CN210072029U - Test circuit board of large screen - Google Patents
Test circuit board of large screen Download PDFInfo
- Publication number
- CN210072029U CN210072029U CN201920580546.7U CN201920580546U CN210072029U CN 210072029 U CN210072029 U CN 210072029U CN 201920580546 U CN201920580546 U CN 201920580546U CN 210072029 U CN210072029 U CN 210072029U
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- China
- Prior art keywords
- circuit board
- heat conduction
- heat
- insulating layer
- large screen
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Abstract
The utility model discloses a large screen test circuit board, which comprises a circuit board, electronic components and a heat dissipation plate, wherein the electronic components are arranged at the top of the circuit board, the bottom of the circuit board is connected with a first heat conduction insulating layer, the bottom of the first heat conduction insulating layer is connected with a metal body, the bottom of the metal body is connected with a second heat conduction insulating layer, a through hole is arranged at the bottom of the electronic components in the circuit board for the LED test circuit, high heat conduction glue is filled in the through hole, the high heat conduction glue is contacted with the first heat conduction insulating layer, thereby realizing the rapid heat dissipation of the circuit board at the position of the electronic components, meanwhile, the first heat conduction insulating layer conducts the heat on the circuit board to the heat dissipation plate through the metal body and the second heat conduction insulating layer, a heat conduction column arranged in the heat dissipation plate transfers the heat to the outside, and a semiconductor refrigeration sheet, the radiating effect is better, is convenient for prolong the life of circuit board.
Description
Technical Field
The utility model relates to a LED test circuit technical field specifically is a test circuit board of large screen.
Background
In order to ensure the quality of the integrated circuit, it is generally required to test the large-screen integrated circuit, and during the test, the electronic components on the test circuit board operate to generate a large amount of heat.
The existing circuit board heat dissipation is generally directly connected with a heat dissipation sheet on a circuit board for heat dissipation, electronic elements on the circuit board can generate a large amount of heat in a large-screen test, the heat dissipation is performed only through a single heat dissipation plate, the heat dissipation effect is poor, and therefore a large-screen test circuit board is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a test circuit board of large screen to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a test circuit board of large screen, includes circuit board, electronic component and heating panel, electronic component is installed at the top of circuit board, the bottom of circuit board is connected with first heat conduction insulating layer, the bottom of first heat conduction insulating layer is connected with the metallics, and the bottom of metallics is connected with second heat conduction insulating layer, the bottom fixedly connected with heating panel of second heat conduction insulating layer, the intercommunication groove has been seted up in the heating panel, the both ends in intercommunication groove all communicate with the heating panel outside, equidistance fixedly connected with heat conduction post in the heating panel.
Preferably, the communication groove in the heat dissipation plate is formed in a spiral shape as a whole.
Preferably, the circuit board comprises a substrate, a first metal layer and a second metal layer, the top and the bottom of the substrate are fixedly connected with the first metal layer and the second metal layer respectively, a conductive pattern layer is formed on the surface of the first metal layer, and the electronic element is fixedly mounted on the surface of the first metal layer.
Preferably, the bottom of the heat dissipation plate is located under the electronic element and is provided with the semiconductor refrigeration piece, and the refrigeration end of the semiconductor refrigeration piece is connected with the heat dissipation plate.
Preferably, the bottom and the top of the heat conducting column are flush with the bottom and the equal distance of the heat dissipation plate respectively.
Preferably, the circuit board is provided with through holes at equal intervals below the electronic elements, the through holes are filled with high-thermal-conductivity glue, and the high-thermal-conductivity glue penetrates through the circuit board to be connected with the first thermal-conductivity insulating layer.
Preferably, the first metal layer and the second metal layer are both copper metal layers.
Preferably, the heat dissipation plate is an aluminum plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses at the top installation electronic component of circuit board, can make the circuit board produce more heat when electronic component during operation, the bottom that is located electronic component in the circuit board sets up the through-hole, and pack high heat conduction glue in the through-hole, make high heat conduction glue and the contact of first heat conduction insulating layer, realize the quick heat dissipation to the circuit board at electronic component position, first heat conduction insulating layer passes through the metal body with the heat on the circuit board simultaneously, second heat conduction insulating layer conduction is to heating panel department, the heat conduction post of installation is with heat transfer to outside in the heating panel, simultaneously through the bottom installation semiconductor refrigeration piece at the heating panel, can carry out quick cooling to the heating panel, this sets up the life of the extension circuit board of being convenient for, can be comparatively thorough dispel the heat to the circuit board.
2. The utility model discloses a set the circuit board to base plate, first metal level and second metal level, can be comparatively quick carry out heat-conduction, make heat transfer to first heat conduction insulating layer department, and then carry out heat-conduction in proper order, through set up the intercommunication groove in the heating panel, can let in the cold air current to the intercommunication inslot when dispelling the heat and carry out the cooling comprehensive to the heating panel fast, accelerated the heat dissipation to the heating panel.
Drawings
FIG. 1 is a schematic view of the overall internal structure of the present invention;
FIG. 2 is a schematic diagram of the circuit board structure of the present invention;
fig. 3 is a schematic sectional view of a top view of the heat dissipating plate of the present invention.
In the figure: 1. a circuit board; 2. an electronic component; 3. a through hole; 4. high thermal conductive glue; 5. a first thermally conductive insulating layer; 6. a metal body; 7. a second thermally conductive insulating layer; 8. a heat dissipation plate; 9. a heat-conducting column; 10. a semiconductor refrigeration sheet; 11. a communicating groove; 12. a substrate; 13. a first metal layer; 14. a second metal layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a test circuit board of large screen, includes circuit board 1, electronic component 2 and heating panel 8, electronic component 2 is installed at the top of circuit board 1, the bottom of circuit board 1 is connected with first heat conduction insulating layer 5, the bottom of first heat conduction insulating layer 5 is connected with metal body 6, and the bottom of metal body 6 is connected with second heat conduction insulating layer 7, the bottom fixedly connected with heating panel 8 of second heat conduction insulating layer 7, intercommunication groove 11 has been seted up in the heating panel 8, the both ends of intercommunication groove 11 all communicate with heating panel 8 outside, equidistance fixedly connected with heat conduction post 9 in the heating panel 8.
The communication groove 11 in the heat dissipation plate 8 is spiral as a whole, so that large-area heat dissipation can be conveniently performed in the heat dissipation plate 8.
The circuit board 1 comprises a substrate 12, a first metal layer 13 and a second metal layer 14, the top and the bottom of the substrate 12 are fixedly connected with the first metal layer 13 and the second metal layer 14 respectively, a conductive pattern layer is formed on the surface of the first metal layer 13, the electronic element 2 is fixedly installed on the surface of the first metal layer 13, and a certain heat dissipation effect can be achieved by arranging the first metal layer 13 and the second metal layer 14.
The bottom and the top of heat conduction post 9 flush with the bottom and the equidistance of heating panel 8 respectively, all communicate the top and the bottom of heat conduction post 9 with heating panel 8 outside, can conduct the heat on the second heat conduction insulating layer 7 to heating panel 8 outside fast, play better radiating effect.
Through holes 3 are formed in the circuit board 1 and located below the electronic elements 2 at equal intervals, high-heat-conduction glue 4 is filled in the through holes 3, the high-heat-conduction glue 4 penetrates through the circuit board 1 and is connected with the first heat-conduction insulating layer 5, and high heat at the position of the circuit board 1 where the electronic elements 2 are located can be rapidly conducted to the first heat-conduction insulating layer 5 through the high-heat-conduction glue 4.
The first metal layer 13 and the second metal layer 14 are both copper metal layers, so that the heat conducting performance is enhanced.
The heating panel 8 is aluminum plate, can heat conduction fast, realizes the quick heat dissipation to circuit board 1.
The working principle is as follows: an electronic element 2 is arranged on the top of a circuit board 1, when the electronic element 2 works, the circuit board 1 can generate more heat, a through hole 3 is arranged at the bottom of the electronic element 2 in the circuit board 1, high heat-conducting glue 4 is filled in the through hole 3, the high heat-conducting glue 4 is contacted with a first heat-conducting insulating layer 5, the circuit board 1 at the position of the electronic element 2 is quickly radiated, meanwhile, the first heat-conducting insulating layer 5 conducts the heat on the circuit board 1 to a radiating plate 8 through a metal body 6 and a second heat-conducting insulating layer 7, a heat-conducting column 9 arranged in the radiating plate 8 transfers the heat to the outside, meanwhile, a semiconductor sheet 10 is arranged at the bottom of the radiating plate 8, the radiating plate 8 can be quickly cooled, the circuit board 1 is composed of a substrate 12, a first metal layer 13 and a second metal layer 14, the heat conduction can be quickly carried out, and the heat is transferred to the first heat, further, heat conduction is performed in sequence, and the communication groove 11 is formed in the heat dissipation plate 8, so that cold air flow can be introduced into the communication groove 11 during heat dissipation to rapidly cool the heat dissipation plate 8 comprehensively, and heat dissipation of the heat dissipation plate 8 is accelerated.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a test circuit board of large screen, includes circuit board (1), electronic component (2) and heating panel (8), its characterized in that: electronic component (2) are installed at the top of circuit board (1), the bottom of circuit board (1) is connected with first heat conduction insulating layer (5), the bottom of first heat conduction insulating layer (5) is connected with metal body (6), and the bottom of metal body (6) is connected with second heat conduction insulating layer (7), the bottom fixedly connected with heating panel (8) of second heat conduction insulating layer (7), intercommunication groove (11) have been seted up in heating panel (8), the both ends of intercommunication groove (11) all communicate with heating panel (8) outside, equidistance fixedly connected with heat conduction post (9) in heating panel (8).
2. The large screen test circuit board of claim 1, wherein: the whole communicating groove (11) in the heat radiating plate (8) is spiral.
3. The large screen test circuit board of claim 1, wherein: the circuit board (1) comprises a substrate (12), a first metal layer (13) and a second metal layer (14), the top and the bottom of the substrate (12) are fixedly connected with the first metal layer (13) and the second metal layer (14) respectively, a conductive pattern layer is formed on the surface of the first metal layer (13), and the electronic element (2) is fixedly installed on the surface of the first metal layer (13).
4. The large screen test circuit board of claim 1, wherein: the bottom of the heat dissipation plate (8) is located under the electronic element (2) and is provided with a semiconductor refrigeration piece (10), and the refrigeration end of the semiconductor refrigeration piece (10) is connected with the heat dissipation plate (8).
5. The large screen test circuit board of claim 1, wherein: the bottom and the top of the heat conducting column (9) are respectively flush with the bottom and the equal distance of the heat radiating plate (8).
6. The large screen test circuit board of claim 1, wherein: through-hole (3) have been seted up to the below equidistance that lies in electronic component (2) in circuit board (1), and through-hole (3) intussuseption is filled with high heat conduction glue (4), high heat conduction glue (4) run through circuit board (1) and are connected with first heat conduction insulating layer (5).
7. The large screen test circuit board of claim 3, wherein: the first metal layer (13) and the second metal layer (14) are both copper metal layers.
8. The large screen test circuit board of claim 1, wherein: the heat dissipation plate (8) is an aluminum plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920580546.7U CN210072029U (en) | 2019-04-25 | 2019-04-25 | Test circuit board of large screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920580546.7U CN210072029U (en) | 2019-04-25 | 2019-04-25 | Test circuit board of large screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210072029U true CN210072029U (en) | 2020-02-14 |
Family
ID=69449137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920580546.7U Expired - Fee Related CN210072029U (en) | 2019-04-25 | 2019-04-25 | Test circuit board of large screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210072029U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584444A (en) * | 2020-05-12 | 2020-08-25 | 京东方科技集团股份有限公司 | Display module and display device |
-
2019
- 2019-04-25 CN CN201920580546.7U patent/CN210072029U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584444A (en) * | 2020-05-12 | 2020-08-25 | 京东方科技集团股份有限公司 | Display module and display device |
| CN111584444B (en) * | 2020-05-12 | 2022-06-24 | 京东方科技集团股份有限公司 | Display module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200214 Termination date: 20210425 |
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| CF01 | Termination of patent right due to non-payment of annual fee |