CN218975409U - Quartz boat and diffusion furnace - Google Patents
Quartz boat and diffusion furnace Download PDFInfo
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- CN218975409U CN218975409U CN202223204241.7U CN202223204241U CN218975409U CN 218975409 U CN218975409 U CN 218975409U CN 202223204241 U CN202223204241 U CN 202223204241U CN 218975409 U CN218975409 U CN 218975409U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The application relates to the technical field of photovoltaics, in particular to a quartz boat and a diffusion furnace. A quartz boat, comprising: a boat support and a plurality of silicon wafer bearing units; the silicon wafer bearing units are detachably mounted on the boat support in sequence along the length direction of the boat support. Each silicon wafer bearing unit comprises two baffle frames and at least two connecting rods, the two baffle frames are arranged at intervals along the width direction of the boat support, and the opposite ends of each connecting rod are respectively connected with the two baffle frames; along the width direction of the boat support, a plurality of clamping grooves which are in one-to-one correspondence and are used for clamping the silicon wafers are arranged on at least two connecting rods at intervals. The quartz boat is favorable for avoiding the phenomenon that the front surface and the back surface of the silicon wafer are subjected to extrusion force of diffusion gas to cause lattice defects and even fragments of the silicon wafer at the contact position of the silicon wafer and the clamping groove, and is also favorable for avoiding the phenomenon that the surface of the silicon wafer is bent and even fragments are caused by the gravity action of the middle area of the front surface and the back surface of the silicon wafer under the high-temperature environment of the diffusion furnace.
Description
Technical Field
The application relates to the technical field of photovoltaics, in particular to a quartz boat and a diffusion furnace.
Background
Diffusion is a very important process in the preparation of solar cells, and the PN junction of the core part of the solar cell for power generation is formed in the diffusion process. In the diffusion process, a quartz boat loaded with silicon wafers is required to be loaded in an inner cavity of a diffusion furnace, and a PN junction is formed by the action of diffusion gas in the diffusion furnace and the surface of the silicon wafers.
At present, the clamping grooves for clamping the silicon wafers on the existing quartz boat are arranged at intervals along the length direction of the quartz boat, when the quartz boat is loaded in the inner cavity of the diffusion furnace, the length direction of the furnace cavity is consistent with the length direction of the quartz boat, so that the front or back of the silicon wafers in the diffusion furnace is perpendicular to the diffusion direction of diffusion gas, the diffusion gas can generate certain extrusion force on the silicon wafers, certain extrusion force is arranged between the silicon wafers and the clamping grooves of the quartz boat, the defect of crystal lattice is caused on the surface of the silicon wafers by the extrusion force of the clamping grooves on the silicon wafers under the high-temperature environment of the diffusion furnace, the minority carrier lifetime of the silicon wafers at the position contacted with the quartz boat is reduced, and even the silicon wafers directly generate broken edge unfilled corner and other fragments.
Disclosure of Invention
The utility model aims to provide a quartz boat and a diffusion furnace, which aim to solve the technical problem that the quartz boat loaded in the existing diffusion furnace is easy to cause internal defects or fragments of silicon wafers.
In a first aspect, the present application provides a quartz boat comprising: a boat support and a plurality of silicon wafer bearing units; the silicon wafer bearing units are detachably mounted on the boat support in sequence along the length direction of the boat support.
Each silicon wafer bearing unit comprises two baffle frames and at least two connecting rods, the two baffle frames are arranged at intervals along the width direction of the boat support, and the opposite ends of each connecting rod are respectively connected with the two baffle frames; along the width direction of the boat support, a plurality of clamping grooves which are in one-to-one correspondence and are used for clamping the silicon wafers are arranged on at least two connecting rods at intervals.
According to the silicon wafer carrier, the boat supports and the plurality of silicon wafer carrying units which are detachably mounted on the boat supports in sequence along the length direction of the boat supports are arranged, the plurality of clamping grooves used for clamping the silicon wafers on each silicon wafer carrying unit are arranged at intervals along the width direction of the boat supports, the plurality of silicon wafers loaded in each silicon wafer carrying unit on the quartz boat are arranged at intervals along the width direction of the boat supports, the thickness direction of the silicon wafers is consistent with the width direction of the boat supports (namely, the front surface and the back surface of the silicon wafers are parallel to the height direction of the boat supports), and when the length direction of the boat supports of the silicon wafer loaded in the diffusion furnace is consistent with the diffusion direction of diffusion gas in the diffusion furnace, the front surface and the back surface of the silicon wafers are parallel to the diffusion direction of the diffusion gas in the diffusion furnace, so that lattice defects and even chip phenomena of the silicon wafers occur at positions which are contacted with the clamping grooves and are caused by extrusion force of the diffusion gas can be avoided.
In addition, compare in the mode that is used for the card to establish a plurality of draw-in grooves of silicon chip on the silicon chip bears the weight of the unit and follows the direction interval setting of the direction of height of boat support (the front and the back of silicon chip is parallel with the width of boat support under this mode), the silicon chip who is used for the card to establish a plurality of draw-in grooves of silicon chip on the silicon chip bears the weight of the unit and follows the direction interval setting of width of boat support (the front and the back of silicon chip are parallel with the direction of height of boat support under this mode), can be favorable to avoiding the phenomenon that the middle part region of front and the back of silicon chip leads to the silicon chip surface to take place crooked even the piece owing to receive the action of gravity under the diffusion furnace high temperature environment.
In some embodiments of the first aspect of the present application, the slot wall of the slot includes a bottom surface, and the bottom surface is an arc surface that is concave.
By the arrangement mode, the phenomenon of scratch on the surface of the silicon wafer in the process that the silicon wafer is loaded on the silicon wafer bearing unit is avoided.
In some embodiments of the first aspect of the present application, the slot wall of the slot further includes two side surfaces that are both connected to the bottom surface and are disposed opposite to each other, and one ends of the two side surfaces, far away from the bottom surface, are both bent outwards.
The arrangement mode is beneficial to further avoiding the phenomenon of scratch on the surface of the silicon wafer in the process of loading the silicon wafer on the silicon wafer bearing unit.
In some embodiments of the first aspect of the present application, at least two connecting rods are respectively located at two opposite sides of the height direction, and the groove depth direction of the clamping groove is consistent with the height direction.
Compared with the mode that at least two connecting rods set up along boat support length direction interval, the mode that at least two connecting rods of this application are located the opposite sides of direction of height respectively is favorable to reducing the interval between two adjacent silicon chip bearing units that load on the boat support, is favorable to improving the quantity of the silicon chip bearing units that load on the whole boat support, and then is favorable to improving the silicon chip quantity that whole quartz boat loaded.
In some embodiments of the first aspect of the present application, the slot spacing of any two adjacent card slots is equal.
By the arrangement mode, the diffusion air flow distributed between every two adjacent silicon wafers is more uniform, and the uniformity of the diffusion effect of the silicon wafers loaded on the quartz boat is improved.
In some embodiments of the first aspect of the present application, the quartz boat further includes two flow equalizing plates, the two flow equalizing plates are respectively connected with opposite ends of the length direction of the boat support, and each flow equalizing plate is provided with a plurality of air flow holes penetrating through the flow equalizing plates along the length direction of the boat support.
The arrangement of the flow equalizing plate is beneficial to ensuring good air flow circulation of the quartz boat along the length direction of the boat support and ensuring diffusion uniformity of diffusion air flow.
In some embodiments of the first aspect of the present application, the air flow holes are progressively spaced apart from each other along the upper portion of the boat support to the lower portion of the boat support.
Because the quartz boat is loaded in the diffusion furnace, the bottom of the boat support is close to the heating position of the diffusion furnace, and the distance between the air flow holes is gradually increased from the upper part of the boat support to the lower part of the boat support, the quantity of diffusion gas introduced from the upper part of the flow equalizing plate is increased, the difference between the square resistance of the top of the silicon wafer and the square resistance of the bottom of the silicon wafer is reduced, and the square resistance uniformity of the whole silicon wafer is improved.
In some embodiments of the first aspect of the present application, the aperture of the airflow aperture gradually decreases along the upper portion of the boat support to the lower portion of the boat support.
When the quartz boat is loaded in the diffusion furnace, the bottom of the boat support is close to the heating position of the diffusion furnace, the aperture of the air flow hole is gradually reduced from the upper part of the boat support to the lower part of the boat support, so that the amount of diffusion gas introduced from the upper part of the flow equalizing plate is increased, the difference between the sheet resistance at the top of the silicon wafer and the sheet resistance at the bottom of the silicon wafer is reduced, and the sheet resistance uniformity of the whole silicon wafer is improved.
In some embodiments of the first aspect of the present application, the boat support includes a chassis and at least two side bars, opposite ends of the chassis are respectively connected with two flow equalizing plates, the at least two side bars are located above the chassis and are arranged at intervals along a width direction of the boat support, and opposite ends of each side bar are respectively connected with two flow equalizing plates; along the length direction of the boat support, a plurality of silicon wafer bearing units are detachably arranged between the two side rods in sequence.
By the arrangement mode, a plurality of silicon wafer bearing units can be stably loaded on the boat support.
In a second aspect, the present application provides a diffusion furnace comprising a diffusion furnace body and a quartz boat as provided in the first aspect above for loading in the diffusion furnace body.
The diffusion furnace body is provided with a furnace mouth, one end of the boat support in the length direction is close to the furnace mouth, the other end of the boat support is far away from the furnace mouth, and a diffusion gas inlet is arranged at the position, close to the furnace mouth, of the diffusion furnace body.
The diffusion furnace provided by the application is beneficial to avoiding the phenomenon that the front surface and the back surface of the silicon wafer are subjected to the extrusion force of diffusion gas to cause the position of the silicon wafer, which is contacted with the clamping groove, to generate lattice defects and even fragments, and is also beneficial to avoiding the phenomenon that the surface of the silicon wafer is bent or even fragments due to the gravity action in the middle area of the front surface and the back surface of the silicon wafer under the high-temperature environment of the diffusion furnace.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic structural diagram of a diffusion furnace according to an embodiment of the present application.
Fig. 2 shows a schematic structural view of a quartz boat according to an embodiment of the present application.
Fig. 3 shows a front view of a silicon wafer carrier unit of a first example provided by an embodiment of the present application.
Fig. 4 shows a right side view of a silicon wafer carrier unit of a first example provided by embodiments of the present application.
Fig. 5 shows a top view of a first example silicon wafer carrier unit provided by an embodiment of the present application.
Fig. 6 shows an enlarged view at a in fig. 4.
Fig. 7 shows a front view of a silicon wafer carrier unit of a second example provided by embodiments of the present application.
Fig. 8 shows a right side view of a second example silicon wafer carrier unit provided by an embodiment of the present application.
Fig. 9 shows a top view of a second example silicon wafer carrier unit provided by an embodiment of the present application.
Fig. 10 shows a schematic structural diagram of a flow equalization plate provided in an embodiment of the present application.
Icon: 10-a diffusion furnace; a 100-diffusion furnace body; 101-furnace mouth; 102-diffusion gas inlet; 103-a diffusion gas outlet; 200-quartz boat; 201-a silicon wafer; 210-boat support; 211-a chassis; 212-side bars; 220-a silicon wafer carrying unit; 221-a baffle frame; 222-connecting rod; 223-card slot; 2231-bottom surface; 2232-sided; 224-a connection; 225-bottom bar; 230-a flow equalization plate; 231-airflow holes.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the embodiments of the present application, it should be understood that the azimuth or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship conventionally put in use of the product of the application, or the azimuth or positional relationship conventionally understood by those skilled in the art, are merely for convenience of description of the present application and for simplification of description, and are not indicative or implying that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application.
In the description of the embodiments of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
Examples
Fig. 1 is a schematic structural view of a diffusion furnace 10 according to an embodiment of the present application, fig. 1 is a schematic structural view of a quartz boat 200 according to an embodiment of the present application, fig. 1 and fig. 2 are schematic structural views of a diffusion furnace 10 according to an embodiment of the present application, and the diffusion furnace 10 includes a diffusion furnace body 100 and the quartz boat 200 loaded in the diffusion furnace body 100.
The quartz boat 200 includes a boat support 210 and a plurality of wafer carrying units 220 for carrying wafers 201; the plurality of silicon wafer carrying units 220 are detachably mounted on the boat 210 in sequence along the length direction of the boat 210.
The diffusion furnace body 100 has a furnace mouth 101, a diffusion gas inlet 102 is provided at a position of the diffusion furnace body 100 close to the furnace mouth 101, and a diffusion gas outlet 103 is provided at a position of the diffusion furnace body 100 away from the furnace mouth 101. When the quartz boat 200 is loaded in the diffusion furnace body 100, one end of the boat support 210 in the length direction is close to the furnace mouth 101, and the other end is far away from the furnace mouth 101, so that the diffusion direction of the diffusion gas in the diffusion furnace body 100 is parallel to the length direction of the boat support 210.
It should be noted that the silicon wafer 201 is not part of the diffusion furnace 10, and the silicon wafer 201 is shown in the figure to more clearly describe the structure and implementation of the diffusion furnace 10.
Fig. 3 illustrates a front view of a silicon wafer carrying unit 220 of a first example provided in an embodiment of the present application, fig. 4 illustrates a right side view of the silicon wafer carrying unit 220 of the first example provided in an embodiment of the present application, fig. 5 illustrates a top view of the silicon wafer carrying unit 220 of the first example provided in an embodiment of the present application, fig. 6 illustrates an enlarged view at a in fig. 4, and the silicon wafer carrying unit 220 illustrated in fig. 2 is the first example, please refer to fig. 1 to 6, each silicon wafer carrying unit 220 includes two blocking frames 221 and at least two connecting rods 222, the two blocking frames 221 are disposed at intervals along a width direction of the boat 210, and opposite ends of each connecting rod 222 are respectively connected to the two blocking frames 221; along the width direction of the boat support 210, a plurality of clamping grooves 223 for clamping the silicon wafers 201 are arranged on at least two connecting rods 222 at intervals.
According to the silicon wafer carrier, the boat support 210 and the plurality of silicon wafer carrying units 220 which are sequentially and detachably arranged on the boat support 210 along the length direction of the boat support 210 are arranged, the plurality of clamping grooves 223 which are used for clamping the silicon wafers 201 on each silicon wafer carrying unit 220 are arranged at intervals along the width direction of the boat support 210, the plurality of silicon wafers 201 which are loaded in each silicon wafer carrying unit 220 on the quartz boat 200 are arranged at intervals along the width direction of the boat support 210, the thickness direction of the silicon wafers 201 is consistent with the width direction of the boat support 210 (namely, the front surface and the back surface of the silicon wafers 201 are parallel to the height direction of the boat support 210), and the diffusion direction of diffusion gas in the diffusion furnace body 100 is parallel to the length direction of the boat support 210, so that the front surface and the back surface of the silicon wafers 201 are parallel to the diffusion direction of diffusion gas in the diffusion furnace body 100, and the situation that lattice defects even fragments occur at the positions of the silicon wafers 201, which are contacted with the clamping grooves 223, are caused by the extrusion force of the diffusion gas on the front surface and the back surface of the silicon wafers 201 can be avoided.
In addition, compared to the manner in which the plurality of clamping grooves 223 on the silicon wafer carrying unit 220 for clamping the silicon wafer 201 are arranged at intervals along the height direction of the boat support 210 (the front surface and the back surface of the silicon wafer 201 are parallel to the width of the boat support 210 in this manner), the manner in which the plurality of clamping grooves 223 on the silicon wafer carrying unit 220 for clamping the silicon wafer 201 are arranged at intervals along the width direction of the boat support 210 (the front surface and the back surface of the silicon wafer 201 are parallel to the height direction of the boat support 210 in this manner) can be beneficial to avoiding the phenomenon that the surface of the silicon wafer 201 is bent or even broken due to the gravity action in the middle regions of the front surface and the back surface of the silicon wafer 201 in the high-temperature environment in the diffusion furnace body 100.
The number of the two connecting rods 222 is not limited in the present application, and the two connecting rods 222 may be clamped together with the silicon wafer 201 as long as the number is at least two.
Referring to fig. 6, the slot wall of the slot 223 includes a bottom surface 2231, and the bottom surface 2231 is an arc surface with a concave shape. The above arrangement is beneficial to avoiding the scratch phenomenon on the surface of the silicon wafer 201 in the process of loading the silicon wafer 201 on the silicon wafer bearing unit 220.
Further, the slot wall of the slot 223 further includes two side surfaces 2232 connected to the bottom surface 2231 and disposed opposite to each other, and ends of the two side surfaces 2232 away from the bottom surface 2231 are bent outwards. The above arrangement is beneficial to further avoiding the scratch phenomenon on the surface of the silicon wafer 201 in the process of loading the silicon wafer 201 on the silicon wafer bearing unit 220.
In the present embodiment, the groove pitches of any adjacent two of the card grooves 223 are equal. By the arrangement mode, the diffusion air flow distributed between every two adjacent silicon wafers 201 on the quartz boat 200 can be more uniform, and the uniformity of the diffusion effect of the silicon wafers 201 loaded on the quartz boat 200 can be improved.
Fig. 7 shows a front view of a silicon wafer carrier unit 220 of a second example provided by an embodiment of the present application, fig. 8 shows a right side view of the silicon wafer carrier unit 220 of the second example provided by an embodiment of the present application, fig. 9 shows a top view of the silicon wafer carrier unit 220 of the second example provided by an embodiment of the present application, please refer to fig. 2 to 5 and fig. 7 to 9, and the second example differs from the first example in that: the positions of the connection rods 222 are different.
In the first example, at least two connecting rods 222 are respectively located at two opposite sides of the height direction, and the groove depth direction of the clamping groove 223 coincides with the height direction. In the second example, at least two connecting rods 222 are disposed at intervals along the length direction of the boat support 210, and the groove depth direction of the clamping groove 223 coincides with the width direction of the boat support 210. Compared to the arrangement position of the connecting rod 222 of the second example, the arrangement position of the connecting rod 222 of the first example is advantageous in reducing the space between two adjacent silicon wafer carrying units 220 loaded on the boat 210, in increasing the number of the silicon wafer carrying units 220 loaded on the entire boat 210, and in turn, in increasing the number of the silicon wafers 201 loaded on the entire quartz boat 200.
In the first example, since the at least two connecting rods 222 are respectively located at two opposite sides of the height direction, the connecting rod 222 located above the height is further connected with a connecting portion 224, so as to facilitate connection by a manipulator or the like to load and unload the silicon wafer carrying unit 220 on the boat 210.
In the second example, since the at least two connection rods 222 are spaced apart along the length direction of the boat 210, the silicon wafer carrying unit 220 further includes a bottom rod 225 for supporting the silicon wafer 201, so that the silicon wafer 201 can be stably loaded in the silicon wafer carrying unit 220; and the connection parts 224 for connection with the robot and the like are respectively connected with two connection rods 222 arranged at intervals along the length direction of the boat 210, so that the silicon wafer carrying unit 220 is conveniently assembled and disassembled on the boat 210 by connection with the robot and the like.
Fig. 10 shows a schematic structural diagram of a flow equalizing plate 230 provided in the embodiment of the present application, referring to fig. 1, 2 and 10, the quartz boat 200 further includes two flow equalizing plates 230, the two flow equalizing plates 230 are respectively connected to opposite ends of the boat support 210 in the length direction, and each flow equalizing plate 230 has a plurality of air flow holes 231 penetrating through the flow equalizing plate 230 along the length direction of the boat support 210. The flow equalizing plate 230 is beneficial to ensuring good air flow communication of the quartz boat 200 along the length direction of the boat support 210 and ensuring diffusion uniformity of diffusion air flow.
Since the bottom of the boat support 210 approaches the heating position of the diffusion furnace 10 when the quartz boat 200 is loaded in the diffusion furnace body 100, as shown in fig. 10, the distance between the air flow holes 231 increases gradually from the upper side of the boat support 210 to the lower side of the boat support 210, which is advantageous for increasing the amount of diffusion gas introduced from the upper side of the flow equalization plate 230, reducing the difference between the sheet resistance at the top of the silicon wafer 201 and the sheet resistance at the bottom of the silicon wafer 201 in the silicon wafer carrying unit 220 loaded on the boat support 210, and improving the sheet resistance uniformity of the whole silicon wafer 201.
In other possible embodiments, the airflow holes 231 may be gradually reduced in diameter from above the boat support 210 to below the boat support 210. The above arrangement is also beneficial to increasing the amount of diffusion gas introduced above the flow equalization plate 230, reducing the difference between the sheet resistance at the top of the silicon wafer 201 and the sheet resistance at the bottom of the silicon wafer 201 in the silicon wafer carrying unit 220 loaded on the boat 210, and improving the sheet resistance uniformity of the whole silicon wafer 201.
Referring to fig. 1 and 2 again, the boat support 210 includes a bottom frame 211 and at least two side bars 212, wherein opposite ends of the bottom frame 211 are respectively connected with two flow equalizing plates 230, the at least two side bars 212 are located above the bottom frame 211 and are arranged at intervals along the width direction of the boat support 210, and opposite ends of each side bar 212 are respectively connected with two flow equalizing plates 230; along the length direction of the boat 210, a plurality of silicon wafer carrying units 220 are detachably mounted between two side bars 212 in sequence. The above arrangement can make the plurality of silicon wafer carrying units 220 stably loaded on the boat 210.
The present embodiment also provides a quartz boat 200, and the structure, shape and connection of the quartz boat 200 are described above, and will not be repeated here.
The quartz boat 200 provided in this embodiment has at least the following advantages:
according to the silicon wafer carrier, the boat support 210 and the plurality of silicon wafer carrying units 220 which are sequentially and detachably arranged on the boat support 210 along the length direction of the boat support 210 are arranged, the plurality of clamping grooves 223 which are used for clamping the silicon wafers 201 on each silicon wafer carrying unit 220 are arranged at intervals along the width direction of the boat support 210, the plurality of silicon wafers 201 which are loaded in each silicon wafer carrying unit 220 on the quartz boat 200 are arranged at intervals along the width direction of the boat support 210, the thickness direction of the silicon wafers 201 is consistent with the width direction of the boat support 210 (namely, the front surface and the back surface of the silicon wafers 201 are parallel with the height direction of the boat support 210), and when the length direction of the boat support 210 of the quartz boat 200 loaded in the diffusion furnace body 100 is consistent with the diffusion direction of diffusion gas in the diffusion furnace body 100, the front surface and the back surface of the silicon wafers 201 are parallel with the diffusion direction of the diffusion gas in the diffusion furnace body 100, so that lattice defect even chip phenomenon of the position of the silicon wafers 201, which is contacted with the clamping grooves 223, is caused by the extrusion force of the silicon wafers 201 is avoided.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A quartz boat, comprising: a boat support and a plurality of silicon wafer bearing units; the silicon wafer bearing units are detachably mounted on the boat support in sequence along the length direction of the boat support;
each silicon wafer bearing unit comprises two baffle frames and at least two connecting rods, the two baffle frames are arranged at intervals along the width direction of the boat support, and the opposite ends of each connecting rod are respectively connected with the two baffle frames; and a plurality of clamping grooves which are in one-to-one correspondence and used for clamping the silicon wafers are arranged on at least two connecting rods at intervals along the width direction of the boat support.
2. The quartz boat of claim 1, wherein the slot walls of the clamping slots comprise a bottom surface, the bottom surface being an arcuate surface that is concave.
3. The quartz boat of claim 2, wherein the slot wall of the slot further comprises two side surfaces each connected to the bottom surface and disposed opposite to each other, and one end of each of the two side surfaces remote from the bottom surface is bent outward.
4. A quartz boat according to any of claims 1-3, wherein at least two of the connecting rods are located on opposite sides of the height direction, respectively, and the groove depth direction of the clamping groove coincides with the height direction.
5. A quartz boat according to any of claims 1-3, wherein the slot spacing of any adjacent two of the card slots is equal.
6. The quartz boat of claim 1, further comprising two flow equalization plates, wherein the two flow equalization plates are respectively connected to opposite ends of the boat support in the length direction, and each flow equalization plate is provided with a plurality of air flow holes penetrating through the flow equalization plates in the length direction of the boat support.
7. The quartz boat of claim 6, wherein the gas flow holes are progressively more spaced along the upper portion of the boat support to the lower portion of the boat support.
8. The quartz boat of claim 6 or 7, wherein the airflow holes gradually decrease in diameter along an upper portion of the boat support to a lower portion of the boat support.
9. The quartz boat of claim 6, wherein the boat support comprises a bottom frame and at least two side rods, wherein opposite ends of the bottom frame are respectively connected with two flow equalizing plates, the at least two side rods are respectively positioned above the bottom frame and are arranged at intervals along the width direction of the boat support, and the opposite ends of each side rod are respectively connected with two flow equalizing plates; along the length direction of the boat support, a plurality of silicon wafer bearing units are detachably arranged between the two side rods in sequence.
10. A diffusion furnace, comprising: a diffusion furnace body and a quartz boat according to any of claims 1-9 for loading within the diffusion furnace body;
the diffusion furnace comprises a diffusion furnace body, wherein the diffusion furnace body is provided with a furnace mouth, one end of the boat support in the length direction is close to the furnace mouth, the other end of the boat support is far away from the furnace mouth, and a diffusion gas inlet is formed in the diffusion furnace body, close to the furnace mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223204241.7U CN218975409U (en) | 2022-11-30 | 2022-11-30 | Quartz boat and diffusion furnace |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223204241.7U CN218975409U (en) | 2022-11-30 | 2022-11-30 | Quartz boat and diffusion furnace |
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| Publication Number | Publication Date |
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| CN218975409U true CN218975409U (en) | 2023-05-05 |
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| CN202223204241.7U Active CN218975409U (en) | 2022-11-30 | 2022-11-30 | Quartz boat and diffusion furnace |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116536649A (en) * | 2023-06-27 | 2023-08-04 | 江苏微导纳米科技股份有限公司 | Combined boat, single boat, processing equipment, slide method and processing method |
| CN117832139A (en) * | 2023-12-29 | 2024-04-05 | 浙江富同石英新材料有限公司 | Quartz boat support with high temperature resistance function and high temperature resistance method thereof |
-
2022
- 2022-11-30 CN CN202223204241.7U patent/CN218975409U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116536649A (en) * | 2023-06-27 | 2023-08-04 | 江苏微导纳米科技股份有限公司 | Combined boat, single boat, processing equipment, slide method and processing method |
| CN116536649B (en) * | 2023-06-27 | 2023-10-17 | 江苏微导纳米科技股份有限公司 | Combined boat, single boat, processing equipment, slide method and processing method |
| CN117832139A (en) * | 2023-12-29 | 2024-04-05 | 浙江富同石英新材料有限公司 | Quartz boat support with high temperature resistance function and high temperature resistance method thereof |
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