CN206364063U - CSP LED expand encapsulating structure, circuit board and the lighting device of pad - Google Patents
CSP LED expand encapsulating structure, circuit board and the lighting device of pad Download PDFInfo
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- CN206364063U CN206364063U CN201720008535.2U CN201720008535U CN206364063U CN 206364063 U CN206364063 U CN 206364063U CN 201720008535 U CN201720008535 U CN 201720008535U CN 206364063 U CN206364063 U CN 206364063U
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- Prior art keywords
- pad
- surface mount
- mount elements
- sheet metal
- area
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Abstract
The utility model is related to technical field of semiconductor encapsulation, disclose encapsulating structure, circuit board and lighting device that CSP LED expand pad, it includes at least two pads of surface mount elements and the one side located at surface mount elements, it is provided with pad and the one-to-one sheet metal of pad, the area of sheet metal is more than or equal to the area of pad, and is each formed with gap between any two sheet metal and any two pad.By being set and the one-to-one sheet metal of pad on pad, and area of the area more than or equal to pad of sheet metal, it can carry out expanding during paster the bonding area of pad, the work difficulty that surface mount elements carry out paster can be effectively reduced.Ampereconductors are increased by the surface for expanding pad indirectly, the operation difficulty of the wafer-level package in technique are reduced, and increase the area of dissipation of surface mount elements, it is to avoid heat aggregation causes the phenomenon that surface mount elements overheat is burnt.
Description
Technical field
The utility model is related to the technical field of semiconductor packages, more particularly to CSP LED expand pad encapsulating structure,
Circuit board and lighting device.
Background technology
CSP (Chip Scale Package) encapsulation is wafer-level package, and traditional C/S P encapsulation as shown in Figure 1 is straight
Connect by the use of the both positive and negative polarity pad on flip-chip as paster, and by the use of both positive and negative polarity pad as solder joint, but due to upside-down mounting core
The size limitation of piece causes the area of both positive and negative polarity pad minimum, is unfavorable for flip-chip using SMT (Surface Mount
Technology wiring board) is mounted on, and the spacing distance of both positive and negative polarity pad can closely cause short-circuit failure between paster excessively.
Traditional PLCC (Plastic Leaded Chip Carrier) encapsulation as shown in Figure 2, using using insulating materials
The support or base being made increase the area of pad, so as to reduce the difficulty of SMT paster techniques, but are due to support or base
Material be the insulating materials such as plastic cement or ceramic material, therefore its thermal conductivity extreme difference, cause heat accumulation on surface mount elements without
Passed under method, thus cause surface mount elements burn or the dead lamps of LED phenomenon.
Utility model content
The purpose of this utility model is to provide encapsulating structure, circuit board and illumination dress that a kind of CSP LED expand pad
Put, it is intended to solve surface mount elements present in prior art bonding pad area it is small be inconvenient to fill paste caused by patch, and heat aggregation
The problem of piece element burns.
The utility model embodiment provides the encapsulating structure that CSP LED expand pad, and CSP LED expand the encapsulation of pad
Structure, it includes being provided with least two pads of surface mount elements and the one side located at the surface mount elements, the pad
With the one-to-one sheet metal of the pad, the area of the sheet metal is more than or equal to the area of the pad, and any two
Gap is each formed between pad described in the individual sheet metal and any two.
Further, the gap that the gap between the sheet metal is more than or equal between the pad.
Further, the gap between the pad is 0.02~0.3mm.
Further, edge of the edge of the sheet metal without departing from the surface mount elements.
Further, the surface mount elements are mounted on connector by the sheet metal.
Further, the surface mount elements are sealed on the connector by packaging plastic.
Further, the surface mount elements use LED chip.
Further, the pad is electrically connected with least one negative electrode and at least one positive electrode respectively.
Another object of the present utility model is to provide a kind of circuit board, including the above-mentioned CSP LED of some uses expand
The surface mount elements that the encapsulating structure of pad is fitted on the circuit board.
Another object of the present utility model is to provide a kind of lighting device, including surface mount elements and circuit board, the patch
Piece element is connected with the circuit board using the CSP LED described above encapsulating structures for expanding pad.
Based on above-mentioned technical proposal compared with prior art, the CSP LED that the utility model embodiment is proposed expand pad
Encapsulating structure, circuit board and lighting device, by being set on pad and pad one-to-one sheet metal, and sheet metal
Area is more than or equal to the area of pad, can carry out expanding during paster the bonding area of pad, can effectively reduce paster
Element carries out the work difficulty of paster.Ampereconductors are increased by the surface for expanding pad indirectly, the chip in technique is reduced
The operation difficulty of level encapsulation, and increases the area of dissipation of surface mount elements, it is to avoid heat aggregation causes the surface mount elements overheat to burn
Phenomenon.
Brief description of the drawings
The sectional view that Fig. 1 encapsulates for CSP in the prior art；
The sectional view that Fig. 2 encapsulates for PLCC in the prior art；
Fig. 3 is the sectional view of the encapsulating structure of CSP LED expansion pads in the utility model embodiment；
Fig. 4 is the sectional view of circuit board in the utility model embodiment；
The stereogram of surface mount elements in the encapsulating structure for the CSP LED expansion pads that Fig. 5 is Fig. 3.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only to explain
The utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.
In addition, it should also be noted that, the orientation term such as left and right, upper and lower in the utility model embodiment, is only mutual
It is relative concept or using the normal operating condition of product as reference, and should not be regarded as restrictive.Tie below
Specific embodiment is closed realization of the present utility model is described in detail.
As shown in Figure 3 and Figure 4, the utility model embodiment proposes the encapsulating structure that CSP LED expand pad, and it includes
It is provided with and is corresponded with pad 3 at least two pads 3 of surface mount elements 2 and one side located at surface mount elements 2, pad 3
Sheet metal 4, the area of sheet metal 4 is more than or equal to the area of pad 3, any two sheet metal 4 and any two pad 3 it
Between be each formed with gap.
By being set and the one-to-one sheet metal 4 of pad 3 on pad 3, and the area of sheet metal 4 is more than or equal to weldering
The area of disk 3, can carry out expanding during paster the bonding area of pad 3, can effectively reduce surface mount elements 2 and carry out paster
Work difficulty.The surface increase Ampereconductors of pad 3 are expanded indirectly, and the operation for reducing the wafer-level package in technique is difficult
Degree, and increases the area of dissipation of surface mount elements 2, it is to avoid heat aggregation causes surface mount elements 2 to overheat the phenomenon burnt.
Specifically, pad 3 at least two, one sheet metal 4 of each correspondence of pad 3.Pass through the sheet metal 4 that area is larger
Expand the area of pad 3, and do not contacted between any two sheet metal 4, can effectively avoid the short circuit between pad 3.
Further, the gap that the gap between sheet metal 4 is more than or equal between pad 3.Specifically, any two is golden
Gap, and area of the area more than or equal to pad 3 of sheet metal 4 are each formed between category piece 4 and any two pad 3, i.e.,
Sheet metal 4 fits in side of the pad 3 away from the gap., can be with when sheet metal 4 can expand the bonding area of pad 3
Increase the gap between pad 3, not only reduce the operation difficulty of the wafer-level package in technique, also increase surface mount elements 2
Area of dissipation, it is to avoid heat aggregation causes surface mount elements 2 to overheat the phenomenon burnt.
Further, the gap between pad 3 is 0.02~0.3mm.Specifically, the gap between pad 3 is used to avoid
Short circuit between positive electrode 31 and negative electrode 32, can increase operation difficulty of the surface mount elements 2 when carrying out paster when gap is too small,
Conference is crossed in gap causes the edge of sheet metal 4 to exceed the edge of surface mount elements 2, so as to increase the area occupied of surface mount elements 2.
Certainly, according to actual conditions and real needs, in other embodiment of the present utility model, gap between pad 3 can be with
More than or equal to 0.3mm or less than 0.02mm, unique restriction is not made herein.
Further, edge of the edge of sheet metal 4 without departing from surface mount elements 2.Specifically, sheet metal 4 is arranged at pad 3
The projection of side away from surface mount elements 2, i.e. sheet metal 4 is positioned at the bottom of surface mount elements 2.The edge of sheet metal 4 exceeds paster
The area that the edge of element 2 can cause surface mount elements 2 to take is larger, increases the volume of surface mount elements 2.The edge of sheet metal 4
Without departing from the edge of surface mount elements 2, the gap between pad 3 can increased in the case of not increasing the volume of surface mount elements 2, with
And the bonding area of increase surface mount elements 2.
Further, surface mount elements 2 are mounted on connector (not shown) by sheet metal 4.Set if connector is top
There is naked copper area, surface mount elements 2 are attached at the top of connector, the i.e. bottom of surface mount elements 2 and the naked copper area of connector and fitted,
Pad 3 is arranged on the bottom of surface mount elements 2.Wherein, connector is preferably the circuit board 1 in Fig. 4.
Further, surface mount elements 2 are sealed on connector by packaging plastic 5.Specifically, packaging plastic 5 can be by paster member
Part 2 is sealed on connector, and packaging plastic 5 can play the effects such as moistureproof, dust-proof, secrecy.Wherein, what packaging plastic 5 can be completely
The outside of surface mount elements 2 is coated on, sheet metal 4 can protrude from packaging plastic 5, the inside of packaging plastic 5 can also be coated on, encapsulated
The material of glue 5 is light wave transformational substance, and it is preferably the mixture of silica gel and fluorescent material, and its main function is surface mount elements 2
When can light, blue light is converted into white light so that human eye can receive, larger stimulation will not be produced to human eye
Further, surface mount elements use LED chip.Specifically, LED chip is a kind of semiconductor devices of solid-state,
And LED chip is a kind of luminescence chip, light can be sent and larger heat energy can be produced, pad is expanded using CSP LED
Encapsulating structure being capable of increasing heat radiation area, it is to avoid occur the phenomenon of the dead lamp of LED chip.
Surface mount elements 1 can also use common flip LED chips, can effectively avoid flip LED from connecting respectively just
Spacing distance between the pad 3 of electrode 31 and negative electrode 32 is excessively near, so as to cause short-circuit failure between flip-chip, and keeps away
Exempting from the heat accumulation in flip-chip or LED chip can not pass down, so as to cause chip to burn the phenomenon with the dead lamps of LED.Certainly,
According to actual conditions and real needs, in other embodiment of the present utility model, surface mount elements can also include diode, tantalum
The elements such as matter electric capacity, do not make unique restriction herein.
Further, pad 3 is electrically connected with least one negative electrode 31 and at least one positive electrode 32 respectively.Specifically,
The positive electrode 31 and negative electrode 32 of surface mount elements 2 are arranged at the bottom surface of surface mount elements 2.Pad 3 is surface mount elements 2 and connector
The lead being connected, and positive electrode 31 is not in contact with negative electrode 32.Positive electrode 31 and negative electrode 32 are connected with sheet metal 4 respectively
Connect, effectively expand the contact area between positive electrode 31 and negative electrode 32 and connector, convenient welding.
Further, as shown in figure 5, the one side of the surface mount elements 2 offers holding tank 21, pad 3 is attached at receiving
The inside of groove 21.Specifically, holding tank 21 is arranged on the bottom surface of surface mount elements 2, it can effectively reduce the face shared by pad 3
Product, the height of pad 3 is more than or equal to the height of holding tank 21.Specifically, the height of pad 3 is higher to disclosure satisfy that pad 3 is made
Surface mount elements 2 are fixed on to the purpose on the inner surface of holding tank 21 for pad.
Another object of the present utility model is to provide in a kind of circuit board, including any of the above-described embodiment of some uses
CSP LED expand the surface mount elements 2 that the encapsulating structure of pad is fitted on circuit board 1.
By being set and the one-to-one sheet metal 4 of pad 3 on pad 3, and the area of sheet metal 4 is more than or equal to weldering
The area of disk 3, can carry out expanding during paster the bonding area of pad 3, can effectively reduce surface mount elements 2 and carry out paster
Work difficulty.The surface increase Ampereconductors of pad 3 are expanded indirectly, and the operation for reducing the wafer-level package in technique is difficult
Degree, and increases the area of dissipation of surface mount elements 2, it is to avoid heat aggregation causes surface mount elements 2 to overheat the phenomenon burnt.
Another object of the present utility model is to provide a kind of lighting device, and it includes surface mount elements 2 and circuit board 1, patch
Piece element 2 is connected with circuit board 1 using the encapsulating structures for expanding pad of the CSP LED in any of the above-described embodiment.
By being set and the one-to-one sheet metal 4 of pad 3 on pad 3, and the area of sheet metal 4 is more than or equal to weldering
The area of disk 3, can carry out expanding during paster the bonding area of pad 3, can effectively reduce surface mount elements 2 and carry out paster
Work difficulty.The surface increase Ampereconductors of pad 3 are expanded indirectly, and the operation for reducing the wafer-level package in technique is difficult
Degree, and increases the area of dissipation of surface mount elements 2, it is to avoid heat aggregation causes surface mount elements 2 to overheat the phenomenon burnt.
Above example, only the utility model embodiment, but protection domain of the present utility model do not limit to
In this, any one skilled in the art can readily occur in various in the technical scope that the utility model is disclosed
Equivalent modification, replace and improve etc., these modifications, replace and improve should all cover protection domain of the present utility model it
It is interior.Therefore, protection domain of the present utility model should be defined by scope of the claims.
Claims (10)
1.CSP LED expand the encapsulating structure of pad, it is characterised in that：It includes surface mount elements and located at the surface mount elements
Be provided with least two pads of one side, the pad with the one-to-one sheet metal of the pad, the sheet metal
Area is more than or equal to the area of the pad, and is respectively formed between pad described in sheet metal described in any two and any two
There is gap.
2. CSP LED as claimed in claim 1 expand the encapsulating structure of pad, it is characterised in that：Between the sheet metal
The gap that gap is more than or equal between the pad.
3. CSP LED as claimed in claim 1 expand the encapsulating structure of pad, it is characterised in that：Between between the pad
Gap is 0.02~0.3mm.
4. CSP LED as claimed in claim 1 expand the encapsulating structure of pad, it is characterised in that：The edge of the sheet metal
Without departing from the edge of the surface mount elements.
5. CSP LED as claimed in claim 1 expand the encapsulating structure of pad, it is characterised in that：The surface mount elements pass through
The sheet metal is mounted on connector.
6. CSP LED as claimed in claim 5 expand the encapsulating structure of pad, it is characterised in that：The surface mount elements are by sealing
Dress glue is sealed on the connector.
7. CSP LED as claimed in claim 1 expand the encapsulating structure of pad, it is characterised in that：The surface mount elements are used
LED chip.
8. CSP LED as claimed in claim 1 expand the encapsulating structure of pad, it is characterised in that：The pad respectively with extremely
A few negative electrode and at least one positive electrode are electrically connected.
9. circuit board, it is characterised in that：Expand pad including some CSP LED using as described in any one of claim 1 to 8
The surface mount elements that fit on the circuit board of encapsulating structure.
10. lighting device, it is characterised in that：Including surface mount elements and circuit board, the surface mount elements are used with the circuit board
The encapsulating structure that CSP LED as described in any one of claim 1 to 8 expand pad is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720008535.2U CN206364063U (en) | 2017-01-03 | 2017-01-03 | CSP LED expand encapsulating structure, circuit board and the lighting device of pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720008535.2U CN206364063U (en) | 2017-01-03 | 2017-01-03 | CSP LED expand encapsulating structure, circuit board and the lighting device of pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206364063U true CN206364063U (en) | 2017-07-28 |
Family
ID=59378757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720008535.2U Expired - Fee Related CN206364063U (en) | 2017-01-03 | 2017-01-03 | CSP LED expand encapsulating structure, circuit board and the lighting device of pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206364063U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109270719A (en) * | 2018-12-12 | 2019-01-25 | 惠科股份有限公司 | Display panel and display device |
| CN116646449A (en) * | 2023-06-02 | 2023-08-25 | 淮安澳洋顺昌光电技术有限公司 | LED packaging structure |
-
2017
- 2017-01-03 CN CN201720008535.2U patent/CN206364063U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109270719A (en) * | 2018-12-12 | 2019-01-25 | 惠科股份有限公司 | Display panel and display device |
| CN116646449A (en) * | 2023-06-02 | 2023-08-25 | 淮安澳洋顺昌光电技术有限公司 | LED packaging structure |
| CN116646449B (en) * | 2023-06-02 | 2024-02-13 | 淮安澳洋顺昌光电技术有限公司 | LED packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170728 Termination date: 20200103 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |