JP4686318B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4686318B2 JP4686318B2 JP2005281145A JP2005281145A JP4686318B2 JP 4686318 B2 JP4686318 B2 JP 4686318B2 JP 2005281145 A JP2005281145 A JP 2005281145A JP 2005281145 A JP2005281145 A JP 2005281145A JP 4686318 B2 JP4686318 B2 JP 4686318B2
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- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor
- semiconductor chip
- heat sink
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
10 基板
20 半導体チップ
22 半田ボール
24 アンダーフィル樹脂
30 半導体チップ
32 外部電極端子
34 アンダーフィル樹脂
40 放熱板
40a 基部
40b 張出部
42 接着材
50 樹脂ポスト
60 外部電極端子
Claims (13)
- 基板と、
前記基板上に設けられた第1および第2の半導体チップと、
前記第1の半導体チップに固定された放熱板と、を備え、
前記第1の半導体チップの上面は、前記第2の半導体チップの上面に比して、前記基板からの高さが低く、
前記放熱板は、前記第1および第2の半導体チップのうち第1の半導体チップの上部にのみ設けられており、
前記放熱板の上面と前記第2の半導体チップの上面とは、前記基板からの高さが等しい半導体装置。 - 請求項1に記載の半導体装置において、
前記第1の半導体チップの発熱量は、前記第2の半導体チップよりも発熱量が大きい半導体装置。 - 請求項1又は2に記載の半導体装置において、
前記第1および第2の半導体チップは、それぞれロジック回路およびメモリ回路である半導体装置。 - 請求項1〜3のいずれか一項に記載の半導体装置において、
前記放熱板の上面と前記第2の半導体チップの上面は、同一の他の装置に取り付けられる半導体装置。 - 請求項4に記載の半導体装置において、
前記他の装置はヒートシンクである半導体装置。 - 請求項1〜5のいずれか一項に記載の半導体装置において、
前記第1の半導体チップは、ベアチップであり、
前記第2の半導体チップは、パッケージ化されている半導体装置。 - 請求項1〜6のいずれか一項に記載の半導体装置において、
前記放熱板は、平板状をしている半導体装置。 - 請求項1〜7のいずれか一項に記載の半導体装置において、
前記基板と前記放熱板との間に設けられ、当該基板および放熱板にそれぞれ両端が接続された樹脂ポストを備える半導体装置。 - 請求項1〜8のいずれか一項に記載の半導体装置において、
前記第2の半導体チップは、外部電極端子を有し、当該外部電極端子を介して前記基板に接続されている半導体装置。 - 請求項1〜9のいずれか一項に記載の半導体装置において、
前記放熱板は、矩形の一部が切り欠かれた形状をしており、
当該切欠部に、前記第2の半導体チップが配されている半導体装置。 - 請求項10に記載の半導体装置において、
前記放熱板と前記切欠部との境界には、平面視で角が存在しない半導体装置。 - 請求項10または11に記載の半導体装置において、
前記基板上には、前記第2の半導体チップが複数設けられており、
前記放熱板の一部は、当該複数の第2の半導体チップ同士の間に入り込んでいる半導体装置。 - 請求項12に記載の半導体装置において、
前記放熱板は、基部と当該基部から張り出した張出部とを有しており、
前記基部は、前記第1の半導体チップの上部に位置し、
前記張出部は、前記複数の第2の半導体チップ同士の間に入り込んでいる半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005281145A JP4686318B2 (ja) | 2005-09-28 | 2005-09-28 | 半導体装置 |
US11/512,228 US7649253B2 (en) | 2005-09-28 | 2006-08-30 | Semiconductor device |
CNB2006101595397A CN100517695C (zh) | 2005-09-28 | 2006-09-27 | 半导体器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005281145A JP4686318B2 (ja) | 2005-09-28 | 2005-09-28 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007095860A JP2007095860A (ja) | 2007-04-12 |
JP4686318B2 true JP4686318B2 (ja) | 2011-05-25 |
Family
ID=37892853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005281145A Active JP4686318B2 (ja) | 2005-09-28 | 2005-09-28 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7649253B2 (ja) |
JP (1) | JP4686318B2 (ja) |
CN (1) | CN100517695C (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8067256B2 (en) * | 2007-09-28 | 2011-11-29 | Intel Corporation | Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method |
JP5779042B2 (ja) * | 2011-08-18 | 2015-09-16 | 新光電気工業株式会社 | 半導体装置 |
US9673175B1 (en) * | 2015-08-25 | 2017-06-06 | Freescale Semiconductor,Inc. | Heat spreader for package-on-package (PoP) type packages |
JP2017112241A (ja) * | 2015-12-17 | 2017-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR102609445B1 (ko) | 2018-10-22 | 2023-12-04 | 삼성전자주식회사 | 반도체 패키지 |
JP7061949B2 (ja) * | 2018-10-24 | 2022-05-02 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN109860131A (zh) * | 2019-03-22 | 2019-06-07 | 西安微电子技术研究所 | 一种具有内散热装置的***级封装结构 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263457A (ja) * | 1991-02-18 | 1992-09-18 | Fujitsu Ltd | 半導体装置 |
JPH0521662A (ja) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | 半導体チツプモジユール及びその製造方法 |
JPH10223816A (ja) * | 1997-02-03 | 1998-08-21 | Nec Corp | マルチチップモジュールの冷却構造 |
JP2001144202A (ja) * | 1999-11-16 | 2001-05-25 | Tdk Corp | 高周波モジュール |
JP2001156246A (ja) * | 1999-11-25 | 2001-06-08 | Nec Corp | 集積回路チップの実装構造および実装方法 |
JP2005223008A (ja) * | 2004-02-03 | 2005-08-18 | Toshiba Corp | 半導体モジュール |
JP2005228811A (ja) * | 2004-02-10 | 2005-08-25 | Renesas Technology Corp | 半導体装置 |
JP2007067067A (ja) * | 2005-08-30 | 2007-03-15 | Kokusan Denki Co Ltd | 樹脂注型形電力用回路ユニット |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349989A (ja) * | 1992-12-21 | 1994-12-22 | Internatl Business Mach Corp <Ibm> | 熱伝達冷却装置 |
KR100245971B1 (ko) | 1995-11-30 | 2000-03-02 | 포만 제프리 엘 | 중합접착제를 금속에 접착시키기 위한 접착력 촉진층을 이용하는 히트싱크어셈블리 및 그 제조방법 |
US6703560B2 (en) * | 1998-09-15 | 2004-03-09 | International Business Machines Corporation | Stress resistant land grid array (LGA) module and method of forming the same |
JP3228339B2 (ja) | 1998-11-04 | 2001-11-12 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US6259155B1 (en) | 1999-04-12 | 2001-07-10 | International Business Machines Corporation | Polymer enhanced column grid array |
JP4405024B2 (ja) | 2000-01-18 | 2010-01-27 | 株式会社ルネサステクノロジ | 半導体装置 |
US6979894B1 (en) * | 2001-09-27 | 2005-12-27 | Marvell International Ltd. | Integrated chip package having intermediate substrate |
US7034387B2 (en) * | 2003-04-04 | 2006-04-25 | Chippac, Inc. | Semiconductor multipackage module including processor and memory package assemblies |
JP4302607B2 (ja) * | 2004-01-30 | 2009-07-29 | 株式会社デンソー | 半導体装置 |
TWI232568B (en) * | 2004-03-11 | 2005-05-11 | Advanced Semiconductor Eng | Multi package module with heat spreader |
JP4445351B2 (ja) * | 2004-08-31 | 2010-04-07 | 株式会社東芝 | 半導体モジュール |
US7332818B2 (en) * | 2005-05-12 | 2008-02-19 | Endicott Interconnect Technologies, Inc. | Multi-chip electronic package with reduced line skew and circuitized substrate for use therein |
-
2005
- 2005-09-28 JP JP2005281145A patent/JP4686318B2/ja active Active
-
2006
- 2006-08-30 US US11/512,228 patent/US7649253B2/en active Active
- 2006-09-27 CN CNB2006101595397A patent/CN100517695C/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263457A (ja) * | 1991-02-18 | 1992-09-18 | Fujitsu Ltd | 半導体装置 |
JPH0521662A (ja) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | 半導体チツプモジユール及びその製造方法 |
JPH10223816A (ja) * | 1997-02-03 | 1998-08-21 | Nec Corp | マルチチップモジュールの冷却構造 |
JP2001144202A (ja) * | 1999-11-16 | 2001-05-25 | Tdk Corp | 高周波モジュール |
JP2001156246A (ja) * | 1999-11-25 | 2001-06-08 | Nec Corp | 集積回路チップの実装構造および実装方法 |
JP2005223008A (ja) * | 2004-02-03 | 2005-08-18 | Toshiba Corp | 半導体モジュール |
JP2005228811A (ja) * | 2004-02-10 | 2005-08-25 | Renesas Technology Corp | 半導体装置 |
JP2007067067A (ja) * | 2005-08-30 | 2007-03-15 | Kokusan Denki Co Ltd | 樹脂注型形電力用回路ユニット |
Also Published As
Publication number | Publication date |
---|---|
JP2007095860A (ja) | 2007-04-12 |
US7649253B2 (en) | 2010-01-19 |
CN100517695C (zh) | 2009-07-22 |
US20070069370A1 (en) | 2007-03-29 |
CN1941364A (zh) | 2007-04-04 |
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