CN110545616A - PCB facilitating layer deviation monitoring and manufacturing method thereof - Google Patents
PCB facilitating layer deviation monitoring and manufacturing method thereof Download PDFInfo
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- CN110545616A CN110545616A CN201910790514.4A CN201910790514A CN110545616A CN 110545616 A CN110545616 A CN 110545616A CN 201910790514 A CN201910790514 A CN 201910790514A CN 110545616 A CN110545616 A CN 110545616A
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- pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a PCB convenient for monitoring layer deviation and a manufacturing method thereof, wherein the PCB convenient for monitoring layer deviation comprises a PCB, at least one alignment module is arranged on the PCB, the alignment module comprises a first target and a second target, wherein the first target has a harmomegathus compensation coefficient of 1: and 1, the expansion and contraction compensation coefficient of the second target corresponds to the expansion and contraction compensation coefficient of the PCB. The alignment module comprises a first target and a second target, wherein the first target expansion compensation coefficient is 1: the first target does not change along with the change of the expansion and shrinkage compensation coefficient of the PCB and is used for inspecting the layer deviation before lamination, the second target corresponds to the expansion and shrinkage compensation coefficient of the PCB along with the expansion and shrinkage compensation coefficient of the PCB, the second target correspondingly changes along with the change of the expansion and shrinkage compensation coefficient and is used for inspecting the layer deviation after lamination, and an operator can quickly and accurately judge the layer deviation condition of the PCB before lamination and after lamination in the production process, so that the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of PCBs (printed circuit boards), in particular to a PCB convenient for monitoring layer deviation and a manufacturing method thereof.
Background
In the production process of the PCB, different layer board cores need to be laminated, in order to ensure accurate alignment of each board core in the laminating process, a concentric circle alignment module is often designed on the PCB, the PCB is complex in design, the number of the board cores is large in the laminating process, in order to ensure that the size expansion and shrinkage of each layer board core of the PCB in the production process do not influence the performance of the PCB, different expansion and shrinkage compensation coefficients are sometimes needed for different layer boards, and different compensation coefficients lead to different lengths of different board cores, after the PCB with the structure is fused or riveted, the phenomenon that the concentric circles are tangent can occur in the traditional concentric circle design, so that operating personnel can not quickly and accurately judge whether the layer is a true layer or a false layer, the production difficulty is increased, the production difficulty is prolonged, and the production efficiency is low.
Disclosure of Invention
In order to solve the technical problems of high layer deviation judgment difficulty and low efficiency in the production process of the PCB, the invention provides the PCB convenient for monitoring the layer deviation and the manufacturing method thereof.
the invention discloses a PCB board convenient for monitoring layer deviation, which comprises: PCB board is provided with at least one counterpoint module on the PCB board, and the module of counterpointing includes: the first target and the second target, wherein the first target harmomegathus compensation coefficient is 1: and 1, the expansion and contraction compensation coefficient of the second target corresponds to the expansion and contraction compensation coefficient of the PCB.
According to an embodiment of the present invention, a PCB board includes: the multilayer coincide's board core in proper order, first target and second target all include: the diameters of the concentric circles are sequentially increased from the top surface to the bottom surface of the PCB and respectively correspond to one layer of board core.
According to one embodiment of the present invention, the edge spacing between two adjacent concentric circles is the same.
According to one embodiment of the present invention, the edge distance between two adjacent concentric circles is 0-6 mil.
According to an embodiment of the present invention, the number of the alignment modules is four, and the four alignment modules are respectively disposed at four corners of the long side or the short side of the PCB.
According to an embodiment of the present invention, the four alignment modules are symmetrical to each other.
the invention also discloses a manufacturing method of the PCB convenient for monitoring layer deviation, which comprises the following steps: the method comprises the following steps: the engineering data of preparation PCB board sets up at least one counterpoint module on the PCB board, and the counterpoint module includes: the first target and the second target, the compensation coefficient of the first target expansion and contraction is 1: 1, the expansion and contraction compensation coefficient of the second target corresponds to the expansion and contraction compensation coefficient of the PCB; and a second step: manufacturing the PCB according to the engineering data in the first step.
According to an embodiment of the present invention, step two: sequentially comprises pressing, drilling, copper/board plating, outer layer pattern plating, outer layer etching, solder resisting, character processing, surface processing and molding.
According to an embodiment of the invention, before lamination in the second step, the PCB is subjected to lamination front layer deviation detection according to the first target, if so, the position of the corresponding core is adjusted, and if not, the next step is continued.
According to an embodiment of the invention, after lamination in the second step, layer deviation detection is performed on the PCB after lamination according to the second target, if yes, the expansion and shrinkage compensation coefficient is adjusted, and if not, the next step is continued.
The invention relates to a PCB convenient for monitoring layer deviation and a manufacturing method thereof.A contraposition module comprises a first target and a second target, wherein the expansion and contraction compensation coefficient of the first target is 1: the first target does not change along with the change of the expansion and shrinkage compensation coefficient of the PCB and is used for inspecting the layer deviation before lamination, the second target corresponds to the expansion and shrinkage compensation coefficient of the PCB along with the expansion and shrinkage compensation coefficient of the PCB, and the second target correspondingly changes along with the change of the expansion and shrinkage compensation coefficient and is used for inspecting the layer deviation after lamination, so that an operator can quickly and accurately judge the layer deviation condition of the PCB before lamination and after lamination in the production process, the time consumption of production adjustment is reduced, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a PCB board facilitating layer deviation monitoring according to the present invention.
fig. 2 is a second schematic structural diagram of the PCB board for facilitating layer deviation monitoring according to the present invention.
Detailed Description
The PCB and the method for manufacturing the same are described in detail below with reference to specific embodiments.
Fig. 1 to 2 show a first schematic structural diagram and a second schematic structural diagram of a PCB board for facilitating layer deviation monitoring according to the present invention.
The invention provides a PCB board convenient for monitoring layer deviation, which comprises: PCB board 1, PCB board 1 is last to be provided with at least one counterpoint module 2, and counterpoint module 2 includes first target 201 and second target 202, and wherein first target 201 harmomegathus compensation coefficient is 1: 1, the expansion and contraction compensation coefficient of the second target 202 corresponds to the expansion and contraction compensation coefficient of the PCB board 1, in other words, the expansion and contraction compensation coefficient of the first target 201 does not change with the expansion and contraction compensation coefficient of the PCB board 1, and the expansion and contraction compensation coefficient of the second target 202 changes with the expansion and contraction compensation coefficient of the PCB board 1, so that the PCB board 1 can detect layer deviation through the first target 201 before lamination, thereby preventing layer deviation before lamination of the PCB board 1, and after lamination of the PCB board 1, because the PCB board 1 needs to pass through a high-temperature environment, each layer core 101 of the PCB board 1 is easy to expand and contract, and the expansion and contraction compensation coefficient of the second target 202 corresponds to the expansion and contraction compensation coefficient of the PCB board 1, the layer deviation after lamination of the PCB board 1 can be detected through the second target 202, thereby timely adjusting the production of the PCB board 1 and ensuring the product quality.
In this application, the PCB board 1 mainly includes the multiple layers of core 101 that coincide in proper order, and first mark target 201 and second mark target 202 all include a plurality of concentric circles, in other words, first mark target 201 and second mark target 202 all adopt the design of concentric circles, and wherein a plurality of concentric circles increase progressively in proper order and correspond a layer core 101 respectively by the top surface of PCB board 1 to bottom surface direction diameter, and so, through observing the skew position of concentric circles in first mark target 201 or second mark target 202 to obtain the core 101 position that takes place the layer partially fast, improve the operation personnel to the inclined detection efficiency in layer of PCB board 1. Wherein the edge interval between two adjacent concentric circles is the same for the operation personnel easily know the deviant of the core 101 that takes place the layer partially through observing the skew condition between the concentric circles, thereby carries out quick adjustment to production. Specifically, the edge distance between two adjacent concentric circles is 0-6mil, so that the first target 201 and the second target 202 are suitable for the sizes of more PCB boards 1 on the market, and the universality of the PCB board convenient for monitoring layer deviation is improved.
It should be noted that, in the present invention, the number of the alignment modules 2 is four, and the four alignment modules 2 are respectively disposed at four corners of the long side or the short side of the PCB 1, so that the operator can perform layer deviation detection on four corners of the PCB 1, thereby preventing missing detection caused by local layer deviation and further improving the precision of layer deviation detection. Further, the four alignment modules 2 are symmetrical with each other, so that the positions of the first target 201 and the second target 202 are the same and symmetrical, in other words, the first target 201 of the four alignment modules 2 is close to the inner side or the outer side at the same time, so that the detection positions of the four alignment modules 2 are the same, the precision of the high-level deviation detection is further improved, and meanwhile, the detection results of the four alignment modules 2 can be compared conveniently by an operator.
The invention also discloses a manufacturing method of the PCB convenient for monitoring layer deviation, which comprises the following steps:
The method comprises the following steps: the engineering data of preparation PCB board 1, for example adopt the engineering data of genetics preparation PCB board 1, wherein set up at least one counterpoint module 2 on the PCB board 1, counterpoint module 2 includes first target 201 and second target 202, and first target 201 harmomegathus compensation coefficient is 1: for example, the module attribute of the first target 201 is defined as out _ scale in the engineering data manufacturing process, and the expansion/contraction compensation coefficient of the second target 202 is set to correspond to the expansion/contraction compensation coefficient of the PCB 1 in the engineering data manufacturing process.
Step two: manufacturing the PCB 1 according to the engineering data in the step one, wherein the specific manufacturing process of the PCB 1 sequentially comprises pressing, drilling, copper/board plating, outer layer graph electroplating, outer layer etching, solder resisting, character processing, surface treatment and forming.
Before the laminating step in the second step of the method for manufacturing the PCB convenient for monitoring the layer deviation, the method also comprises the steps of judging whether the layer deviation exists before the laminating of the PCB 1 according to the first target 201, if so, adjusting the position of the corresponding board core, otherwise, continuing the next working procedure, thereby preventing the PCB 1 before the laminating from generating the layer deviation.
After the laminating step in the second step of the method for manufacturing the PCB facilitating the monitoring of the layer deviation, the method further comprises the following steps: and (3) carrying out lamination deviation detection on the PCB (printed circuit board) 1 according to the second target 202, if so, adjusting the expansion and shrinkage compensation coefficient, otherwise, continuing the next step of working procedure, thereby preventing the laminated PCB 1 from generating lamination deviation.
In summary, in the PCB convenient for monitoring layer deviation and the manufacturing method thereof of the present invention, the alignment module includes a first target and a second target, wherein a compensation coefficient of expansion and contraction of the first target is 1: the first target does not change along with the change of the expansion and shrinkage compensation coefficient of the PCB and is used for inspecting the layer deviation before lamination, the second target corresponds to the expansion and shrinkage compensation coefficient of the PCB along with the expansion and shrinkage compensation coefficient of the PCB, and the second target correspondingly changes along with the change of the expansion and shrinkage compensation coefficient and is used for inspecting the layer deviation after lamination, so that an operator can quickly and accurately judge the layer deviation condition of the PCB before lamination and after lamination in the production process, the time consumption of production adjustment is reduced, and the production efficiency is improved.
In the description of the present invention, it is to be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, all such alternatives, modifications, and variations are intended to be included within the spirit and scope of the present invention.
Claims (10)
1. A PCB board facilitating monitoring of layer bias, comprising: the PCB board, be provided with at least one counterpoint module on the PCB board, its characterized in that, the counterpoint module includes: the first target and the second target, wherein the first target harmomegathus compensation coefficient is 1: and 1, the expansion and contraction compensation coefficient of the second target corresponds to the expansion and contraction compensation coefficient of the PCB.
2. The PCB board facilitating monitoring of layer misalignment of claim 1, wherein the PCB board comprises: the multilayer coincide's board core in proper order, first target and second target all include: the diameters of the concentric circles are sequentially increased from the top surface to the bottom surface of the PCB and respectively correspond to one layer of the board core.
3. The PCB board for facilitating layer deviation monitoring of claim 2, wherein the edge spacing between two adjacent concentric circles is the same.
4. The PCB board facilitating layer deviation monitoring of claim 3, wherein an edge spacing between two adjacent concentric circles is 0-6 mil.
5. The PCB convenient for monitoring layer deviation as claimed in any one of claims 1 to 4, wherein the number of the alignment modules is four, and the four alignment modules are respectively arranged at four corners of the long side or the short side of the PCB.
6. The ladle with high safety according to claim 5, wherein the four aligning modules are symmetrical with each other.
7. A manufacturing method of a PCB convenient for monitoring layer deviation is characterized by comprising the following steps:
The method comprises the following steps: the engineering data of preparation PCB board sets up at least one counterpoint module on the PCB board, and the counterpoint module includes: the first target and the second target, the compensation coefficient of the first target expansion and contraction is 1: 1, the expansion and contraction compensation coefficient of the second target corresponds to the expansion and contraction compensation coefficient of the PCB;
Step two: manufacturing the PCB according to the engineering data in the first step.
8. The method as claimed in claim 8, wherein before lamination in the second step, the PCB is subjected to pre-lamination layer deviation detection according to the first target, if so, the corresponding core position is adjusted, otherwise, the next step is continued.
9. The method as claimed in claim 8, wherein before lamination in the second step, the PCB is subjected to pre-lamination layer deviation detection according to the first target, if so, the corresponding core position is adjusted, otherwise, the next step is continued.
10. The method as claimed in claim 8, wherein after the lamination in the second step, the laminated PCB is subjected to a post-lamination layer deviation detection, if so, the expansion/contraction compensation coefficient is adjusted, otherwise, the next step is continued.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910790514.4A CN110545616A (en) | 2019-08-26 | 2019-08-26 | PCB facilitating layer deviation monitoring and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910790514.4A CN110545616A (en) | 2019-08-26 | 2019-08-26 | PCB facilitating layer deviation monitoring and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN110545616A true CN110545616A (en) | 2019-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910790514.4A Pending CN110545616A (en) | 2019-08-26 | 2019-08-26 | PCB facilitating layer deviation monitoring and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN112714560A (en) * | 2021-03-29 | 2021-04-27 | 福莱盈电子股份有限公司 | Circuit board preparation method for preventing bending area from deviating |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN115023066A (en) * | 2021-03-04 | 2022-09-06 | 北大方正集团有限公司 | Multilayer PCB and interlayer deviation detection method thereof |
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| CN206332900U (en) * | 2016-10-17 | 2017-07-14 | 珠海杰赛科技有限公司 | Laminated construction printed board |
| CN105072830B (en) * | 2015-09-10 | 2019-04-02 | 江门崇达电路技术有限公司 | A kind of inclined detection method of layer |
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2019
- 2019-08-26 CN CN201910790514.4A patent/CN110545616A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105072830B (en) * | 2015-09-10 | 2019-04-02 | 江门崇达电路技术有限公司 | A kind of inclined detection method of layer |
| CN206332900U (en) * | 2016-10-17 | 2017-07-14 | 珠海杰赛科技有限公司 | Laminated construction printed board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN112911791B (en) * | 2021-01-29 | 2022-12-06 | 南通强达电路科技有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN115023066A (en) * | 2021-03-04 | 2022-09-06 | 北大方正集团有限公司 | Multilayer PCB and interlayer deviation detection method thereof |
| CN112714560A (en) * | 2021-03-29 | 2021-04-27 | 福莱盈电子股份有限公司 | Circuit board preparation method for preventing bending area from deviating |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191206 |
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| RJ01 | Rejection of invention patent application after publication |