CN218069897U - Miniature semiconductor refrigeration crystal grain mounting device - Google Patents

Abstract

The utility model relates to a semiconductor cooler production technology, concretely relates to miniature semiconductor refrigeration crystalline grain pastes dress device, which comprises a worktable, transversely be provided with Y0 axle module on the board, vertical installation has Z axle module on the slide of Y0 axle module, install the discernment location camera subassembly that the subassembly was put and be located to inhale the subassembly side of putting to inhaling of crystalline grain on the slide of Z axle module, be provided with on the board and be located to inhale the crystalline grain position adjustment camera mechanism who puts the subassembly below, the both sides that are located crystalline grain position adjustment camera mechanism are provided with crystalline grain carrier module and water conservancy diversion piece carrier module. The device is favorable for improving the die mounting speed on the basis of ensuring the die swinging and mounting precision of the miniature semiconductor refrigeration die.

Description

Miniature semiconductor refrigeration crystal grain mounting device

Technical Field

The utility model relates to a semiconductor cooler production technology, in particular to a miniature semiconductor cooler crystal grain mounting device.

Background

At present, in the production process of domestic semiconductor refrigerating chips, the tin dispensing process is automatically realized by a glue dispenser, the glue dispenser presses glue into a feeding pipe connected with a piston chamber by sending compressed air into an injector or a glue bottle, and the glue dispensing operation is carried out by utilizing pressure. When the piston is in the up stroke, the piston chamber is filled with the glue; when the piston pushes the glue-dropping needle downwards, the glue is pressed out from the needle mouth. The amount of glue dripping is determined by the distance of the piston undershooting, and can be manually adjusted or controlled by programming. However, after the dispensing process is completed, the placing and mounting of the semiconductor refrigeration die on the guide plate with the dispensed tin paste is mainly manually completed. For miniature products, the size of the grains is much finer. Taking the commonly used micro device as an example, the length, width and height of the grain size are generally within 0.5 mm. In the production process, the requirement on the distance precision between crystal grains of a product is generally within 10 percent of the width of the crystal grains, namely within 50 micrometers or even higher, so that the difficulty of manual operation is greatly increased and the operation can be completed by matching with a microscope. The process method has low working efficiency and difficult guarantee of precision, thereby influencing the yield and the performance of products. In the process of replacing manual automatic swing mold attaching: the mounting precision influence factors of the semiconductor refrigeration crystal grain mainly have three aspects: (1) the repeated positioning precision of the manipulator; (2) rotational offset occurring when a die is sucked; (3) rotational offset of die during placement.

In the automation field, the pasting system for micro components based on machine vision in industry needs to absorb and paste two links of product compared with a single-operation dispensing system, so that after a target element is grabbed by absorption station identification and positioning, the target element is moved to a placing station for positioning again to be matched with the position and placed, the control difficulty is greatly increased, the visual correction station is added between two actions for improving the pasting precision, and the rotary offset error caused by the absorption link can be eliminated.

Because the micro crystal grain size is very small, the weight is light: the length, width and height dimensions are about 0.5mm, and the weight is about 3mg. The existing mounting technology is limited to: (1) in the suction link, the key to successful suction of the micro die is how to align the center of the suction nozzle with the geometric center of the die when the suction is performed. If the two centers are not aligned, the crystal grains can not only shift on a plane but also rotate in the spatial pose after the suction nozzle sucks to take action. This requires more accurate image recognition algorithms and higher accuracy of displacement control, which means higher cost investment. (2) In the mounting and placing process, for the micro-crystal grains with small sizes, the crystal grains can be adsorbed on the suction nozzle due to static electricity after the suction of the suction nozzle is stopped, and when the suction nozzle is moved away, the crystal grains can be moved and interfered, and random space errors can be generated on the crystal grains. (3) In the filed patent technology "micro semiconductor cooling die mounting device, patent application No.: 202221189130.0", the movement of the nozzle is controlled by the three-axis module in time sequence, and the die is only controlled by one axial movement at each moment from the suction to the placement, resulting in a limited mounting speed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a miniature semiconductor refrigeration crystalline grain pastes dress device, the device has helped on the basis of guaranteeing miniature semiconductor refrigeration crystalline grain pendulum mould, subsides dress precision, has improved crystalline grain and has pasted dress speed.

The technical scheme of the utility model lies in: the utility model provides a quick subsides of miniature semiconductor refrigeration crystalline grain pastes dress device, includes the board, transversely be provided with Y0 axle module on the board, vertically install Z axle module on the slide of Y0 axle module, install the subassembly and be located the discernment location camera subassembly of inhaling the subassembly side of putting of inhaling of crystalline grain on the slide of Z axle module, be provided with the crystalline grain position adjustment camera mechanism that is located the subassembly below of inhaling on the board, the both sides that are located crystalline grain position adjustment camera mechanism are provided with crystalline grain carrier module and water conservancy diversion piece carrier module.

Further, inhale put the subassembly including vertical setting and through mount pad and Z axle module's slide fixed connection's quill shaft step motor, but trachea rotary joint is installed to quill shaft step motor's quill shaft upper end, and the connecting seat is installed to quill shaft step motor's quill shaft lower extreme, the below elastic connection of connecting seat has the suction nozzle.

Furthermore, the identification and positioning camera assembly comprises an identification and positioning camera and a lens mounted on the identification and positioning camera, a first coaxial light source is mounted below the lens, the suction nozzle is located below the lower surface of the first coaxial light source, and the center of the suction nozzle is parallel to the optical center connecting line of the identification and positioning camera and the Y axis.

Further, crystalline grain position adjustment camera mechanism is including vertically installing the dovetail slip table on the board, install the riser on the dovetail slip table, the fixed plate that can lift adjustment is installed to the riser, crystalline grain position adjustment camera is installed to the downside of fixed plate, install the camera lens steering gear on the telecentric mirror head of crystalline grain position adjustment camera, install the coaxial light source of second that is located camera lens steering gear upside on the cantilever end of fixed plate.

Further, a dovetail slide rail is vertically arranged on the vertical plate, the fixed plate is connected with the dovetail slide rail through a slide block, and a hand-tightening bolt is arranged on the slide block.

Further, the crystalline grain carrier module is including the X1 axle module that vertically is provided with, transversely install Y1 axle module on the slide of X1 axle module, install the R axle revolving stage that is used for carrying putting the crystalline grain on the slide of Y1 axle module.

Further, the water conservancy diversion piece carrier module is including the X2 axle module that vertically is provided with, transversely install Y2 axle module on the slide of X2 axle module, install water conservancy diversion piece carrier platform on the slide of Y2 axle module.

Compared with the prior art, the utility model has the advantages of it is following:

1. the utility model discloses on the subsides of the patent technology "miniature semiconductor refrigeration crystalline grain subsides dress device" (patent application number: 202221189130.0) that has proposed the application subsides the technical basis, absorb, the direction is rectified and is pasted the dress operation flow to original crystalline grain and improve crystalline grain source coordinate control, paste dress coordinate control and vision correction link, on the basis of the pendulum mould of guaranteeing miniature semiconductor refrigeration crystalline grain, paste the dress precision, improved crystalline grain and pasted the dress speed.

2. In the mounting process, the movement control of the crystal grain carrier and the movement control of the deflector carrier and the Y-axis movement control can be synchronously carried out, so that the mounting speed is improved.

3. By installing the crystal grain direction adjusting camera mechanism, the single crystal grain can be rotationally adjusted, the flexibility of the crystal grain pose adjusting action is improved, the crystal grain direction is convenient to correct, and the quick mounting is realized.

Drawings

Fig. 1 is a structural diagram of a die attachment system of the present invention;

FIG. 2 is a structural view of the sucking and discharging assembly of the present invention;

FIG. 3 is a structural diagram of a die carrier according to the present invention;

fig. 4 is a structural view of a baffle carrier of the present invention;

fig. 5 is a structural diagram of a crystal grain orientation adjustment camera according to the present invention;

FIG. 6 is a schematic diagram illustrating a die attachment process according to the present invention;

FIG. 7 shows the effect of the refrigerating sheet after the upper and lower flow guide substrates are attached and welded to the crystal grains of the present invention;

in the figure: 1-Y0 axis module; 2. a Z-axis module; 3. identifying a positioning camera assembly; 31. a first coaxial light source; 4. a suction component; 41. a suction nozzle; 42. a spring; 43. a connecting seat; 44. a hollow shaft stepping motor; 45. a rotatable trachea joint; 46. a mounting seat; 5. a guide vane carrier module; 51. an X2-axis module; 52. a Y2-axis module; 53. a limit switch; 54. a vane carrier platform; 6. a dovetail slide; 61. a vertical plate; 62. a fixing plate; 63. a dovetail slide rail; 64. a slider; 65. tightening the bolt by hand; 7. a die orientation adjustment camera mechanism; 71. a grain orientation adjustment camera; 72. a telecentric lens; 73. a lens diverter; 74. a second coaxial light source 8, a die carrier module; 81. An X1 axis module; 82. a Y1 axis module; 83. an R-axis rotating table; 84. r-axis rotary table driver.

Detailed Description

In order to make the aforementioned features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below, but the present invention is not limited thereto.

Refer to fig. 1 to 7

A miniature semiconductor refrigeration crystal grain rapid mounting system comprises a machine table, wherein a Y0-axis module 1 is transversely arranged on the machine table, a Z-axis module 2 is vertically arranged on a sliding seat of the Y0-axis module, a crystal grain suction and discharge assembly 4 and a recognition and positioning camera assembly 3 located on the side face of the suction and discharge assembly are arranged on a sliding seat of the Z-axis module, a crystal grain direction adjusting camera mechanism 7 located below the suction and discharge assembly is arranged on the machine table, and a crystal grain carrier module 8 and a guide vane carrier module 5 are arranged on two sides of the crystal grain direction adjusting camera mechanism.

In this embodiment, the sucking and releasing assembly includes a hollow shaft stepping motor 44 vertically arranged and fixedly connected with the slide carriage of the Z-axis module through a mounting seat 46, an air pipe rotatable joint 45 is installed at the upper end of the hollow shaft stepping motor, a connecting seat 43 is installed at the lower end of the hollow shaft stepping motor, and a suction nozzle 41 is elastically connected below the connecting seat. The suction nozzle is provided with an annular flange, and a spring 42 with the lower end abutting against the annular flange and the upper end abutting against the connecting seat is sleeved on the suction nozzle so as to realize the elastic connection between the suction nozzle and the connecting seat. When the suction nozzle works, the suction nozzle moves in the Y-axis direction through the Y0-axis module, moves to and fro between the crystal grain carrier module and the deflector carrier module, and is lifted through the Z-axis module. The suction nozzle positive pressure can be controlled by the control electromagnetic valve in cooperation with the pressure regulating valve, and a proper air blowing action is added during the placement action, so that the crystalline grains are completely released, and the suction nozzle is prevented from being driven to interfere when being moved away.

In this example, taking a semiconductor refrigeration crystal grain with 0.5mm x 1.5mm as an example, a suction nozzle with a diameter of 0.30mm is used, and the suction height and the release height of the crystal grain are selected from the positions compressed by 0.10mm in a spring state.

In this embodiment, the recognition and positioning camera assembly includes a recognition and positioning camera and a lens mounted on the recognition and positioning camera, a first coaxial light source 31 is mounted below the lens, the suction nozzle is located below the lower surface of the first coaxial light source, and the center of the suction nozzle is parallel to the optical center connecting line of the recognition and positioning camera and the Y axis.

Identifying dies on the die carrier and identifying the guide patterns on the guide vane carrier both use a lens to identify and position the camera assembly. When the operation is started, the crystal grain station and the flow deflector mounting station are identified and respectively adjusted in a fine mode, so that the crystal grain suction point and the flow deflector placing point are located at the visual field center of each camera, namely two fixed points (which are called as a crystal grain carrier O1 point and a placing station photographing O2 point temporarily), and the suction nozzle only reciprocates between the two fixed points to achieve suction and mounting actions.

In this embodiment, the die orientation adjustment camera mechanism includes a dovetail slide 6 longitudinally mounted on the machine base, and in order to adjust the longitudinal position, a hand-tightening bolt is provided on the dovetail slide, so as to limit the position of the slide. Install the riser 61 on the dovetail slip table, fixed plate 62 that can lift adjustment is installed to the riser, crystalline grain position adjustment camera 71 is installed to the downside of fixed plate, install camera lens steering gear 73 on the telecentric mirror head 72 of crystalline grain position adjustment camera, install the coaxial light source 74 of second that is located camera lens steering gear upside on the cantilever end of fixed plate.

In this embodiment, in order to realize the lift adjustment of fixed plate, the vertical forked tail slide rail 63 that is provided with on the riser, the fixed plate is connected with the forked tail slide rail through slider 64, be provided with on the slider and hand tight bolt 65.

In this embodiment, the die orientation adjustment camera mechanism is disposed on the moving line of the die and below the die (between the O1 point and the O2 point), and the lens redirector 73 is used to perform 90-degree optical path direction conversion, so that a horizontally mounted camera can capture the orientation of the die on the suction nozzle from below the die, so as to identify an image and adjust the orientation of the die, and make the die be mounted smoothly.

In this embodiment, in order to provide the die to be sucked, the die carrier module includes an X1 axis module 81 disposed longitudinally, a Y1 axis module 82 is transversely installed on a sliding seat of the X1 axis module, an R axis rotating table 83 for loading the die is installed on the sliding seat of the Y1 axis module, and a table top of the R axis rotating table forms a die carrier platform. When the suction and discharge assembly sucks and mounts a crystal grain, the X1-axis module and the Y1-axis module can move the central point of the next crystal grain to an O1 point according to a preset path direction and moving parameters, and the R-axis rotating table finely adjusts the rotating crystal grain carrier to enable the edge direction of the crystal grain to be adjusted to be basically parallel to the X, Y axis, so that the mounting is convenient.

In this embodiment, as a target board for implementing placement and mounting of a die, the guide vane carrier module includes an X2-axis module 51 longitudinally disposed, a Y2-axis module 52 is transversely mounted on a slide carriage of the X2-axis module, and a guide vane carrier platform 54 is mounted on the slide carriage of the Y2-axis module. The guide vane carrier module is further provided with a limit switch 53, so that the moving positions of the slide seat of the X2-axis module and the slide seat of the Y2-axis module are limited. The die mounting coordinate position can be defined in advance according to the PCB pattern of the flow deflector and the size of the bonding pad, and when the suction and discharge assembly sucks and mounts one die, the movement control of the X2-axis module and the Y2-axis module can move the next mounting position coordinate to an O2 point.

In this embodiment, the Y0-axis module, the Z-axis module, the X1-axis module, the X2-axis module, the Y1-axis module, and the Y2-axis module may be linear modules, respectively.

In this embodiment, the system further includes a suction and discharge control unit of the suction and discharge assembly, and a motion control module. The motion control module comprises coordinate position control of the modules and connection control of actions in the mounting process.

In this embodiment, in the processes of sucking the die and mounting the die by the suction nozzle, the die carrier module and the guide plate carrier module can be synchronously controlled to move, so that the next die to be sucked is always in the O1 position and the guide plate of the next die to be mounted is always in the O2 position, thereby obviously improving the mounting speed.

The working principle of the device for quickly mounting the miniature semiconductor refrigeration crystal grain is as follows:

setting photographing detection positions, namely a crystal grain carrier O1 point and a placing station photographing O2 point, by taking Mark identification points of the sucking and placing stations as reference; respectively identifying and positioning the micro crystal grain to be sucked and the flow guide substrate to be pasted; adjusting the proper height through a laser displacement distance measuring sensor arranged on the Z-axis module to adjust the absorption height and the placement height, wherein the two heights are the same; the Y0 axis module moves to a point O1 of the crystal grain carrier, the crystal grain carrier moves to a working area at the same time, the initial position of the crystal grain carrier is that the first crystal grain to be sucked is positioned at the point O1, the recognition and positioning camera recognizes the crystal grain and positions, the suction and discharge assembly enables the suction nozzle to move to the position right above the crystal grain to suck the crystal grain with the expanded film in the step (a) through the matching motion of each module, and the suction link is completed; after the crystal grains are absorbed, the Y0-axis module moves towards the direction of the flow deflector carrier and is corrected by the crystal grain direction adjusting camera mechanism, and the purpose of correction is to enable the crystal grain direction on the suction nozzle to be matched with a flow guide pattern to be mounted, so that mounting is facilitated; after correction, the Y0 axis module reaches a placing station to photograph an O2 point, the diversion carrier moves simultaneously, the center point of the pattern to be pasted reaches the placing station to photograph the O2 point, the recognition and positioning camera recognizes and positions the diversion substrate, and then the suction assembly is subjected to micro-control air blowing and complete release right above, so that the crystal grains are placed on the diversion substrate with the tin glue in the point in the figure 6 (b), the pasting link is completed, and the swinging of the crystal grains is completed; repeating the above steps to complete the mold placing and mounting of the micro crystal grains on the whole flow guide substrate, wherein the mounting effect is shown in fig. 6 (c).

The above is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made according to the claims of the present invention should be covered by the present invention.

Claims (7)

1. A miniature semiconductor refrigeration crystal grain mounting device comprises a machine table and is characterized in that a Y0-axis module is transversely arranged on the machine table, a Z-axis module is vertically arranged on a sliding seat of the Y0-axis module, a crystal grain suction and discharge assembly and a recognition and positioning camera assembly located on the side face of the suction and discharge assembly are arranged on a sliding seat of the Z-axis module, a crystal grain direction adjusting camera mechanism located below the suction and discharge assembly is arranged on the machine table, and a crystal grain carrier module and a flow deflector carrier module are arranged on two sides of the crystal grain direction adjusting camera mechanism.

2. The miniature semiconductor refrigeration die mounting device according to claim 1, wherein the sucking and releasing assembly comprises a hollow shaft stepping motor which is vertically arranged and fixedly connected with the sliding seat of the Z-axis module through a mounting seat, a rotatable air pipe joint is mounted at the upper end of the hollow shaft stepping motor, a connecting seat is mounted at the lower end of the hollow shaft stepping motor, and a suction nozzle is elastically connected below the connecting seat.

3. The micro semiconductor cooling die mounting device as claimed in claim 2, wherein the identification and positioning camera assembly comprises an identification and positioning camera and a lens mounted on the identification and positioning camera, a first coaxial light source is mounted below the lens, the suction nozzle is located below the lower surface of the first coaxial light source, and the center of the suction nozzle is parallel to the optical center connecting line and the Y-axis of the identification and positioning camera.

4. The miniature semiconductor cooling die mounting device according to claim 1, 2 or 3, wherein the die orientation adjusting camera mechanism comprises a dovetail sliding table longitudinally installed on the machine table, a vertical plate is installed on the dovetail sliding table, a fixing plate capable of being adjusted in a lifting mode is installed on the vertical plate, the die orientation adjusting camera is installed on the lower side of the fixing plate, a lens steering gear is installed on a telecentric lens of the die orientation adjusting camera, and a second coaxial light source located on the upper side of the lens steering gear is installed on a cantilever end of the fixing plate.

5. The miniature semiconductor refrigeration die mounting device according to claim 4, wherein a dovetail slide rail is vertically arranged on the vertical plate, the fixed plate is connected with the dovetail slide rail through a slide block, and a hand-tightening bolt is arranged on the slide block.

6. The micro semiconductor cooling die mounting apparatus as claimed in claim 1, wherein the die carrier module comprises a longitudinally disposed X1 axis module, a slide carriage of the X1 axis module is transversely mounted with a Y1 axis module, and a slide carriage of the Y1 axis module is mounted with an R axis rotary table for loading a die.

7. The micro semiconductor cooling die mounting apparatus as claimed in claim 1, wherein the guide vane carrier module comprises a longitudinally disposed X2 axis module, a slide carriage of the X2 axis module is transversely mounted with a Y2 axis module, and a slide carriage of the Y2 axis module is mounted with a guide vane carrier platform.

Images