CN217387100U - Silicon chip coating tray - Google Patents

Abstract

The utility model discloses a silicon wafer film coating tray, which comprises a plurality of tray grooves and mounting grooves, wherein the tray grooves are arranged in a hollow way and are used for double-sided film coating of silicon wafers, and the mounting grooves are used for mounting and positioning a buckle component and a fixing component, the utility model discloses a hollow tray groove design is used for realizing double-sided film coating of the silicon wafers, the mounting grooves are arranged on the front surface and the back surface of the tray and are used for mounting the fixing component and the buckle component, the two surfaces of the silicon wafers are fixed through the design, the stability of fixing the silicon wafers is enhanced, the silicon wafers can be subjected to double-sided film coating, the effects of transversely placing and vertically placing the tray are realized simultaneously, the occupied area is reduced, and the automation degree is improved, the utility model designs that a first front mounting groove is connected with four groups of adjacent tray grooves, a second front mounting groove is connected with two groups of adjacent tray grooves, and then one group of buckle components is respectively and simultaneously clamps four groups of silicon wafers and two groups of silicon wafers, not only strengthened the stability to the silicon chip, also reduced the quantity of buckle subassembly.

Description

Silicon chip coating tray

Technical Field

The utility model belongs to the solar cell field of making relates to a silicon chip coating film tray.

Background

The thin film/crystalline silicon heterojunction solar cell (hereinafter referred to as heterojunction solar cell, which may be called HIT or HJT or SHJ solar cell) belongs to the third-generation high-efficiency solar cell technology, combines the advantages of the first-generation crystalline silicon and the second-generation silicon thin film, has the characteristics of high conversion efficiency, low temperature coefficient and the like, particularly has the conversion efficiency of the double-sided heterojunction solar cell reaching more than 26 percent, and has wide market prospect; in order to obtain higher module power to reduce unit cost, photovoltaic enterprises issue large-size silicon wafers (referred to as "large silicon wafers") with the specification or side length of 18Xmm (such as 180mm, 182mm or 188mm) and the size of 210mm and the like, when the large silicon wafers are used for manufacturing heterojunction solar cells, the silicon wafers are placed in a tray for film coating, but the existing tray has the following problems: firstly, the edge of the silicon wafer needs surface support, and a large click print can be formed; secondly, the back of the tray is not hollowed or only partially hollowed, the silicon wafer can only be plated on one side, the efficiency is very low, and once fragments are generated, the production is influenced and the cleaning is difficult; thirdly, most of the existing trays can only be transversely placed, thus the space of the height of a factory building is wasted virtually, and the occupied area is increased; fourth, erect put the words or the apron is too heavy, or the stuck point is too many, has increased the degree of difficulty of automation, the utility model discloses this kind of problem has been solved effectively.

Disclosure of Invention

The utility model provides a silicon wafer coating tray for overcoming the defects of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a silicon chip coating tray is characterized in that: the film coating device comprises a plurality of tray grooves and mounting grooves, wherein the tray grooves are arranged in a hollow mode and used for double-sided film coating of a silicon wafer, the mounting grooves are used for mounting and positioning of a buckle assembly and a fixing assembly, the mounting grooves comprise front mounting grooves and back mounting grooves, the front mounting grooves are located in the front of a tray, and the back mounting grooves are located in the back of the tray.

Further, the method comprises the following steps of; the tray grooves are arranged horizontally and vertically at even intervals, the tray grooves which are horizontally adjacent are isolated through vertical partition plates, and the tray grooves which are vertically adjacent are isolated through horizontal partition plates.

Further, the method comprises the following steps of; the front mounting groove is provided with a first front mounting groove and a second front mounting groove according to different positions, the first front mounting groove is positioned at the cross position of the transverse partition plate and the vertical partition plate, and the second front mounting groove is positioned at the cross position of the transverse partition plate, the vertical partition plate and the tray.

Further, the method comprises the following steps of; the first front mounting groove comprises a fixing hole and four groups of fixing grooves, the fixing hole is positioned in the center of the cross position, the four groups of fixing grooves are radially communicated with the fixing hole and the tray groove, and the fixing grooves extend to the angular point position of the tray groove; the second front mounting groove is similar to the first front mounting groove in structure and comprises a fixing hole and two groups of fixing grooves, the fixing holes and the tray grooves are communicated in a radial mode, and the two groups of fixing grooves extend to the angular point position of the tray grooves; a set of first front mounting groove communicates with four adjacent sets of tray grooves, and a set of second front mounting groove communicates with two adjacent sets of tray grooves.

Further, the method comprises the following steps of; the back mounting groove sets up first back mounting groove and second back mounting groove according to the position difference, and first back mounting groove is located horizontal space bar and perpendicular space bar cross position, and second back mounting groove is located the cross position of horizontal space bar and perpendicular space bar and tray, and first back mounting groove and first front mounting groove are located the relative position of tray both sides, and second back mounting groove and second front mounting groove are located the relative position of tray both sides.

Further, the method comprises the following steps of; first back mounting groove includes the restriction groove, and the restriction groove is provided with four groups, and four groups restriction grooves are radial intercommunication tray groove, and the restriction groove extends to the angular point position in tray groove, and a set of first back mounting groove communicates with four adjacent groups tray groove, and a set of second back mounting groove communicates with two adjacent groups tray groove.

Further, the method comprises the following steps of; the back of the tray is fixedly provided with a plurality of mounting holes, the mounting holes are positioned beside the limiting grooves and distributed along the limiting grooves, and the fixing part is mounted in the mounting holes and locks the buckle component.

Further, the method comprises the following steps of; chamfers are arranged on the periphery of the tray groove.

Further, the method comprises the following steps of; the sizes of a plurality of tray grooves of one group of trays are the same and are used for coating the silicon wafers with the same size, or the sizes of a plurality of tray grooves of one group of trays are different and are used for coating the silicon wafers with various sizes.

Further, the method comprises the following steps of; the size of the tray groove is larger than that of the silicon wafer by 1.5mm, the gaps between the four edges of the silicon wafer and the four edges of the tray groove are 0.75mm, and the transverse partition plate, the vertical partition plate and the tray are integrally formed.

To sum up, the utility model discloses an useful part lies in:

1) the utility model discloses a hollow tray groove design all disposes the installation that the mounting groove is used for fixed subassembly and buckle subassembly in order to realize carrying out two-sided coating to the silicon chip at the front of tray and the back, fixes the two sides of silicon chip through this kind of design, strengthens the stability fixed to the silicon chip, can make the silicon chip carry out two-sided coating, realizes the effect that the tray was violently put and was put vertically simultaneously, has reduced area to degree of automation has been improved.

2) The utility model relates to a first positive mounting groove links to each other with four adjacent group's tray grooves, and the positive mounting groove of second links to each other with two adjacent group's tray grooves, and then realizes that a set of buckle subassembly blocks four group's silicon chips and two sets of silicon chips respectively simultaneously, has not only strengthened the stability to the silicon chip, has also reduced the quantity of buckle subassembly simultaneously for the structure is lighter-weighted more.

3) The utility model relates to a first back mounting groove links to each other with four adjacent group's tray grooves, and a second back mounting groove links to each other with two adjacent group's tray grooves, and then realizes that a set of buckle subassembly blocks four group's silicon chips and two sets of silicon chips respectively simultaneously, has not only strengthened the stability to the silicon chip, has also reduced the quantity of buckle subassembly simultaneously for the structure is lighter-weighted more.

Drawings

Fig. 1 is a schematic view of the front side of the tray of the present invention.

Fig. 2 is an enlarged schematic view of a in fig. 1.

Fig. 3 is an installation schematic diagram of the middle fixing component of the present invention.

Fig. 4 is a schematic view of the middle tray, the fixing component and the buckle component of the present invention.

Fig. 5 is a schematic view of the back of the tray of the present invention.

Fig. 6 is a schematic view of the middle buckle assembly of the present invention.

Fig. 7 is a first schematic view of the middle clip of the present invention.

Fig. 8 is a second schematic view of the middle clip of the present invention.

Fig. 9 is a third schematic view of the middle clip of the present invention.

Fig. 10 is a schematic view of the back of a tray according to a second embodiment of the present invention.

Fig. 11 is a schematic view of a tray, a fixing component and a buckle component in the third embodiment of the present invention.

Fig. 12 is an enlarged view of B in fig. 11.

The labels in the figure are: the tray comprises a tray 1, a second front face mounting groove 10, a tray groove 11, a transverse partition plate 12, a vertical partition plate 13, a first front face mounting groove 14, a fixing hole 141, a fixing groove 142, a first back face mounting groove 15, a mounting hole 151, a limiting groove 152, a chamfer 111, a fixing component 2, a silicon wafer 3, a buckle component 4, a clamping point 41, a clamping pin 42, a limiting end 421, a clamping end 422 and a fixing end 423.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.

It should be noted that the drawings provided in the following embodiments are only for illustrating the basic concept of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

All directional indicators (such as upper, lower, left, right, front, rear, horizontal, vertical … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, if the specific posture changes, the directional indicator changes accordingly.

The first embodiment is as follows:

as shown in fig. 1-9, a silicon wafer coating tray comprises a tray 1, a fixing component 2 and a buckle component 4, wherein a plurality of tray grooves 11 are fixedly arranged on the tray 1, a silicon wafer 3 is positioned in the tray grooves 11 for double-sided coating, the fixing component 2 is used for connecting the buckle component 4 with the tray 1, and the buckle component 4 limits the silicon wafer 3 in the tray grooves 11.

Tray 1 includes a plurality of tray grooves 11 and mounting groove, and tray groove 11 cavity sets up for the two-sided coating film of silicon chip 3, and the mounting groove is fixed a position buckle subassembly 4 and fixed subassembly 2's installation.

Usually, the tray 1 is configured as a square plate structure, but not limited to, the tray 1 is made of aluminum and aluminum alloy, or ceramic, or quartz, or carbon, or graphite, or silicon carbide, or stainless steel, or Polyimide (PI), or Polytetrafluoroethylene (PTFE), or polyarylether compound, or a combination of multiple materials thereof.

The tray grooves 11 are of a mesopore structure, a plurality of tray grooves 11 are uniformly arranged at intervals in the horizontal direction and the vertical direction, the tray grooves 11 which are adjacent in the horizontal direction are separated by a vertical spacing plate 13, the tray grooves 11 which are adjacent in the vertical direction are separated by a horizontal spacing plate 12, in the embodiment, the transverse partition plates 12, the vertical partition plates 13 and the tray 1 are integrally formed, the tray groove 11 is preferably in a square structure, the size of the tray groove 11 is slightly larger than that of the silicon wafer 3, the silicon chip 3 can be placed in the tray groove 11, the silicon chip 3 is not easy to shake due to the oversize of the tray groove 11, preferably, the size of the tray groove 11 is larger than the size of the silicon chip 3 by 1.5mm, the gap between the four edges of the silicon chip 3 and the four edges of the tray groove 11 is 0.75mm, under the size design, the silicon wafer 3 can slightly shake, but the coating of the silicon wafer 3 is not greatly or not influenced, and other embodiments can set the size of the tray groove 11 according to actual needs.

Conventionally, the sizes of the plurality of tray grooves 11 disposed on the group of trays 1 are the same, that is, the group of trays 1 is used for coating the silicon wafers 3 with the same size, but not limited thereto, the sizes of the plurality of tray grooves 11 disposed on the group of trays 1 may also be different, that is, the group of trays 1 can be used for coating the silicon wafers 3 with various sizes.

In this embodiment, the mounting groove is used for installing fixed subassembly 2, install buckle subassembly 4 through fixed subassembly 2, the mounting groove and restrict buckle subassembly 4, and this embodiment carries out two-sided coating film in order to realize carrying out silicon chip 3 through hollow tray groove 11 design, the event is on two sides of silicon chip 3, tray 1's front and back all dispose the mounting groove and be used for fixed subassembly 2 and buckle subassembly 4's installation promptly, fix silicon chip 3's two sides through this kind of design, strengthen the stability fixed to silicon chip 3, can make silicon chip 3 carry out two-sided coating film, realize tray 1 violently put and the effect of putting vertically simultaneously, floor area is reduced, and degree of automation has been improved.

For convenience of description, the mounting grooves include a front mounting groove and a back mounting groove, the front mounting groove is located at the front of the tray 1, the back mounting groove is located at the back of the tray 1, the front mounting groove is provided with a first front mounting groove 14 and a second front mounting groove 10 according to different positions, the first front mounting groove 14 is located at the crossing position of the horizontal partition plate 12 and the vertical partition plate 13, the second front mounting groove 10 is located at the crossing position of the horizontal partition plate 12 and the vertical partition plate 13 and the tray, as shown in fig. 2, the first front-side mounting groove 14 includes a fixing hole 141 and four fixing grooves 142, the fixing hole 141 is located at the center of the intersection, the shape of the fixing hole 141 may be regular, such as circular, square, etc., or irregular, the fixing grooves 142 are provided with four groups, the four groups of fixing grooves 142 radially communicate the fixing hole 141 and the tray groove 11, and preferably, the fixing grooves 142 extend to the corner position of the tray groove 11; the second front surface mounting groove 10 has a similar structure to the first front surface mounting groove 14, except that the second front surface mounting groove 10 includes two sets of fixing grooves 142, the two sets of fixing grooves 142 radially communicate the fixing holes 141 and the tray groove 11, and preferably, the two sets of fixing grooves 142 extend to the corner position of the tray groove 11; above-mentioned front mounting groove's design, a first front mounting groove 14 links to each other with four adjacent group's tray groove 11, and a second front mounting groove 10 links to each other with two adjacent group's tray groove 11, and then realizes that a set of buckle subassembly 4 blocks four group's silicon chips 3 and two sets of silicon chips 3 respectively simultaneously, has not only strengthened the stability to silicon chip 3, has also reduced buckle subassembly 4's quantity simultaneously for the structure is lighter-weighted more.

As shown in fig. 5, the back mounting grooves are provided with a first back mounting groove 15 and a second back mounting groove according to different positions, the first back mounting groove 15 is located at the intersection position of the horizontal partition plate 12 and the vertical partition plate 13, the second back mounting groove is located at the intersection position of the horizontal partition plate 12 and the vertical partition plate 13 and the tray, the first back mounting groove 15 and the first front mounting groove 14 are located at the opposite positions of both sides of the tray 1, the second back mounting groove and the second front mounting groove 10 are located at the opposite positions of both sides of the tray 1, the first back mounting groove 15 comprises four groups of limiting grooves 152, the four groups of limiting grooves 152 are radially communicated with the tray grooves 11, and preferably, the limiting grooves 152 extend to the corner points of the tray grooves 11; under the general condition, the buckle assemblies 4 arranged on the front side and the back side of the tray 1 have the same structure, that is, the positions, the shapes and the like of the fixing groove 142 and the limiting groove 152 are matched, but not limited to, in different occasions, the positions can be set according to actual requirements, the design of the back side mounting grooves is adopted, a first back side mounting groove 15 is connected with four adjacent groups of tray grooves 11, a second back side mounting groove is connected with two adjacent groups of tray grooves 11, and then the four groups of silicon wafers 3 and the two groups of silicon wafers 3 are clamped by one group of buckle assemblies 4 respectively, so that the stability of the silicon wafers 3 is enhanced, the number of the buckle assemblies 4 is reduced, and the structure is lighter.

In this embodiment, fixed subassembly 2 adopts magnet, and fixed subassembly 2 installs in fixed orifices 141, and fixed subassembly 2 is connected through the magnetic action actuation with buckle subassembly 4, has made things convenient for buckle subassembly 4's loading and unloading, the design of the last unloading of more convenient automation.

The clamping component 4 comprises a clamping point 41 and a plurality of clamping pins 42, each clamping pin 42 comprises a fixed end 423 and a clamping end 422, the fixed end 423 is connected with the clamping point 41, and the clamping ends 422 form supporting claws for clamping the silicon wafer 3.

The shape of the sticking points 41 can be regular patterns such as square, round, etc., or irregular patterns, and the material of the sticking points 41 can be aluminum and aluminum alloy, ceramic, quartz, carbon, graphite, silicon carbide, stainless steel, Polyimide (PI), Polytetrafluoroethylene (PTFE), polyarylether compound, or a combination of a plurality of materials thereof.

In this embodiment, the fastening component 4 is assembled and disassembled with the tray 1 in a magnetic attraction manner, and the fastening point 41 is provided with magnetism or a material embedded with a magnetic object, so as to be magnetically connected with the fixing component 2; the fastening point 41 is fixedly provided with a boss (not shown), the boss is matched with the fixing hole 141, and the boss is embedded into the fixing hole 141 to facilitate the installation and positioning of the fastening component 4.

The clip pin 42 is radially installed on the clip point 41 centering on the clip point 41, a radial track of the clip pin 42 matches radial tracks of the fixing groove 142 and the limiting groove 152, and the clip pin 42 is respectively embedded in the fixing groove 142 and the limiting groove 152, and the fixing groove 142 and the limiting groove 152 limit the clip pin 42, thereby limiting a moving or shaking range of the clip pin 42.

The clip pin 42 further includes a limiting end 421, and the fixing end 423, the limiting end 421 and the clip end 422 are sequentially and fixedly connected, in this embodiment, the fixing end 423, the limiting end 421 and the clip end 422 are integrally formed; the fixing end 423 is connected with the clamping point 41, the length of the limiting end 421 is matched with the lengths of the fixing groove 142 and the limiting groove 152, the limiting end 421 is embedded into the fixing groove 142 and the limiting groove 152, the clamping end 422 extends into the tray groove 11, and the clamping end 422 abuts against the silicon wafer 3 to clamp the silicon wafer 3.

As shown in fig. 6, the card end 422 and the limiting end 421 are located at different horizontal planes, preferably at the lower side of the limiting end 421, a height difference exists between the card end 422 and the limiting end 421, and the height differences between the end surfaces of the fixing groove 142 and the limiting groove 152 and the end surface of the silicon wafer 3 located in the tray groove 11 are matched, so that the card end 422 abuts against the silicon wafer 3 after the fastening assembly 4 is installed.

Two sets of the clamping pins 42 are provided, one set of the clamping pins 42 includes two sets of limiting ends 421 and clamping ends 422, the limiting ends 421 and the clamping ends 422 are respectively and symmetrically located at two ends of the fixing end 423, as shown in fig. 7, the two sets of limiting ends 421 are obliquely arranged, preferably, the angle is set to 90 °, the two sets of the clamping pins 42 are symmetrically and fixedly arranged on the clamping points 41, and the two sets of the clamping ends 422 on one set of the clamping pins 42 respectively clamp two adjacent sets of silicon wafers.

Preferably, two sets of the clamping pins 42 may be provided, one set of the clamping pins 42 includes two sets of limiting ends 421 and clamping ends 422, the limiting ends 421 and the clamping ends 422 are respectively symmetrically located at two ends of the fixing end 423, as shown in fig. 8, the two sets of limiting ends 421 are arranged at 180 °, the two sets of the clamping pins 42 are fixed on the clamping points 41 in a crossing manner, and the two sets of the clamping ends 422 on the one set of the clamping pins 42 respectively clamp two sets of silicon wafers at opposite angles.

Preferably, the number of the clamping pins 42 can be four, as shown in fig. 9, one group of the clamping pins 42 includes a group of limiting ends 421 and clamping ends 422, the four groups of the clamping pins 42 are radially connected to the clamping points 41, and the group of the clamping ends 422 on the group of the clamping pins 42 clamps a group of silicon wafers.

In this embodiment, the latch assembly 4 may rotate with respect to the tray 1, the latch assembly 4 is manually or automatically triggered to rotate, the latch pin 42 is separated from the fixing groove 142 or/and the limiting groove 152, the latch end 422 is separated from the latching state with the silicon wafer 3, so as to achieve the wafer loading and unloading operation of the silicon wafer 3, or the latch pin 42 and the latch point 41 may rotate, the latch pin 42 is manually or automatically triggered to rotate, the latch pin 42 is separated from the fixing groove 142 or/and the limiting groove 152, and the latch end 422 is separated from the latching state with the silicon wafer 3, so as to achieve the wafer loading and unloading operation of the silicon wafer 3.

In the implementation process of this embodiment, before the silicon wafer 3 is subjected to film coating, the fixing element 2 is fixedly arranged in the fixing hole 141, the boss of the fastening point 41 is embedded in the fixing hole 141 on the front surface of the tray 1 and is connected with the fixing element 2 through magnetic attraction, the fastening point 41 is connected with the fixing element 2 through magnetic attraction on the back surface of the tray 1, that is, two groups of fastening elements 4 share one group of fixing element 2, in a normal state, four groups of limiting ends 421 are embedded in the fixing groove 142, four groups of fastening ends 422 extend to the tray groove 11 to support or abut against the silicon wafer 3, four groups of limiting ends 421 are embedded in the limiting groove 152, four groups of fastening ends 422 extend to the tray groove 11 to support or abut against the silicon wafer 3, when the silicon wafer 3 is assembled or disassembled, the fastening elements 4 are manually or automatically triggered to rotate, the fastening pins 42 are disengaged from the fixing groove 142 or/and the limiting groove 152, and the fastening ends 422 are disengaged from the silicon wafer 3, the loading and unloading operation of the silicon wafer 3 is realized, or the clamping needle 42 is triggered manually or automatically to rotate, the clamping needle 42 is separated from the fixing groove 142 or/and the limiting groove 152, the clamping end 422 is separated from the buckling state with the silicon wafer 3, and the loading and unloading operation of the silicon wafer 3 is realized.

In the embodiment, the silicon wafers 3 are limited on the front surface and the back surface of the tray 1 through the buckle components, so that the tray 1 can be horizontally placed and also vertically placed, the problem that the vertically placed silicon wafers fall down is solved, the floor area of the whole equipment can be reduced, and the utilization rate of the space in the longitudinal direction is increased; the clamping needles 42 form clamping jaws, four adjacent groups of silicon wafers 3 are clamped through the four clamping ends 422, a thick cover plate in the prior art is replaced, shielding on the edges of the silicon wafers is reduced, large clamping point printing cannot be caused, the number of clamping points is also reduced, and the structure is lighter.

Example two:

as shown in fig. 10, the difference between the first embodiment and the second embodiment is that, in the first embodiment, the fastening assemblies 4 on the front and back sides of the tray 1 are magnetically connected by one set of the fixing assemblies 2, i.e. two sets of the fastening assemblies 4 share one set of the fixing assemblies 2, while in the second embodiment, the fastening assemblies 4 on the front side of the tray 1 are magnetically connected by the fixing assemblies 2, and the fastening assemblies 4 on the back side of the tray 1 are connected by fasteners (not shown).

Specifically, a plurality of mounting holes 151 are fixedly arranged on the back of the tray 1, the mounting holes 151 are located beside the limiting grooves 152 and distributed along the limiting grooves 152, the limiting ends 421 of the buckle assemblies 4 are embedded into the limiting grooves 152, the fixing members are mounted in the mounting holes 151 and lock the limiting ends 421, so that the limiting ends 421 are limited in the horizontal direction and the vertical direction, and the limiting ends 421 are locked in the limiting grooves 152.

The mounting of the snap-in assembly 4 on the front and back of the tray 1 can also be reversed.

Example three:

as shown in fig. 11 to 12, the present embodiment is different from the above embodiments in that the fixing grooves 142 and the limiting grooves 152 limit the latch pins 42, but in the present embodiment, the tray 1 has no groove on the front surface and the back surface, and the latch pins 42 are positioned by installing the latch points 41.

In this embodiment, the chamfer 111 is added around the tray slot 11, the limiting end 421 extends along the chamfer 111 at the corner position of the tray slot 11, and the clamping end 422 extends to the tray slot 11 and limits the silicon wafer 3.

In other embodiments, the horizontal partition plates 12 and/or the vertical partition plates 13 and the pallet 1 are not integrally formed, the horizontal partition plates 12 and/or the vertical partition plates 13 are arranged on the pallet 1, and the pallet slots 11 are formed through the horizontal partition plates 12 and/or the vertical partition plates 13.

In other embodiments, the snap assembly 4 is coupled to the tray 1 using a lever or magnetic coupling.

In other embodiments, the tray 1 is not chamfered, the fastening assembly 4 is magnetically connected to the tray 1, and the fastening assembly 4 is connected to the tray 1 through a fixing member, and may be combined arbitrarily.

It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

Claims (10)

1. A silicon chip coating tray is characterized in that: the film coating device comprises a plurality of tray grooves and mounting grooves, wherein the tray grooves are arranged in a hollow mode and used for double-sided film coating of a silicon wafer, the mounting grooves are used for mounting and positioning of a buckle assembly and a fixing assembly, the mounting grooves comprise front mounting grooves and back mounting grooves, the front mounting grooves are located in the front of a tray, and the back mounting grooves are located in the back of the tray.

2. The silicon wafer coating tray of claim 1, wherein: the tray grooves are arranged horizontally and vertically at even intervals, the tray grooves which are horizontally adjacent are isolated through vertical partition plates, and the tray grooves which are vertically adjacent are isolated through horizontal partition plates.

3. The silicon wafer coating tray of claim 1, wherein: the front mounting groove is provided with a first front mounting groove and a second front mounting groove according to different positions, the first front mounting groove is positioned at the cross position of the transverse partition plate and the vertical partition plate, and the second front mounting groove is positioned at the cross position of the transverse partition plate, the vertical partition plate and the tray.

4. The silicon wafer coating tray according to claim 3, wherein: the first front mounting groove comprises a fixing hole and four groups of fixing grooves, the fixing hole is positioned in the center of the cross position, the four groups of fixing grooves are radially communicated with the fixing hole and the tray groove, and the fixing grooves extend to the angular point position of the tray groove; the second front mounting groove is similar to the first front mounting groove in structure and comprises a fixing hole and two groups of fixing grooves, the fixing holes and the tray grooves are communicated in a radial mode, and the two groups of fixing grooves extend to the angular point position of the tray grooves; a set of first front mounting groove communicates with four adjacent sets of tray grooves, and a set of second front mounting groove communicates with two adjacent sets of tray grooves.

5. The silicon wafer coating tray of claim 1, wherein: the back mounting groove sets up first back mounting groove and second back mounting groove according to the position difference, and first back mounting groove is located horizontal space bar and perpendicular space bar cross position, and second back mounting groove is located the cross position of horizontal space bar and perpendicular space bar and tray, and first back mounting groove and first front mounting groove are located the relative position of tray both sides, and second back mounting groove and second front mounting groove are located the relative position of tray both sides.

6. The silicon wafer coating tray of claim 5, wherein: first back mounting groove includes the restriction groove, and the restriction groove is provided with four groups, and four groups restriction grooves are radial intercommunication tray groove, and the restriction groove extends to the angular point position in tray groove, and a set of first back mounting groove communicates with four adjacent groups tray groove, and a set of second back mounting groove communicates with two adjacent groups tray groove.

7. The silicon wafer coating tray according to claim 1, wherein: the tray back sets firmly a plurality of mounting holes, and the mounting hole is located the next door of restriction groove, and distributes along the restriction groove, and the mounting is installed in the mounting hole to lock the buckle subassembly.

8. The silicon wafer coating tray according to claim 1, wherein: chamfers are arranged on the periphery of the tray groove.

9. The silicon wafer coating tray according to claim 1, wherein: the sizes of the plurality of tray grooves of one group of trays are the same and are used for coating the silicon wafers with the same size, or the sizes of the plurality of tray grooves of one group of trays are different and are used for coating the silicon wafers with various sizes.

10. The silicon wafer coating tray of claim 1, wherein: the size of the tray groove is larger than that of the silicon wafer by 1.5mm, the gaps between the four edges of the silicon wafer and the four edges of the tray groove are 0.75mm, and the transverse partition plate, the vertical partition plate and the tray are integrally formed.

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