CN106900140B - The uniform method of copper particle spacing dimension and substrate on copper ceramic substrate are covered in a kind of holding - Google Patents
The uniform method of copper particle spacing dimension and substrate on copper ceramic substrate are covered in a kind of holding Download PDFInfo
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- CN106900140B CN106900140B CN201510970507.4A CN201510970507A CN106900140B CN 106900140 B CN106900140 B CN 106900140B CN 201510970507 A CN201510970507 A CN 201510970507A CN 106900140 B CN106900140 B CN 106900140B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
The present invention relates to a kind of holdings to cover the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate, comprising: determines copper foil side etching extent according to copper thickness, integrally places to all copper particle outer dimensions by side etching extent, placing the vertical and horizontal spacing of rear copper particle is a；Copper particle on the angle of edge four is designed to asymmetric quadrangle；Remaining copper particle on edge is designed to symmetric trapezium；The interior spacing of trapezoidal cross is a, and horizontal olo is b；Trapezoidal perpendicular interior spacing is a, perpendicular olo c.B=0.30a~0.80a, c=0.40a~0.90a.The present invention is when designing the film drawing of copper particle shape, change copper particle outer dimension by the whole conventional design method that uniformly places of side etching extent, the rectangle form Design of copper particle is enclosed at trapezoidal in edge one, makes spacing in courage jacking mouth, it is fast to compensate edge flow velocity, etches fast pool effect.Edge spacing is solved in horn mouth form undesirable condition and product edge spacing and middle ware away from size problem of non-uniform.
Description
Technical field
The invention belongs to semiconductor cooling device manufacturing field, in particular to a kind of holding is covered on copper ceramic substrate between copper particle
The uniform method of carpenters square cun.
Background technique
Covering copper ceramic substrate (DBC substrate) is that copper foil direct sintering is existed using DBC (Direct BondCopper) technology
Ceramic surface and a kind of manufactured basic electronic material.Copper ceramic substrate is covered with fabulous thermal cycle, dimensionally stable, rigidity
Good, thermal conductivity height, high reliablity cover the characteristics of copper face can etch various figures, and it is a kind of pollution-free, nuisanceless
Green product, it is quite extensive using temperature, can be from -55 DEG C~850 DEG C, thermal expansion coefficient is close to silicon, application field
It is very extensive: to can be used for semiconductor cooler, electronic heater, high-power electric semiconductor module, power control circuit, power
Hybrid circuit, intelligent power component, high frequency switch power, solid-state relay, automotive electronics, space flight and aviation and military electronic group
Part, solar cell panel assembly, telecommunication private branch exchange system receive system, the multinomial industrial electronic field such as laser.
Copper ceramic substrate (DBC) product is covered for semiconductor cooling device, surface copper particle is generally rectangular in shape
Or it is rectangular, see Fig. 1.When the copper foil of x product is thicker (generally 0.40mm~0.70mm), since etching period is too long, etching
After will appear spacing non-uniform phenomenon between product copper particle: edge spacing than middle ware away from big and in horn mouth form,
Copper particle shape is also no longer in rectangle form, and product size does not meet drawing and scraps, and sees Fig. 1.Its producing cause are as follows: in design copper
When the film drawing of particle shape shape, traditional design methods are the thickness according to copper foil, after determining copper foil side etching extent, then to all
Copper particle outer dimension is integrally placed by side etching extent, does not account for pool effect when etching.And in etching due to water
Pond effect, etching solution gradually accelerate state in the presentation of product edge to be etched flow velocity, and new and old etching solution exchange is also accelerated；
And in the product between flow velocity it is slow, the exchange of new and old etching solution is slow, cause copper particle etching in product edge fast (accelerating in gradient), in
Between copper particle etching it is slow, spacing is inconsistent and is in horn mouth form.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of holdings to cover copper particle spacing on copper ceramic substrate
Method of uniform size.Method of the invention, make product after the etching edge spacing and middle ware away from essentially identical, and
Without horn mouth form, copper particle shape is still rectangle or rectangular, improves product yield.
The purpose of the present invention is achieved through the following technical solutions:
The purpose of the present invention is to provide a kind of holdings to cover the uniform method of copper particle spacing dimension on copper ceramic substrate, special
Sign is, comprising:
Step 1: determining copper foil side etching extent δ according to copper thickness；
Step 2: integrally placing copper particle matrix by side etching extent to copper particle outer dimension:
Copper particle matrix includes mutually perpendicular X-direction and Y-direction, and the copper particle of copper particle matrix is divided into arrangement according to arrangement position
Middle part copper particle among copper particle matrix, the edge copper particle for being arranged in four side of middle part copper particle outer rim and it is arranged in copper particle matrix quadrangle
Corner copper particle；
Middle part copper particle is rectangle, and the long side of middle part copper particle is parallel with X-direction, and broadside is parallel with Y-direction, middle part after placing
X between copper particle to spacing and Y-direction spacing be a, if a be the base being spaced；
The edge copper particle is isosceles trapezoid, and edge copper particle includes upper bottom edge and bottom, and the upper bottom edge is in
Portion's copper particle；Edge copper particle along Y-direction distribution is long side copper particle, and the upper bottom edge spacing of adjacent long side copper particle is a, adjacent long side
The bottom spacing of copper particle is b, b=0.30a~0.80a；Along X to the edge copper particle of distribution be broadside copper particle, adjacent broadside
The upper bottom edge spacing of copper particle is a, and the bottom spacing of adjacent broadside copper particle is c, c=0.40a~0.90a；
The corner copper particle is the quadrangle with a right angle, and right angle joint is right angle electrical, opposite with right angle
Obtuse angle joint is interior angle point；In long side copper particle upper bottom edge to adjacent corner copper particle between angle point between be divided into a, long side copper particle
Bottom to the interval between adjacent corner copper particle right angle electrical is also b, b=0.30a~0.80a；Broadside copper particle upper bottom edge is extremely
In adjacent corner copper particle between angle point between be divided into one section of right angle side length of the corner a+ copper particle；Broadside copper particle bottom to corner
Interval between copper particle right angle electrical is also another section of right angle side length of the corner c+ copper particle, c=0.40a~0.90a.
Preferably, the X between the long side copper particle and middle part copper particle is a to spacing, and the upper bottom edge of long side copper particle is in
The width of portion's copper particle is identical, and the height of long side copper particle is identical as the length of middle part copper particle；Y between the broadside copper particle and middle part copper particle
It is a to spacing, the upper bottom edge of broadside copper particle is identical as the length of middle part copper particle, and the height of broadside copper particle is identical as the width of middle part copper particle.
Preferably, a value method of determination is that the pitch requirements between pre-set product copper particle are D, a=D-2 δ.
The uniform method of copper particle spacing dimension on copper ceramic substrate is covered in a kind of holding, comprising:
Step 1: determining copper foil side etching extent δ according to copper thickness；
Step 2: integrally placing copper particle matrix by side etching extent to copper particle outer dimension, copper particle matrix includes orthogonal
X-direction and Y-direction, the copper particle unit of copper particle matrix is divided into the middle part copper being arranged among copper particle matrix according to arrangement position
Grain, the edge copper particle for being arranged in four side of middle part copper particle outer rim and the corner copper particle for being arranged in copper particle matrix quadrangle；
Middle part copper particle is square, place X between rear middle part copper particle to spacing and Y-direction spacing be a, if a is interval
Base；
The edge copper particle is isosceles trapezoid, and edge copper particle includes upper bottom edge and bottom, and the upper bottom edge is in
Portion's copper particle；The upper bottom edge spacing of adjacent edge copper particle is a, and the bottom spacing of adjacent edge copper particle is b, b=0.30a~
0.90a；
The corner copper particle is the quadrangle with a right angle, and right angle joint is right angle electrical, opposite with right angle
Obtuse angle joint is interior angle point；In edge copper particle upper bottom edge to adjacent corner copper particle between angle point between be divided into a；Edge copper particle
Bottom to the interval between adjacent corner copper particle right angle electrical be also b, b=0.30a~0.90a.
Preferably, the X between the edge copper particle and middle part copper particle to spacing and Y-direction spacing be a, edge copper particle
Upper bottom edge it is identical as the length of middle part copper particle.
Preferably, a value method of determination is that the pitch requirements between pre-set product copper particle are D, a=D-2 δ.
Substrate made from the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in a kind of holding, and copper particle is arranged on substrate
Matrix, including mutually perpendicular X-direction and Y-direction, copper particle unit is same shape, and X is identical as Y-direction spacing to spacing.
The uniform method of copper particle spacing dimension on copper ceramic substrate is covered in a kind of holding, determines the corruption of copper foil side according to copper thickness
Erosion amount；Copper particle matrix integrally placed by side etching extent to copper particle outer dimension, copper particle matrix have X to and Y-direction, X is to mutual with Y-direction
Vertically, the middle part of copper particle matrix is middle part copper particle, and the peripheral four edges of middle part copper particle are edge copper particle, four angles of copper particle matrix
For corner copper particle.The coordinate of homography, i.e. copper particle (X1,Y1), copper particle (Xn, Y1), copper particle (X1, Yn) and copper particle (Xn,Yn) it is angle
The shape of portion's copper particle, corner copper particle is identical, is the quadrangle with a right angle, the right angle of right angle counterpart substrate in arrangement
Place.Copper particle (X2, Y1), copper particle (X3, Y1) ... copper particle (Xn-1, Y1) it is edge copper particle, copper particle (X2,Yn), copper particle (X3, Yn)……
Copper particle (Xn-1,Yn) it is edge copper particle, copper particle (X1, Y2), copper particle (X1, Y3) ... copper particle (X1, Yn-1) it is edge copper particle, copper particle
(Xn, Y2), copper particle (Xn, Y3) ... copper particle (Xn, Yn-1) it is edge copper particle.Remaining copper particle is middle part copper particle, and middle part copper particle is length
Rectangular, to parallel, long side is parallel with Y-direction by the broadside of middle part copper particle and X.Edge copper particle is isosceles trapezoid, the upper bottom of edge copper particle
While closing on middle part copper particle, but edge copper particle shape is not identical, along X to the edge copper particle of distribution be broadside copper particle, broadside copper particle
High identical as the length of middle part copper particle, the upper bottom edge of broadside copper particle is identical as the width of middle part copper particle.Along Y-direction distribution edge copper particle be
The height of long side copper particle, long side copper particle is identical as the width of middle part copper particle, and the upper bottom edge of long side copper particle is identical as the length of middle part copper particle 1.
All copper particles are rectangle or close to rectangle, and four angles of copper particle are A, B, C, D, are said for one jiao of substrate
The arrangement relation of bright copper particle matrix.The X of middle part copper particle is identical as Y-direction spacing to spacing, is a, and a is interval base.Angle
Portion copper particle (X1,Y1) 4 points are as follows:AB(X1,Y1)And CD(X1,Y1)While being right-angle side, with corner copper
Grain (X1,Y1) adjacent broadside copper particle (X2,Y1) 4 points beAB(X2,Y1)With middle part copper particle 1
It is of same size, B(X1,Y1)With A(X2,Y1)Between spacing be a, D(X1,Y1)With C(X2,Y1)Between spacing be c.Middle part copper particle (X2,
Y2) 4 points beA(X2,Y1)With C(X2,Y2)Between spacing be a.Edge copper particle (X3, Y1) four
It puts and isB(X2,Y1)With A(X3,Y1)Between spacing be a, D(X2,Y1)With C(X3,Y1)Between spacing be
c.Long side copper particle (X1,Y2) 4 points beWith corner copper particle (X1,Y1) adjacent.B(X1,Y1)With
D(X1,Y2)Between spacing be a, A(X1,Y1)With C(X1,Y2)Between spacing be b.With middle part copper particle (X2,Y2) between A(X2,Y1)With
B(X1,Y2)Between spacing be a.Edge copper particle (X1, Y3) 4 points beB(X1,Y2)With D(X1,Y3)It
Between spacing be a, A(X1,Y2)With C(X1,Y3)Between spacing be b.B=0.5a, c=0.6a.Positioned at XnLong side copper particle be located at
X1Long side copper particle be arranged symmetrically, be located at YnBroadside copper particle and Y1Broadside copper particle be arranged symmetrically.Corner copper particle (X1,Y1) and angle
Portion copper particle (Xn, Y1) Y-axis is arranged symmetrically, corner copper particle (X1,Y1) and corner copper particle (X1,Yn) X-axis is arranged symmetrically.Corner copper particle
(X1,Y1) and corner copper particle (Xn,Yn) be centrosymmetrically arranged.
Compared with prior art, the positive effect of the present invention is as follows:
The conventional design method that the present invention is integrally uniformly placed by changing copper particle outer dimension by side etching extent, is being designed
When the film drawing of copper particle shape, the rectangle form Design that copper particle is enclosed in edge one makes spacing in courage jacking mouth at trapezoidal,
It is fast to compensate edge flow velocity, etches fast pool effect, to solve edge spacing in horn mouth form
Undesirable condition and product edge spacing and middle ware improve product yield away from size problem of non-uniform.
Detailed description of the invention
Fig. 1 is that the substrate copper particle of the prior art is arranged.
Fig. 2 is the schematic diagram of copper particle matrix arrangements of the present invention；
Fig. 3 is the schematic diagram of finished product of the present invention；
Wherein, copper particle in the middle part of 1-；2- edge copper particle；21- long side copper particle；
22- broadside copper particle；The corner 3- copper particle；
Specific embodiment:
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, those skilled in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiment 1
The uniform method of copper particle spacing dimension on copper ceramic substrate, the first step, according to copper are covered in a kind of holding as shown in Figure 2
Foil thickness and etching machine performance determine copper foil side etching extent δ；Second, the pitch requirements between product copper particle are D, by side corrosion
Amount δ carries out entirety and places, spacing a, the a=D-2 δ after placing；By this size design copper particle film drawing and make film bottom
Piece；By pattern transfer process by pattern transfer to product surface, required copper particle shape is obtained after overetch.
Copper particle matrix have X to and Y-direction, X be mutually perpendicular to Y-direction, the middle part of copper particle matrix is middle part copper particle 1, middle part copper
The peripheral four edges of grain 1 are edge copper particle 2, and four angles of copper particle matrix are corner copper particle 3.The coordinate of homography, i.e. copper particle
(X1,Y1), copper particle (Xn, Y1), copper particle (X1, Yn) and copper particle (Xn,Yn) it is corner copper particle 3, the shape of corner copper particle 3 is identical, is
Quadrangle with a right angle, the right angle of right angle counterpart substrate in arrangement.Copper particle (X2, Y1), copper particle (X3, Y1)……
Copper particle (Xn-1, Y1) it is edge copper particle 2, copper particle (X2,Yn), copper particle (X3, Yn) ... copper particle (Xn-1,Yn) it is edge copper particle 2, copper particle
(X1, Y2), copper particle (X1, Y3) ... copper particle (X1, Yn-1) it is edge copper particle 2, copper particle (Xn, Y2), copper particle (Xn, Y3) ... copper particle
(Xn, Yn-1) it is edge copper particle 2.Remaining copper particle be middle part copper particle 1, middle part copper particle 1 be rectangle, the broadside of middle part copper particle 1 with
For X to parallel, long side is parallel with Y-direction.Edge copper particle 2 is isosceles trapezoid, and middle part copper particle 1, but side are closed in the upper bottom edge of edge copper particle 2
Copper particle 2 shape in portion's is not identical, to the edge copper particle of distribution is broadside copper particle 22 along X, the height of broadside copper particle 22 is with middle part copper particle 1
Width is identical, and the upper bottom edge of broadside copper particle 22 is identical as the length of middle part copper particle 1.Edge copper particle along Y-direction distribution is long side copper particle 21,
The height of long side copper particle 21 is identical as the length of middle part copper particle 1, and the upper bottom edge of long side copper particle 21 is identical as the width of middle part copper particle 1.
All copper particles are rectangle or close to rectangle, and four angles of copper particle are A, B, C, D, are said for one jiao of substrate
The arrangement relation of bright copper particle matrix.The X of middle part copper particle 1 is identical as Y-direction spacing to spacing, is a.Corner copper particle (X1,Y1) four
Point are as follows:AB(X1,Y1)And CD(X1,Y1)While being right-angle side, with corner copper particle (X1,Y1) adjacent width
Side copper particle (X2,Y1) 4 points beAB(X2,Y1)With of same size, the B of middle part copper particle 1(X1,Y1)With
A(X2,Y1)Between spacing be a, D(X1,Y1)With C(X2,Y1)Between spacing be c.Middle part copper particle (X2,Y2) 4 points beA(X2,Y1)With C(X2,Y2)Between spacing be a.Edge copper particle (X3, Y1) 4 points beB(X2,Y1)With A(X3,Y1)Between spacing be a, D(X2,Y1)With C(X3,Y1)Between spacing be c.It is long
Side copper particle (X1,Y2) 4 points beWith corner copper particle (X1,Y1) adjacent.B(X1,Y1)With D(X1,Y2)It
Between spacing be a, A(X1,Y1)With C(X1,Y2)Between spacing be b.With middle part copper particle (X2,Y2) between A(X2,Y1)With B(X1,Y2)Between
Spacing be a.Edge copper particle (X1, Y3) 4 points beB(X1,Y2)With D(X1,Y3)Between spacing be
A, A(X1,Y2)With C(X1,Y3)Between spacing be b.B=0.5a, c=0.6a.Positioned at XnLong side copper particle be located at X1Long side copper
Grain is arranged symmetrically, and is located at YnBroadside copper particle and Y1Broadside copper particle be arranged symmetrically.Corner copper particle (X1,Y1) and corner copper particle (Xn,
Y1) Y-axis is arranged symmetrically, corner copper particle (X1,Y1) and corner copper particle (X1,Yn) X-axis is arranged symmetrically.Corner copper particle (X1,Y1) and angle
Portion copper particle (Xn,Yn) be centrosymmetrically arranged.Copper thickness is 0.40mm, determines side etching extent δ=0.20mm；Space D is 0.65mm
When, calculate a=D-2 × δ=0.25mm, b=0.18mm, c=0.21mm.
Embodiment 2
The uniform method of copper particle spacing dimension on copper ceramic substrate, the first step, according to copper thickness and corruption are covered in a kind of holding
Erosion machine performance determines copper foil side etching extent δ；Second, the pitch requirements between product copper particle are D, whole by side etching extent δ progress
Body places, spacing a, the a=D-2 δ after placing；By this size design copper particle film drawing and make film egative film；Pass through figure
Pattern transfer to product surface is obtained required copper particle shape by shape transfering process after overetch.
Copper particle matrix have X to and Y-direction, X be mutually perpendicular to Y-direction, the middle part of copper particle matrix is middle part copper particle 1, middle part copper
The peripheral four edges of grain 1 are edge copper particle 2, and four angles of copper particle matrix are corner copper particle 3.The coordinate of homography, i.e. copper particle
(X1,Y1), copper particle (Xn, Y1), copper particle (X1, Yn) and copper particle (Xn,Yn) it is corner copper particle 3, the shape of corner copper particle 3 is identical, is
Quadrangle with a right angle, the right angle of right angle counterpart substrate in arrangement.Copper particle (X2, Y1), copper particle (X3, Y1)……
Copper particle (Xn-1, Y1) it is edge copper particle 2, copper particle (X2,Yn), copper particle (X3, Yn) ... copper particle (Xn-1,Yn) it is edge copper particle 2, copper particle
(X1, Y2), copper particle (X1, Y3) ... copper particle (X1, Yn-1) it is edge copper particle 2, copper particle (Xn, Y2), copper particle (Xn, Y3) ... copper particle
(Xn, Yn-1) it is edge copper particle 2.Remaining copper particle is middle part copper particle 1, and middle part copper particle 1 is square, one side of middle part copper particle 1 with
For X to parallel, another side is parallel with Y-direction.Edge copper particle 2 is isosceles trapezoid, and middle part copper particle 1, side are closed in the upper bottom edge of edge copper particle 2
Copper particle 2 shape in portion's is identical.
All copper particles are square or close to square, four angles of copper particle are A, B, C, D, are said for one jiao of substrate
The arrangement relation of bright copper particle matrix.The X of middle part copper particle 1 is identical as Y-direction spacing to spacing, is a.Corner copper particle (X1,Y1) four
It puts and isAB(X1,Y1)And CD(X1,Y1)While being right-angle side, with corner copper particle (X1,Y1) adjacent edge
Copper particle (X2,Y1) 4 points beB(X1,Y1)With A(X2,Y1)Between spacing be a, D(X1,Y1)With
C(X2,Y1)Between spacing be c.Middle part copper particle (X2,Y2) 4 points beA(X2,Y1)With C(X2,Y2)
Between spacing be a.Edge copper particle (X3, Y1) 4 points beB(X2,Y1)With A(X3,Y1)Between
Spacing is a, D(X2,Y1)With C(X3,Y1)Between spacing be c.Edge copper particle (X1,Y2) 4 points be
With corner copper particle (X1,Y1) adjacent.B(X1,Y1)With D(X1,Y2)Between spacing be a, A(X1,Y1)With C(X1,Y2)Between spacing be b.
With middle part copper particle (X2,Y2) between A(X2,Y1)With B(X1,Y2)Between spacing be a.Edge copper particle (X1, Y3) 4 points beB(X1,Y2)With D(X1,Y3)Between spacing be a, A(X1,Y2)With C(X1,Y3)Between spacing be b.B=
C=0.7a.Positioned at XnEdge copper particle be located at X1Edge copper particle be arranged symmetrically, be located at YnEdge copper particle and Y1Edge
Copper particle is arranged symmetrically.Corner copper particle (X1,Y1) and corner copper particle (Xn, Y1) Y-axis is arranged symmetrically, corner copper particle (X1,Y1) and corner
Copper particle (X1,Yn) X-axis is arranged symmetrically.Corner copper particle (X1,Y1) and corner copper particle (Xn,Yn) be centrosymmetrically arranged.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, various changes and improvements may be made to the invention without departing from the spirit and scope of the present invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent defines.
Claims (5)
1. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in a kind of holding characterized by comprising
Step 1: determining copper foil side etching extent δ according to copper thickness；
Step 2: integrally placing copper particle matrix by side etching extent to copper particle outer dimension:
Copper particle matrix includes mutually perpendicular X-direction and Y-direction, and the copper particle of copper particle matrix is divided into according to arrangement position is arranged in copper
Middle part copper particle among grain matrix is arranged in the edge copper particle on four side of middle part copper particle outer rim and is arranged in the angle of copper particle matrix quadrangle
Portion's copper particle；
Middle part copper particle is rectangle, and the long side of middle part copper particle is parallel with X-direction, and broadside is parallel with Y-direction, middle part copper particle after placing
Between X to spacing and Y-direction spacing be a, if a be the base being spaced；
The edge copper particle is isosceles trapezoid, and edge copper particle includes upper bottom edge and bottom, and the upper bottom edge is adjacent to middle part copper
Grain；Edge copper particle along Y-direction distribution is long side copper particle, and the upper bottom edge spacing of adjacent long side copper particle is a, adjacent long side copper particle
Bottom spacing be b, b=0.30a~0.80a；Along X to the edge copper particle of distribution be broadside copper particle, adjacent broadside copper particle
Upper bottom edge spacing be a, the bottom spacing of adjacent broadside copper particle is c, c=0.40a~0.90a；
The corner copper particle is the quadrangle with a right angle, and right angle joint is right angle electrical, the obtuse angle opposite with right angle
Joint is interior angle point；In long side copper particle upper bottom edge to adjacent corner copper particle between angle point between be divided into a, long side copper particle bottom
While be also one section of right angle side length of the corner b+ copper particle to the interval between adjacent corner copper particle right angle electrical, b=0.30a~
0.80a；In broadside copper particle upper bottom edge to adjacent corner copper particle between angle point between be divided into a；Broadside copper particle bottom to corner
Interval between copper particle right angle electrical is also another section of right angle side length of the corner c+ copper particle, c=0.40a~0.90a；
X between the long side copper particle and middle part copper particle to spacing be a, the upper bottom edge of long side copper particle and the wide phase of middle part copper particle
Together, the height of long side copper particle is identical as the length of middle part copper particle；Y-direction spacing between the broadside copper particle and middle part copper particle is a, wide
The upper bottom edge of side copper particle is identical as the length of middle part copper particle, and the height of broadside copper particle is identical as the width of middle part copper particle.
2. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in holding according to claim 1, which is characterized in that
The a value method of determination is that the pitch requirements between pre-set product copper particle are D, a=D-2 δ.
3. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in a kind of holding characterized by comprising
Step 1: determining copper foil side etching extent δ according to copper thickness；
Step 2: integrally placing copper particle matrix by side etching extent to copper particle outer dimension, copper particle matrix includes the mutually perpendicular side X
To and Y-direction, the copper particle unit of copper particle matrix be divided into according to arrangement position the middle part copper particle being arranged among copper particle matrix, arrangement
In four side of middle part copper particle outer rim edge copper particle and be arranged in the corner copper particle of copper particle matrix quadrangle；
Middle part copper particle is square, place X between rear middle part copper particle to spacing and Y-direction spacing be a, if a be the base being spaced
Quasi- unit；
The edge copper particle is isosceles trapezoid, and edge copper particle includes upper bottom edge and bottom, and the upper bottom edge is adjacent to middle part copper
Grain；The upper bottom edge spacing of adjacent edge copper particle is a, and the bottom spacing of adjacent edge copper particle is b, b=0.30a~
0.90a；
The corner copper particle is the quadrangle with a right angle, and right angle joint is right angle electrical, the obtuse angle opposite with right angle
Joint is interior angle point；In edge copper particle upper bottom edge to adjacent corner copper particle between angle point between be divided into a；Under edge copper particle
Bottom edge to the interval between adjacent corner copper particle right angle electrical is also one section of right angle side length of the corner b+ copper particle, b=0.30a~
0.90a；
X between the edge copper particle and middle part copper particle to spacing and Y-direction spacing be a, the upper bottom edge of edge copper particle with
The length of middle part copper particle is identical.
4. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in holding according to claim 3, which is characterized in that
The a value method of determination is that the pitch requirements between pre-set product copper particle are D, a=D-2 δ.
5. a kind of cover the uniform method system of copper particle spacing dimension on copper ceramic substrate with any holding of Claims 1-4
The substrate obtained, which is characterized in that setting copper particle matrix on substrate, including mutually perpendicular X-direction and Y-direction, copper particle unit are equal
For same shape, and X is identical as Y-direction spacing to spacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510970507.4A CN106900140B (en) | 2015-12-21 | 2015-12-21 | The uniform method of copper particle spacing dimension and substrate on copper ceramic substrate are covered in a kind of holding |
Applications Claiming Priority (1)
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| CN110868807A (en) * | 2019-11-04 | 2020-03-06 | 上海申和热磁电子有限公司 | Method for keeping right angle of copper foil on DBC substrate |
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| US4904339A (en) * | 1989-05-26 | 1990-02-27 | Psi Star | Vertical spray etch reactor and method |
| JP2001168528A (en) * | 1999-12-07 | 2001-06-22 | Toshiba Corp | Printed wiring board and manufacturing method therefor |
| KR20090067249A (en) * | 2007-12-21 | 2009-06-25 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
| CN101962774A (en) * | 2009-07-24 | 2011-02-02 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| CN204707338U (en) * | 2015-04-03 | 2015-10-14 | 淳华科技(昆山)有限公司 | Soft printed circuit board automatic aligning target |
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| US4904339A (en) * | 1989-05-26 | 1990-02-27 | Psi Star | Vertical spray etch reactor and method |
| JP2001168528A (en) * | 1999-12-07 | 2001-06-22 | Toshiba Corp | Printed wiring board and manufacturing method therefor |
| KR20090067249A (en) * | 2007-12-21 | 2009-06-25 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
| CN101962774A (en) * | 2009-07-24 | 2011-02-02 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| CN204707338U (en) * | 2015-04-03 | 2015-10-14 | 淳华科技(昆山)有限公司 | Soft printed circuit board automatic aligning target |
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