CN214901475U - Efficient chip mounter - Google Patents
Efficient chip mounter Download PDFInfo
- Publication number
- CN214901475U CN214901475U CN202120838517.3U CN202120838517U CN214901475U CN 214901475 U CN214901475 U CN 214901475U CN 202120838517 U CN202120838517 U CN 202120838517U CN 214901475 U CN214901475 U CN 214901475U
- Authority
- CN
- China
- Prior art keywords
- positioning
- carrier
- support
- plate
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Die Bonding (AREA)
Abstract
The utility model discloses a high-efficiency chip mounter, which comprises a workbench, a bracket positioned on the workbench, an adsorption material sticking mechanism and a carrier; the support both sides are all vertical to be provided with sharp module one, adsorb the facing material mechanism and be connected with sharp module one through the graduated disk, adsorb the facing material mechanism and include a plurality of vacuum chuck, be provided with a plurality of feed mechanism corresponding with the vacuum chuck position on the support, feed mechanism includes the blowing jar, blowing tank bottoms both sides have the striker plate through torsional spring coupling, the carrier is connected with the workstation upper surface through sharp module two, be provided with positioning mechanism on the carrier, positioning mechanism includes the locating plate, the clamp plate that is connected with the locating plate through the guide bar and is located the spring on the guide bar, positioning mechanism is corresponding with adsorb facing material mechanism position. The utility model discloses need attached components and parts automatic feeding, improve the paster efficiency of chip mounter, improve the paster precision.
Description
Technical Field
The utility model relates to a components and parts paste dress technical field, especially relate to a high-efficient chip mounter.
Background
A placement machine, also known as a "placement machine" or a "surface placement system," is a device that is configured after a dispensing machine or a screen printing machine in a production line to accurately place surface-mounted components on PCB pads by moving a placement head. The method is divided into manual operation and full-automatic operation. The full-automatic chip mounter is used for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex equipment in the whole SMT production. Chip mounters are main devices in SMT production lines, have been developed from early low-speed mechanical chip mounters to high-speed optical centering chip mounters, and have been developed towards multifunctional and flexible connection modularization.
The conventional chip mounter can only mount one component at a time, and the problem of errors in mounting due to material deflection or displacement often occurs when the components are mounted, so that the problem needs to be solved by providing an efficient chip mounter.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model aims to provide a high-efficient chip mounter needs attached components and parts automatic feeding, realizes that multiple components and parts carry out attachedly simultaneously, realizes that attached distance is adjustable, improves the paster efficiency of chip mounter, improves the paster precision.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a high-efficiency chip mounter comprises a workbench, a bracket positioned on the workbench, an adsorption material sticking mechanism and a carrier; the support both sides are all vertical to be provided with sharp module one, adsorb the facing material mechanism and be connected with sharp module one through the graduated disk, adsorb the facing material mechanism and include a plurality of vacuum chuck, be provided with a plurality of feed mechanism corresponding with the vacuum chuck position on the support, feed mechanism includes the blowing jar, blowing tank bottoms both sides have the striker plate through torsional spring coupling, the carrier is connected with the workstation upper surface through sharp module two, be provided with positioning mechanism on the carrier, positioning mechanism includes the locating plate, the clamp plate that is connected with the locating plate through the guide bar and is located the spring on the guide bar, positioning mechanism is corresponding with adsorb facing material mechanism position.
Preferably, the support is provided with a distance adjusting mechanism, the distance adjusting mechanism comprises a fixing hole and a moving frame located at the top of the discharging tank, a bolt penetrates through the moving frame and the fixing hole to position and adjust the distance of the moving frame, and the distance adjusting mechanism corresponds to the position of the vacuum chuck.
Preferably, the adsorption and sticking mechanism further comprises a sucker fixing frame, the vacuum sucker is fixed on the sucker fixing frame, and two ends of the sucker fixing frame in the length direction are clamped in the dividing plate.
Preferably, feed mechanism still includes the axis of rotation, the axis of rotation runs through striker plate and blowing jar.
Preferably, the straight line of the second straight line module in the length direction is perpendicular to the straight line of the support in the length direction, and the second straight line module is provided with two.
Preferably, the positioning mechanism further comprises a positioning block, and a pull handle convenient to pull is arranged on the clamping plate.
The utility model has the advantages that:
the utility model discloses a mutual cooperation of roll adjustment mechanism, feed mechanism, absorption subsides material mechanism, carrier and positioning mechanism, through establishing to place the material jar, realize needing attached components and parts automatic feeding, install a plurality of vacuum chuck and with the material jar of putting that the vacuum chuck position corresponds realizes that multiple components and parts carry out attachedly simultaneously, removes the frame and drives the slip roll adjustment of material jar on the support to attach through the bolt lock, realize attached distance adjustable, improve the practicality of chip mounter, improve the paster efficiency of chip mounter and improve the paster precision.
Drawings
FIG. 1 is a front view of the overall structure of a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a positioning mechanism according to a preferred embodiment of the present invention;
FIG. 3 is a partial schematic structural view of a preferred embodiment of the present invention;
in the figure: 1. a work table; 2. a support; 3. a distance adjusting mechanism; 31. a fixing hole; 32. a movable frame; 4. a feeding mechanism; 41. placing a material tank; 42. a feeding trough; 43. a striker plate; 44. a torsion spring; 45. a rotating shaft; 5. a first linear module; 6. an index plate; 7. an adsorption material sticking mechanism; 71. a vacuum chuck; 72. a suction cup fixing frame; 8. a carrier; 9. a positioning mechanism; 91. positioning a plate; 92. positioning blocks; 93. a guide bar; 94. a spring; 95. a handle; 96. and (5) clamping the plate.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Referring to fig. 1 to 3, the high-efficiency chip mounter in the present embodiment includes a worktable 1, a support 2 located on the worktable 1, an adsorption material sticking mechanism 7, and a carrier 8; the two sides of the support 2 are both vertically provided with a linear module I5, the adsorption sticking mechanism 7 is connected with the linear module I5 through an index plate 6, and the linear module I5 drives the adsorption sticking mechanism 7 to move up and down; the adsorption sticking mechanism 7 comprises a plurality of vacuum chucks 71, a plurality of feeding mechanisms 4 corresponding to the positions of the vacuum chucks 71 are arranged on the support 2, the linear module I5 drives the vacuum chucks 71 to move upwards to be close to the feeding mechanisms 4 and adsorb the bottommost component, the index plate 6 drives the vacuum chucks 71 to rotate 180 degrees after adsorption is completed, so that the components face a PCB (printed circuit board) substrate for placing the components, and then the linear module I5 drives the components to move downwards until the components are placed at the designated positions on the PCB substrate and the adsorption of the vacuum chucks 71 stops; the feeding mechanism 4 comprises a material placing tank 41, two sides of the bottom of the material placing tank 41 are connected with baffle plates 43 through torsion springs 44, components are sequentially placed into the material placing tank 41 from bottom to top through a material feeding tank 42, when the components are not placed in the material feeding tank 42 on the uppermost layer, the components in the material placing tank 41 cannot fall under the action of the baffle plates 43, when the components are required to be fed, the components are placed in the material feeding tank 42 on the uppermost layer, and at the moment, the baffle plates are pressed down to just the vacuum suction cups 71 which can enter the lower end of the material placing tank 41 and suck the components; carrier 8 is connected with 1 upper surface of workstation through two 10 of sharp module, be provided with positioning mechanism 9 on the carrier 8, carrier 8 is used for placing the PCB base plate that needs the paster, positioning mechanism 9 includes locating plate 91, the pinch-off blades 96 that is connected with locating plate 91 through guide bar 93 and is located the spring 94 on the guide bar 93, positioning mechanism 9 is corresponding with the position of absorption pasting material mechanism 7, positioning mechanism 9 fixes a position the PCB base plate, avoids PCB base plate to produce the position when placing components and parts and removes and lead to the paster to produce the error, improves the precision of paster.
Be provided with roll adjustment mechanism 3 on the support 2, roll adjustment mechanism 3 includes fixed orifices 31 and is located the removal frame 32 at discharge tank 41 top passes through the bolt remove frame 32 and fixed orifices 31 and fix a position the roll adjustment to removing frame 32, roll adjustment mechanism 3 is corresponding with vacuum chuck 71 position, and the position dimensional requirement of paster as required removes the unloading position that removes frame 32 adjustment feed mechanism 3, improves this chip mounter's practicality.
The adsorption and sticking mechanism 7 further comprises a sucker fixing frame 72, the vacuum sucker 71 is fixed on the sucker fixing frame 72, two ends of the sucker fixing frame 72 in the length direction are clamped in the dividing plate 6, the dividing plate 6 realizes 180-degree rotation of the vacuum sucker 71, and timely sticking after material suction is met.
The feeding mechanism 4 further comprises a rotating shaft 45, and the rotating shaft 45 penetrates through the material baffle 43 and the material discharging tank 41.
The straight line of the second straight line module 10 in the length direction is perpendicular to the straight line of the support 2 in the length direction, and the number of the second straight line module 10 is two.
The positioning mechanism 9 further comprises a positioning block 92, and a pull handle 95 convenient to pull is arranged on the clamping plate 96.
The working principle is as follows: when the PCB processing device works, a worker or a mechanical arm places a PCB substrate to be processed on a carrier 8, the PCB substrate is accurately positioned by a positioning mechanism 9, wherein the PCB substrate is preliminarily positioned by utilizing a positioning block 92, then the PCB substrate is clamped between a clamping plate 96 and a positioning plate 91 by loosening a handle 95, the distance of a feeding mechanism 4 is adjusted according to the position of a component to be attached on the PCB substrate, the component is sequentially placed into a material placing tank 41 from bottom to top through a material feeding tank 42, when the component is not placed in the material feeding tank 42 at the uppermost layer, the component in the material placing tank 41 cannot fall under the action of a material blocking plate 43, when the component is required to be fed, the component is placed in the material feeding tank 42 at the uppermost layer, at the moment, a baffle plate is pressed down to just the vacuum chuck 71 which can enter the lower end of the material placing tank 41 and suck the component, a linear module 5 drives the vacuum chuck 71 to move downwards after the component is sucked, and the dividing disc 6 drives the vacuum chuck 71 to rotate 180 degrees in the moving process, so that the components are placed on the PCB substrate, the circulating automatic feeding and surface mounting are realized, and the practicability and the surface mounting efficiency of the surface mounting machine are improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (6)
1. A high-efficient chip mounter which characterized in that: comprises a workbench (1), a bracket (2) positioned on the workbench (1), an adsorption sticking mechanism (7) and a carrier (8); the device is characterized in that linear modules I (5) are vertically arranged on two sides of the support (2), the adsorption sticking mechanism (7) is connected with the linear modules I (5) through a dividing plate (6), the adsorption sticking mechanism (7) comprises a plurality of vacuum suckers (71), a plurality of feeding mechanisms (4) corresponding to the positions of the vacuum suckers (71) are arranged on the support (2), each feeding mechanism (4) comprises a material discharging tank (41), two sides of the bottom of the material discharging tank (41) are connected with material blocking plates (43) through torsional springs (44), the carrier (8) is connected with the upper surface of the workbench (1) through a linear module II (10), a positioning mechanism (9) is arranged on the carrier (8), the positioning mechanism (9) comprises a positioning plate (91), a clamping plate (96) connected with the positioning plate (91) through a guide rod (93) and a spring (94) located on the guide rod (93), the positioning mechanism (9) corresponds to the adsorption sticking mechanism (7).
2. The high efficiency die bonder as claimed in claim 1, wherein: be provided with roll adjustment mechanism (3) on support (2), roll adjustment mechanism (3) include fixed orifices (31) and are located the removal frame (32) at blowing material jar (41) top passes through the bolt remove frame (32) and fixed orifices (31) carry out the location roll adjustment to removing frame (32), roll adjustment mechanism (3) are corresponding with vacuum chuck (71) position.
3. The high efficiency die bonder as claimed in claim 1, wherein: the material adsorption and sticking mechanism (7) further comprises a sucker fixing frame (72), the vacuum sucker (71) is fixed on the sucker fixing frame (72), and the two ends of the sucker fixing frame (72) in the length direction are clamped in the dividing plate (6).
4. The high efficiency die bonder as claimed in claim 1, wherein: the feeding mechanism (4) further comprises a rotating shaft (45), and the rotating shaft (45) penetrates through the material baffle (43) and the material discharge tank (41).
5. The high efficiency die bonder as claimed in claim 1, wherein: the straight line of the second straight line module (10) in the length direction is perpendicular to the straight line of the support (2) in the length direction, and the number of the second straight line module (10) is two.
6. The high efficiency die bonder as claimed in claim 1, wherein: the positioning mechanism (9) further comprises a positioning block (92), and a handle (95) convenient to pull is arranged on the clamping plate (96).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120838517.3U CN214901475U (en) | 2021-04-22 | 2021-04-22 | Efficient chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120838517.3U CN214901475U (en) | 2021-04-22 | 2021-04-22 | Efficient chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214901475U true CN214901475U (en) | 2021-11-26 |
Family
ID=78948415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120838517.3U Active CN214901475U (en) | 2021-04-22 | 2021-04-22 | Efficient chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214901475U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669329A (en) * | 2023-07-28 | 2023-08-29 | 杭州南淳电子科技有限公司 | Circuit board chip mounter capable of automatically removing impurities from welding spots |
-
2021
- 2021-04-22 CN CN202120838517.3U patent/CN214901475U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669329A (en) * | 2023-07-28 | 2023-08-29 | 杭州南淳电子科技有限公司 | Circuit board chip mounter capable of automatically removing impurities from welding spots |
| CN116669329B (en) * | 2023-07-28 | 2024-01-30 | 杭州南淳电子科技有限公司 | Circuit board chip mounter capable of automatically removing impurities from welding spots |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104701199A (en) | Flip chip bonding equipment | |
| CN114038786A (en) | High-speed high-precision die bonder and application method thereof | |
| CN214901475U (en) | Efficient chip mounter | |
| CN214818659U (en) | Gripping device with mechanical clamping jaw | |
| CN114334783A (en) | Wafer mounting device | |
| CN112676672A (en) | Automatic heat conduction block assembling and feeding machine | |
| CN112874134B (en) | Plate collecting and releasing system of screen printing machine | |
| CN211267292U (en) | Automatic chip mounter | |
| CN111726978A (en) | Paster mechanism and circuit board point gum machine | |
| CN218069897U (en) | Miniature semiconductor refrigeration crystal grain mounting device | |
| CN216487980U (en) | Swing arm device of die bonder | |
| CN114273779B (en) | Surface laser welding grain equipment and welding process thereof | |
| CN212542360U (en) | Automatic die bonder with direct-insertion type electrode support base | |
| CN113905538A (en) | Adjustable circuit board chip mounter | |
| CN216036941U (en) | IC material strip accurate positioning mobile device | |
| CN115117228A (en) | Rapid mounting system and method for miniature semiconductor refrigeration crystal grain | |
| CN114888475A (en) | Full-automatic laser device surface mounting device and method | |
| CN113612101A (en) | DBC board automatic assembly equipment | |
| CN114453880A (en) | Automatic equipment mechanism before welding of electric welding square bridge | |
| CN113423261A (en) | Automatic chip mounter and chip mounting process | |
| CN220935389U (en) | Adjustable chip mounting table of chip mounter | |
| CN220097483U (en) | Feeding mechanism of new energy battery cover plate substrate | |
| CN110545628B (en) | Circuit soft board pre-pasting machine | |
| CN111556706B (en) | Superspeed mounting head and chip mounter | |
| CN216700863U (en) | PCB and potsherd paste and pay machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 plant 5, No. 99 Hefeng Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Dingzheng Holding (Suzhou) Co.,Ltd. Address before: 215000 plant 5, No. 99 Hefeng Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou dingzheng Electronic Technology Co.,Ltd. |