CN215268955U - Film structure for aligning inner layers of PCB multi-layer board - Google Patents
Film structure for aligning inner layers of PCB multi-layer board Download PDFInfo
- Publication number
- CN215268955U CN215268955U CN202121651217.0U CN202121651217U CN215268955U CN 215268955 U CN215268955 U CN 215268955U CN 202121651217 U CN202121651217 U CN 202121651217U CN 215268955 U CN215268955 U CN 215268955U
- Authority
- CN
- China
- Prior art keywords
- fan
- pad
- film
- shaped
- shaped pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
The utility model provides a film structure for aligning between PCB multiply wood inlayer layer, the border position of positive film and reverse side film all is provided with the discernment frame, is equipped with first fan-shaped PAD and the second fan-shaped PAD of symmetry setting in the discernment frame of positive film, is equipped with the third fan-shaped PAD and the fourth fan-shaped PAD of symmetry setting in the discernment frame of reverse side film, when positive film and reverse side film stack together, first fan-shaped PAD, second fan-shaped PAD, third fan-shaped PAD and fourth fan-shaped PAD form complete circular PAD jointly, and overlap and form the overlap region between two adjacent fan-shaped PADs; through set up fan-shaped PAD on the positive and negative film of base plate, thereby form complete circular PAD through fan-shaped PAD and observe whether to produce the light leak between the adjacent fan-shaped PAD, then explain two films of positive and negative counterpoint precision when the light leak appears and surpass the requirement, otherwise accord with the requirement, through this kind of counterpoint precision that the mode can be quick effectual judgement base plate, effectual reduction scrap cost.
Description
Technical Field
The utility model relates to a PCB production technical field especially relates to a film structure that is used for aiming at between PCB multiply wood inlayer layer.
Background
The PCB is called as a Printed Circuit Board, means a Printed Circuit Board, is an important electronic component, is also a support body of the electronic component, and is mainly manufactured by electronic printing; the laminated board is manufactured by tightly combining layers of a multilayer board at the high temperature of 200 ℃ and 230 ℃ under the high-temperature and high-pressure condition, the temperature of the laminated board after being pressed down is 50-80 ℃, and the size stability of expansion and contraction of the produced board is extremely unstable due to overhigh temperature, so that the next production process x-ray target locking operation cannot be directly carried out, and the product quality is influenced.
In the prior art, in the production process of a PCB, when inner layers of four or more boards are produced, the most important control point is whether the alignment of front and back film patterns on the same substrate of the inner layer can meet the requirement of alignment precision, and the general requirement of alignment precision is +/-2 mil. If the requirement of alignment accuracy is exceeded, the quality yield will be affected, which causes the abnormal phenomena of too low yield and high scrap cost, and a new film structure is urgently needed to solve the problem.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists in the above-mentioned technique, the utility model provides a film structure that is used for aiming at between PCB multiply wood inlayer layer, through set up fan-shaped PAD on the positive and negative film of base plate, thereby form complete circular PAD through fan-shaped PAD and observe whether to produce the light leak between the adjacent fan-shaped PAD, when appearing the light leak then explain two films on the positive and negative counterpoint precision and surpass the requirement, otherwise accord with the requirement, through this kind of counterpoint precision that the mode can be quick effectual judgement base plate, effectual reduction scrap cost.
In order to realize the above-mentioned purpose, the utility model provides a film structure that is used for aiming at between PCB multiply wood inlayer layer, same inlayer base plate is including setting up respectively in positive film and the reverse side film of positive and negative, positive film with the border position of reverse side film all is provided with the discernment frame, be equipped with the first fan-shaped PAD and the fan-shaped PAD of second that the symmetry set up in the discernment frame of positive film, be equipped with the third fan-shaped PAD and the fourth fan-shaped PAD that the symmetry set up in the discernment frame of reverse side film, work as positive film with the reverse side film stacks when being in the same place, first fan-shaped PAD, the fan-shaped PAD of second, the fan-shaped PAD of third and the fan-shaped PAD of fourth form complete circular PAD jointly, and overlap and form the overlap region between two adjacent fan-shaped PADs.
Specifically, the method comprises the following steps: the colors of the first and second fan-shaped PADs are different from the colors of the third and fourth fan-shaped PADs.
Preferably, the method comprises the following steps: the colors of the first and second fan-shaped PADs and the colors of the third and fourth fan-shaped PADs are any two of blue, green, red, cyan, and orange.
Specifically, the method comprises the following steps: the identification frames are arranged at the four corners of the front film and the back film respectively.
Preferably, the method comprises the following steps: the identification frame is one of a circular frame, a square frame, a triangular frame and a polygonal frame.
Specifically, the method comprises the following steps: the side length of the identification outer frame is between 5mm and 7 mm.
Specifically, the method comprises the following steps: the width of the overlapping area is between 2mil and 3 mil.
Specifically, the method comprises the following steps: the first fan-shaped PAD, the second fan-shaped PAD, the third fan-shaped PAD and the fourth fan-shaped PAD are 1/4 circular arc fan-shaped PADs.
Preferably, the method comprises the following steps: the diameters of the first fan-shaped PAD, the second fan-shaped PAD, the third fan-shaped PAD and the fourth fan-shaped PAD are larger than the diameter of a complete circular PAD formed together.
Specifically, the method comprises the following steps: the sector radiuses of the first sector PAD, the second sector PAD, the third sector PAD and the fourth sector PAD are 2mm-3 mm.
The utility model has the advantages that: compared with the prior art, the utility model provides a pair of a film structure that is used for aiming at between PCB multiply wood inlayer layer, same inlayer base plate is including setting up in positive film and the reverse side film of positive and negative respectively, the border position of positive film and reverse side film all is provided with the discernment frame, be equipped with the first fan-shaped PAD and the second fan-shaped PAD of symmetry setting in the discernment frame of positive film, be equipped with the third fan-shaped PAD and the fourth fan-shaped PAD of symmetry setting in the discernment frame of reverse side film, when positive film and reverse side film stack together, first fan-shaped PAD, second fan-shaped PAD, third fan-shaped PAD and fourth fan-shaped PAD form complete circular PAD jointly, and overlap and form the overlap region between two adjacent fan-shaped PADs; through set up fan-shaped PAD on the positive and negative film of base plate, thereby form complete circular PAD through fan-shaped PAD and observe whether to produce the light leak between the adjacent fan-shaped PAD, then explain two films of positive and negative counterpoint precision when the light leak appears and surpass the requirement, otherwise accord with the requirement, through this kind of counterpoint precision that the mode can be quick effectual judgement base plate, effectual reduction scrap cost.
Drawings
FIG. 1 is a schematic view of the front and back films of the present invention during the lamination alignment;
FIG. 2 is a schematic view of the front film of the present invention;
fig. 3 is a schematic view of the reverse film of the present invention.
The main element symbols are as follows:
1. identifying a frame; 2. a third fan-shaped PAD; 3. a fourth sector PAD; 4. a first sector PAD; 5. a second sector PAD; 6. an overlap region.
Detailed Description
In order to make the present invention clearer, the present invention will be further described with reference to the accompanying drawings.
In the prior art, in the production process of a PCB, when inner layers of four or more boards are produced, the most important control point is whether the alignment of front and back film patterns on the same substrate of the inner layer can meet the requirement of alignment precision, and the general requirement of alignment precision is +/-2 mil. If the requirement of alignment accuracy is exceeded, the quality yield will be affected, which causes the abnormal phenomena of too low yield and high scrap cost, and a new film structure is urgently needed to solve the problem.
For solving the defect and not enough among the prior art, the utility model particularly provides a film structure that is used for aiming at between PCB multiply wood inlayer layer, please refer to fig. 1-3, same inlayer base plate is including setting up in positive film and the reverse side film of positive and negative respectively, the border position of positive film and reverse side film all is provided with discernment frame 1, be equipped with first fan-shaped PAD4 and the second fan-shaped PAD5 of symmetry setting in the discernment frame 1 of positive film, be equipped with third fan-shaped PAD2 and the fourth fan-shaped PAD3 of symmetry setting in the discernment frame 1 of reverse side film, when positive film and reverse side film stack together, first fan-shaped PAD4, second fan-shaped PAD5, third fan-shaped PAD2 and fourth fan-shaped PAD3 form complete circular PAD jointly, and overlap and form overlap area 6 between two adjacent fan-shaped PADs; before the inner layer is produced, the films on the front and back surfaces of the same substrate are aligned. In order to judge whether the films on the front and back surfaces are aligned in time during production and whether the alignment precision requirement is met. Interlayer alignment patterns as shown in the figure are added on the four corners of the front and back films respectively; the purpose of forming the overlapping area 6 is to leave a floating space with precision, the overlapping area 6 is a floating limit value, when the alignment patterns of front and back films are inaccurate, when the patterns are accurately aligned, a film shift phenomenon is generated, which is not easy to observe, the first fan-shaped PAD4, the second fan-shaped PAD5, the third fan-shaped PAD2 and the fourth fan-shaped PAD3 which are arranged in the application form a complete circular PAD together, so that the amount of shift can be known clearly through whether light leakage occurs between adjacent fan-shaped PADs, and thus whether front and back films are aligned can be rapidly judged.
In the present embodiment, mention is made of: the colors of the first fan PAD4 and the second fan PAD5 are different from the colors of the third fan PAD2 and the fourth fan PAD 3; the fan-shaped PADs with different colors can form overlapping areas with completely different colors in the overlapping area 6, so that the width of the color of the overlapping part is the offset under the condition of offset, and the overlapping area is very intuitive; in a preferred embodiment, mention is made of: the colors of the first and second fan-shaped PAD4, 5 and the third and fourth fan-shaped PAD2, 3 are any two of blue, green, red, cyan and orange; the overlapping area 6 can be seen more visually with the above-mentioned colours, preferably in an already implemented example with the first and second fan PAD4, 5 being blue; the third fan PAD2 and the fourth fan PAD3 are red and the overlapping area 6 is yellow.
In the present embodiment, mention is made of: a plurality of identification frames 1 are arranged at the four corners of the front film and the back film respectively; in a preferred embodiment, mention is made of: identifying the outer frame as one of a circular outer frame, a square outer frame, a triangular outer frame and a polygonal outer frame; set up in the four corners position and can avoid producing the influence to the figure, guarantee more accurate counterpoint, in an example of having implemented, discern the square frame of frame.
In the present embodiment, mention is made of: the side length of the identification outer frame is between 5mm and 7mm, the identification outer frame can be better identified by 5mm to 7mm, and 5mm is preferably selected.
In the present embodiment, mention is made of: the width of the overlapping area 6 is between 2mil and 3 mil; preferably, 2mil is selected, the width of the overlapping area 6 is a floating range with reasonable accuracy, when the width exceeds the floating range, the overlapping area is not overlapped any more and light leaks, and at this time, it represents that the front and back films do not meet the accuracy requirement of alignment, and it is necessary to re-measure to confirm whether the films are normal or not.
In the present embodiment, mention is made of: the first fan PAD4, the second fan PAD5, the third fan PAD2, and the fourth fan PAD3 are 1/4 arc fan PADs; the diameters of the first fan PAD4, the second fan PAD5, the third fan PAD2, and the fourth fan PAD3 are larger than the diameters of the complete circular PADs collectively formed; the diameter of the fan-shaped PAD is larger than the diameter of the complete circular PAD formed together, so that the overlapping area 6 is formed only when aligned.
In the present embodiment, mention is made of: the sector radii of the first sector PAD4, the second sector PAD5, the third sector PAD2 and the fourth sector PAD3 are 2mm-3 mm; preferably 3 mm.
In a preferred embodiment, mention is made of: when the inner-layer film data is manufactured, identification outer frames, namely a first fan-shaped PAD4 and a second fan-shaped PAD5 are respectively added at four plate corners of the front film of the inner-layer substrate;
respectively adding an identification outer frame, a third fan-shaped PAD2 and a fourth fan-shaped PAD3 at the same positions of four corners of a film on the back surface of the inner layer substrate;
wherein the width of the overlapping area 6 of the first fan PAD4 and the fourth fan PAD3 is 2 mil; the width of the overlapping area 6 of the fourth fan-shaped PAD3 and the second fan-shaped PAD5 is 2 mils, the width of the overlapping area 6 of the second fan-shaped PAD5 and the third fan-shaped PAD2 is 2 mils, and the width of the overlapping area 6 of the third fan-shaped PAD2 and the first fan-shaped PAD4 is 2 mils.
When the film alignment precision is checked, the front films of the inner-layer base plates are firstly stacked together and placed on a light table. And completely overlapping and aligning the two films, respectively observing the alignment PADs on the four corners of the plate, and judging whether a light transmission phenomenon exists between two adjacent alignment PADs in the alignment patterns on the front and back films. If no light transmission phenomenon exists between two adjacent fan-shaped PADs at different layers of four corners, the front and back film alignment precision is within +/-2mil, and the production requirement can be met;
when the alignment patterns at four corners are observed, if a light transmission phenomenon occurs between two adjacent fan-shaped PADs in the front and back film alignment patterns, the alignment accuracy of the two front and back films exceeds the +/-2mil requirement, and then the alignment needs to be performed again.
When the alignment patterns on the four corners are observed, if the alignment pattern on only one corner has the alignment precision requirement exceeding +/-2mil and the alignment precision on the other three corners meets the requirement, the two films on the front side and the back side have different harmomegathus sizes, and the film needs to be measured again to determine whether to be normal.
The utility model has the advantages that:
through set up fan-shaped PAD on the positive and negative film of base plate, thereby form complete circular PAD through fan-shaped PAD and observe whether to produce the light leak between the adjacent fan-shaped PAD, then explain two films of positive and negative counterpoint precision when the light leak appears and surpass the requirement, otherwise accord with the requirement, through this kind of counterpoint precision that the mode can be quick effectual judgement base plate, effectual reduction scrap cost.
The above disclosure is only for the specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be made by those skilled in the art should fall within the protection scope of the present invention.
Claims (10)
1. The utility model provides a film structure that is used for aiming at between PCB multiply wood inlayer layer, same inlayer base plate is including setting up respectively in the positive film and the reverse side film of positive and negative, its characterized in that, the positive film with the border position of reverse side film all is provided with the discernment frame, be equipped with the first fan-shaped PAD and the fan-shaped PAD of second of symmetry setting in the discernment frame of positive film, be equipped with the third fan-shaped PAD and the fourth fan-shaped PAD of symmetry setting in the discernment frame of reverse side film, work as the positive film with the reverse side film stacks together, first fan-shaped PAD, the fan-shaped PAD of second, third fan-shaped PAD and the fan-shaped PAD of fourth form complete circular PAD jointly, and overlap and form the overlap region between two adjacent fan-shaped PADs.
2. A film structure for PCB multi-layer board interlayer alignment as recited in claim 1, wherein the first fan PAD and the second fan PAD are different colors than the third fan PAD and the fourth fan PAD.
3. A film structure for PCB multiwall interlayer alignment as recited in claim 2, wherein the colors of the first fan PAD and the second fan PAD and the third fan PAD and the fourth fan PAD are any two of blue, green, red, cyan, and orange.
4. The film structure for interlayer alignment of inner layers of a multilayer PCB board as claimed in claim 1, wherein the identification frame is provided in plurality and is respectively arranged at four corners of the front film and the back film.
5. A film structure for interlayer alignment of inner layers of a PCB multi-layer board according to claim 1, wherein the identification frame is one of a circular frame, a square frame, a triangular frame and a polygonal frame.
6. A film structure for the interlayer alignment of inner layers of a PCB multi-layer board according to claim 5, wherein the side length of the identification outer frame is between 5mm and 7 mm.
7. A film structure for interlayer alignment of inner layers of a PCB multi-layer board according to claim 1, wherein the width of the overlapping area is between 2mil and 3 mil.
8. A film structure for PCB multi-layer board interlayer alignment as recited in claim 1, wherein the first, second, third and fourth fan-shaped PADs are 1/4 arc fan-shaped PADs.
9. A film structure for PCB multi-layer board interlayer alignment as recited in claim 8, wherein the first, second, third and fourth fan-shaped PADs have a diameter larger than a diameter of a complete circular PAD formed together.
10. A film structure for interlayer alignment of inner layers of a PCB multi-layer board according to claim 1, wherein the first, second, third and fourth fan-shaped PADs have a fan radius of 2mm-3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121651217.0U CN215268955U (en) | 2021-07-20 | 2021-07-20 | Film structure for aligning inner layers of PCB multi-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121651217.0U CN215268955U (en) | 2021-07-20 | 2021-07-20 | Film structure for aligning inner layers of PCB multi-layer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215268955U true CN215268955U (en) | 2021-12-21 |
Family
ID=79493022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121651217.0U Active CN215268955U (en) | 2021-07-20 | 2021-07-20 | Film structure for aligning inner layers of PCB multi-layer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215268955U (en) |
-
2021
- 2021-07-20 CN CN202121651217.0U patent/CN215268955U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105072830A (en) | Layer deviation detection method | |
| CN101472405B (en) | Multi-layer circuit board manufacturing method | |
| CN105182680A (en) | Color-resistor mask plate and application method thereof | |
| CN112040675A (en) | Multilayer circuit board layer construction method | |
| CN215268955U (en) | Film structure for aligning inner layers of PCB multi-layer board | |
| CN110545616A (en) | PCB facilitating layer deviation monitoring and manufacturing method thereof | |
| CN105376963A (en) | Method for grabbing internal layer compensation coefficients | |
| JPH10163630A (en) | Multi-layer printed circuit board and its manufacturing method | |
| CN105611752A (en) | Manufacture method adopting inner layer pattern transfer exposure | |
| KR101932060B1 (en) | Method of increasing core matching ratio with changing guide position for X-ray drill | |
| CN211090108U (en) | Multilayer PCB circuit board with mistake proofing layer | |
| JPH0878273A (en) | Production of multilayer electronic device | |
| CN109287080A (en) | The compression method of asymmetric core plate and asymmetric core plate | |
| CN116489906A (en) | Printed circuit board inner core plate capable of preventing stacking fault and manufacturing method thereof | |
| CN106525114A (en) | Method for testing production line hole making capability in positive process | |
| JPS6151510A (en) | Inspecting method for interlayer deviation of multilayer printed board | |
| CN112504183B (en) | Hole deviation detection method | |
| CN110708896B (en) | Manufacturing method of HDI board | |
| CN210670766U (en) | Multilayer laminated PCB board | |
| KR101655928B1 (en) | Method of manufacturing a printed circuit board | |
| US20080186045A1 (en) | Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminate | |
| JPH09312235A (en) | Manufacture of electronic component | |
| CN108650795A (en) | Code printing method, processing method and the package substrate of package substrate | |
| CN212413708U (en) | Treatment tool for comprehensive detection of PCB (printed circuit board) processing capacity | |
| CN219628037U (en) | Composite target spot considering alignment of through hole and blind hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Shajing Town Xihuan Road Xihuan Jiaotang Industrial Zone, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Trustech Electronics Co.,Ltd. Address before: 518000 Shajing Town Xihuan Road Xihuan Jiaotang Industrial Zone, Bao'an District, Shenzhen City, Guangdong Province Patentee before: QUANCHENGXIN ELECTRONICS (SHENZHEN) CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder |