CN116489906A - Printed circuit board inner core plate capable of preventing stacking fault and manufacturing method thereof - Google Patents
Printed circuit board inner core plate capable of preventing stacking fault and manufacturing method thereof Download PDFInfo
- Publication number
- CN116489906A CN116489906A CN202310604467.6A CN202310604467A CN116489906A CN 116489906 A CN116489906 A CN 116489906A CN 202310604467 A CN202310604467 A CN 202310604467A CN 116489906 A CN116489906 A CN 116489906A
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- layer
- core
- core plate
- board
- copper foil
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- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000010410 layer Substances 0.000 claims abstract description 178
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 239000011889 copper foil Substances 0.000 claims abstract description 65
- 238000003475 lamination Methods 0.000 claims abstract description 12
- 239000012790 adhesive layer Substances 0.000 claims abstract description 9
- 239000012792 core layer Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 9
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a printed circuit board inner core board capable of preventing error lamination, which at least comprises an adhesive layer, a copper foil and a core board layer; the core plate layer comprises a core plate and core plate copper foils fixed on the upper surface and the lower surface of the core plate; the number of the core plate layers is at least two, the plurality of core plate layers are fixedly connected together through bonding layers between the two adjacent core plate layers to form a core plate layer stack, bonding layers are arranged at two sides of the core plate layer stack, and copper foils are arranged at one side of the core plate layer stack, away from the bonding layers, of the core plate layer stack; the bonding layer and the core plate layer from the lowest core plate layer to the uppermost copper foil in the core plate laminated layers are provided with window parts, the sizes of the bonding layer and the core plate layer window parts which are adjacent from bottom to top are the same, and the core plate copper foil on the upper surface of the core plate layer is provided with a core plate layer mark corresponding to the window opening position of the upper adjacent core plate layer. According to the invention, the camera is used for photographing the layer identification of the core plate, the consistency of the layer identification is automatically compared and judged by the computer software and the standard picture, the accuracy is high, and the fault can be timely found and corrected.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing technology, in particular to a printed circuit board inner core board capable of preventing error lamination and a manufacturing method thereof.
Background
Printed circuit boards are one of the most basic and active industries in the electronics industry, and with the increasing development of semiconductor design and manufacturing technology, printed circuit boards are also developed towards ultra-thin, high-density, multi-layer, high-performance and the like; at present, the number of layers of the printed circuit board has reached 46 layers or more, so to speak, the high technology and high complexity of the printed circuit board has reached a fairly high level; the number of layers of the printed circuit board is larger, so that the number of the core boards is larger, if the core boards are managed and controlled by personnel during lamination, the core boards are prone to being overlapped in a leaking mode, and if the core boards are overlapped in a staggered mode in sequence, even if an electrical test flow is arranged before finished products are delivered, special products are difficult to detect.
Disclosure of Invention
The invention aims to overcome and supplement the defects in the prior art and provide a printed circuit board inner core board capable of preventing error lamination and a manufacturing method thereof. The technical scheme adopted by the invention is as follows:
a printed wiring board inner core panel that prevents stacking errors, wherein: the printed circuit board at least comprises an adhesive layer, a copper foil and a core board layer; the core plate layer comprises a core plate and core plate copper foils fixed on the upper surface and the lower surface of the core plate; the number of the core plate layers is at least two, the plurality of core plate layers are fixedly connected together through bonding layers between two adjacent core plate layers to form a core plate layer stack, bonding layers are arranged on two sides of the core plate layer stack, and copper foils are arranged on one side, away from the core plate layer stack, of the bonding layers; the bonding layer and the core plate layer from the lowest core plate layer to the uppermost copper foil in the core plate laminated layer are respectively provided with a window part, the sizes of the adjacent bonding layer and the window part of the core plate layer are the same from bottom to top, the window parts are sequentially increased from bottom to top and have the same width, the core plate copper foil on the upper surface of the core plate layer is provided with a core plate layer mark corresponding to the windowing position of the adjacent core plate layer above, and circuit patterns are manufactured on the copper foil and the core plate copper foil.
A manufacturing method of a printed circuit board inner core board capable of preventing stacking fault comprises the following steps: the method comprises the following specific steps:
s1, taking an adhesive layer, a copper foil and a core plate layer according to the final structure of a printed circuit board;
s2, manufacturing required pattern circuits on at least one side of a core board copper foil and a copper foil on the core board layer, and arranging a core board layer mark on the core board copper foil on the upper surface of the core board layer at a window position corresponding to an adjacent upper core board layer;
s3, windowing is carried out on the bonding layer between the lowest core plate layer and the uppermost copper foil in the core plate layer lamination and the core plate layer to form window parts, the window sizes of the bonding layer and the core plate adjacent from bottom to top are the same, and the lengths of the window parts from bottom to top are sequentially increased by the same width;
s4, stacking the copper foil, the core plate and the bonding layer to obtain a laminated board, wherein the laminated board does not comprise the uppermost copper foil, and the uppermost bonding layer of the laminated board can be visually identified by the core plate layer after stacking;
s5, photographing the windowing position of the laminated board, wherein the photographed picture can clearly identify the core board layer identification and is stored as a standard picture;
s6, manufacturing a plurality of laminated boards according to the steps S1-S4, photographing through a camera, storing pictures, automatically comparing the pictures with core board layer marks of standard pictures through computer software, automatically alarming errors if the pictures are not matched, passing the errors if the errors are matched, and then arranging copper foil at the uppermost part of the passed laminated boards to obtain the inner core board of the printed circuit board.
Preferably, the method for manufacturing the inner core board of the printed circuit board for preventing the stacking fault comprises the following steps: step S2, the core board layer is respectively identified as one of a number and a letter.
Preferably, the method for manufacturing the inner core board of the printed circuit board for preventing the stacking fault comprises the following steps: in the step S3, the length of the lowest window is a, the length of the window from bottom to top is na, n is the number of the window from bottom to top, and the widths of the windows are all the same.
Preferably, the method for manufacturing the inner core board of the printed circuit board for preventing the stacking fault comprises the following steps: the uppermost core layer identification in step S4 cannot block the core layer identification below.
The invention has the advantages that:
(1) The manufacturing method of the inner core plate of the printed circuit board for preventing the stacking fault, disclosed by the invention, uses the camera of the stacking table to photograph the layer identification of the core plate, and computer software and a standard picture are automatically compared to judge the consistency of the layer identification, so that the accuracy is high, and the stacking fault can be timely found and corrected.
(2) The manufacturing method of the inner core plate of the printed circuit board for preventing the stacking fault can process all the bonding layers and the windowing of the core plate layers by using the existing equipment, such as a forming machine, a punching machine and the like, does not need to invest new equipment, can effectively control the cost, synchronously manufacture the marks of the core plates when manufacturing the circuit patterns, does not need to add a new production flow, and can effectively control the production time.
Drawings
Fig. 1 is a schematic view of an inner core board of a printed circuit board according to embodiment 1 of the present invention.
Fig. 2 is a schematic view of an inner core board of a printed circuit board according to embodiment 2 of the present invention.
Fig. 3 is a schematic plan view of the inner core board window and the lowermost core board label of embodiment 2 of the present invention.
Fig. 4 is a schematic plan view of an inner core board window and an intermediate core board label of embodiment 2 of the present invention.
Fig. 5 is a schematic plan view of the inner core board window and the uppermost core board label of embodiment 2 of the present invention.
Fig. 6 is a schematic view of the inner core board window and all core board identifiers of the printed circuit board according to embodiment 2 of the present invention.
Description of the embodiments
The invention will be further described with reference to the following specific drawings and examples.
Examples
As shown in fig. 1, a printed wiring board inner core board for preventing stacking fault, wherein: the printed circuit board at least comprises an adhesive layer 3, a copper foil 1 and a core plate layer 2; the core plate layer comprises a core plate 2-1 and core plate copper foils 2-2 fixed on the upper surface and the lower surface of the core plate 2-1; the number of the core plate layers 2 is two, the two core plate layers 2 are fixedly connected together through the bonding layers 3 between the two adjacent core plate layers 2 to form a core plate layer stack, the bonding layers 3 are arranged on two sides of the core plate layer stack, and the copper foil 1 is arranged on one side of the core plate layer stack, away from the bonding layers 3; the bonding layer 3 and the core plate layer 2 between the lowest core plate layer 2 and the uppermost copper foil 1 in the core plate laminated layers are respectively provided with a window part, the sizes of the bonding layer and the core plate layer window parts which are adjacent from bottom to top are the same, the lengths of the bonding layer and the core plate layer window parts which are adjacent from bottom to top are sequentially increased to be the same, the core plate copper foil 2-2 on the upper surface of the core plate layer is provided with a core plate layer mark corresponding to the windowing position of the upper adjacent core plate layer 2, and circuit patterns are manufactured on the copper foil 1 and the core plate copper foil 2-2.
The manufacturing method of the inner core board of the printed circuit board for preventing the stacking fault of the embodiment comprises the following specific steps:
s1, taking an adhesive layer 3, a copper foil 1 and a core plate layer 2 according to the final structure of a printed circuit board;
s2, manufacturing required pattern circuits on at least one surface of the core plate copper foil 2-2 and at least one surface of the copper foil 1 on the core plate layer, and arranging core plate layer marks corresponding to window positions of the upper adjacent core plate layers 2 on the core plate copper foil 2-2 on the upper surface of the core plate layer 2, wherein the marks of the core plate layer 2 positioned below are letters "a", and the marks of the core plate layer 2 positioned above are letters "b";
s3, windowing the bonding layer 3 between the lowest core layer 2 and the uppermost copper foil 1 in the core plate layer lamination and the core plate layer 2 to form window parts, wherein the sizes of the bonding layer 3 adjacent from bottom to top and the window parts of the core plates 2 are the same, the window parts are sequentially increased from bottom to top and have the same width, the middle bonding layer 3 and the upper core plate layer 2 have the same window size and position, the length of the window part of the uppermost bonding layer 3 is 2a, and the widths of the window parts are the same;
s4, stacking the copper foil 1, the core plate 2 and the bonding layer 3 to obtain a laminated board, wherein the laminated board does not comprise the uppermost copper foil 1, and the bonding layer 3 on the uppermost side of the laminated board can be visually identified as a core plate layer respectively;
s5, photographing the windowing position of the laminated board, and enabling the photographed picture to clearly identify the core board layer identifiers 'a' and 'b', and storing the core board layer identifiers as standard pictures;
s6, manufacturing a plurality of laminated boards according to the steps S1-S4, photographing through a camera, storing pictures, automatically comparing the picture with core board layer identification "a" and "b" of a standard picture through computer software, automatically alarming errors if the comparison is not met, passing the errors, and then arranging a first copper foil at the uppermost part of the passed laminated boards to obtain the inner core board of the printed circuit board.
Examples
As shown in fig. 2, a printed wiring board inner core board for preventing stacking fault, wherein: the printed circuit board at least comprises an adhesive layer 3, a copper foil 1 and a core plate layer 2; the core plate layer comprises a core plate 2-1 and core plate copper foils 2-2 fixed on the upper surface and the lower surface of the core plate 2-1; the number of the core plate layers 2 is three, the three core plate layers 2 are fixedly connected together through bonding layers 3 between two adjacent core plate layers 2 to form a core plate layer lamination, bonding layers 3 are arranged on two sides of the core plate layer lamination, and copper foil 1 is arranged on one side of the core plate layer lamination away from the bonding layers 3; the bonding layer 3 and the core plate layer 2 between the lowest core plate layer 2 and the uppermost copper foil 1 in the core plate laminated layers are respectively provided with a window part, the sizes of the bonding layer and the core plate layer window parts which are adjacent from bottom to top are the same, the lengths of the bonding layer and the core plate layer window parts which are adjacent from bottom to top are sequentially increased, the widths of the bonding layer and the core plate layer window parts are the same, the core plate copper foil 2-2 on the upper surface of the core plate layer is provided with a core plate layer mark corresponding to the window opening position of the upper adjacent core plate layer 2, and circuit patterns are manufactured on the copper foil 1 and the core plate copper foil 2-2.
The manufacturing method of the inner core board of the printed circuit board for preventing the stacking fault of the embodiment is as follows, as shown in fig. 2-6:
s1, taking an adhesive layer 3, a copper foil 1 and a core plate layer 2 according to the final structure of a printed circuit board;
s2, manufacturing required pattern circuits on at least one surface of a core board copper foil 2-2 and a copper foil 1 on a core board layer, arranging a core board layer mark corresponding to a window position of an upper adjacent core board layer 2 on the core board copper foil 2-2 on the upper surface of the core board layer, wherein the mark of the core board layer 2 positioned below is a letter "4", the mark of the middle core board layer 2 is a letter "5", and the mark of the uppermost core board layer 2 is a letter "7";
s3, windowing the bonding layer 3 between the lowest core layer 2 and the uppermost copper foil 1 in the core layer lamination and the core layer 2 to form window parts, wherein the sizes of the adjacent bonding layer 3 and the window parts of the core layer 2 from bottom to top are the same; the size and the position of the window of the second bonding layer 3 and the middle core plate layer 2 are the same from bottom to top, and the length is a; the window opening sizes of the third bonding layer 3 and the uppermost core plate layer 2 are the same, the lengths of the window parts are sequentially increased from bottom to top, the lengths are 2a, the window opening length of the fourth bonding layer is 3a, and the widths of the window parts are the same;
s4, stacking the copper foil 1, the core plate 2 and the bonding layer 3 to obtain a laminated board, wherein the laminated board does not comprise the uppermost copper foil 1, and the bonding layer 3 on the uppermost side of the laminated board can be visually identified as a core plate layer respectively by '4', '5', '7';
s5, photographing the windowing position of the laminated board, and enabling the photographed picture to clearly identify the core board layer identifiers '3', '5', '7', and storing the core board layer identifiers as standard pictures;
s6, manufacturing a plurality of laminated boards according to the steps S1-S4, photographing through a camera, storing pictures, automatically comparing the pictures with core board layer marks 4, 5 and 7 of standard pictures through computer software, automatically alarming errors if the comparison is not met, passing the errors, and then arranging a first copper foil at the uppermost part of the passed laminated boards to obtain the inner core board of the printed circuit board.
Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all such modifications and equivalents are intended to be encompassed in the scope of the claims of the present invention.
Claims (5)
1. An inner core board of a printed circuit board for preventing stacking fault, which is characterized in that: the inner core board of the printed circuit board at least comprises an adhesive layer (3), copper foil (1) and a core board layer (2); the core plate layer comprises a core plate (2-1) and core plate copper foils (2-2) fixed on the upper surface and the lower surface of the core plate (2-1); the number of the core plate layers (2) is at least two, the plurality of core plate layers (2) are fixedly connected together through bonding layers (3) between two adjacent core plate layers (2) to form a core plate layer stack, bonding layers (3) are arranged on two sides of the core plate layer stack, and copper foils (1) are arranged on one side of the core plate layer stack, away from the bonding layers (3); the bonding layer (3) and the core layer (2) between the lowest core layer (2) and the uppermost copper foil (1) in the core layer lamination layers are provided with window parts, the lengths and the widths of the adjacent bonding layers and the core layer window parts are the same from bottom to top, the lengths of the adjacent bonding layers and the core layer window parts are sequentially increased from bottom to top, the core copper foil (2-2) on the upper surface of the core layer is provided with a core layer identification corresponding to the window opening position of the adjacent core layer (2) above, and circuit patterns are manufactured on the copper foil (1) and the core copper foil (2-2).
2. A method of manufacturing the misalignment-preventing inner core board for a printed wiring board as claimed in claim 1, wherein: the method comprises the following specific steps:
s1, taking an adhesive layer (3), a copper foil (1) and a core plate layer (2) according to the final structure of a printed circuit board;
s2, manufacturing required pattern circuits on at least one surface of a core copper foil (2-2) and a copper foil (1) of the core layer (2), and arranging core layer identification at a window position of the core copper foil (2-2) on the upper surface of the core layer (2) corresponding to the adjacent core layer (2) above;
s3, windowing is carried out on the bonding layer (3) and the core layer (2) between the lowest core layer and the uppermost copper foil (1) in the core layer lamination to form window parts, the window sizes of the bonding layer (3) and the core layer (2) which are adjacent from bottom to top are the same, and the lengths of the window parts from bottom to top are sequentially increased to be the same;
s4, stacking the copper foil (1), the core board (2) and the bonding layer (3) to obtain a laminated board, wherein the laminated board does not comprise the uppermost copper foil (1), and the bonding layer (3) on the uppermost side of the laminated board can be visually identified by the core board layer after stacking;
s5, photographing the windowing position of the laminated board, wherein the photographed picture can clearly identify the core board layer identification and is stored as a standard picture;
s6, manufacturing a plurality of laminated boards according to the steps S1-S4, photographing through a camera, storing pictures, automatically comparing the pictures with core board layer marks of standard pictures through computer software, automatically alarming errors if the comparison is not met, passing the comparison, and then arranging a copper foil (1) at the uppermost part of the passed laminated boards to obtain the inner core board of the printed circuit board.
3. The method for manufacturing the inner core board of the printed wiring board for preventing the stacking fault as claimed in claim 2, wherein: step S2, the core board layer is respectively identified as one of a number and a letter.
4. The method for manufacturing the inner core board of the printed wiring board for preventing the stacking fault as claimed in claim 2, wherein: in the step S3, the length of the lowest window is a, the length of the window from bottom to top is na, n is the number of the window from bottom to top, and the widths of the windows are all the same.
5. The method for manufacturing the inner core board of the printed wiring board for preventing the stacking fault as claimed in claim 2, wherein: the uppermost core layer (2) identifier in the step S4 cannot block the core layer identifier below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310604467.6A CN116489906A (en) | 2023-05-26 | 2023-05-26 | Printed circuit board inner core plate capable of preventing stacking fault and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310604467.6A CN116489906A (en) | 2023-05-26 | 2023-05-26 | Printed circuit board inner core plate capable of preventing stacking fault and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116489906A true CN116489906A (en) | 2023-07-25 |
Family
ID=87217988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310604467.6A Pending CN116489906A (en) | 2023-05-26 | 2023-05-26 | Printed circuit board inner core plate capable of preventing stacking fault and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116489906A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113147A (en) * | 2021-11-17 | 2022-03-01 | 佛山市南海区广工大数控装备协同创新研究院 | Multilayer PCB (printed Circuit Board) stacking information extraction and level fool-proof detection method |
-
2023
- 2023-05-26 CN CN202310604467.6A patent/CN116489906A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113147A (en) * | 2021-11-17 | 2022-03-01 | 佛山市南海区广工大数控装备协同创新研究院 | Multilayer PCB (printed Circuit Board) stacking information extraction and level fool-proof detection method |
| CN114113147B (en) * | 2021-11-17 | 2024-05-14 | 佛山市南海区广工大数控装备协同创新研究院 | Multilayer PCB lamination information extraction and hierarchical fool-proof detection method |
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