CN216391499U - Ceramic circuit board - Google Patents
Ceramic circuit board Download PDFInfo
- Publication number
- CN216391499U CN216391499U CN202121386547.1U CN202121386547U CN216391499U CN 216391499 U CN216391499 U CN 216391499U CN 202121386547 U CN202121386547 U CN 202121386547U CN 216391499 U CN216391499 U CN 216391499U
- Authority
- CN
- China
- Prior art keywords
- heat
- ceramic
- silica gel
- conducting
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A ceramic circuit board comprises two ceramic substrates, a plurality of conductive circuit layers arranged on the inner side and the outer side of the ceramic substrates, and a heat dissipation device detachably arranged on the outer side of the ceramic substrates; one side of each of the two ceramic substrates, which is adjacent to the middle conductive circuit layer, is provided with a limiting groove, and the bottom surface of each limiting groove is provided with a wavy surface; a heat-conducting silica gel layer is arranged in the limiting groove, and silica gel grease is coated on the outer surface of the heat-conducting silica gel layer; the surface of the heat-conducting silica gel layer, which is in contact with the ceramic substrate, is also arranged in a wave shape, and the surface of one side of the heat-conducting silica gel layer, which is in contact with the conducting circuit layer, is horizontally arranged; the heat dissipation device is characterized in that a clamping groove is formed in the outer side face of the ceramic substrate, and a convex block is arranged on the heat dissipation device and clamped in the clamping groove. The circuit board has the advantages that the heat conduction and the heat dissipation performance of the circuit board are greatly improved, the practicability is high, and the popularization significance is high.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a ceramic circuit board.
Background
The current circuit boards include ceramic circuit boards, PCB boards, aluminum ultrathin circuit boards, printed circuit boards and the like; the circuit board enables the circuit to be miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electric appliance layout, and is widely used in modern industrial production and daily life of people.
However, the heat dissipation efficiency of the existing circuit board is low, especially the multilayer circuit board increases along with the increase of the number of the composite layers, the thickness of the circuit board is also increased, the heat in the middle of the circuit board is not easy to be dissipated to the outside, the phenomenon that the temperature of the circuit board is quickly raised in the working process is easy to occur, the temperature of the circuit board is high, the problem of high-temperature damage of the circuit board is caused, and the high-temperature resistance of the circuit board is greatly reduced.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model aims to provide a ceramic circuit board to solve the problem of low heat dissipation efficiency of the traditional circuit board.
A ceramic circuit board comprises two ceramic substrates, a plurality of conductive circuit layers arranged on the inner side and the outer side of the ceramic substrates, and a heat dissipation device detachably arranged on the outer side of the ceramic substrates; one side of each of the two ceramic substrates, which is adjacent to the middle conductive circuit layer, is provided with a limiting groove, and the bottom surface of each limiting groove is provided with a wavy surface; a heat-conducting silica gel layer is arranged in the limiting groove, and silica gel grease is coated on the outer surface of the heat-conducting silica gel layer; the surface of the heat-conducting silica gel layer, which is in contact with the ceramic substrate, is also arranged in a wave shape, and the surface of one side of the heat-conducting silica gel layer, which is in contact with the conducting circuit layer, is horizontally arranged; the heat dissipation device is characterized in that a clamping groove is formed in the outer side face of the ceramic substrate, and a convex block is arranged on the heat dissipation device and clamped in the clamping groove.
Furthermore, the ceramic substrate is also provided with vertical and longitudinal extending heat conduction holes, wherein the vertical heat conduction holes vertically penetrate through the ceramic substrate, and the transverse extending heat conduction holes are communicated with the adjacent vertical heat conduction holes and penetrate through the outer side surface of the ceramic substrate.
Furthermore, the heat dissipation device further comprises a bottom plate and a plurality of fins arranged on the outer side of the bottom plate, the protruding block is arranged on the inner side of the bottom plate, and elastic bulges are arranged on the side faces of the protruding block.
Furthermore, a groove which penetrates through the groove on the end face of the outer side of the ceramic substrate and is not filled in the heat conducting hole is partially formed, a groove communicated with the clamping groove is formed, and the elastic bulge is clamped in the groove.
Further, heat conduction silica gel is filled in the heat conduction holes.
Furthermore, the cross section of the fin is arranged in a C shape.
In summary, the double-layer ceramic substrate of the present invention increases the contact area between the ceramic substrate and the conductive circuit layer by the heat conductive silica gel layer and the wavy surface, so as to improve the heat conductive effect and enable the heat of the conductive circuit layer to be rapidly transferred to the ceramic plate. In addition, the arrangement of the detachable heat dissipation plate can not only increase the heat dissipation area of the ceramic substrate, but also play a certain protection role on the ceramic substrate. The utility model has strong practicability and stronger popularization significance.
Drawings
FIG. 1 is a schematic structural view of a ceramic circuit board according to the present invention, wherein a heat dissipation device is not shown;
FIG. 2 is a partially exploded view of FIG. 1;
fig. 3 is a schematic structural diagram of another embodiment in fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1 and fig. 2, a ceramic circuit board is provided, which is a multilayer circuit board and includes two ceramic substrates 10, a plurality of conductive circuit layers 20 disposed on the inner and outer sides of the ceramic substrates 10, and a heat dissipation device 30 detachably disposed on the outer side of the ceramic substrates 10.
And one side of each of the two ceramic substrates 10 adjacent to the middle conductive circuit layer 20 is provided with a limiting groove, and the bottom surface of each limiting groove is provided with a wavy surface. Be provided with heat conduction silica gel layer 40 in this spacing recess, the coating of heat conduction silica gel layer 40 surface has silica gel fat. The surface of the heat conductive silica gel layer 40 contacting the ceramic substrate 10 is also in a wave shape, and the surface of the side contacting the conductive circuit layer 20 is horizontally arranged. The arrangement of the wavy surface can increase the contact area between the ceramic substrate 10 and the conductive circuit layer 20, thereby improving the heat conduction effect and enabling the heat energy of the conductive circuit layer 20 to be rapidly transferred to the ceramic plate. It is understood that in other embodiments, a heat conductive silicone layer may also be disposed between the ceramic substrate 10 and the outer conductive circuit layer 20.
The ceramic substrate 10 is further provided with vertical and longitudinally extending heat conduction holes 11, wherein the vertical heat conduction holes 11 penetrate through the ceramic substrate 10 from top to bottom, and the transversely extending heat conduction holes 11 are communicated with the adjacent vertical heat conduction holes 11 and penetrate through the outer side face of the ceramic substrate 10. And the heat conducting holes 11 are filled with heat conducting silica gel. The groove penetrating the outer end face of the ceramic substrate 10 is partially unfilled in the heat conduction hole 11 to form a recess. In addition, the ceramic substrate 10 is further provided with a clamping groove 12, wherein a groove at an outer side end of the transverse heat conduction hole 11 is communicated with the clamping groove 12.
The heat dissipation device 30 includes a bottom plate 31, a protrusion 32 disposed inside the bottom plate 31, and a plurality of fins 33 disposed outside the bottom plate 31, wherein the protrusion 32 is clamped in the slot 12, an elastic protrusion 34 is disposed on a side surface of the protrusion 32, and an outer surface of the elastic protrusion 34 is disposed in a spherical shape, thereby facilitating guiding. The cross section of the fin 33 is arranged in a C shape, and the arrangement of the shape structure not only has a larger heat dissipation area, but also has certain protection safety performance. The bottom plate 31 and the fins 33 may protect the ceramic substrate to some extent, which may prevent foreign objects from directly striking the ceramic substrate 10.
During installation, the bump 32 is clamped into the convex groove 12, the elastic protrusion 34 is compressed inwards, and when the elastic protrusion 34 reaches the groove position of the outer side end of the corresponding transverse heat conduction hole 11, the elastic protrusion 34 protrudes towards the ceramic substrate 10 and is clamped into the ceramic substrate, so that the heat dissipation device 30 is installed more stably, the heat conduction area can be increased, and the heat conduction speed is increased. Furthermore, as shown in fig. 3, the heat dissipation device 30a is a structure that can be simultaneously engaged with the two ceramic substrates 10, so that the heat dissipation area can be increased in a wider range, and the mounting can be completed at one time, and the detachable mounting does not affect the processing of the whole circuit board; meanwhile, in the subsequent use process, the detachable and replaceable cover is convenient.
In summary, the double-layer ceramic substrate 10 of the present invention has the heat conductive silicone layer 40 and the wavy surface, so that the contact area between the ceramic substrate 10 and the conductive circuit layer 20 is increased, the heat conductive effect is improved, and the heat of the conductive circuit layer 20 can be rapidly transferred to the ceramic plate. In addition, the detachable heat dissipation plate 30 can not only increase the heat dissipation area of the ceramic substrate 10, but also protect the ceramic substrate 10 to a certain extent. The utility model has strong practicability and stronger popularization significance.
The above-mentioned embodiments only represent one embodiment of the present invention, and the description is specific and detailed, but not understood as the limitation of the scope of the utility model, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the concept of the present invention, and these are within the scope of the utility model, and therefore, the scope of the utility model should be determined by the appended claims.
Claims (6)
1. A ceramic wiring board characterized in that: the heat dissipation device comprises two ceramic substrates, a plurality of conductive circuit layers arranged on the inner side and the outer side of the ceramic substrates and a heat dissipation device detachably arranged on the outer side of the ceramic substrates; one side of each of the two ceramic substrates, which is adjacent to the middle conductive circuit layer, is provided with a limiting groove, and the bottom surface of each limiting groove is provided with a wavy surface; a heat-conducting silica gel layer is arranged in the limiting groove, and silica gel grease is coated on the outer surface of the heat-conducting silica gel layer; the surface of the heat-conducting silica gel layer, which is in contact with the ceramic substrate, is also arranged in a wave shape, and the surface of one side of the heat-conducting silica gel layer, which is in contact with the conducting circuit layer, is horizontally arranged; the heat dissipation device is characterized in that a clamping groove is formed in the outer side face of the ceramic substrate, and a convex block is arranged on the heat dissipation device and clamped in the clamping groove.
2. The ceramic wiring board of claim 1, wherein: the ceramic substrate is also provided with vertical and longitudinally extending heat conducting holes, wherein the vertical heat conducting holes vertically penetrate through the ceramic substrate, and the transversely extending heat conducting holes are communicated with the adjacent vertical heat conducting holes and penetrate through the outer side surface of the ceramic substrate.
3. The ceramic wiring board of claim 2, wherein: the heat dissipation device further comprises a bottom plate and a plurality of fins arranged on the outer side of the bottom plate, the protruding block is arranged on the inner side of the bottom plate, and elastic bulges are arranged on the side faces of the protruding block.
4. The ceramic wiring board of claim 3, wherein: the part of the groove penetrating through the groove on the end face of the outer side of the ceramic substrate and the heat conducting hole is not filled and forms a groove communicated with the clamping groove, and the elastic bulge is clamped in the groove.
5. The ceramic wiring board of claim 2, wherein: and heat-conducting silica gel is filled in the heat-conducting holes.
6. The ceramic wiring board of claim 3, wherein: the cross section of the fin is arranged in a C shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121386547.1U CN216391499U (en) | 2022-01-13 | 2022-01-13 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121386547.1U CN216391499U (en) | 2022-01-13 | 2022-01-13 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216391499U true CN216391499U (en) | 2022-04-26 |
Family
ID=81215641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121386547.1U Active CN216391499U (en) | 2022-01-13 | 2022-01-13 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216391499U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116156815A (en) * | 2023-02-27 | 2023-05-23 | 东台施迈尔新材料科技有限公司 | Alumina ceramic substrate of oxygen sensor |
-
2022
- 2022-01-13 CN CN202121386547.1U patent/CN216391499U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116156815A (en) * | 2023-02-27 | 2023-05-23 | 东台施迈尔新材料科技有限公司 | Alumina ceramic substrate of oxygen sensor |
| CN116156815B (en) * | 2023-02-27 | 2023-11-07 | 东台施迈尔新材料科技有限公司 | Alumina ceramic substrate of oxygen sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201827857U (en) | Heat conducting structure of LED light source | |
| CN216391499U (en) | Ceramic circuit board | |
| CN212517183U (en) | High-efficient heat radiation structure of IGBT module | |
| CN203523231U (en) | Integrated radiator | |
| CN212851195U (en) | Printed circuit board | |
| CN216852500U (en) | Circuit board with better heat dissipation effect | |
| CN107949160A (en) | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN209861242U (en) | High-efficient radiating PCB board | |
| CN203057695U (en) | Ceramic circuit board | |
| CN207382669U (en) | A kind of double-sided PCB board with radiator structure | |
| CN213462437U (en) | Circuit board with good heat dissipation effect | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN215345227U (en) | Multilayer circuit board with non-porous surface | |
| CN209930602U (en) | Novel circuit board | |
| CN217389091U (en) | Multi-layer heat dissipation type ceramic substrate | |
| CN212851186U (en) | Circuit board with insulating layer for automobile | |
| CN211656502U (en) | High heat dissipating aluminium base board | |
| CN212278536U (en) | Tin spraying circuit board | |
| CN210257528U (en) | High-voltage-resistant high-thermal-conductivity aluminum-based copper-clad plate | |
| CN212587483U (en) | High-heat-dissipation semiconductor product and electronic product | |
| CN212587484U (en) | Dual-heat-dissipation semiconductor product and electronic product | |
| CN211980603U (en) | Semiconductor product and electronic product with bottom surface heat dissipation plate | |
| CN217306486U (en) | Double-sided heat dissipation aluminum substrate | |
| CN211980602U (en) | High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |