two supporting portions are respectively distributed at both ends of the connecting portion 142. When the power management circuit board 100 is in use, heat generated by the circuit board 12 is simultaneously conducted to the at least two supporting portions 144 through the connecting portion 142, and the at least two supporting portions 144 and the exposed portion of the connecting portion 142 are simultaneously radiated, so that the radiating area is effectively increased, and the radiating efficiency of the radiating member 14 is improved to the greatest extent.
In a specific embodiment, as shown in fig. 2 to 4, the number of the supporting portions 144 is two, and the two supporting portions 144 are located at two opposite ends of the connecting portion 142 along the width direction of the connecting portion 142.
In an embodiment of the present invention, preferably, the cross-sectional shape of the supporting portion 144 includes at least one of the following: straight line shape, zigzag shape, arc shape and wave shape.
In this embodiment, the cross-sectional shape of the support portion 144 may be various, including but not limited to the following: straight line shape, zigzag shape, arc shape and wave shape. Wherein, the supporting part 144 with the linear cross section has the simplest structure and is convenient for processing and manufacturing; the supporting part 144 with the cross section in a zigzag shape, an arc shape or a wave shape has a larger heat dissipation area and a better heat dissipation effect.
In the embodiment, in order to simplify the structure, as shown in fig. 2 to 4, the supporting portion 144 has a linear cross-sectional shape.
In one embodiment of the present invention, the cross-sectional shape of the heat sink 14 preferably includes at least one of: l-shaped, T-shaped, U-shaped, circular, oval and polygonal.
In this embodiment, the cross-sectional shape of the heat sink 14 may be varied, including but not limited to the following: l-shaped, T-shaped, U-shaped, circular, oval and polygonal. Wherein, the heat sink 14 with the cross section in L shape or T shape has a supporting part 144, the structure is simplest, and the processing and the manufacturing are convenient; the heat sink 14 having a U-shaped or polygonal cross section has two or more support portions 144, which provides a larger heat dissipation area and a better heat dissipation effect; the heat sink 14 having a circular or elliptical cross-sectional shape combines the advantages of both heat sinks 14.
In an embodiment, as shown in fig. 2 to 4, the heat sink 14 of the present invention has a U-shaped cross section.
In an embodiment of the present invention, the connecting portion 142 and the supporting portion 144 are preferably an integral structure.
In this embodiment, the connecting portion 142 and the supporting portion 144 are of an integral structure, and the connecting portion 142 and the supporting portion 144 together form the heat sink 14, so that the heat sink 14 has a simple overall structure; the heat sink 14 is integrally formed, which ensures the most simplified structure and prolonged service life of the heat sink 14.
In one embodiment of the present invention, the distribution area of the heat dissipation element 14 is preferably adapted to the distribution area of the heat generating elements 16.
In this embodiment, on the basis of ensuring the heat dissipation efficiency, it is ensured that the distribution area of the heat dissipation member 14 is adapted to the distribution area of the heat generation elements 16. For example, the heat dissipation structure is distributed around the heating element, so that the heat of the heating element can quickly reach the heat dissipation part, and the heat dissipation efficiency is improved. The use of the heat sink 14 is reduced while achieving a minimization of the structure and a minimization of the weight of the power management circuit board 100.
In one embodiment of the present invention, it is preferable that the number of the heat dissipation members 14 is at least two, and at least two heat dissipation members 14 are located on the peripheral side of the heat generation element 16.
In this embodiment, the heat generated by the heat generating component 16 is much higher than the heat generated by the circuit board 12 during the operation of the power management circuit board 100, and the heat generated at the opposite ends of the heat generating component 16 is the largest. Therefore, at least two heat dissipation members 14 are adopted, and the at least two heat dissipation members 14 are distributed on the peripheral side of the heat generating element 16, so as to achieve the optimal heat dissipation effect.
In the embodiment, in order to achieve the simplest structure and weight, the height of the heat dissipation member 14 is less than or equal to the height of the heat generating element 16, and the length of the heat dissipation member 14 is less than or equal to the length of the heat generating element 16.
In an embodiment of the present invention, preferably, the heat dissipation element 14 includes one or a combination of the following: red copper heat sinks, brass heat sinks, or aluminum alloy heat sinks.
In this embodiment, the heat sink 14 includes, but is not limited to, the following categories: red copper radiating element, brass radiating element, aluminum alloy radiating element. The heat conductivity of red copper is second to that of silver, and the heat dissipation member 14 has the best heat dissipation efficiency due to the red copper heat dissipation member, so that the temperature of the circuit board 12 is effectively reduced, and the red copper heat dissipation member can be used alone or in combination according to actual conditions. In addition, the red copper can be replaced by other materials with higher heat dissipation coefficients, and a brass heat dissipation member, an aluminum alloy heat dissipation member, or other heat dissipation members 14 with higher heat dissipation performance are adopted.
In a specific embodiment, the heat sink 14 provided by the present invention is a red copper heat sink.
In an embodiment, as shown in fig. 1 to 4, the power management circuit board 100 of the present invention employs a U-shaped heat sink, and the U-shaped heat sink is made of red copper. This structure can satisfy the demand that paster production and heat dissipation capacity are big through using thinner, the less material of weight. Specifically, two U-shaped heat sinks are attached to the PCBA and positioned adjacent to the heat generating components 16 to dissipate heat.
The U-shaped heat dissipation piece provided by the utility model reduces the thickness and weight of the heat dissipation piece 14, thereby reducing the cost of the heat dissipation piece 14; the U-shaped structure increases the heat dissipation area and improves the heat dissipation efficiency; the U-shaped structure improves the flatness of the heat sink 14, thereby ensuring a larger contact area between the heat sink 14 and the circuit board 12; the U-shaped structure improves the flatness of the heat dissipation piece 14, increases the strength of the heat dissipation piece 14, avoids deformation in the transportation and installation processes, and improves the quality and efficiency of SMT.
The utility model discloses a second aspect provides a battery pack, include: an electric core; and the utility model discloses power management circuit board 100 of any one of the first aspect, power management circuit board 100 are connected with electric core for control electric core work.
The utility model provides a battery pack, reach including electric core the utility model discloses the power management circuit board 100 of the arbitrary one of first aspect, consequently, have above-mentioned power management circuit board 100's whole beneficial effect, no longer state one by one here. Specifically, the battery assembly is a smart battery.
The utility model discloses the third aspect provides a consumer, include: including the power management circuit board 100 of any one of the first aspects of the present invention, or the battery pack of any one of the second aspects of the present invention.
The utility model provides an electric equipment, include the utility model discloses the power management circuit board 100 of any one of the first aspect, or the utility model discloses the battery pack of any one of the second aspect, consequently, have above-mentioned power management circuit board 100's whole beneficial effect, no longer state one by one here. Specifically, the electric equipment is a 3C digital product.
The utility model discloses a fourth aspect provides a movable platform, include: the present invention provides the power management circuit board 100 of any one of the first aspects, or the battery pack of any one of the second aspects.
The utility model provides a movable platform, include the utility model discloses the power management circuit board 100 of any one of the first aspect, or the utility model discloses the battery pack of any one of the second aspect, consequently, have above-mentioned power management circuit board 100's whole beneficial effect, no longer state one by one here.
In an embodiment of the present invention, preferably, the movable platform includes at least one of the following: unmanned vehicles, handheld cloud platform, motion camera.
In the technical scheme, the movable platform can be an unmanned aerial vehicle, a handheld cloud platform and a motion camera.
In the description of the present invention, the terms "plurality" or "a plurality" refer to two or more, and unless otherwise specifically limited, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A power management circuit board, comprising:
the circuit board is used for bearing the heating element;
the heat dissipation part is arranged on the circuit board and at least one side of the heating element so that the heat of the heating element can be conducted to the heat dissipation part through the circuit board;
the heat dissipation piece is provided with at least one bent part to divide the heat dissipation piece into a connecting part and a supporting part, the connecting part is arranged on the circuit board and is attached and connected with the circuit board, the supporting part protrudes out of the circuit board, and the supporting part is used for providing supporting force for the connecting part.
2. The power management circuit board of claim 1,
the connecting part is attached to the circuit board through a heat conducting medium; and/or the presence of a gas in the gas,
the heat dissipation member further comprises a bending part for connecting the connecting part and the supporting part; wherein, under the condition that the heat dissipation piece receives external force, the supporting part provides the supporting force for the connecting part through the bending part, so as to avoid the deformation of the connecting part.
3. The power management circuit board of claim 1,
the number of the supporting parts is one, and one supporting part is positioned in the middle or at the end part of the connecting part; and/or the presence of a gas in the gas,
the quantity of supporting part is at least two, at least two the supporting part is along the length direction or the width direction of connecting portion are interval distribution.
4. The power management circuit board of any of claims 1 to 3,
the cross-sectional shape of the support portion includes at least one of: straight line shape, arc shape, saw tooth shape and wave shape; and/or the presence of a gas in the gas,
the heat sink has a cross-sectional shape including at least one of: l-shaped, T-shaped, U-shaped, circular, elliptical and polygonal; and/or the presence of a gas in the gas,
the connecting part and the supporting part are of an integrated structure; and/or the presence of a gas in the gas,
the heat dissipation member comprises one or a combination of the following components: red copper heat sinks, brass heat sinks, or aluminum alloy heat sinks.
5. The power management circuit board of any of claims 1 to 3,
the distribution area of the heat dissipation element is adapted to the distribution area of the heat generation element.
6. The power management circuit board of claim 5,
the number of the heat dissipation members is at least two, and the at least two heat dissipation members are located on the peripheral side of the heating element.
7. A battery assembly, comprising:
an electric core; and
the power management circuit board of any one of claims 1 to 6, electrically connected to the cells for controlling operation of the cells.
8. An electrical device, comprising:
the power management circuit board of any of claims 1 to 6; or
The battery module of claim 7.
9. A movable platform, comprising:
the power management circuit board of any of claims 1 to 6; or
The battery module of claim 7.
10. The movable platform of claim 9,
the movable platform comprises at least one of: unmanned vehicles, handheld cloud platform, motion camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921092174.XU CN210168291U (en) | 2019-07-12 | 2019-07-12 | Power management circuit board, battery pack, electric equipment and movable platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921092174.XU CN210168291U (en) | 2019-07-12 | 2019-07-12 | Power management circuit board, battery pack, electric equipment and movable platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210168291U true CN210168291U (en) | 2020-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921092174.XU Expired - Fee Related CN210168291U (en) | 2019-07-12 | 2019-07-12 | Power management circuit board, battery pack, electric equipment and movable platform |
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| CN (1) | CN210168291U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111856095A (en) * | 2020-07-28 | 2020-10-30 | 哈尔滨工业大学 | Pulse high-voltage load resistor module, assembling method and device |
-
2019
- 2019-07-12 CN CN201921092174.XU patent/CN210168291U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111856095A (en) * | 2020-07-28 | 2020-10-30 | 哈尔滨工业大学 | Pulse high-voltage load resistor module, assembling method and device |
| CN111856095B (en) * | 2020-07-28 | 2023-04-11 | 哈尔滨工业大学 | Pulse high-voltage load resistor module, assembling method and device |
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