CN214676231U

CN214676231U - Thermosiphon radiator

Info

Publication number: CN214676231U
Application number: CN202022481470.8U
Authority: CN
Inventors: 王烨; 韦立川
Original assignee: Shenzhen Envicool Technology Co Ltd
Current assignee: Shenzhen Envicool Technology Co Ltd
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2021-11-09
Anticipated expiration: 2030-10-30

Abstract

The utility model discloses a thermosiphon radiator, which comprises a base plate and a radiating fin component, wherein the base plate is at least provided with a first accommodating cavity, a second accommodating cavity and a first plate surface, and the first plate surface is at least provided with a first radiating station and a second radiating station; the radiating fin assembly at least comprises a first radiating fin with a first gas-liquid channel and a second radiating fin with a second gas-liquid channel, the projection of the first gas-liquid channel is at least partially overlapped with the first accommodating cavity, and the projection of the second gas-liquid channel is at least partially overlapped with the second accommodating cavity and is partially overlapped with the first accommodating cavity; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are arranged in a staggered mode, the first gas-liquid channel is located on the upper side of the first accommodating cavity, the second accommodating cavity and the second gas-liquid channel are arranged in a staggered mode, and the second gas-liquid channel is located on the upper side of the second accommodating cavity. Therefore, the technical problem that a good heat dissipation effect cannot be achieved when the thermosiphon radiator radiates a plurality of heat sources which are different in height and deviate from the horizontal direction is solved.

Description

Thermosiphon radiator

Technical Field

The utility model relates to a radiating technical field especially relates to a thermosiphon radiator.

Background

In recent decades, with the rapid development of communication equipment, super computing, data mining, electronic commerce, artificial intelligence and other fields, the total heat dissipation capacity demand has increased dramatically. Device miniaturization further increases power density, while also exacerbating the need for efficient cooling solutions.

In the prior art, the heat of the high heat flux density component can be dissipated through a thermosiphon radiator. When a plurality of heat sources with different heights are placed in a manner of deviating from the horizontal direction, particularly when the heat sources are placed vertically, a good heat dissipation effect cannot be achieved when the heat sources with different heights and deviating from the horizontal direction are subjected to heat dissipation through the existing thermosiphon heat dissipater, and then the normal working environment of the heat sources can be influenced.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a thermosiphon heat sink to solve the technical problem that the prior art thermosiphon heat sink cannot achieve a good heat dissipation effect when dissipating heat from a plurality of heat sources having different heights and deviating from the horizontal direction.

To this end, in one embodiment there is provided a thermosiphon heat sink comprising:

the base plate at least comprises a first accommodating cavity and a second accommodating cavity which are arranged at intervals in the vertical direction, the first accommodating cavity is filled with a first phase change working medium, and the second accommodating cavity is filled with a second phase change working medium; the substrate is also provided with a first plate surface, and the first plate surface is at least provided with a first heat dissipation station corresponding to the first accommodating cavity and a second heat dissipation station corresponding to the second accommodating cavity;

the heat dissipation fin assembly at least comprises a first heat dissipation fin which corresponds to the first accommodating cavity and is arranged on the substrate and a second heat dissipation fin which corresponds to the second accommodating cavity and is arranged on the substrate; the first radiating fins are provided with first gas-liquid channels communicated with the first containing cavities, the second radiating fins are provided with second gas-liquid channels communicated with the second containing cavities, the projections of the first gas-liquid channels on the first plate surface are at least partially overlapped with the first containing cavities, and the projections of the second gas-liquid channels on the first plate surface are at least partially overlapped with the second containing cavities and are partially overlapped with the first containing cavities; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are arranged in a staggered mode, the first gas-liquid channel is located on the upper side of the first accommodating cavity, the second accommodating cavity and the second gas-liquid channel are arranged in a staggered mode, and the second gas-liquid channel is located on the upper side of the second accommodating cavity.

In some embodiments of the thermosiphon heat sink, the substrate is divided into at least a first portion, a second portion and a third portion arranged in sequence along a first direction, the second receiving cavity is disposed in the first portion, the first receiving cavity is disposed in the second portion, the first heat dissipation fin is disposed in the third portion and may partially extend to the second portion, and the second heat dissipation fin is disposed in the second portion and may partially extend to the first portion.

In some embodiments of the thermosiphon heat sink, the heat sink further comprises a first heat source and a second heat source, the first heat source is disposed on the first heat dissipation station, and a liquid level of the first phase change working medium is higher than a top of the first heat source;

the second heat source is arranged on the second heat dissipation station, and the liquid level of the second phase change working medium is higher than the top of the second heat source.

In some embodiments of the thermosiphon heat sink, a projection of the first heat source on the first plate surface is located within a projection of the first phase change working medium on the first plate surface;

the projection of the second heat source on the first plate surface is located within the projection of the second phase change material on the first plate surface.

In some embodiments of the thermosiphon heat sink, the substrate is provided with a first communicating hole and a second communicating hole, the first communicating hole communicates the first gas-liquid channel with the first accommodating cavity, and a hole wall of the first communicating hole, which is close to one side of the first heat dissipation station, is higher than or level with a liquid level of the first phase-change working medium; the second communication hole is communicated with the second gas-liquid channel and the second containing cavity, and the hole wall of the second communication hole, close to one side of the second heat dissipation station, is higher than the liquid level of the second phase-change working medium or is flush with the liquid level of the second phase-change working medium.

In some embodiments of the thermosiphon heat sink, the substrate further has a second plate surface disposed opposite to the first plate surface, and the first heat dissipation fin and the second heat dissipation fin are both disposed on the second plate surface.

In some embodiments of the thermosiphon heat sink, the thermosiphon heat sink further includes a heat dissipation member disposed corresponding to the second receiving cavity, and the heat dissipation member is disposed on the second plate surface.

In some embodiments of the thermosiphon heat sink, a projection of the second phase change working medium on the first plate surface at least partially overlaps a projection of the heat sink on the first plate surface.

In some embodiments of the thermosiphon heat sink, the heat sink is an expansion plate fin or a solid fin.

In some embodiments of the thermosiphon heat sink, the first cooling fin has a first liquid injection hole in communication with the first gas-liquid channel; or the base plate is provided with a first liquid injection hole communicated with the first containing cavity;

the second radiating fin is provided with a second liquid injection hole communicated with the second gas-liquid channel, or the base plate is provided with a second liquid injection hole communicated with the second containing cavity.

Adopt the embodiment of the utility model provides a, following beneficial effect has:

the projection of the first gas-liquid channel on the first plate surface is at least partially overlapped with the first accommodating cavity, and the first gas-liquid channel is communicated with the first accommodating cavity, so that gaseous first phase change working medium formed by heating evaporation is diffused to the first gas-liquid channel for condensation and heat release; the projection of the second gas-liquid channel on the first plate surface is at least partially overlapped with the second containing cavity so that the second gas-liquid channel is communicated with the second containing cavity, and therefore the gaseous second phase change working medium formed by heating and evaporation is diffused to the second gas-liquid channel to be condensed and release heat; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are arranged in a staggered mode, the first gas-liquid channel is located on the upper side of the first accommodating cavity, the second accommodating cavity and the second gas-liquid channel are arranged in a staggered mode, and the second gas-liquid channel is located on the upper side of the second accommodating cavity, so that the first gas-liquid channel is higher than the first accommodating cavity to prevent the first phase-change working medium from flowing into the first gas-liquid channel, and the second gas-liquid channel is higher than the second accommodating cavity to prevent the second phase-change working medium from flowing into the second gas-liquid channel; furthermore, in the vertical direction of the substrate, the projection of the second gas-liquid channel on the first plate surface is at least partially overlapped with the first accommodating cavity, so that the vacant space formed by the dislocation arrangement of the first gas-liquid channel and the first accommodating cavity on the substrate is fully utilized to arrange the position of the second gas-liquid channel, the relative positions among the first gas-liquid channel, the first accommodating cavity, the second gas-liquid channel and the second accommodating cavity are compactly arranged along the height extending direction of the substrate, and a plurality of heat sources with different heights and deviating from the horizontal direction can be radiated; and the first heat source arranged on the first heat dissipation station and the second heat source arranged on the second heat dissipation station are dissipated through the combined action of two-phase heat exchange and steam movement, so that the heat dissipation effect of the thermosiphon heat sink is improved. The technical problem that a good heat dissipation effect cannot be achieved when the heat siphon radiator in the prior art dissipates heat of a plurality of heat sources which are different in height and deviate from the horizontal direction is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

fig. 1 is a schematic view illustrating an overall structure of a thermosiphon heat sink according to the present invention;

FIG. 2 illustrates a left side view of an implemented thermosiphon heat sink;

FIG. 3 shows a left side view of a thermosiphon heat sink of another implementation;

fig. 4 shows a schematic heat dissipation diagram of a thermosiphon heat sink according to the present invention.

Description of the main element symbols:

100. a thermosiphon heat sink; 10. a substrate; 11. a first portion; 12. a second portion; 13. a third portion; 10a, a first accommodating cavity; 10b, a second accommodating cavity; 10c, a first plate surface; 10d, a second board surface; 10e, a first communication hole; 10f, a second communication hole; 10g, a first heat dissipation station; 10j, a second heat dissipation station; 21. a first heat source; 22. a second heat source; 30. a heat sink fin assembly; 31. a first heat radiation fin; 311. a first gas-liquid channel; 312. a first inner bottom surface; 32. a second heat radiation fin; 321. a second gas-liquid passage; 322. a second inner bottom surface; 40. a heat sink.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-4, in the embodiment of the present invention, a thermosiphon heat sink 100 is provided, in which the thermosiphon heat sink 100 cools the power electronic device through its own functions of heat conduction and heat release, such as heat dissipation of a central processing unit, a chip, etc. of the power electronic device, and ensures that the power electronic device stably operates within a rated temperature range.

The thermosiphon heat sink 100 includes a substrate 10 and a heat fin assembly 30; the substrate 10 at least has a first receiving cavity 10a and a second receiving cavity 10b arranged at intervals along the vertical direction of the substrate 10, the first receiving cavity 10a is filled with a first phase change working medium (not shown in the figure), and the second receiving cavity 10b is filled with a second phase change working medium (not shown in the figure); the substrate 10 further has a first board surface 10c, and the first board surface 10c is provided with at least a first heat dissipation station 10g corresponding to the first accommodating cavity 10a and a second heat dissipation station 10j corresponding to the second accommodating cavity 10 b. The heat radiation fin assembly 30 includes at least a first heat radiation fin 31 corresponding to the first receiving cavity 10a and provided on the substrate 10 and a second heat radiation fin 32 corresponding to the second receiving cavity 10b and provided on the substrate 10; the first heat dissipation fin 31 has a first gas-liquid channel 311 communicated with the first accommodation cavity 10a, the second heat dissipation fin 32 has a second gas-liquid channel 321 communicated with the second accommodation cavity 10b, a projection of the first gas-liquid channel 311 on the first plate surface 10c at least partially overlaps the first accommodation cavity 10a, a projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps the second accommodation cavity 10b and partially overlaps the first accommodation cavity 10 a; in the vertical direction of the substrate 10, the first receiving cavity 10a and the first gas-liquid passage 311 are disposed in a staggered manner, and the first gas-liquid passage 311 is located on the upper side of the first receiving cavity 10a, and the second receiving cavity 10b and the second gas-liquid passage 321 are disposed in a staggered manner, and the second gas-liquid passage 321 is located on the upper side of the second receiving cavity 10 b.

It should be noted that the first phase change medium filled in the first receiving cavity 10a is in a state of saturation pressure and saturation temperature, and the second phase change medium filled in the second receiving cavity 10b is in a state of saturation pressure and saturation temperature.

The first heat source 21 is arranged on the first heat dissipation station 10g to exemplify the heat dissipation process of the thermosiphon heat sink 100, and when the first phase change working medium is heated, the first phase change working medium can be evaporated from a liquid state to a gaseous state; when the first phase change working medium is cooled, the gaseous first phase change working medium can be converted into the liquid first phase change working medium. Therefore, after the first phase-change working medium in the first accommodating cavity 10a is heated by the first heat source 21, the first phase-change working medium absorbs heat of the first heat source 21 through rapid vaporization and is converted from a liquid state to a gaseous state; the gaseous first phase change working medium is heated and can be diffused into the first gas-liquid channel 311, the gaseous first phase change working medium is condensed on the inner wall surface of the first radiating fin 31, and simultaneously releases a large amount of heat, the heat is transmitted to the outer surface of the first radiating fin 31 through the inner wall surface of the first radiating fin 31, the heat on the outer surface of the first radiating fin 31 is released into the environment through multiple heat exchange modes such as natural convection heat exchange, forced convection heat exchange or evaporation heat exchange and the like with the environment, the condensed liquid first phase change working medium flows back to the accommodating cavity from the first gas-liquid channel 311 under the action of gravity to continue to be heated and evaporated, so that the phase change circulation between the first accommodating cavity 10a and the first gas-liquid channel 311 through the first phase change working medium is completed, and the heat is transmitted to the first radiating fin 31 from the first heat source 21. When the second heat source 22 is disposed at the second heat dissipation station 10j, the heat dissipation process of the second heat source 22 may refer to the heat dissipation process of the first heat source 21, and will not be described herein again.

It should be noted that there are a plurality of first heat dissipation fins 31 and a plurality of second heat dissipation fins 32, each first heat dissipation fin 31 has a first gas-liquid channel 311 formed therein, and each second heat dissipation fin 32 has a second gas-liquid channel 321 formed therein. According to the technical scheme, heat is rapidly transmitted to the first radiating fins 31 and the second radiating fins 32 through phase change heat exchange of the first phase change working medium and the second phase change working medium and diffusion movement of steam, and then the heat is released to the environment through natural convection heat exchange, and the heat-transferring heat-radiating device is particularly shown in figure 3. Since the phase change heat transfer can realize the exchange of large heat amount under a small temperature difference, and the steam diffusion is very rapid, the temperature difference between the heat source and the heat dissipation fin assembly 30 is very small, the thermal resistance from the heat source to the heat dissipation fin assembly 30 is greatly reduced, and the heat transfer efficiency of the thermosiphon heat sink 100 is improved.

In the utility model, the projection of the first gas-liquid channel 311 on the first plate surface 10c is at least partially overlapped with the first containing cavity 10a, and the first gas-liquid channel 311 is communicated with the first containing cavity 10a, so that the gaseous first phase change working medium formed by thermal evaporation is diffused to the first gas-liquid channel 311 for condensation and heat release; the projection of the second gas-liquid channel 321 on the first plate surface 10c is at least partially overlapped with the second containing cavity 10b, so that the second gas-liquid channel 321 is communicated with the second containing cavity 10b, and the gaseous second phase-change working medium formed by heating and evaporation is diffused to the second gas-liquid channel 321 to be condensed and release heat; in the vertical direction of the substrate 10, the first receiving cavity 10a and the first gas-liquid channel 311 are arranged in a staggered manner, the first gas-liquid channel 311 is located on the upper side of the first receiving cavity 10a, the second receiving cavity 10b and the second gas-liquid channel 321 are arranged in a staggered manner, and the second gas-liquid channel 321 is located on the upper side of the second receiving cavity 10b, so that the first gas-liquid channel 311 is higher than the first receiving cavity 10a to prevent the first phase-change working medium from flowing into the first gas-liquid channel 311, and the second gas-liquid channel 321 is higher than the second receiving cavity 10b to prevent the second phase-change working medium from flowing into the second gas-liquid channel 321; further, in the vertical direction of the substrate 10, the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps the first accommodating cavity 10a, so that the vacant space formed by the first gas-liquid channel 311 and the first accommodating cavity 10a in the staggered arrangement of the substrate 10 is fully utilized to arrange the position of the second gas-liquid channel 321, and the relative positions among the first gas-liquid channel 311, the first accommodating cavity 10a, the second gas-liquid channel 321 and the second accommodating cavity 10b are compactly arranged along the height extension direction of the substrate 10, so that a plurality of heat sources with different heights and deviating from the horizontal direction can be radiated; and the first heat source 21 arranged on the first heat dissipation station 10g and the second heat source 22 arranged on the second heat dissipation station 10j are dissipated by the combined action of the two-phase heat exchange and the steam movement, so that the heat dissipation effect of the thermosiphon heat sink 100 is improved. The technical problem that a good heat dissipation effect cannot be achieved when the heat siphon radiator in the prior art dissipates heat of a plurality of heat sources which are different in height and deviate from the horizontal direction is solved.

It should be noted that, as shown in fig. 1-2, the first heat dissipation stations 10g correspond to the first receiving cavities 10a, and the second heat dissipation stations 10j correspond to the second receiving cavities 10b, which means that the first heat dissipation stations 10g are disposed on the same surface of the first board 10c of the substrate 10 as the first receiving cavities 10a, the second heat dissipation stations 10j are disposed on the same surface of the first board 10c of the substrate 10 as the second receiving cavities 10b, so that the heat of the first heat source 21 on the first heat dissipation station 10g can be directly transferred to the first phase change working medium in the first receiving cavities 10a through the thin wall between the first board 10c and the first receiving cavities 10a, and the heat of the second heat source 22 on the second heat dissipation station 10j can be directly transferred to the second phase change working medium in the second receiving cavities 10b through the thin wall between the first board 10c and the second receiving cavities 10b, the first phase change working medium absorbs heat to vaporize and takes away the heat of the first heat source 21, and the second phase change working medium absorbs heat to vaporize and takes away the heat of the second heat source 22. In addition, the vertical direction of the base plate 10 is only one reference direction for describing the offset arrangement of the first gas-liquid passage 311 and the first receiving cavity 10a and the offset arrangement of the second gas-liquid passage 321 and the second receiving cavity 10b, as shown in fig. 1-3, when the base plate 10 is vertically placed, the vertical direction of the base plate 10 is the same as the Z direction shown in fig. 1, the first heat dissipation fins 314 are offset in the Z direction shown in fig. 1 with respect to the first receiving cavity 10a and the first heat source 21 on the first heat dissipation station 10g, and the second heat dissipation fins 32 are offset in the Z direction shown in fig. 1 with respect to the second receiving cavity 10b and the second heat source 22 on the second heat dissipation station 10 j; it is understood that when the substrate 10 is horizontally placed, the vertical direction is also changed accordingly, and the vertical direction is the same as the horizontal direction; when the substrate 10 is placed obliquely, the vertical direction at this time is also inclined with respect to the horizontal plane.

When the first heat source 21 and the second heat source 22 having different heights and deviating from the horizontal direction are radiated, in order to prevent the first heat source 21 and the second heat source 22 from being dried, the first phase change medium needs to be in full contact with the whole first heat source 21, and the second phase change medium needs to be in full contact with the whole second heat source 22. However, the first receiving cavity 10a needs to communicate with the first gas-liquid passage 311 to diffuse the gaseous first phase-change working substance, the second receiving cavity 10b needs to communicate with the second gas-liquid passage 321 to diffuse the gaseous second phase-change working substance, in order to ensure sufficient filling amounts of the first phase change working medium and the second phase change working medium, the first phase change working medium flows into the first gas-liquid channel 311, and the second phase change working medium flows into the second gas-liquid channel 321, on the one hand, the filling amount of the first phase change working medium and the second phase change working medium can be increased, unnecessary waste is caused, on the other hand, the first phase change working medium flowing into the first gas-liquid channel 311 can occupy the space of the first gas-liquid channel 311, the second phase change working medium flowing into the second gas-liquid channel 321 can occupy the space of the second gas-liquid channel 321, the condensation area of heated steam is reduced, and the heat exchange efficiency of the heat dissipation fin assembly 30 is limited. Therefore, in the technical scheme, the first gas-liquid channel 311 and the first phase change working medium are arranged in a staggered manner, and the second gas-liquid channel 321 and the second phase change working medium are arranged in a staggered manner, namely the first gas-liquid channel 311 is positioned right above or laterally above the first phase change working medium, and the second gas-liquid channel 321 is positioned right above or laterally above the second phase change working medium, so that the heat source component is ensured to be fully contacted to improve the heat transfer efficiency, and the condensation space of steam is also ensured.

It should be noted that the base plate 10 of the thermosiphon heat sink 100 may further be provided with three, four, etc. multiple receiving cavities, and multiple sets of heat dissipation fins may be provided corresponding to the number of the receiving cavities, and the relative positions of the gas-liquid channel of the heat dissipation fins, the phase change working medium in the receiving cavities, and the heat source, etc. are all set by the structure of the thermosiphon heat sink 100 with two receiving cavities, so as to achieve heat dissipation for multiple heat sources with different heights, and ensure a compact structure.

It should be noted that the base plate 10 may be disposed off the horizontal direction, that is, the base plate 10 may be disposed vertically or obliquely with respect to the horizontal direction. Specifically, the base plate 10 further has a second plate surface 10d arranged opposite to the first plate surface 10c, and the first heat dissipation fins 31 and the second heat dissipation fins 32 are both arranged on the second plate surface 10d of the base plate 10, so as to avoid interference of heat of the first heat source 21 and the second heat source 22 on heat dissipation of the first heat dissipation fins 31 and the second heat dissipation fins 32 when the first heat source 21 and the first heat dissipation fins 31 are located on the same side and the second heat source 22 and the second heat dissipation fins 32 are located on the same side, and ensure heat exchange efficiency of the first heat dissipation fins 31 and the second heat dissipation fins 32 with the environment.

The substrate 10 may be formed of two metal substrates 10 to ensure thermal conductivity of the substrate 10, and the two metal substrates 10 form the substrate 10 having the first receiving cavity 10a and the second receiving cavity 10 b.

Specifically, the substrate 10 is divided into at least a first portion 11, a second portion 12, and a third portion 13 arranged in sequence along the first direction, the second receiving cavity 10b is disposed at the first portion 11, the first receiving cavity 10a is disposed at the second portion 12, the first heat dissipation fin 31 is disposed at the third portion 13 and may extend partially to the second portion 12, and the second heat dissipation fin 32 is disposed at the second portion 12 and may extend partially to the first portion 11. Wherein the first direction is the same as the vertical direction of the substrate 10 described above, and in this embodiment, the first direction is the Z direction shown in fig. 1.

The thermosiphon heat radiator 100 at least comprises a first heat source 21 and a second heat source 22, preferably, the first heat source 21 is arranged on the first heat radiation station 10g, and the liquid level of the first phase change working medium is higher than the top of the first heat source 21; the filling amount of the first phase change working medium is enough, the situation that the first heat source 21 on the first heat dissipation station 10g cannot be completely covered by the remaining first phase change working medium in the first accommodating cavity 10a due to the fact that a part of the first phase change working medium is heated and evaporated is avoided, and the situation that the first heat source 21 is partially dried is avoided.

The second heat source 22 is arranged on the second heat dissipation station 10j, and the liquid level of the second phase-change working medium is higher than the top of the second heat source 22. So as to ensure that the filling amount of the second phase change medium is sufficient, prevent the second phase change medium remaining in the second accommodating cavity 10b from being incapable of completely covering the second heat source 22 on the second heat dissipation station 10j due to the evaporation of a part of the second phase change medium by heating, and avoid the situation that the second heat source 22 is partially dried.

In one embodiment, the projection of the first heat source 21 onto the first plate surface 10c is located within the projection of the first phase change medium onto the first plate surface 10 c. Therefore, the first heat source 21 disposed on the first heat dissipation station 10g can be in sufficient indirect contact with the first phase change working medium, preventing the first heat source 21 and the substrate 10 from dry burning.

The projection of the second heat source 22 onto the first face 10c is located within the projection of the second phase change material onto the first face 10 c. Therefore, the second heat source 22 disposed at the second heat radiation station 10j can be in sufficient indirect contact with the second phase change material, preventing the second heat source 22 and the substrate 10 from being dried.

In some specific embodiments, the bottom of the first heat source 21 disposed at the first heat dissipation station 10g is flush with the bottom surface of the first phase change medium. That is, under the condition that the first phase-change working medium fully covers the first heat source 21, the filling amount of the first phase-change working medium can be reduced by further limiting the relative specific positions of the first heat source 21 and the first phase-change working medium.

The bottom of the second heat source 22 arranged at the second heat dissipation station 10j is flush with the bottom surface of the second phase change working medium. That is, under the condition of ensuring that the second phase-change working medium fully covers the second heat source 22, the filling amount of the second phase-change working medium can be reduced by further limiting the relative specific positions of the second heat source 22 and the second phase-change working medium.

In some embodiments, the bottom of the first heat source 21 disposed at the first heat dissipation station 10g is higher than the bottom surface of the first phase-change working medium, so that the first phase-change working medium can conduct heat to the first heat source 21 disposed at the first heat dissipation station 10g integrally.

The bottom of the second heat source 22 arranged at the second heat dissipation station 10j is higher than the bottom surface of the second phase change working medium, so that the second phase change working medium can conduct overall heat conduction on the second heat source 22 arranged at the second heat dissipation station 10 j.

As shown in fig. 2 or fig. 3, the substrate 10 is provided with a first communicating hole 10e communicating the first gas-liquid passage 311 and the first accommodating cavity 10a, and the liquid level of the first phase-change working medium may be higher than or lower than or flush with the hole wall of the first communicating hole 10e on the side close to the first heat dissipation station 10 g. When the liquid level of the first phase change working medium is higher than the hole wall of the first communication hole 10e on the side close to the first heat dissipation station 10g, that is, the first phase change working medium overflows to the first gas-liquid channel 311 through the first communication hole 10e, the filling amount of the first phase change working medium is ensured to be sufficient.

When the liquid level of the first phase-change working medium is lower than the hole wall of the first through hole 10e close to the first heat dissipation station 10g side, that is, the hole wall of the first through hole 10e close to the first heat dissipation station 10g side is higher than the liquid level of the first phase-change working medium, the liquid level of the first phase-change working medium in the first accommodating cavity 10a is at a certain distance from the lower hole wall of the first through hole 10e, so that the first phase-change working medium cannot flow into the first gas-liquid channel 311 of the first heat dissipation fin 31, and the condensation area of the first gas-liquid channel 311 can be ensured.

Preferably, the hole wall of the first communication hole 10e on the side close to the first heat dissipation station 10g is flush with the liquid level of the first phase change working medium, that is, the liquid level of the first phase change working medium is flush with the lower hole wall of the first communication hole 10e, which not only ensures that the first phase change working medium does not overflow to the first gas-liquid channel 311 to prevent the condensation area from decreasing, but also ensures that the filling amount of the first phase change working medium is sufficient.

The base plate 10 is further provided with a second communicating hole 10f communicating the second gas-liquid channel 321 and the second accommodating cavity 10b, and the liquid level of the second phase-change working medium can be higher than or lower than or flush with the hole wall of the second communicating hole 10f on the side close to the second heat dissipation station 10 j. When the liquid level of the second phase change working medium is higher than the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j, namely, the second phase change working medium overflows to the second gas-liquid channel 321 through the second communication hole 10f, the filling amount of the second phase change working medium is ensured to be sufficient.

When the liquid level of the second phase-change working medium is lower than the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j, that is, the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j is higher than the liquid level of the second phase-change working medium, and the liquid level of the second phase-change working medium in the second accommodating cavity 10b is at a certain distance from the lower hole wall of the second communication hole 10f, the second phase-change working medium does not flow into the second gas-liquid channel 321 of the second heat dissipation fin 32, and the condensation area of the second gas-liquid channel 321 can be ensured.

Preferably, the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j is flush with the liquid level of the second phase change medium, that is, the liquid level of the second phase change medium is flush with the lower hole wall of the second communication hole 10f, which not only ensures that the second phase change medium does not overflow to the second gas-liquid channel 321 to prevent the condensation area from decreasing, but also ensures that the filling amount of the second phase change medium is sufficient.

In one embodiment, the thermosiphon heat sink 100 further includes a heat sink 40 disposed corresponding to the second receiving cavity 10b, the heat sink 40 being on the second plate surface 10 d. The heat dissipation capability of the thermosiphon heat sink 100 is improved by the heat conduction of the heat sink 40 and the substrate 10.

In some embodiments, the heat sink 40 is an expansion plate fin, a solid fin, or other types of heat sink fins. The heat sink 40 and the heat dissipation fins may be integrated or separated, as shown in fig. 2 and 3.

In one embodiment, the projection of the second phase change material on the first board 10c at least partially overlaps the projection of the heat sink 40 on the first board 10 c. That is, the heat of the second phase change working medium can be dissipated not only by the steam but also by the heat conduction of the heat dissipating member 40.

In some embodiments, the first heat dissipation fin 31 is flush with one end of the substrate 10, and the heat dissipation member 40 is flush with the other end of the substrate 10. That is, when the occupied space of the thermosiphon heat sink 100 is predetermined, the heat radiation area of the first heat radiation fins 31 and the heat conduction area of the heat sink 40 are sufficiently increased, and the heat radiation efficiency is improved.

In some embodiments, the first heat dissipation fins 31 may protrude from one end of the substrate 10, and/or the heat dissipation member 40 may protrude from the other end of the substrate 10, so as to improve heat dissipation efficiency.

In some embodiments, referring to fig. 2 or fig. 3, the second receiving cavity 10b is opened in the first portion 11 of the substrate 10, and the second receiving cavity 10b extends to an end of the first portion 11 away from the second portion 12, that is, the second receiving cavity 10b extends to a bottom end of the first portion 11, so as to fully utilize the volume of the substrate 10, that is, the volume of the thermosiphon heat sink 100 can be reduced, and the applicability thereof can be improved. It should be noted that, the position of the second accommodating cavity 10b is not limited to this, and in the height extending direction of the substrate 10, the second gas-liquid channel 321 is always located above the first phase-change working medium, and the first gas-liquid channel 311 is always located above the first phase-change working medium.

In one embodiment, the first heat dissipation fins 31 and the second heat dissipation fins 32 are arranged at intervals, and the heat dissipation functions of the first heat dissipation fins 31 and the second heat dissipation fins 32 are relatively independent and are not interfered by the intervals. The distance between the first and second radiating

fins

31 and 32 can be adjusted according to the compactness and the heat radiation performance of the overall structure of the thermosiphon heat sink 100.

In some specific embodiments, the first heat dissipation fins 31 and the second heat dissipation fins 32 are multiple, and the multiple first heat dissipation fins 31 are all communicated with the first accommodating cavity 10a, that is, the multiple first heat dissipation fins 31 are communicated with each other through the first accommodating cavity 10 a; the plurality of second heat dissipation fins 32 are all communicated with the first accommodation cavity 10a, that is, the plurality of second heat dissipation fins 32 are mutually communicated through the second accommodation cavity 10b, therefore, steam formed by thermal evaporation of the first phase change working medium in the first accommodation cavity 10a can be rapidly diffused into the first gas-liquid channels 311 of the first heat dissipation fins 31, steam formed by thermal evaporation of the second phase change working medium in the second accommodation cavity 10b can be rapidly diffused into the second gas-liquid channels 321 of the second heat dissipation fins 32, and all the first heat dissipation fins 31 and the second heat dissipation fins 32 are fully utilized for heat dissipation to improve the heat dissipation efficiency. Meanwhile, the plurality of first heat dissipation fins 31 are spaced and arranged in parallel, and the plurality of second heat dissipation fins 32 are spaced and arranged in parallel, so that the outer surfaces of the respective first heat dissipation fins 31 and the respective second heat dissipation fins 32 can exchange heat with the environment in a fully balanced manner, and the heat dissipation effect of the heat dissipation fin assembly 30 is ensured. Therefore, the problem that the whole radiator cannot be used for radiating because the substrate 10 of the traditional radiator has weak diffusion capacity when the size of the heat source is small in the prior art is solved.

The first heat dissipation fin 31 may have a rectangular structure, and the first heat dissipation fin 31 has a first inner bottom surface 312 forming the first gas-liquid channel 311, the first heat dissipation fin 31 is provided with a third communication hole communicating the first gas-liquid channel 311 with the first communication hole 10e, that is, the first gas-liquid channel 311 and the first receiving chamber 10a are communicated through the first communication hole 10e and the third communication hole, and the hole walls of the third communication hole are connected to the first inner bottom surface 312 and the second communication hole 10f, so that the condensed first phase-change working medium may flow back to the first receiving chamber 10a through the first inner bottom surface 312, the third communication hole, and the first communication hole 10 e. It should be noted that the shape of the first heat dissipating fin 31 includes, but is not limited to, for example, the first inner bottom surface 312 of the first heat dissipating fin 31 for forming the first gas-liquid channel 311 may be configured as an inclined surface, an arc-shaped inclined surface, or the like, and the inclined surface or the arc-shaped inclined surface is made to contact with the hole wall of the third communicating hole of the first heat dissipating fin 31, so that the condensed liquid can flow through the inclined surface or the arc-shaped inclined surface and then flow back to the first receiving cavity 10 a.

The second heat dissipation fin 32 may have a rectangular structure, and the second heat dissipation fin 32 has a second inner bottom surface 322 forming the second gas-liquid channel 321, the second heat dissipation fin 32 is provided with a fourth communication hole communicating the second gas-liquid channel 321 and the second communication hole 10f, and the hole walls of the fourth communication hole are connected to the second inner bottom surface 322 and the hole walls of the second communication hole 10f, so that the condensed second phase change material may flow back to the second accommodation cavity 10b through the second inner bottom surface 322, the fourth communication hole, and the second communication hole 10 f. It should be noted that the shape of the second heat dissipating fin 32 includes, but is not limited to, for example, the second inner bottom surface 322 of the second heat dissipating fin 32 for forming the second gas-liquid channel 321 may be configured as an inclined surface, an arc-shaped inclined surface, or the like, and the inclined surface or the arc-shaped inclined surface is made to contact with the hole wall of the fourth communication hole of the second heat dissipating fin 32, so that the condensed liquid may flow through the inclined surface or the arc-shaped inclined surface and then flow back to the second receiving chamber 10 b.

In addition, the heat dissipation fin assembly 30 is fixed on the substrate 10 by means of welding, so as to ensure that the heat dissipation fin assembly 30 and the substrate 10 are relatively stable.

In one embodiment, the first heat dissipation fin 31 defines a first liquid injection hole (not shown) communicating with the first gas-liquid channel 311. The first liquid injection hole may be opened at an end of the first heat dissipating fin 31 away from the first accommodating cavity 10a, that is, the first liquid injection hole is opened at a top end of the first heat dissipating fin 31, a first phase change working medium is injected into the first gas-liquid passage 311 from the first liquid injection hole, and the first phase change working medium flows through the first inner bottom surface 312, the third communicating hole, and the first communicating hole 10e in sequence under the action of gravity and then is stored in the first accommodating cavity 10 a.

The second heat dissipation fin 32 is provided with a second liquid injection hole (not shown) communicating with the second gas-liquid passage 321. The second liquid injection hole may be opened at an end of the second heat dissipating fin 32 away from the second receiving cavity 10b, that is, the second liquid injection hole is opened at a top end of the second heat dissipating fin 32, and the second phase-change medium is injected into the second gas-liquid passage 321 through the second liquid injection hole, and the second phase-change medium flows through the second inner bottom surface 322, the fourth communication hole, and the second communication hole 10f in sequence under the action of gravity, and then is stored in the second receiving cavity 10 b.

In one embodiment, the base plate 10 is provided with a first injection hole (not shown) communicating with the first housing cavity 10a, and the first phase-change working medium is injected into the first housing cavity 10a from the first injection hole.

The base plate 10 is further provided with a second liquid injection hole (not shown) communicating with the second housing chamber 10b, and the second phase-change material is injected into the second housing chamber 10b through the second liquid injection hole.

It is worth one, the number of the first heat dissipation stations 10g and the second heat dissipation stations 10j may be multiple, and the plurality of first heat dissipation stations 10g and the plurality of second heat dissipation stations 10j are all arranged at intervals along the width direction of the substrate 10. In addition, the above embodiment is only directed to the case that only includes two receiving cavities and two heat dissipation stations, in some other embodiments, the thermosiphon heat sink 100 may further include a third receiving cavity, a fourth receiving cavity, a fifth receiving cavity, and the like, which are arranged at intervals in the vertical direction of the substrate, and a plurality of third heat dissipation stations, a plurality of fourth heat dissipation stations, a plurality of fifth heat dissipation stations, and the like, where the plurality of third heat dissipation stations, the plurality of fourth heat dissipation stations, and the plurality of fifth heat dissipation stations respectively correspond to the third receiving cavity, the fourth receiving cavity, the fifth receiving cavity, and the like, and the number of the heat dissipation stations and the receiving cavities may be selected according to actual needs to meet different heat dissipation requirements.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples are merely illustrative of several embodiments of the present invention, which are described in more detail and detail, but are not to be construed as limiting the scope of the claims. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A thermosiphon heat sink, comprising:

the base plate at least comprises a first accommodating cavity and a second accommodating cavity which are arranged at intervals in the vertical direction, the first accommodating cavity is filled with a first phase change working medium, and the second accommodating cavity is filled with a second phase change working medium; the substrate is also provided with a first plate surface, and the first plate surface is provided with a first heat dissipation station corresponding to the first accommodating cavity and a second heat dissipation station corresponding to the second accommodating cavity;

2. The thermosiphon heat sink of claim 1, wherein the base plate is divided into at least a first portion, a second portion, and a third portion arranged in sequence along a first direction, the second receiving cavity is disposed at the first portion, the first receiving cavity is disposed at the second portion, the first fin is disposed at the third portion and extends partially to the second portion, and the second fin is disposed at the second portion and extends partially to the first portion.

3. The thermosiphon heat sink of claim 1, further comprising at least a first heat source and a second heat source, the first heat source disposed on the first heat dissipation station, the first phase change working medium having a liquid level above a top of the first heat source;

4. The thermosiphon heat sink of claim 3, wherein a projection of the first heat source onto the first plate surface is located within a projection of the first phase change working medium onto the first plate surface;

5. The thermosiphon heat sink according to claim 1, wherein the substrate is provided with a first communication hole and a second communication hole, the first communication hole communicates the first gas-liquid channel with the first receiving cavity, and a hole wall of the first communication hole, which is close to one side of the first heat dissipation station, is higher than or flush with a liquid level of the first phase-change working medium; the second communication hole is communicated with the second gas-liquid channel and the second containing cavity, and the hole wall of the second communication hole, close to one side of the second heat dissipation station, is higher than the liquid level of the second phase-change working medium or is flush with the liquid level of the second phase-change working medium.

6. The thermosiphon heat sink of one of claims 1 to 5, wherein the base plate further has a second plate surface disposed opposite the first plate surface, the first fins and the second fins being disposed on the second plate surface.

7. The thermosiphon heat sink of claim 6, further comprising a heat sink disposed in correspondence with the second receiving cavity, the heat sink being on the second plate surface.

8. The thermosiphon heat sink of claim 7, wherein a projection of the second phase change working medium onto the first plate surface at least partially overlaps a projection of the heat sink onto the first plate surface.

9. The thermosiphon heat sink of claim 8, wherein the heat sink is an expanded plate fin or a solid fin.

10. The thermosiphon heat sink of claim 9, wherein the first fin has a first liquid injection hole in communication with the first gas-liquid channel; or the base plate is provided with a first liquid injection hole communicated with the first containing cavity;