CN217217055U

CN217217055U - High-efficiency stacked power module structure

Info

Publication number: CN217217055U
Application number: CN202221036862.6U
Authority: CN
Inventors: 李亚宇; 曾剑鸿
Original assignee: Shanghai Peiyuan Electronics Co ltd
Current assignee: Shanghai Peiyuan Electronics Co ltd
Priority date: 2022-05-04
Filing date: 2022-05-04
Publication date: 2022-08-16
Anticipated expiration: 2032-05-04

Abstract

The utility model discloses a high-efficiency stacked power module structure, which comprises a substrate, at least one first element and at least one second element; the upper surface of base plate sets up first component, and the second component sets up in the clearance region between base plate and the first component, and the side of first component has the side pin, and the upper surface of first component and second component passes through veneer fixed connection, and/or, the upper surface of first component and base plate passes through veneer fixed connection, and side pin and the inside at least a conducting structure integrated into one piece of first component. The utility model discloses a pin flattens the mode that directly draws and forms integrated into one piece's side pin, has reduced one preparation flow to solve the problem of placing the unstability that first component adopted the pin to flatten when directly drawing forth through veneer fixed connection, thereby reduced the loss of module, improved power module's power density, can satisfy the application demand under the work occasion of heavy current.

Description

High-efficiency stacked power module structure

Technical Field

The utility model belongs to the technical field of electronic components, especially, relate to a power module structure is piled up to high efficiency.

Background

The power module is widely applied due to the characteristics of small volume and high power density, and the structure of the current typical power module is shown in fig. 1 and mainly comprises three parts: a substrate 1, a first element 2 and a second element 3. The substrate 1 is a bottom PCB board for connecting each independent electronic element by circuits, a second element 3 is placed in the middle layer of the upper part of the substrate, the second element 3 is a power chip and some thin elements such as resistance-capacitance and the like, the elements are welded on the upper surface of the substrate 1, the top layer is a first element 2 occupying most of the volume of a power module, a typical first element 2 is a power inductor, the height of the first element 2 is higher, the first element 2 is stacked on the second element 3 with smaller size, and side pins 4 at two ends of the first element 2 are welded on the substrate 1 to play a role in electrical connection and fixation.

Taking a power inductor as an example, as shown in the left part of fig. 2, the pin of the power inductor is led out directly by a narrow copper flat wire pin, specifically, by a way of directly leading out a copper wire after being flattened.

Therefore, the conventional power module adopts a pin leading-out manner as shown in the right part of fig. 2, which is an indirect lead-out manner of a wide metal sheet pin, specifically, an indirect lead-out manner of a wide metal sheet.

The manufacturing process of the power inductor corresponding to the indirect lead-out mode of the wide metal sheet pin is shown in fig. 3:

the first step is as follows: winding a copper wire;

the second step is that: flattening the wound copper wire and cutting the flattened copper wire into a proper length;

the third step: welding a copper wire on the wide metal sheet;

the fourth step: and (4) compression molding, wherein pins of the power inductor are vertically led out from two sides of the power inductor.

With the development of power modules towards high frequency, small size and high power density, the prior art cannot realize higher current increase at smaller size. The main reason is that in the third step of the summary of the manufacturing process of the power inductor, the copper wire is soldered on a wider metal sheet. Although the mode ensures the better stability of the power inductor, the mode cannot be applied in a large-current scene, for example, when the current of the power inductor is greater than 10A, especially greater than 20A, the following problems mainly exist:

1) the welding point formed by the copper wire and the wide metal sheet additionally increases the internal resistance of the power inductor by 1m omega, the development trend of the power module is high power density, the 1m omega resistor generates a large amount of loss under the working condition that the small-size power module runs large current, more loss means more heat is accumulated in the power module with small volume, and the heat dissipation difficulty is large.

2) Under the same heat dissipation condition, the operating temperature of the power module can be higher, devices inside the power module work at higher temperature, the parameters of some devices can be derated, the electrical performance can be reduced, and the service life and the reliability are influenced.

3) In order to maintain the performance and reliability requirements of the power supply module, the compromise can be made only in reducing the loss at other layers, and the power density is greatly reduced no matter the output power or the frequency is reduced;

4) the pins formed by the wide metal sheets are very wide, so that more areas of the bottom layer PCB can be occupied, the functional space of the bottom layer PCB is limited, and the flexibility of the bottom layer PCB is reduced.

Therefore, the power inductor with wide sheet metal pins has a great limitation in the power module.

In summary, it is an urgent need to solve the problem of how to improve the performance and power density of the power module while the first element, such as the power inductor, is stably placed, so as to greatly reduce the loss of the whole device.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a power module structure is piled up to high efficiency when first component is placed stably, can improve power module's performance and power density to make the loss greatly reduced of integrated device.

In order to achieve the above object, the utility model provides a power module structure is piled up to high efficiency, include:

a substrate, at least one first element and at least one second element;

the first element is arranged on the upper surface of the substrate, and the second element is arranged in a gap area between the substrate and the first element;

the side surface of the first element is provided with a side surface pin which is electrically connected with the substrate;

the first element is fixedly connected with the upper surface of the second element through gluing, and/or the first element is fixedly connected with the upper surface of the substrate through gluing;

the side pin and the at least one conductive structure inside the first element are integrally formed.

Preferably, the upper surfaces of the first element and the second element are fixedly connected by gluing, specifically: the bottom of the first element is fixedly connected with the upper surface of the second element through an adhesive arranged on the upper surface of the second element.

Preferably, the first element is fixedly connected with the upper surface of the substrate by gluing, specifically: and arranging a glue compound at the position of the substrate where the second element is not arranged, wherein the bottom of the first element is fixedly connected with the upper surface of the substrate through the glue compound.

Preferably, the inner sides of the side pins are fixedly connected with the upper surface of the substrate through the glue.

Preferably, the side pins are narrow copper flat wires.

Preferably, the first component is superposed on the second component.

Preferably, the second element is attached to the upper surface of the substrate.

Preferably, the lower surface of the substrate is provided with an outer pin.

The utility model discloses a power module structure is piled up to high efficiency has following beneficial effect:

(1) the integrally formed side pins are formed in a manner of flattening the pins and directly leading out the pins, so that a manufacturing process is reduced, the production resources and cost of the first element are saved, and the problem of placement instability of the first element caused by flattening the pins and directly leading out the pins is solved through gluing and fixing connection, so that the loss of a module is reduced, the power density of a power supply module is improved, and the application requirement of the power supply module in a heavy-current working occasion can be met;

(2) power module's development trend is that the size is littleer, and power density is bigger, the utility model discloses the efficiency of promotion can be more outstanding, and heat radiation pressure is littleer, is favorable to improving power module's electrical characteristic, promotes power capacity, more can exert power module's advantage.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of a prior art power module;

FIG. 2 is a diagram illustrating a pin-out manner of a power module according to the prior art;

FIG. 3 is a flow chart illustrating a method for manufacturing a power inductor of a power module according to the prior art;

fig. 4 is a schematic diagram of a high-efficiency stacked power module structure according to a first embodiment of the present invention;

fig. 5 is a flow chart illustrating a manufacturing process of a first element of the high efficiency stacked power module structure according to the first embodiment of the present invention;

fig. 6 is a schematic diagram of a high-efficiency stacked power module structure according to a second embodiment of the present invention;

fig. 7 is a schematic diagram of a high-efficiency stacked power module structure according to a third embodiment of the present invention.

In the figure: the device comprises a substrate 1, a first element 2, a second element 3, a side pin 4 and an adhesive 5.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

First embodiment

Fig. 4 is a schematic diagram illustrating a structure of a high-efficiency stacked power module disclosed in this embodiment, which includes a substrate 1, a first element 2, and a second element 3, wherein the first element 2 is disposed on an upper surface of the substrate 1, the second element 3 is disposed in a gap region between the substrate 1 and the first element 2, a side surface of the first element 2 has a side surface pin 4, and the side surface pin 4 is electrically connected to the substrate 1; the first element 2 includes, but is not limited to, a power inductor, a larger element or a module formed by a plurality of elements, the second element 3 includes, but is not limited to, a power chip, a diode, a resistor-capacitor, a triode, a silicon device, and the like, and preferably, the bottom of the substrate 1 is provided with an outer pin.

In this embodiment, the side pins 4 are integrally formed with at least one conductive structure inside the first component 2, and the following first component 2 takes the power inductor as an example, and in order to realize low energy loss of the power supply, the side pins 4 on both sides of the power inductor adopt a way of directly leading out by flattening copper wires instead of indirectly leading out through a wide metal sheet. As shown in fig. 5, after the copper wire is wound, the pins on both sides of the power inductor are flattened by the copper wire and directly led out, so as to form the side pins 4 of the narrow copper flat wire.

Simultaneously, in order to solve the problem that the copper wire is flattened and is directly drawn out to lead to the power inductance to place the unstability, this embodiment improves the firm in connection degree of power inductance through the mode of first component 2 and the 1 upper surface bonding fixed connection of second component. The method specifically comprises the following steps: set up glue 5 at the upper surface of second component 3 with the mode of gluing, this glue 5 has stickness, non-liquidity and possesses heat conductivity and certain deformability, later places first component 2 on base plate 1 for the lower surface of first component 2 passes through glue 5 and is connected with the upper surface fixed of second component 2, thereby guarantees the steadiness of first component 2, and side pin 4 and base plate 1 electric connection. The connection mode reduces the cost, improves the reliability, improves the power density and has wide applicability.

Second embodiment

The difference between this embodiment and the first embodiment is that, in order to solve the problem of instability of the power inductor caused by the direct extraction of the flattened copper wires, the connection firmness of the power inductor is improved by the way of fixedly connecting the first element 2 to the upper surface of the substrate 1 by gluing. As shown in fig. 6, after the second element 3 is soldered on the substrate 1, the adhesive 5 is disposed in a dispensing manner at a position where the second element 3 is not disposed on the substrate 1, and the adhesive 5 has viscosity, non-fluidity, thermal conductivity and certain deformation capability, and then the first element 2 is placed on the substrate 1, so that the first element 2 is fixedly connected with the upper surface of the substrate 1 through the adhesive 5.

In a preferred embodiment, as shown in fig. 6, the glue 5 is disposed inside the position where the side pins 4 are electrically connected to the substrate 1, so that the inside of the side pins 4 can be fixedly connected to the upper surface of the substrate 1 through the glue 5, thereby improving the connection firmness of the side pins 4.

Third embodiment

The difference between this embodiment and the first embodiment is that, in order to solve the problem of instability of the power inductor caused by the direct lead-out of the flattened copper wires, the connection firmness of the power inductor is improved by the way of fixedly connecting the upper surfaces of the first element 2 and the second element 1 by gluing, and by the way of fixedly connecting the upper surfaces of the first element 2 and the substrate 1 by gluing, as shown in fig. 7.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high efficiency stacked power module structure, comprising: a substrate, at least one first element and at least one second element;

2. A high efficiency stacked power supply module structure as claimed in claim 1, wherein the upper surfaces of said first and second elements are fixedly connected by gluing, in particular: the bottom of the first element is fixedly connected with the upper surface of the second element through an adhesive arranged on the upper surface of the second element.

3. A high efficiency stacked power supply module structure as claimed in claim 1, wherein said first element is fixedly connected with the upper surface of said substrate by gluing, specifically: and arranging a glue compound at the position of the substrate where the second element is not arranged, wherein the bottom of the first element is fixedly connected with the upper surface of the substrate through the glue compound.

4. The structure of claim 3, wherein the inner side of the side pins is fixedly connected to the upper surface of the substrate through the adhesive.

5. A high efficiency stacked power module structure as claimed in claim 1, wherein said side pins are integrally formed with at least one conductive structure inside said first component, specifically: and at least one conductive structure in the first element forms the side pin in a manner of directly leading out the pins by flattening the pins.

6. The structure of claim 4, wherein the side pins are narrow copper flat wires.

7. A high efficiency stacked power module structure as claimed in claim 1, wherein said first member is stacked on said second member.

8. The structure of claim 1, wherein the second element is attached to the upper surface of the substrate.

9. The structure of claim 1, wherein the lower surface of the substrate is provided with external pins.