CN217428433U - 电路模块 - Google Patents
电路模块 Download PDFInfo
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- CN217428433U CN217428433U CN202220321707.2U CN202220321707U CN217428433U CN 217428433 U CN217428433 U CN 217428433U CN 202220321707 U CN202220321707 U CN 202220321707U CN 217428433 U CN217428433 U CN 217428433U
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- lead frames
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- 239000002184 metal Substances 0.000 claims abstract description 112
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000003566 sealing material Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 3
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 11
- 102100022626 Glutamate receptor ionotropic, NMDA 2D Human genes 0.000 description 8
- 101000972840 Homo sapiens Glutamate receptor ionotropic, NMDA 2D Proteins 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 101100129750 Arabidopsis thaliana MDN1 gene Proteins 0.000 description 1
- 101100049029 Rattus norvegicus Atp6v0e1 gene Proteins 0.000 description 1
- 101100327317 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CDC1 gene Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Abstract
本实用新型提供一种能够兼顾散热性和金属柱间的空间的确保的电路模块。电路模块具备:基板,安装形成给定电子电路的多个电子部件,具有第1主面;多个引线框,在第1主面侧与基板分离地配置;柱状的多个金属柱,配置在多个引线框与第1主面之间,将多个引线框和第1主面的电极连接;以及绝缘性密封材料,对多个金属柱、第1主面以及多个引线框的一部分进行密封,多个引线框具有:第1LF面,与第1主面对置;以及第2LF面,是与第1LF面相反侧的面,从绝缘性密封材料露出,多个引线框具备:焊盘部,包含第1LF面的一部分,并与金属柱连接,在与第1主面正交的方向上透视了绝缘性密封材料的状态下观察,焊盘部与金属柱重叠。
Description
技术领域
本实用新型涉及具有安装了电子部件的电路基板和将该电路基板与外部的基板等连接的多个端子的电路模块。
背景技术
在专利文献1记载了电子部件内置基板。专利文献1记载的电子部件内置基板具备两个基板和安装在两个基板之间的多个电子部件。
专利文献1记载的电子部件内置基板在电子部件内置基板的外表面具备用于与外部电路连接的多个连接用焊盘。基板和连接用焊盘通过金属柱连接。
在先技术文献
专利文献
专利文献1:日本专利第05951414号
在专利文献1记载的电子部件内置基板中,在相邻的两个金属柱(或者,相邻的两个连接用焊盘)之间配置布线、电子部件的情况下,需要将金属柱间的距离设为给定的阈值以上。
因此,与不配置布线、电子部件的情况相比,每单位面积的金属柱的数量变少,散热性下降。此外,如果缩小金属柱间的距离,则散热性提高,但是用于配置电子部件、布线的空间变少。
像这样,金属柱间的空间和散热性处于需要权衡的关系,存在难以兼顾的问题。
实用新型内容
实用新型要解决的课题
鉴于上述课题,本实用新型的目的在于,提供一种能够兼顾散热性和金属柱间的空间的确保的电路模块。
用于解决课题的技术方案
本实用新型的电路模块具备:基板,安装形成给定电子电路的多个电子部件,具有第1主面;多个引线框,在所述第1主面侧与所述基板分离地配置;柱状的多个金属柱,配置在所述多个引线框与所述第1主面之间,将所述多个引线框和所述第1主面的电极连接;以及绝缘性密封材料,对所述多个金属柱、所述第1主面以及所述多个引线框的一部分进行密封,所述多个引线框具有:第1LF面,与所述第1主面对置;以及第2LF面,是与所述第1LF面相反侧的面,从所述绝缘性密封材料露出,所述多个引线框具备:焊盘部,包含所述第1LF面的一部分,并与所述金属柱连接,在与所述第1主面正交的方向上透视了所述绝缘性密封材料的状态下观察,所述焊盘部与所述金属柱重叠。
在该结构中,通过使用柱状的金属柱,使每单位面积的金属柱的数量增加。此外,引线框配置为与基板不接触,因此基板的能够安装电子部件的空间扩大。进而,引线框具备与金属柱重叠的焊盘部,由此从金属柱经由引线框传导到外部的热量变大。
实用新型效果
根据本实用新型,能够兼顾散热性和金属柱间的空间的确保。
附图说明
图1(A)、图1(B)是第1实施方式涉及的电路模块的省略了绝缘性密封材料的立体图。
图2(A)、图2(B)是第1实施方式涉及的电路模块的外观立体图。
图3是第1实施方式涉及的电路模块的省略了绝缘性密封材料的俯视图。
图4是从具有多个引线框的一侧的面侧观察的图。
图5(A)、图5(B)是示出多个引线框以及散热板的形状的立体图。
图6(A)、图6(B)是相邻的两个引线框的放大立体图。
图7(A)、图7(B)、图7(C)、图7(D)、图7(E)是相邻的两个引线框的各种图。
图8(A)、图8(B)是示出引线框以及金属柱的配置形状的剖视图。
附图标记说明
10:电路模块;
20:基板;
21、22:主面;
32、33、311、312:电子部件;
41、42:引线框组;
51、52:金属柱组;
61、62:绝缘性密封材料;
231、232、241、242:侧面;
431、432:散热板;
511、512、521、522:金属柱;
4101-4121、4201-4221:引线框;
B1、B2:引线部;
SR1、SR2:焊盘部;
BB1、BB2:底面;
EB11、EB12、EB21、EB22:端面;
SB11、SB12、SB21、SB22:侧面;
TB1、TB2:顶面。
具体实施方式
[第1实施方式]
参照图对本实用新型的第1实施方式涉及的电路模块进行说明。
图1(A)、图1(B)是第1实施方式涉及的电路模块的省略了绝缘性密封材料的立体图。图1(B)是从具有多个引线框的一侧的面(安装到外部电路基板的安装面)侧观察的图,图1(A)是从与图1(B)相反侧观察的图。图2(A)、图2(B)是第1实施方式涉及的电路模块的外观立体图。图2(B)是从具有多个引线框的一侧的面(安装到外部电路基板的安装面)侧观察的图,图2(A)是从与图2(B)相反侧观察的图。
图3是第1实施方式涉及的电路模块的省略了绝缘性密封材料的俯视图。图3是从具有多个引线框的一侧的面侧观察的图。图4是第1实施方式涉及的电路模块的省略了绝缘性密封材料以及引线框的俯视图。图4是从具有多个引线框的一侧的面侧观察的图。
如图1(A)、图1(B)、图2(A)、图2(B)、图3、图4所示,电路模块10具备基板20、电子部件311、电子部件312、多个电子部件 32、多个电子部件33、引线框组41、引线框组42、散热板431、散热板 432、金属柱组51、金属柱组52、绝缘性密封材料61、绝缘性密封材料 62。
基板20具有主面21、主面22、侧面231、侧面232、侧面241、侧面 242。主面21和主面22相互对置。侧面231、侧面232、侧面241、侧面 242与主面21和主面22正交。侧面231、侧面232、侧面241、侧面242 沿着主面21和主面22的外缘配置,配置在主面21与主面22之间,与主面21和主面22连接。侧面231和侧面232相互对置,侧面241和侧面242 相互对置。与侧面231以及侧面232平行的方向(图中的x方向)是电路模块10的第1方向,与侧面241以及侧面242平行的方向(图中的y方向)是电路模块10的第2方向。
基板20包含绝缘性基材和形成在绝缘性基材的导体图案。另外,虽然省略了图示,但是导体图案由构成电路模块10的电路图案的形状构成。
电子部件311以及电子部件312例如是控制IC。电子部件311以及电子部件312例如是以半导体为基材的半导体部件,是低矮的形状,是在一个面形成了由焊料凸块等构成的多个安装端子的形状。此外,电子部件311 以及电子部件312是发热性高的电子部件。
IC也可以使用调节器IC。此外,虽然安装端子设为焊料凸块,但是并不限于此,也可以使用引线框端子、铜柱。
电子部件311以及电子部件312安装在基板20的主面21。更具体地,电子部件311以及电子部件312安装在基板20的主面21中的第2方向上的中央区域。电子部件311以及电子部件312在第1方向上排列安装。
多个电子部件32例如是电容器、电感器等。多个电子部件32是片型电子部件,在壳体的两端形成有端子导体。多个电子部件32包含具有后述的金属柱511、512、521、522以上的高度尺寸的比较大的外形形状的电子部件。多个电子部件32安装在基板20的主面22。
多个电子部件33例如是电阻器、电容器等。多个电子部件33是片型电子部件,在壳体的两端或者壳体的一个面的两端附近形成有端子导体。多个电子部件32是具有比后述的金属柱511、512、521、522低的高度尺寸的比较低矮的形状的部件。
多个电子部件33安装在基板20的主面21中的、与电子部件311和电子部件312的安装位置不同的区域。例如,如图1(B)、图3、图4所示,多个电子部件33安装在电子部件311以及电子部件312的安装区域与侧面231或侧面232之间、电子部件311与电子部件312之间。
引线框组41包含多个引线框4101-4121。多个引线框4101-4121 由热传导性、电传导性、加工性优异的金属构成。
多个引线框4101-4121是在第2方向上延伸的形状。另外,多个引线框4101-4121延伸的方向也可以不与第2方向完全平行,例如,也可以由于制造误差等而具有某种程度的角度。多个4101-4121配置在主面 21上的侧面231附近的区域。多个4101-4121与主面21分离地配置。多个引线框4101-4121沿着侧面231以大致等间隔进行配置,换言之,沿着第1方向以大致等间隔进行配置。
引线框组42包含多个引线框4201-4221。多个引线框4201-4221 由热传导性、电传导性、加工性优异的金属构成。
多个引线框4201-4221是在第2方向上延伸的形状。另外,多个引线框4201-4221延伸的方向也可以不与第2方向完全平行,例如,也可以由于制造误差等而具有某种程度的角度。多个引线框4201-4221配置在主面21上的侧面232附近的区域。多个引线框4201-4221与主面21 分离地配置。多个引线框4201-4221沿着侧面232以大致等间隔进行配置,换言之,沿着第1方向以大致等间隔进行配置。
多个引线框4101-4121以及多个引线框4201-4221的更具体的形状以及配置方式将在后面叙述。
金属柱组51包含多个金属柱511以及多个金属柱512。多个金属柱 511、512由热传导性、电传导性优异的材料构成。
多个金属柱511以及多个金属柱512配置在主面21上的侧面231附近的区域。多个金属柱511以及多个金属柱512沿着侧面231以后述的给定的图案进行配置,换言之,沿着第1方向以后述的给定的图案进行配置。
多个金属柱511以及多个金属柱512配置在多个引线框4101-4121 与主面21之间,对多个引线框4101-4121和与多个引线框4101-4121 分别对应的主面21的多个导体焊盘(省略图示)进行连接。
金属柱组52包含多个金属柱521以及多个金属柱522。多个金属柱 521、522由热传导性、电传导性优异的材料构成,例如为铜。
多个金属柱521以及多个金属柱522配置在主面21上的侧面232附近的区域。多个金属柱521以及多个金属柱522沿着侧面232以后述的给定的图案进行配置,换言之,沿着第1方向以后述的给定的图案进行配置。
多个金属柱521以及多个金属柱522配置在多个引线框4201-4221 与主面21之间,对多个引线框4201-4221和与多个引线框4201-4221 分别对应的主面21的多个导体焊盘(省略图示)进行连接。
绝缘性密封材料61以及绝缘性密封材料62例如由绝缘性树脂构成。
绝缘性密封材料61覆盖基板20的主面21侧。更具体地,如图2(B) 所示,绝缘性密封材料61在基板20的主面21覆盖电子部件311、电子部件312、多个电子部件33、多个金属柱511、多个金属柱512、多个金属柱521、多个金属柱522。此外,绝缘性密封材料61除了多个引线框4101 -4121以及多个引线框4201-4221的底面(参照图7(A)~图7(E)、图8(A)、图8(B)的底面BB1、BB2)以外覆盖多个引线框4101-4121 以及多个引线框4201-4221。换言之,绝缘性密封材料61覆盖引线框4101 -4121以及多个引线框4201-4221,使得仅将多个引线框4101-4121以及多个引线框4201-4221的底面露出在外部。
绝缘性密封材料62覆盖基板20的主面22侧。更具体地,如图2(A) 所示,绝缘性密封材料62在基板20的主面22覆盖多个电子部件32。
(引线框以及金属柱的具体的结构)
(金属柱的形状以及排列)
多个金属柱511、多个金属柱512、多个金属柱521、以及多个金属柱 522是圆柱状。多个金属柱511、多个金属柱512、多个金属柱521、以及多个金属柱522是相同的形状。另外,这里所谓的相同的形状,包含考虑了制造误差的偏差的范围。
多个金属柱511、多个金属柱512、多个金属柱521、以及多个金属柱 522在圆柱延伸的方向上的一端与基板20的主面21的多个导体焊盘连接。
多个金属柱511、多个金属柱512、多个金属柱521、以及多个金属柱 522在圆柱延伸的方向上的另一端与多个引线框4101-4121以及多个引线框4201-4221连接。
如图4所示,多个金属柱511以及多个金属柱512在第2方向(y方向)上配置在比电子部件311以及电子部件312靠侧面231侧的区域。
多个金属柱511在侧面231的附近沿着侧面231(沿着第1方向)以给定间隔进行配置。
多个金属柱512在多个金属柱511的排列区域的附近沿着侧面231(沿着第1方向)以给定间隔进行配置。此时,多个金属柱512在第2方向上配置在比多个金属柱511远离侧面231的位置。
在第1方向上,多个金属柱511的配置位置和多个金属柱512的配置位置不同。更具体地,多个金属柱511和多个金属柱512在第1方向上交替地配置(锯齿状配置)。
如图4所示,多个金属柱521以及多个金属柱522在第2方向(y方向)上配置在比电子部件311以及电子部件312靠侧面232侧的区域。
多个金属柱521在侧面232的附近沿着侧面232(沿着第1方向)以给定间隔进行配置。
多个金属柱522在多个金属柱521的排列区域的附近沿着侧面232(沿着第1方向)以给定间隔进行配置。此时,多个金属柱522在第2方向上配置在比多个金属柱521远离侧面232的位置。
在第1方向上,多个金属柱521的配置位置和多个金属柱522的配置位置不同。更具体地,多个金属柱521和多个金属柱522在第1方向上交替地配置(锯齿状配置)。
(引线框的形状、配置)
图5(A)、图5(B)是示出多个引线框以及散热板的形状的立体图。图5(A)是从基板侧观察的图,图5(B)是从电路模块向外部的安装面侧观察的图。图6(A)、图6(B)是相邻的两个引线框的放大立体图。图6(A)是从基板侧观察的图,图6(B)是从电路模块向外部的安装面侧观察的图。图7(A)、图7(B)、图7(C)、图7(D)、图7(E) 是相邻的两个引线框的各种图。图7(A)是俯视图,图7(B)是C-C 剖视图,图7(C)是D-D剖视图,图7(D)、图7(E)是侧视图。
如各图所示,多个引线框4101-4121以及多个引线框4201-4221大体划分,可分类为两种形状。第1形状可应用于多个引线框4101-4121 中的引线框4101、4103、4105、4107、4109、4111、4113、4115、4117、 4119、4121和多个引线框4201-4221中的引线框4201、4203、4205、4207、 4209、4211、4213、4215、4217、4219、4221。第2形状可应用于多个引线框4101-4121中的引线框4102、4104、4106、4108、4110、4112、4114、 4116、4118、4120和多个引线框4201-4221中的引线框4202、4204、4206、 4208、4210、4212、4214、4216、4218、4220。
参照图6(A)以及图6(B)和图7(A)~图7(E),第1形状以引线框4101为例进行说明,第2形状以引线框4102为例进行说明。
引线框4101具备引线部B1和焊盘部SR1。引线部B1和焊盘部SR1 一体形成。
引线部B1是长方体形状,具备顶面TB1、底面BB1、端面EB11、端面EB12、侧面SB11、以及侧面SB12。端面EB11以及端面EB12是长方体形状的长边方向上的端面。侧面SB11、侧面SB12是长方体形状的短边方向上的端面。顶面TB1对应于本实用新型的“第1LF面”,底面BB1对应于本实用新型的“第2LF面”。
焊盘部SR1是平板形状。焊盘部SR1的平面形状为大致正方形。焊盘部SR1的一边的长度WSR1大于与该焊盘部SR1连接的金属柱511的直径φ511。此外,焊盘部SR1的一边的长度WSR1比引线部B1的长度 LB1(端面EB11和端面EB12的距离)短。
焊盘部SR1的厚度DSR1小于引线部B1的厚度(顶面TB1和底面 BB1的距离)DB1。
焊盘部SR1设置在引线部B1的顶面TB1。更具体地,焊盘部SR1设置在引线部B1,使得焊盘部SR1的顶面与引线部B1的顶面TB1平齐。此外,焊盘部SR1设置在引线部B1,使得俯视下的中心与引线部B1的短边方向上的中心一致。由此,在焊盘部SR1的底面侧形成不存在引线部B1的空间。
换言之,引线部B1是在与平板状的焊盘部SR1连接的部分具有凹陷的大致长方体。而且,通过在该引线部B1的凹陷嵌入焊盘部SR1,从而构成引线框4101。
焊盘部SR1设置在引线部B1的长边方向上的端面EB11的附近。换言之,焊盘部SR1设置在引线部B1的长边方向上的、与端面EB12相比更靠近端面EB11的位置。
引线框4102具备引线部B2和焊盘部SR2。引线部B2和焊盘部SR2 一体形成。
引线部B2是长方体形状,具备顶面TB2、底面BB2、端面EB21、端面EB22、侧面SB21、以及侧面SB22。端面EB21以及端面EB22是长方体形状的长边方向上的端面。侧面SB21、侧面SB22是长方体形状的短边方向上的端面。顶面TB2对应于本实用新型的“第1LF面”,底面BB2对应于本实用新型的“第2LF面”。
焊盘部SR2是平板形状。焊盘部SR2的平面形状是大致正方形。焊盘部SR2的一边的长度WSR2大于与该焊盘部SR2连接的金属柱512的直径φ512。此外,焊盘部SR2的一边的长度WSR2比引线部B2的长度 LB2(端面EB21和端面EB22的距离)短。
焊盘部SR2的厚度DSR2小于引线部B2的厚度(顶面TB2和底面 BB2的距离)DB2。
焊盘部SR2设置在引线部B2的顶面TB2。更具体地,焊盘部SR2设置在引线部B2,使得焊盘部SR2的顶面与引线部B2的顶面TB2平齐。此外,焊盘部SR2设置在引线部B2,使得俯视下的中心与引线部B2的短边方向上的中心一致。由此,在焊盘部SR2的底面侧形成不存在引线部 B2的空间。
换言之,引线部B2是在与平板状的焊盘部SR2连接的部分具有凹陷的大致长方体。而且,通过在该引线部B2的凹陷嵌入焊盘部SR2,从而构成引线框4102。
焊盘部SR2设置在引线部B2的长边方向上的端面EB22的附近。换言之,焊盘部SR2设置在引线部B2的长边方向上的、与端面EB11相比更靠近端面EB22的位置。
引线框4101和引线框4102隔开间隔P51进行配置,使得各自的长边方向平行。此时,引线框4101和引线框4102配置为,引线部B1的端面 EB11和引线部B2的端面EB21相对于引线部B1、B2处于相同侧。换言之,配置为引线框4101的焊盘部SR1和引线框4102的焊盘部SR2在引线部B1、B2延伸的方向(电路模块10的第2方向)上处于不同的位置,更优选地,配置为在引线部B1、B2延伸的方向(电路模块10的第2方向) 上处于不重叠的位置。
间隔P51可基于焊盘部SR1从引线部B1突出的长度以及焊盘部SR2 从引线部B2突出的长度、它们之间以及引线部B1与引线部B2之间的电绝缘性进行设定。
通过这样的结构,在引线框4101和引线框4102排列的方向(电路模块10的第1方向)上,引线框4101的焊盘部SR1与引线框4102的焊盘部SR2不相邻,而与引线部B2相邻。同样地,引线框4102的焊盘部SR2 与引线框4101的焊盘部SR1不相邻,而与引线部B1相邻。
由此,关于引线框4101和引线框4102,与引线部B1、B2的整体为与焊盘部SR1、SR2相同的宽度的情况相比较,换言之,与是具有焊盘部 SR1、SR2的宽度的长方体的情况相比较,能够使引线框4101和引线框 4102的间隔变窄。
此外,在俯视下(在电路模块10的厚度方向上观察),焊盘部SR1、 SR2与金属柱511、512完全重叠。由此,通过了金属柱511、512的热被有效地传导到焊盘部SR1、SR2。而且,在引线框4101、4102中,引线部 B1、B2是在第2方向上比焊盘部SR1、SR2长的形状。因此,即使引线部B1、B2在第1方向上比焊盘部SR1、SR2短,热也在引线部B1、B2 的长边方向上扩散而有效地被传导。由此,引线框4101、4102能够将来自金属柱511、512的热有效地向外部散热。
如图5(A)以及图5(B)所示,这样的第1形状的引线框和第2形状的引线框沿着电路模块10的第1方向(x方向)交替地配置。如果是引线框组41,则按照第1形状的引线框4101、第2形状的引线框4102、第 1形状的引线框4103、第2形状的引线框4104、……、第1形状的引线框4121的顺序配置。如果是引线框组42,则按照第1形状的引线框4201、第2形状的引线框4202、第1形状的引线框4203、第2形状的引线框 4204、……、第1形状的引线框4221的顺序配置。
图8(A)、图8(B)是示出引线框以及金属柱的配置形状的剖视图。图8(A)示出图3的A-A剖面,图8(B)示出图3的B-B剖面。
通过具备上述的结构,从而如图8(A)、图8(B)所示,在电路模块10中,即使在以所希望的直径形成多个金属柱521、522的同时使多个金属柱521、522的第1方向上的配置间隔变窄,也能够使多个引线框4201 -4221的引线部的间隔大于多个金属柱521、522的间隔。除此以外,能够抑制金属柱521、522和引线框4201-4221的连接面积的下降,电路模块10能够有效地实现从金属柱521、522向引线框4201-4221的热传导。
由此,电路模块10能够在保持多个金属柱间以及多个引线框间的绝缘性的同时,抑制基于多个金属柱以及多个引线框的散热性能的下降。即,电路模块10能够实现散热性、确保金属柱间的空间、以及确保引线框间的空间。其结果是,例如,电路模块10能够实现散热性和小型化的兼顾。例如,电路模块10能够实现具有优异的散热性且小型的电源电路模块。
进而,在电路模块10中,多个引线框4101-4121、4201-4221与基板20的主面21分离地配置。而且,多个引线框4101-4121、4201-4221 通过圆柱状的多个金属柱511、512、521、522与基板20的主面21连接。由此,在多个引线框4101-4121、4201-4221与基板20的主面21之间形成空间。利用该空间,例如,如图1(B)、图3所示,能够将低矮的电子部件33配置在引线框与基板20之间,更具体地,能够将比金属柱低矮且宽度比相邻的金属柱间的距离窄的电子部件配置在引线框与基板20 之间。因此,电路模块10能够将电子部件33的配置区域扩大到与多个引线框重叠的区域,能够实现省空间化。
此外,如上所述,电路模块10在多个引线框中在焊盘部的下方形成空间。即,电路模块10能够与焊盘部的形状无关地使引线部间以给定距离分离地进行配置。
由此,能够在该部分配置导体图案等。具体地,例如,在安装电路模块10的外部电路基板中,能够在与该电路模块10的多个引线框的引线部间重叠的位置配置导体图案。因此,外部电路基板的布线的设计自由度提高,并且电路模块10相对于外部电路基板的配置的自由度提高。
此外,在上述的结构中,发热性高的电子部件311、312安装在基板 20的主面21,即,电路模块10的安装面(安装到外部电路基板的安装面) 侧的主面。此外,散热板431、432配置为与发热性高的电子部件311、312 重叠,散热板431、432从绝缘性密封材料61露出到外部。由此,能够将发热性高的电子部件311、312的热有效地向外部散热。进而,电子部件311、312的热还经由基板20、像上述的那样散热性优异的多个金属柱以及多个引线框向外部散热。
因此,电路模块10能够更有效地对电子部件311、312进行散热。例如,如果电路模块10是电源电路模块,则能够对作为开关IC的电子部件 311、312有效地进行散热,能够有效地抑制由电源电路模块的热造成的不良影响(可靠性的下降、特性的劣化)。
另外,在上述的说明中,示出了焊盘部未到达引线部的底面的形状的情况,但是也能够采用焊盘部到达引线部的底面的形状。
Claims (8)
1.一种电路模块,其特征在于,具备:
基板,安装形成给定电子电路的多个电子部件,具有第1主面;
多个引线框,在所述第1主面侧与所述基板分离地配置;
柱状的多个金属柱,配置在所述多个引线框与所述第1主面之间,将所述多个引线框和所述第1主面的电极连接;以及
绝缘性密封材料,对所述多个金属柱、所述第1主面以及所述多个引线框的一部分进行密封,
所述多个引线框具有:
第1LF面,与所述第1主面对置;以及
第2LF面,是与所述第1LF面相反侧的面,从所述绝缘性密封材料露出,
所述多个引线框具备:
焊盘部,包含所述第1LF面的一部分,并与所述金属柱连接,
在与所述第1主面正交的方向上透视了所述绝缘性密封材料的状态下观察,所述焊盘部与所述金属柱重叠。
2.根据权利要求1所述的电路模块,其特征在于,
所述多个引线框沿着与所述第1主面平行的第1方向相互隔开距离排列,
所述第2LF面的所述第1方向上的尺寸小于所述第1LF面的所述焊盘部的所述第1方向上的尺寸。
3.根据权利要求2所述的电路模块,其特征在于,
将与所述第1主面平行且与所述第1方向正交的方向设为第2方向,
所述引线框的所述第2方向上的尺寸大于所述焊盘部的所述第2方向上的尺寸。
4.根据权利要求3所述的电路模块,其特征在于,
所述引线框具备在所述第2方向上比所述焊盘部长的形状的引线部,
所述焊盘部是在所述第1方向上从所述引线框的两侧突出的形状。
5.根据权利要求3或权利要求4所述的电路模块,其特征在于,
将所述多个引线框中的相邻的引线框设为第1引线框和第2引线框,
所述第2方向上的所述第1引线框的焊盘部的位置和所述第2引线框的焊盘部的位置不重叠。
6.根据权利要求1至权利要求4中的任一项所述的电路模块,其特征在于,
具备安装在所述第1主面的电子部件,
所述金属柱的高度方向上的尺寸大于所述电子部件的高度方向上的尺寸,
相邻的金属柱间的距离大于所述电子部件的宽度。
7.根据权利要求1至权利要求4中的任一项所述的电路模块,其特征在于,
在所述第1主面安装半导体部件。
8.根据权利要求7所述的电路模块,其特征在于,
所述半导体部件是IC,在与所述第1主面正交的方向上观察,配置在与所述多个引线框不重叠的位置,
所述电路模块具备:
散热板,一部分从所述绝缘性密封材料露出,在与所述第1主面正交的方向上观察,与由所述IC构成的电子部件重叠。
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