CN210040159U - Graphite frame for bearing silicon wafer - Google Patents
Graphite frame for bearing silicon wafer Download PDFInfo
- Publication number
- CN210040159U CN210040159U CN201921222253.8U CN201921222253U CN210040159U CN 210040159 U CN210040159 U CN 210040159U CN 201921222253 U CN201921222253 U CN 201921222253U CN 210040159 U CN210040159 U CN 210040159U
- Authority
- CN
- China
- Prior art keywords
- grid
- pair
- spacers
- opposite sides
- graphite frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model discloses a graphite frame for bearing silicon wafers, which is suitable for plate-type PECVD and comprises a rectangular grid, wherein hooks for supporting the silicon wafers are respectively arranged on four sides of the grid; the grid is also provided with a division bar; two ends of the parting strip are respectively connected with a pair of opposite sides of the grid, and two sides of the parting strip are connected with hooks for supporting the silicon wafer. The grid of the existing graphite frame can only bear the whole piece, namely a rectangular silicon wafer with the size equivalent to that of the grid; the utility model discloses set up the parting bead in the net, the parting bead can be separated the net, and the both sides of parting bead all are connected with the couple, make the net can bear the burst of above-mentioned whole piece.
Description
Technical Field
The utility model relates to a graphite frame for bearing silicon chip.
Background
At present, in the preparation process of crystalline silicon solar cells, PECVD (plasma enhanced chemical vapor deposition) for preparing an antireflection film has become an indispensable procedure. Plate PECVD requires a graphite frame to carry the silicon wafer. The existing graphite frame is of a grid-shaped structure and is composed of a plurality of grids, a plurality of hooks are uniformly distributed on four sides of each grid and used for bearing a silicon wafer to prevent the silicon wafer from falling off, and the silicon wafer is horizontally placed in each grid so as to be plated on the lower surface of the silicon wafer.
In addition, with the development of solar cell technology, the efficiency of the solar module can be improved by dividing the whole silicon wafer into at least two sub-wafers. However, the existing graphite frame is designed according to the shape of the whole silicon wafer, so that the graphite frame needs to be independently designed additionally for the wafer separation, and the production cost of an enterprise is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects in the prior art, the utility model provides a graphite frame for bearing silicon wafers, which is suitable for plate-type PECVD and comprises a rectangular grid, wherein hooks for supporting the silicon wafers are respectively arranged on four sides of the grid; the grid is also provided with a division bar; two ends of the parting strip are respectively connected with a pair of opposite sides of the grid, and two sides of the parting strip are connected with hooks for supporting the silicon wafer.
The net of current board-like PECVD graphite frame can only bear the whole piece (the rectangle silicon chip that is equivalent to the net size promptly), the utility model discloses set up the parting bead in the net, the parting bead can be separated the net, and the both sides of parting bead all are connected with the couple, make the net can bear the burst of above-mentioned whole piece.
Preferably, the division bar is detachably connected with the pair of opposite edges. The division bars can be detached, when the division bars are detached, the grids are restored, and the silicon wafer is suitable for bearing the whole wafer (namely, a rectangular silicon wafer with the size equal to that of the grids); when the division bars are arranged, the grids are separated by the division bars and are suitable for bearing the whole piece of the piece; the division bars are detachable, so that the grid is suitable for bearing the whole piece and the split pieces of the whole piece.
Preferably, the pair of opposite sides are respectively provided with: a positioning groove for inserting the end part of the parting strip; the positioning grooves on the pair of opposite sides are symmetrically arranged; the two ends of the division bar are respectively clamped into a pair of symmetrically arranged positioning grooves; the installation and the dismantlement of convenient parting bead.
Preferably, the pair of opposite sides are both provided with a plurality of positioning grooves, and the positioning grooves on the same side are sequentially arranged along the extending direction of the side; because of the arrangement of the plurality of positioning grooves, the mounting positions of the division bars can be adjusted along the extending direction of the pair of opposite sides so as to adapt to the slicing of different sizes; a plurality of positioning grooves also provide the possibility for installing a plurality of parting strips.
Preferably, the pair of opposite sides are both provided with a plurality of positioning grooves, and the positioning grooves on the same side are sequentially arranged at equal intervals along the extending direction of the side; because of the arrangement of the plurality of positioning grooves, the mounting positions of the division bars can be adjusted at equal intervals along the extending direction of the pair of opposite sides so as to adapt to the slicing of different sizes; a plurality of positioning grooves also provide the possibility for installing a plurality of parting strips.
Preferably, the number of the division bars is one, the division bars are perpendicular to the pair of opposite sides, and the division bars bisect the grids; so that the grid can carry the halved pieces of the whole piece.
Preferably, the number of the division bars is two, the two division bars are both perpendicular to the pair of opposite sides, and the grid is trisected by the two division bars; so that the grid can carry three halves of the whole sheet.
Preferably, the number of the division bars is three, the three division bars are all perpendicular to the pair of opposite sides, and the grid is divided into four parts by the three division bars; so that the grid can carry the quarter-piece of the whole piece.
Preferably, the number of the division bars is four, the four division bars are all perpendicular to the pair of opposite sides, and the grid is divided into five equal parts by the four division bars; so that the grid can carry five equally divided pieces of the whole piece.
Preferably, the number of the division bars is five, the five division bars are all perpendicular to the pair of opposite sides, and the five division bars divide the grid into six equal parts; so that the grid can carry six equally divided pieces of the whole piece.
Drawings
FIG. 1 is a schematic top view of a grid in a prior art graphite frame;
FIG. 2 is a schematic top view of a grid in a graphite frame of example 1;
FIG. 3 is a schematic view of the grid carrying a monolith in example 1;
fig. 4 is a schematic diagram of a mesh bearer fragmentation in embodiment 1;
fig. 5 and 6 are schematic diagrams of different sizes of slices carried by the grid in embodiment 2;
fig. 7 is a schematic diagram of a mesh bearer bisection slice in embodiment 3;
fig. 8 is a schematic diagram of a mesh carrying trisection slices in embodiment 4.
Detailed Description
The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The graphite frame of the existing plate-type PECVD is of a grid 10-shaped structure and consists of a plurality of rectangular grids 10, as shown in figure 1, a plurality of hooks 20 are uniformly distributed on four sides of each grid 10 and used for bearing a silicon wafer to prevent the silicon wafer from falling off, and the silicon wafer is horizontally placed in each grid 10 so as to coat the lower surface of the silicon wafer.
The grid 10 of the graphite frame of the conventional plate-type PECVD can only bear a whole piece (i.e., a rectangular silicon wafer with the size equal to that of the grid 10).
The embodiment of the utility model is as follows:
example 1
As shown in fig. 2, the utility model provides a graphite frame for bearing silicon wafers, which is suitable for plate-type PECVD, and comprises a rectangular grid 10, wherein hooks 20 for supporting the silicon wafers are respectively arranged on four sides of the grid 10;
the grid 10 is also provided with a division bar 30, and the two sides of the division bar 30 are connected with hooks 20 for supporting silicon wafers;
the pair of opposite sides are respectively provided with: a positioning groove 11 for inserting the end of the parting strip 30; the positioning grooves 11 on the pair of opposite sides are symmetrically arranged;
the two ends of the division bar 30 are respectively clamped into a pair of symmetrically arranged positioning grooves 11, and the division bar 30 is detachably connected with the pair of opposite sides.
The division bars 30 are detachable, when the division bars 30 are detached, the grid 10 is restored and is suitable for bearing the whole piece 40 (namely, a rectangular silicon wafer with the size equivalent to that of the grid 10), as shown in fig. 3; when the division bars 30 are mounted, the grid 10 is divided by the division bars 30 and is adapted to carry the divided pieces 41 of the whole piece 40, as shown in fig. 4; the division bars 30 are removable so that the grid 10 is adapted to carry both the whole sheet 40 and the segments 41 of the whole sheet 40.
Example 2
As shown in fig. 5 and 6, the present invention further provides another graphite frame for supporting a silicon wafer, which is suitable for a plate-type PECVD, and the difference is that:
the pair of opposite sides are provided with a plurality of positioning grooves 11, and the positioning grooves 11 on the same side are sequentially arranged at equal intervals along the extending direction of the side.
Due to the arrangement of the positioning grooves 11, the installation positions of the division bars 30 can be adjusted at equal intervals along the extending direction of the pair of opposite sides to adapt to the slices with different sizes, such as the slice 42 in fig. 5 with a size different from the slice 43 in fig. 6.
Example 3
As shown in fig. 7, the present invention further provides another graphite frame for supporting a silicon wafer, which is suitable for a plate-type PECVD, and on the basis of the graphite frame provided in embodiment 1, the difference lies in:
the number of the division bars 30 is one, the division bars 30 are perpendicular to the pair of opposite sides, and the division bars 30 bisect the grid 10.
The division bar 30 bisects the grid 10 so that the grid 10 can carry the bisected piece 44 of the whole piece 40 (up to two bisected pieces 44).
Example 4
As shown in fig. 8, the present invention further provides another graphite frame for supporting a silicon wafer, which is suitable for a plate-type PECVD, and on the basis of the graphite frame provided in embodiment 1, the difference lies in:
the number of the division bars 30 is two, the two division bars 30 are perpendicular to the pair of opposite sides, and the grid 10 is trisected by the two division bars 30.
Two spacers 30 trisect the grid 10 so that the grid 10 can carry three equally divided pieces 45 of the whole piece 40 (up to three equally divided pieces 45).
Example 5
The utility model discloses still provide another kind of graphite frame for bearing silicon chip, be applicable to board-like PECVD, on the basis of the graphite frame that embodiment 1 provided, the difference lies in:
the number of the division bars is three, the three division bars are all perpendicular to the pair of opposite sides, and the grid is divided into four parts by the three division bars.
The grid is divided into four parts by the three division bars, so that the grid can bear the quartering and slicing pieces of the whole piece (at most, four quartering and slicing pieces can be borne).
Example 6
The utility model discloses still provide another kind of graphite frame for bearing silicon chip, be applicable to board-like PECVD, on the basis of the graphite frame that embodiment 1 provided, the difference lies in:
the number of the division bars is four, the four division bars are all perpendicular to the pair of opposite sides, and the grids are divided into five equal parts by the four division bars.
The grid is divided into five equal parts by four parting strips, so that the grid can bear five equal divided parts of the whole piece (at most, five equal divided parts can be borne).
Example 7
The utility model discloses still provide another kind of graphite frame for bearing silicon chip, be applicable to board-like PECVD, on the basis of the graphite frame that embodiment 1 provided, the difference lies in:
the number of the division bars is five, the five division bars are all perpendicular to the pair of opposite sides, and the five division bars divide the grid into six equal parts.
The grid is divided into six equal parts by five parting strips, so that the grid can bear six equal divided parts of the whole piece (at most, six equal divided parts can be borne).
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The graphite frame for bearing the silicon wafer comprises a rectangular grid, wherein hooks for supporting the silicon wafer are respectively arranged on four sides of the grid; the method is characterized in that the grids are also provided with spacing bars; two ends of the parting strip are respectively connected with a pair of opposite sides of the grid, and two sides of the parting strip are connected with hooks for supporting the silicon wafer.
2. The graphite frame for supporting silicon wafers as claimed in claim 1, wherein the spacers are detachably attached to the pair of opposite sides.
3. The graphite frame for supporting silicon wafers as claimed in claim 2, wherein the pair of opposite sides are respectively provided with: a positioning groove for inserting the end part of the parting strip; the positioning grooves on the pair of opposite sides are symmetrically arranged; the two ends of the division bar are respectively clamped into a pair of symmetrically arranged positioning grooves.
4. The graphite frame for supporting silicon wafers as claimed in claim 3, wherein a plurality of positioning grooves are formed on each of the pair of opposite sides, and the positioning grooves on the same side are arranged in sequence along the extending direction of the side.
5. The graphite frame for supporting silicon wafers as claimed in claim 3, wherein a plurality of positioning grooves are formed on each of the pair of opposite sides, and the positioning grooves on the same side are arranged in sequence at equal intervals along the extending direction of the side.
6. The graphite frame for supporting silicon wafers as claimed in claim 1 or 2, wherein the number of the spacers is one, the spacers are perpendicular to the pair of opposite sides, and the spacers bisect the lattice.
7. The graphite frame for supporting silicon wafers as claimed in claim 1 or 2, wherein the number of the spacers is two, the two spacers are perpendicular to the pair of opposite sides, and the two spacers trisect the lattice.
8. The graphite frame for supporting silicon wafers as claimed in claim 1 or 2, wherein the number of the spacers is three, the three spacers are perpendicular to the pair of opposite sides, and the three spacers divide the grid into four equal parts.
9. The graphite frame for supporting silicon wafers as claimed in claim 1 or 2, wherein the number of the spacers is four, the four spacers are perpendicular to the pair of opposite sides, and the four spacers divide the grid into five equal parts.
10. The graphite frame for supporting silicon wafers as claimed in claim 1 or 2, wherein the number of the spacers is five, the five spacers are perpendicular to the pair of opposite sides, and the five spacers divide the grid into six equal parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921222253.8U CN210040159U (en) | 2019-07-31 | 2019-07-31 | Graphite frame for bearing silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921222253.8U CN210040159U (en) | 2019-07-31 | 2019-07-31 | Graphite frame for bearing silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210040159U true CN210040159U (en) | 2020-02-07 |
Family
ID=69350449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921222253.8U Active CN210040159U (en) | 2019-07-31 | 2019-07-31 | Graphite frame for bearing silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210040159U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323165A (en) * | 2019-07-31 | 2019-10-11 | 常州时创能源科技有限公司 | It is a kind of for carrying the graphite frame of silicon wafer |
-
2019
- 2019-07-31 CN CN201921222253.8U patent/CN210040159U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323165A (en) * | 2019-07-31 | 2019-10-11 | 常州时创能源科技有限公司 | It is a kind of for carrying the graphite frame of silicon wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113382835B (en) | Preparation method and application of monocrystalline silicon wafer | |
| CN110085703B (en) | Slicing method and splicing method of regular-hexagon solar cell | |
| JPWO2003073516A1 (en) | Solar cell module and manufacturing method thereof | |
| CN210040159U (en) | Graphite frame for bearing silicon wafer | |
| US9966287B2 (en) | Drying holder for solar cell and method for producing solar cell | |
| CN218975409U (en) | Quartz boat and diffusion furnace | |
| CN209859931U (en) | Silicon wafer basket for bearing silicon wafers | |
| CN209929280U (en) | Quartz boat for bearing silicon wafers | |
| CN112885768B (en) | Epitaxial wafer carrier of etching baking equipment | |
| CN209607715U (en) | It is silicon chip film-coated to use graphite boat | |
| CN110323165A (en) | It is a kind of for carrying the graphite frame of silicon wafer | |
| CN210110729U (en) | Silicon wafer basket with bearing frame | |
| CN213459754U (en) | Solar cell, cell string and photovoltaic module | |
| CN209929279U (en) | Quartz boat capable of bearing silicon wafers | |
| CN206814882U (en) | A kind of hydride gas-phase epitaxy graphite boat structure | |
| CN111341865A (en) | Solar silicon wafer, solar cell module and manufacturing method thereof | |
| CN110060951B (en) | Graphite boat for silicon wafer coating | |
| US11562920B2 (en) | Semi-conductor wafers longer than industry standard square | |
| CN209947812U (en) | Quartz boat for bearing silicon wafer | |
| CN211088233U (en) | Atomic deposition storage frame and atomic deposition equipment | |
| CN201796934U (en) | Bearing basket for silicon chip wool making | |
| CN219873434U (en) | Bearing boat | |
| CN215869314U (en) | Graphite boat | |
| CN209816331U (en) | Solar cell diffusion quartz boat | |
| CN110379750B (en) | Quartz boat for bearing silicon wafers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Liyang City, Jiangsu province 213300 Li Cheng Zhen Wu Changzhou city Tandu Road No. 8 Patentee after: Changzhou Shichuang Energy Co., Ltd Address before: Liyang City, Jiangsu province 213300 Li Cheng Zhen Wu Changzhou city Tandu Road No. 8 Patentee before: CHANGZHOU SHICHUANG ENERGY TECHNOLOGY Co.,Ltd. |