CN114888475A - Full-automatic laser device surface mounting device and method - Google Patents
Full-automatic laser device surface mounting device and method Download PDFInfo
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- CN114888475A CN114888475A CN202210528154.2A CN202210528154A CN114888475A CN 114888475 A CN114888475 A CN 114888475A CN 202210528154 A CN202210528154 A CN 202210528154A CN 114888475 A CN114888475 A CN 114888475A
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- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 255
- 229910000679 solder Inorganic materials 0.000 claims abstract description 95
- 210000000078 claw Anatomy 0.000 claims description 27
- 230000007306 turnover Effects 0.000 claims description 25
- 238000012544 monitoring process Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 15
- 230000005496 eutectics Effects 0.000 claims description 7
- 238000002425 crystallisation Methods 0.000 claims description 3
- 230000008025 crystallization Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 230000004907 flux Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of laser tube seat mounting, in particular to a full-automatic laser mounting device and a method, which comprises a body module, a feeding and taking module, a heat sink feeding module, a solder feeding module and a mounting module, wherein the mounting module is used for mounting heat sinks and solders on a laser tube seat; the feeding and taking module is arranged on one side of the mounting module and used for automatically feeding the laser tube seats to the mounting module and automatically taking out the mounted laser tube seats in the mounting module; the heat sink feeding module and the solder feeding module are arranged on two sides of the feeding and taking module and are respectively used for automatically feeding heat sinks and solder to the mounting module. The invention can realize the full-automatic mounting of the laser tube seat, improve the mounting efficiency and the product consistency, and the low-temperature heating of the clamping mechanism in the mounting module is normal, the high-temperature heating and cooling time is short, thereby greatly improving the mounting efficiency.
Description
Technical Field
The invention relates to the technical field of laser tube seat mounting, in particular to a full-automatic laser device mounting device and method.
Background
In the optical communication industry, the packaging process of the laser comprises the following steps: generally, the heat sink is attached first, then the solder is attached, and then the processes of wire bonding, cap sealing and the like are performed. The existing laser surface mount device has low surface mount efficiency, can not ensure full-automatic and rapid surface mount of materials in the surface mount of heat sinks and welding fluxes, and has poor consistency.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a full-automatic laser tube mounting device and a full-automatic laser tube mounting method, which can realize full-automatic mounting of a laser tube seat and improve mounting efficiency and product consistency.
In order to achieve the above purpose, the technical solution of the present invention is a full-automatic laser chip mounting device, which includes a body module, a feeding and taking module, a heat sink feeding module, a solder feeding module, and a chip mounting module for mounting a heat sink and a solder on a laser tube base, wherein the feeding and taking module, the heat sink feeding module, the solder feeding module, and the chip mounting module are all disposed on the body module; the feeding and taking module is arranged on one side of the mounting module and is used for automatically feeding the laser tube seats to the mounting module and automatically taking out the mounted laser tube seats in the mounting module; the heat sink feeding module and the solder feeding module are arranged on two sides of the feeding and taking module and are respectively used for automatically feeding heat sinks and solder to the surface mounting module.
Furthermore, the feeding and taking module comprises a bottom plate, a first portal frame, a second portal frame, a first X-direction linear module, a second X-direction linear module, a Y-direction linear module, a turnover mechanism and a first suction mechanism; the bottom plate, the first portal frame and the second portal frame are all fixed on the body module, and the first X-direction linear module is fixed on the first portal frame and used for driving a material tray provided with a laser tube seat to move; the second X-direction linear die is fixed on the bottom plate, and a turnover mechanism used for automatically feeding the laser tube seats to the mounting module and automatically taking out the mounted laser tube seats in the mounting module is slidably mounted on the second X-direction linear die; the Y-direction linear module is fixed on the second portal frame, and a first suction mechanism used for conveying laser tube seats between the turnover mechanism and the material tray is slidably mounted on the Y-direction linear module.
Furthermore, the turnover mechanism comprises a U-shaped fixing frame, an ejection assembly, a fixing seat, a connecting roller, a driving device for driving the connecting roller to rotate and a linear gas claw for clamping a laser tube seat; the connecting roller is rotatably arranged on the U-shaped fixing frame, and the U-shaped fixing frame is slidably arranged on the second X-direction linear die; the laser tube socket ejection mechanism is characterized in that a fixed seat is installed on the connection roller, the linear gas claw is installed on the fixed seat in a sliding mode, and an ejection assembly used for driving the linear gas claw to automatically feed and automatically take out the laser tube socket is further installed on the fixed seat.
Furthermore, the ejection assembly comprises an ejection driving motor, an ejection driving gear and an ejection driven rack, the ejection driving motor is fixed on the fixed seat, an output shaft of the ejection driving motor is connected with the ejection driving gear, the ejection driven rack is fixed on the linear pneumatic claw, and the ejection driven rack is meshed with the ejection driving gear.
Furthermore, the first suction mechanism comprises a suction nozzle, a first adapter plate, a second adapter plate, a linear micropositioner, a connecting plate and a belt wheel assembly for driving the suction nozzle to move up and down; the belt wheel assembly is mounted on the first adapter plate, and the suction nozzle is connected with the belt wheel assembly through the second adapter plate; therefore, the first connecting plate is connected with the linear micropositioner, and the linear micropositioner is slidably mounted on the Y-direction linear module through the connecting plate.
Further, the heat sink feeding module and the solder feeding module have the same structure, and each of the heat sink feeding module and the solder feeding module comprises a connecting base, a linear module, a feeding mechanism for automatically feeding heat sinks or solder, an ejection mechanism for automatically ejecting heat sinks or solder, an adjusting mechanism for adjusting the position of heat sinks or solder, and a second suction mechanism for conveying heat sinks or solder between the feeding mechanism and the adjusting mechanism; the connecting base is fixed on the body module, the linear module is fixed on the connecting base, and the second suction mechanism is slidably mounted on the linear module; the adjusting mechanism is arranged on one side of the ejection mechanism.
Furthermore, a first monitoring mechanism is arranged above the feeding mechanism, and a second monitoring mechanism is arranged above the adjusting mechanism.
Further, the mounting module comprises a clamping mechanism, a pressing mechanism, a first feeding mechanism and a second feeding mechanism, wherein the first feeding mechanism is used for feeding the solder fed by the solder feeding module to the clamping mechanism, and the second feeding mechanism is used for feeding the heat sink fed by the heat sink feeding module to the clamping mechanism; the clamping mechanism is arranged on one side of the feeding and taking module and is used for clamping a laser tube seat fed by the feeding and taking module; the pressing mechanism is arranged on one side of the clamping mechanism and used for pressing the heat sink and the solder with the laser tube seat after eutectic.
Furthermore, a third monitoring mechanism is arranged at the top of the clamping mechanism, and a fourth monitoring mechanism is arranged right above the clamping mechanism.
The invention also provides a full-automatic laser pasting method, which comprises the following steps:
mounting a material tray provided with a laser tube seat to be mounted on a feeding and taking module, mounting a blue film tray provided with a heat sink to be mounted on a feeding mechanism of a heat sink feeding module, and mounting the blue film tray provided with a solder to be mounted on the feeding mechanism of the solder feeding module; the clamping part of the clamping mechanism in the mounting module is heated at a low temperature;
after a first absorbing mechanism of the feeding and taking module absorbs the laser tube seats in the material tray and carries the laser tube seats to a designated position, a turnover mechanism of the feeding and taking module clamps the laser tube seats and turns over the laser tube seats to be conveyed to a clamping mechanism of the mounting module; a second suction mechanism of the heat sink feeding module sucks the heat sink in the blue film disc and conveys the heat sink to an adjusting mechanism of the heat sink feeding module, and the heat sink is adjusted to a proper position; the second suction mechanism of the solder feeding module sucks the solder in the blue film disc and conveys the solder to the adjusting mechanism of the heat sink feeding module, and the solder is adjusted to a proper position;
a second feeding mechanism in the surface mounting module firstly feeds the heat sink in an adjusting mechanism of a heat sink feeding module to a clamping mechanism, a first feeding mechanism then feeds the solder in the adjusting mechanism of the solder feeding module to the clamping mechanism, then the clamping mechanism is heated to carry out eutectic crystal formation, and then the heat sink and the solder are tightly pressed with a laser tube base through a pressing mechanism, so that the surface mounting of the laser tube base is completed.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention can realize the full-automatic mounting of the laser tube seat, and improve the mounting efficiency and the product consistency;
(2) the low-temperature heating of the clamping mechanism in the mounting module is normal, the high-temperature heating and cooling time is short, and the mounting efficiency of the laser tube seat is greatly improved;
(3) the mounting module is simple in structure, 2 pieces of solder can be simultaneously mounted, and the beat of the whole device is compact and coherent.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a fully automatic laser chip mounting device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a body module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a feed take-out module according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a turnover mechanism according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a suction mechanism provided in an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a heat sink feeding module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a solder feeding module according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a mounting module according to an embodiment of the present invention;
in the figure: 1. a body module; 2. a feeding and taking module; 3. a heat sink feeding module; 4. a solder feeding module; 5. mounting a module; 6. a base; 7. a vertical plate; 8. a support beam; 9. a base plate; 10. a second X-direction linear module; 11. a turnover mechanism; 12. a first upright post; 13. a first cross member; 14. a first X-direction linear module; 15. a material tray; 16. a second upright post; 17. a second cross member; 18. a Y-direction linear module; 19. a first suction mechanism; 20. a U-shaped fixing frame; 21. a connection roller; 22. a fixed seat; 23. a driven gear; 24. a speed reducer; 25. ejecting a driving motor; 26. ejecting a driving gear; 27. ejecting the driven rack; 28. a linear pneumatic gripper; 29. a claw head; 30. a connecting plate; 31. a linear micropositioner; 32. a first transfer plate; 33. a pulley drive motor; 34. a pulley assembly; 35. a second adapter plate; 36. a suction nozzle; 37. connecting a base; 38. a linear module; 39. a second suction mechanism; 40. a first monitoring mechanism; 41. a feeding mechanism; 42. an ejection mechanism; 43. an adjustment mechanism; 44. a second monitoring mechanism; 45. a clamping mechanism; 46. a hold-down mechanism; 47. a third monitoring mechanism; 48. a fourth monitoring mechanism; 49. a first feeding mechanism; 50. and a second feeding mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1, this embodiment provides a full-automatic laser chip mounting device, which includes a body module 1, a feeding and taking module 2, a heat sink feeding module 3, a solder feeding module 4, and a mounting module 5 for mounting a heat sink and a solder on a laser tube base, where the feeding and taking module 2, the heat sink feeding module 3, the solder feeding module 4, and the mounting module 5 are all disposed on the body module 1; the feeding and taking module 2 is arranged on one side of the mounting module 5 and is used for automatically feeding a laser tube seat to the mounting module 5 and automatically taking out the mounted laser tube seat in the mounting module 5; the heat sink feeding module 3 and the solder feeding module 4 are arranged on two sides of the feeding and taking module 2 and are respectively used for automatically feeding heat sinks and solder to the mounting module 5. In the invention, the connection and fixation of the device and other module parts are completed through the body module 1, the automatic feeding and the automatic taking out of the laser tube seat are completed through the sinking and feeding module, the reliable and automatic feeding of the heat sink to the laser tube seat is completed through the heat sink feeding module 3, the reliable and automatic feeding of the welding flux to the laser tube seat is completed through the welding flux feeding module 4, and the reliable mounting of the heat sink and the welding flux on the laser tube seat is completed through the mounting module 5, so that the full-automatic mounting of the laser tube seat can be realized, and the mounting efficiency and the product consistency can be improved.
Further, the feeding and taking module 2 comprises a bottom plate 9, a first portal frame, a second portal frame, a first X-direction linear module 14, a second X-direction linear module 10, a Y-direction linear module 18, a turnover mechanism 11 and a first suction mechanism 19; the bottom plate 9, the first portal frame and the second portal frame are all fixed on the body module 1, and the first X-direction linear module 14 is fixed on the first portal frame and used for driving a material tray 15 provided with a laser tube seat to move; the second X-direction linear die is fixed on the bottom plate 9, and a turnover mechanism 11 for automatically feeding the laser tube seats to the mounting module 5 and automatically taking out the mounted laser tube seats in the mounting module 5 is slidably mounted on the second X-direction linear die; the Y-direction linear module 18 is fixed on the second portal frame, and a first sucking mechanism 19 for conveying laser tube seats between the turnover mechanism 11 and the material tray 15 is slidably mounted on the Y-direction linear module 18. As shown in fig. 3, the first X-direction linear module 14 and the second X-direction linear module 10 are disposed in parallel and located on the same side of the Y-direction linear module 18; the first X-direction linear module 14 drives the material tray 15 provided with the laser tube seats to move along the X-axis direction, the Y-direction linear module 18 drives the first suction mechanism 19 to move along the Y-axis direction, and the first suction mechanism 19 sucks the laser tube seats in the material tray 15 row by row through the matching of the first suction mechanism and the first suction mechanism; the Y-direction linear module 18 drives the first suction mechanism 19 to convey the laser tube seat between the material tray 15 and the turnover mechanism 11, the turnover mechanism 11 clamps and turns over the laser tube seat, then the turnover mechanism 11 is conveyed to the position above the clamping mechanism under the action of the second X-direction linear module 10, and the turnover mechanism 11 is loosened and the laser tube seat is placed at the clamping position of the clamping mechanism.
As shown in fig. 3, the first portal frame includes a first beam 13 and two first columns 12, the two first columns 12 are respectively fixed on the base 6 in the body module 1 through screws, the first beam 13 is arranged along the X-axis direction, and two ends of the first beam 13 are respectively fixed on the two first columns 12, and the first X-direction linear module 14 is fixed on the first beam 13 through screws; the second portal frame comprises a second beam 17 and two second columns 16, the two second columns 16 are respectively fixed on the base 6 in the body module 1 through screws, the second beam 17 is arranged along the Y-axis direction, two ends of the second beam 17 are respectively fixed on the two second columns 16, and the Y-direction linear module 18 is fixed on the second beam 17 through screws; the second X-direction linear module 10 is fixed on the bottom plate 9 through screws; the turnover mechanism 11 and the tray 15 with the laser tube seats are both positioned below the second cross beam 17 and are both within the working range of the first suction mechanism 19. All the linear modules in the embodiment can adopt the existing linear module structure, for example, a structural form that a motor drives a sliding block to move linearly along a sliding rail can be adopted.
Furthermore, the turnover mechanism 11 includes a U-shaped fixing frame 20, an ejection assembly, a fixing base 22, a connection roller 21, a driving device for driving the connection roller 21 to rotate, and a linear gas claw 28 for clamping a laser tube holder; the connecting roller 21 is rotatably mounted on the U-shaped fixing frame 20, and the U-shaped fixing frame 20 is slidably mounted on the second X-direction linear die; the laser tube seat automatic feeding device is characterized in that a fixed seat 22 is installed on the connection roller 21, the linear air claw 28 is installed on the fixed seat 22 in a sliding mode, and an ejection assembly used for driving the linear air claw 28 to automatically feed and automatically take out a laser tube seat is further installed on the fixed seat 22. As shown in fig. 4, the U-shaped fixing seat 22 is fixedly connected with the sliding block of the second X-direction linear module 10 by a screw, two ends of the connection roller 21 are rotatably installed in two side plates of the U-shaped fixing seat 20, the fixing seat 22 is fixedly connected with a middle portion of the connection roller 21, the fixing seat 22 and the linear gas claw 28 thereon can be driven to rotate by driving the connection roller 21 through the driving device, when receiving the laser tube holder conveyed by the first suction mechanism 19, the driving device drives the linear gas claw 28 to rotate to a vertical arrangement so as to clamp the laser tube holder conveyed by the first suction mechanism 19, and then the driving device drives the linear gas claw 28 to rotate to a horizontal arrangement so as to convey the clamped laser tube holder into the clamping mechanism 45.
The driving device comprises a driving motor, a speed reducer 24, a driving gear and a driven gear 23, an output shaft of the driving motor is connected with the driving gear through the speed reducer 24, the driven gear 23 is fixed on one end of the connecting roller 21, the driving gear is meshed with the driven gear 23, and the speed reducer 24 is fixed on the U-shaped fixed seat 22; the driving motor drives the driving gear to rotate through the speed reducer 24, and the driving gear drives the driven gear 23 engaged with the driving gear to rotate, so as to drive the connection roller 21 to rotate. The linear gas claw 28 comprises a gas claw body and a claw head 29, a linear sliding rail perpendicular to the arrangement direction of the second X-direction linear module 10 is arranged on the fixed seat 22, the fixed end of the gas claw body is slidably mounted on the linear sliding rail, and the claw head 29 used for clamping the laser tube seat is arranged at one end of the gas claw body.
Furthermore, the ejection assembly comprises an ejection driving motor 25, an ejection driving gear 26 and an ejection driven rack 27, the ejection driving motor 25 is fixed on the fixed seat 22, an output shaft of the ejection driving motor 25 is connected with the ejection driving gear 26, the ejection driven rack 27 is fixed on the linear pneumatic claw 28, and the ejection driven rack 27 is meshed with the ejection driving gear 26. The ejection driven rack 27 is fixed on the gas claw body, the ejection driving gear 26 is driven to rotate by the ejection driving motor 25, the ejection driving gear 26 drives the ejection driven rack 27 meshed with the ejection driven rack to move linearly, so that the gas claw body is driven to move along the linear sliding rail, the laser tube seat is driven to move, and the laser tube seat is conveyed to the clamping mechanism 45 through the cooperation of the ejection assembly, the turnover mechanism 11 and the second X-direction linear module 10. Optimally, the plurality of linear gas claws 28 are arranged on the fixed seat 22 side by side, and each linear gas claw 28 is connected with a corresponding ejection assembly respectively, so that a plurality of laser tube seats can be turned and transferred at one time, and the assembly efficiency is improved.
Further, the first suction mechanism 19 comprises a suction nozzle 36, a first adapter plate 32, a second adapter plate 35, a linear micropositioner 31, a connecting plate 30 and a pulley assembly 34 for driving the suction nozzle 36 to move up and down; the belt wheel assembly 34 is mounted on the first adapter plate 32, and the suction nozzle 36 is connected with the belt wheel assembly 34 through the second adapter plate 35; therefore, the first connecting plate 32 is connected to the linear micropositioner 31, and the linear micropositioner 31 is slidably mounted on the Y-directional linear module 18 through the connecting plate 30. As shown in fig. 5, the first suction mechanism 19 is connected to the slide block of the Y-direction linear module 18 through the connection plate 30, so that the Y-direction linear module 18 drives the first suction mechanism 19 to move in the Y-axis direction; the belt wheel assembly 34 comprises a belt wheel driving motor 33, a belt wheel and a belt sleeved on the belt wheel, the vertical part of the belt is connected with the second adapter plate 35, and the belt is driven to move up and down by the belt wheel driving motor 33, so that the second adapter plate 35 and the suction nozzle 36 on the second adapter plate are driven to move up and down; the first adapter plate 32 may further be provided with a guide rail, and the guide rail is in sliding fit with the second adapter plate 35 to guide the second adapter plate 35 to move up and down.
Further, the heat sink feeding module 3 and the solder feeding module 4 have the same structure, and each include a connection base 37, a linear module 38, a feeding mechanism 41 for automatically feeding heat sinks or solder, an ejecting mechanism 42 for automatically ejecting heat sinks or solder, an adjusting mechanism 43 for adjusting the position of heat sinks or solder, and a second suction mechanism 39 for carrying heat sinks or solder between the feeding mechanism 41 and the adjusting mechanism 43; the connecting base 37 is fixed on the body module 1, the linear module 38 is fixed on the connecting base 37, and the second suction mechanism 39 is slidably mounted on the linear module 38; the adjusting mechanism 43 is disposed on one side of the ejecting mechanism 42. As shown in fig. 6 and 7, the feeding mechanism 41, the ejecting mechanism 42 and the adjusting mechanism 43 are disposed on one side of the linear module 38, and are all located within the working range of the second suction mechanism 39; the slide rail of the linear module 38 is fixed on the connecting base 37 through a screw, and the slide block of the linear module 38 is connected with the suction mechanism through a screw; the circular blue film tray with the heat sink or solder is mounted on the feeding mechanism 41, the ejector mechanism 42 is positioned right below the circular blue film tray, the position of the circular blue film tray is adjusted by the feeding mechanism 41, so that the ejector mechanism 42 ejects the heat sink or solder in the circular blue film tray, and then the second suction mechanism 39 sucks the ejected heat sink or solder and transfers the heat sink or solder to the adjusting mechanism 43.
Further, a first monitoring mechanism 40 is disposed above the feeding mechanism 41, and a second monitoring mechanism 44 is disposed above the adjusting mechanism 43. The first monitoring mechanism 40 is fixed on the connecting base 37 through screws and is used for positioning the position of the heat sink or the solder in the circular blue film disc, so that the second suction mechanism 39 can accurately suck the heat sink or the solder in the circular blue film disc; the second monitoring mechanism 44 is fixed on the support beam 8 of the body module 1 by screws, and is used for adjusting the position of the heat sink or solder in the mechanism 43, so that the adjusting mechanism 43 can adjust the position of the heat sink or solder thereon in time, and the second feeding mechanism 50 and the first feeding mechanism 49 in the mounting module 5 can accurately grab the heat sink or solder on the adjusting mechanism 43.
Further, the mounting module 5 includes a clamping mechanism 45, a pressing mechanism 46, a first feeding mechanism 49 for feeding the solder fed by the solder feeding module 4 to the clamping mechanism 45, and a second feeding mechanism 50 for feeding the heat sink fed by the heat sink feeding module 3 to the clamping mechanism 45; the clamping mechanism 45 is arranged on one side of the feeding and taking module 2 and is used for clamping a laser tube seat fed by the feeding and taking module 2; the pressing mechanism 46 is disposed on one side of the clamping mechanism 45, and is used for pressing the heat sink and the solder against the laser tube base after eutectic crystallization. As shown in fig. 8, the clamping mechanism 45 and the pressing mechanism 46 are fixed on the bottom plate 9, and one side of the clamping mechanism 45 is the turnover mechanism 11, and the other side is the pressing mechanism 46; the first feeding mechanism 49 and the second feeding mechanism 50 are similar in structure and both adopt a structural form that a feeding suction mechanism is slidably mounted on a feeding linear module, wherein the feeding linear module can be fixed on the vertical plate 7 of the body module 1 through screws, and the feeding suction mechanism moves linearly along the feeding linear module so as to feed the heat sink in the adjusting mechanism 43 of the heat sink feeding module 3 into the clamping mechanism 45 and feed the solder in the adjusting mechanism 43 of the solder feeding module 4 into the clamping mechanism 45. Two feeding suction mechanisms can be arranged on the feeding linear module on the first feeding mechanism 49 to suck two pieces of welding flux simultaneously, so that 2 pieces of welding flux can be pasted and mounted simultaneously.
The clamping position of the clamping mechanism 45 is kept heated at a low temperature, and after the feeding and taking module 2 sends the laser tube seats in the material tray 15 to the clamping position of the clamping mechanism 45, the clamping mechanism 45 clamps the laser tube seats; the heat sink feeding module 3 and the solder feeding module 4 respectively transport the corresponding heat sink and solder in the blue film disc to the corresponding adjusting mechanism 43, the second feeding mechanism 50 and the first feeding mechanism 49 respectively transport the heat sink and solder in the corresponding adjusting mechanism 43 to the laser tube seat of the clamping mechanism 45, the clamping mechanism 45 is heated to perform eutectic heating, and then the heat sink and solder are pressed against the laser tube seat through the pressing mechanism 46, so that the mounting of the laser tube seat is completed.
Further, a third monitoring mechanism 47 is disposed on the top of the clamping mechanism 45, and a fourth monitoring mechanism 48 is disposed directly above the clamping mechanism 45. The third monitoring mechanism 47 and the fourth monitoring mechanism 48 are both fixed on the body module 1 and used for positioning the clamping mechanism 45, so that the heat sink feeding module 3, the second feeding mechanism 50 and the first feeding mechanism 49 can conveniently place the laser tube seat, the heat sink and the solder at preset positions in the clamping mechanism 45 respectively, and the assembly quality and the product consistency are improved.
Specifically, the body module 1 comprises a base 6, a vertical plate 7 and a supporting beam 8, wherein the vertical plate 7 is in a portal frame structure form, the beam of the vertical plate 7 is used for fixing the feeding mechanism, and the column of the vertical plate 7 is fixed on the base 6 through a screw; a support beam 8 is fixed to the top of the vertical plate 7 for fixing part of the monitoring mechanism. The bottom plate 9, the first upright post 12, the second upright post 16 and the connecting base 37 are all fixed on the base 6.
As shown in fig. 1 to 8, the present invention further provides a full-automatic laser mounting method, which comprises the following steps:
the positions and the initial working states of the feeding and taking module 2, the heat sink feeding module 3, the solder feeding module 4 and the mounting module 5 are respectively adjusted;
installing a tray 15 provided with a laser tube seat to be mounted on a first X-direction linear module 14 of a feeding and taking module 2, installing a blue film tray provided with a heat sink to be mounted on a feeding mechanism 41 of a heat sink feeding module 3, and installing a blue film tray provided with a solder to be mounted on a feeding mechanism 41 of a solder feeding module 4; the clamping part of the clamping mechanism 45 in the mounting module 5 is kept heated at low temperature;
the device is started, after a suction nozzle 36 of a first suction mechanism 19 of the feeding and taking module 2 sucks a laser tube seat in the material tray 15 and carries the laser tube seat to a designated position, a claw head 29 of a turnover mechanism 11 of the feeding and taking module 2 clamps the laser tube seat tightly, the laser tube seat is turned over under the action of the turnover mechanism 11, and the laser tube seat is conveyed to a clamping mechanism 45 of the mounting module 5 through the matching of a first X-direction linear module 14; the ejection mechanism 42 of the heat sink feeding module 3 ejects the heat sink in the blue film tray, the second suction mechanism 39 of the heat sink feeding module 3 sucks the heat sink in the blue film tray and carries the heat sink to the adjusting mechanism 43 of the heat sink feeding module 3, and the heat sink is adjusted to a proper position through the analysis and calculation of the second monitoring mechanism 44 of the solder feeding module 4; the ejection mechanism 42 of the solder feeding module 4 ejects the solder in the blue film tray, the second suction mechanism 39 of the solder feeding module 4 sucks the solder in the blue film tray and conveys the solder to the adjusting mechanism 43 of the heat sink feeding module 3, and the solder is adjusted to a proper position through analysis and calculation of the second monitoring mechanism 44 of the solder feeding module 4;
the second feeding mechanism 50 in the placement module 5 firstly sends the heat sink in the adjusting mechanism 43 of the heat sink feeding module 3 to the clamping mechanism 45, the first feeding mechanism 49 then sends the solder in the adjusting mechanism 43 of the solder feeding module 4 to the clamping mechanism 45, then the clamping mechanism 45 is heated up and heated for eutectic crystallization, and then the heat sink and the solder are pressed with the laser tube base through the pressing mechanism 46, so that the placement of the laser tube base is completed.
In the embodiment, the low-temperature heating of the clamping mechanism 45 in the mounting module 5 is normal, the high-temperature heating and cooling time is short, and the mounting efficiency of the laser tube seat is greatly improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (10)
1. The utility model provides a full-automatic laser instrument paster device which characterized in that: the laser tube seat comprises a body module, a feeding and taking module, a heat sink feeding module, a solder feeding module and a mounting module, wherein the mounting module is used for mounting heat sinks and solders on the laser tube seat; the feeding and taking module is arranged on one side of the mounting module and is used for automatically feeding the laser tube seats to the mounting module and automatically taking out the mounted laser tube seats in the mounting module; the heat sink feeding module and the solder feeding module are arranged on two sides of the feeding and taking module and are respectively used for automatically feeding heat sinks and solder to the mounting module.
2. A fully automatic laser placement device, as recited in claim 1, wherein: the feeding and taking module comprises a bottom plate, a first portal frame, a second portal frame, a first X-direction linear module, a second X-direction linear module, a Y-direction linear module, a turnover mechanism and a first suction mechanism; the bottom plate, the first portal frame and the second portal frame are all fixed on the body module, and the first X-direction linear module is fixed on the first portal frame and used for driving a material tray provided with a laser tube seat to move; the second X-direction linear die is fixed on the bottom plate, and a turnover mechanism used for automatically feeding the laser tube seats to the mounting module and automatically taking out the mounted laser tube seats in the mounting module is slidably mounted on the second X-direction linear die; the Y-direction linear module is fixed on the second portal frame, and a first suction mechanism used for conveying laser tube seats between the turnover mechanism and the material tray is slidably mounted on the Y-direction linear module.
3. A fully automatic laser placement device, as recited in claim 2, wherein: the turnover mechanism comprises a U-shaped fixing frame, an ejection assembly, a fixing seat, a connecting roller, a driving device for driving the connecting roller to rotate and a linear gas claw for clamping a laser tube seat; the connecting roller is rotatably arranged on the U-shaped fixing frame, and the U-shaped fixing frame is slidably arranged on the second X-direction linear die; the laser tube socket ejection mechanism is characterized in that a fixed seat is installed on the connection roller, the linear gas claw is installed on the fixed seat in a sliding mode, and an ejection assembly used for driving the linear gas claw to automatically feed and automatically take out the laser tube socket is further installed on the fixed seat.
4. A fully automatic laser placement device, as recited in claim 3, wherein: the ejection assembly comprises an ejection driving motor, an ejection driving gear and an ejection driven rack, the ejection driving motor is fixed on the fixed seat, an output shaft of the ejection driving motor is connected with the ejection driving gear, the ejection driven rack is fixed on the linear gas claw, and the ejection driven rack is meshed with the ejection driving gear.
5. A fully automatic laser placement device, as recited in claim 2, wherein: the first suction mechanism comprises a suction nozzle, a first adapter plate, a second adapter plate, a linear micropositioner, a connecting plate and a belt wheel assembly for driving the suction nozzle to move up and down; the belt wheel assembly is mounted on the first adapter plate, and the suction nozzle is connected with the belt wheel assembly through the second adapter plate; therefore, the first connecting plate is connected with the linear micropositioner, and the linear micropositioner is slidably mounted on the Y-direction linear module through the connecting plate.
6. A fully automatic laser placement device, as recited in claim 1, wherein: the heat sink feeding module and the solder feeding module have the same structure and respectively comprise a connecting base, a linear module, a feeding mechanism for automatically feeding heat sink or solder, an ejection mechanism for automatically ejecting the heat sink or solder, an adjusting mechanism for adjusting the position of the heat sink or solder and a second suction mechanism for conveying the heat sink or solder between the feeding mechanism and the adjusting mechanism; the connecting base is fixed on the body module, the linear module is fixed on the connecting base, and the second suction mechanism is slidably mounted on the linear module; the adjusting mechanism is arranged on one side of the ejection mechanism.
7. A fully automatic laser placement device, as recited in claim 6, wherein: a first monitoring mechanism is arranged above the feeding mechanism, and a second monitoring mechanism is arranged above the adjusting mechanism.
8. A fully automatic laser placement device, as recited in claim 1, wherein: the mounting module comprises a clamping mechanism, a pressing mechanism, a first feeding mechanism and a second feeding mechanism, wherein the first feeding mechanism is used for feeding the solder fed by the solder feeding module to the clamping mechanism, and the second feeding mechanism is used for feeding the heat sink fed by the heat sink feeding module to the clamping mechanism; the clamping mechanism is arranged on one side of the feeding and taking module and is used for clamping a laser tube seat fed by the feeding and taking module; the pressing mechanism is arranged on one side of the clamping mechanism and used for pressing the heat sink and the solder with the laser tube seat after eutectic.
9. A fully automatic laser placement device, as recited in claim 8, wherein: and a third monitoring mechanism is arranged at the top of the clamping mechanism, and a fourth monitoring mechanism is arranged right above the clamping mechanism.
10. A full-automatic laser pasting method is characterized by comprising the following steps:
mounting a material tray provided with a laser tube seat to be mounted on a feeding and taking module, mounting a blue film tray provided with a heat sink to be mounted on a feeding mechanism of a heat sink feeding module, and mounting the blue film tray provided with a solder to be mounted on the feeding mechanism of the solder feeding module; the clamping part of the clamping mechanism in the mounting module is heated at a low temperature;
after a first absorbing mechanism of the feeding and taking module absorbs the laser tube seats in the material tray and conveys the laser tube seats to a designated position, a turnover mechanism of the feeding and taking module clamps the laser tube seats tightly and turns over the laser tube seats to be conveyed to a clamping mechanism of the mounting module; a second suction mechanism of the heat sink feeding module sucks the heat sink in the blue film disc and conveys the heat sink to an adjusting mechanism of the heat sink feeding module, and the heat sink is adjusted to a proper position; the second suction mechanism of the solder feeding module sucks the solder in the blue film disc and conveys the solder to the adjusting mechanism of the heat sink feeding module, and the solder is adjusted to a proper position;
the second feeding mechanism in the surface mounting module firstly sends the heat sink in the adjusting mechanism of the heat sink feeding module to the clamping mechanism, the first feeding mechanism then sends the solder in the adjusting mechanism of the solder feeding module to the clamping mechanism, then the clamping mechanism is heated up and heated for eutectic crystallization, and then the heat sink and the solder are pressed with the laser tube base through the pressing mechanism, so that the surface mounting of the laser tube base is completed.
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| CN202210528154.2A CN114888475A (en) | 2022-05-16 | 2022-05-16 | Full-automatic laser device surface mounting device and method |
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| CN202210528154.2A CN114888475A (en) | 2022-05-16 | 2022-05-16 | Full-automatic laser device surface mounting device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116395396A (en) * | 2023-06-08 | 2023-07-07 | 武汉昱升光电股份有限公司 | Automatic mounting machine and method |
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