CN114650696A - Thermosiphon radiator - Google Patents

Abstract

The invention discloses a thermosiphon radiator, which comprises a base plate and radiating fins; the base plate is divided into a first plate part and a second plate part along a first direction, the first plate part is provided with a first containing cavity for containing a phase change working medium, and a heat dissipation station for mounting a heat source is arranged on the outer surface of the first plate part corresponding to the first containing cavity; the radiating fins are arranged on the second plate part and extend in the direction far away from the first plate part along the second direction, and gas-liquid channels communicated with the first containing cavities are formed in the radiating fins; wherein the first direction is different from the second direction. By the technical scheme, the technical problem that a good radiating effect cannot be achieved when the heat source is used for radiating heat, wherein the space of the heat radiating end, which needs to be extended, of the existing thermosiphon radiator is limited is solved.

Description

Thermosiphon radiator

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a thermosiphon heat radiator.

Background

In recent decades, with the rapid development of communication equipment, super computing, data mining, electronic commerce, artificial intelligence and other fields, the total heat dissipation capacity demand has increased dramatically. Device miniaturization further increases power density, while also exacerbating the need for efficient cooling solutions.

In the prior art, the heat of the high heat flux density component can be dissipated through a thermosiphon radiator. When the position of a heat source needing heat dissipation is fixed, and the space in the direction in which the heat dissipation end (such as a heat dissipation fin) of the heat sink needs to extend is limited, a good heat dissipation effect cannot be achieved when the heat source in which the space in which the heat dissipation end (such as the heat dissipation fin) needs to extend is limited is dissipated through the conventional thermosiphon heat sink, so that the normal working environment of the heat source can be affected.

Disclosure of Invention

In view of the above, it is necessary to provide a thermosiphon heat sink to solve the technical problem that the prior thermosiphon heat sink cannot achieve a good heat dissipation effect when dissipating heat from a heat source having a limited space for a heat dissipation end (e.g., a heat dissipation fin).

To this end, an embodiment of the present invention provides a thermosiphon heat sink, including: a base plate and heat radiating fins;

the base plate is divided into a first plate part and a second plate part along a first direction, the first plate part is provided with a first containing cavity for containing a phase-change working medium, and a heat dissipation station for mounting a heat source is arranged on the outer surface of the first plate part corresponding to the first containing cavity; the radiating fins are arranged on the second plate part and extend in the direction far away from the first plate part along the second direction, and gas-liquid channels communicated with the first containing cavities are formed in the radiating fins; wherein the first direction is different from the second direction.

In some embodiments of the thermosiphon heat sink, the first direction is a horizontal direction.

In some embodiments of the thermosiphon heat sink, the second direction is a vertical direction.

In some embodiments of the thermosiphon heat sink, a second receiving cavity is formed in the second plate portion, and the gas-liquid passage, the second receiving cavity, and the first receiving cavity are sequentially communicated with each other.

In some embodiments of the thermosiphon heat sink, in the second direction, a bottom surface of the second receiving cavity and a bottom surface of the first receiving cavity are on the same plane, and the second receiving cavity receives a phase change working medium therein.

In some embodiments of the thermosiphon heat sink, a cavity formed by enclosing the first receiving cavity and the second receiving cavity is L-shaped.

In some embodiments of the thermosiphon heat sink, in the second direction, a height of a bottom surface of the second accommodating chamber is greater than or equal to a height of a liquid level of the phase change working medium in the first accommodating chamber.

In some embodiments of the thermosiphon heat sink, the second plate portion is divided into a first portion and a second portion along a second direction, the first portion is connected to the first plate portion, the second receiving cavity is disposed in the first portion, and the heat dissipation fin is disposed in the second portion and partially extends to the first portion.

In some embodiments of the thermosiphon heat sink, one end of the gas-liquid channel is communicated with the second accommodating cavity, the other end of the gas-liquid channel extends in a direction away from the second accommodating cavity, and in the second direction, the height of the end of the gas-liquid channel communicated with the second accommodating cavity is higher than the liquid level of the phase change working medium in the first accommodating cavity.

In some embodiments of the thermosiphon heat sink, the base plate has a first plate surface, the heat dissipation fins are disposed on a portion of the first plate surface located at the second plate portion, and the heat dissipation station is disposed on a portion of the first plate surface located at the first plate portion.

In some embodiments of the thermosiphon heat sink, the substrate has opposing first and second plate faces; the heat dissipation fins are arranged on part of the first plate surface of the second plate part, and the heat dissipation station is arranged on part of the second plate surface of the first plate part; or the radiating fins are arranged on the part of the second plate part on the second plate surface, and the radiating station is arranged on the part of the first plate part on the first plate surface.

In some embodiments of the thermosiphon heat sink, the base plate further includes a third plate portion, the third plate portion is disposed on a side of the first plate portion opposite to the second plate portion, a third accommodating cavity communicated with the first accommodating cavity is formed in the third plate portion, the third plate portion is also provided with the heat dissipation fin, and the gas-liquid channel in the heat dissipation fin, the third accommodating cavity and the first accommodating cavity are sequentially communicated.

In some embodiments of the thermosiphon heat sink, a cavity formed by enclosing the first receiving cavity, the second receiving cavity, and the third receiving cavity is U-shaped.

In some embodiments of the thermosiphon heat sink, the surface of the first plate portion on the side away from the heat dissipation station is also provided with the heat dissipation fins, the heat dissipation fins are L-shaped, and the gas-liquid channels in the heat dissipation fins are communicated with the first accommodating cavities in the first plate portion.

In some embodiments of the thermosiphon heat sink, the heat sink further comprises a heat sink disposed on any side of the first plate portion other than the side where the heat dissipation station is located.

In some embodiments of the thermosiphon heat sink, the heat sink is disposed on another side of the first plate portion opposite to the side where the heat dissipation station is located.

In some embodiments of the thermosiphon heat sink, the heat sink is an expansion plate fin or a solid fin.

The embodiment of the invention has the following beneficial effects:

in the invention, the substrate is divided into a first plate part and a second plate part along a first direction, and a first accommodating cavity of the first plate part is communicated with a gas-liquid channel arranged on a radiating fin of the second plate part, so that a phase change working medium in the first accommodating cavity can flow into the gas-liquid channel for radiating, condensing and liquefying when absorbing heat of a heat source and being heated and gasified, and then flows back to the first accommodating cavity; the heat dissipation station is arranged on the outer surface of the first plate part corresponding to the first accommodating cavity, and the heat dissipation fins are arranged on the second plate part, so that the heat dissipation fins and the heat source are arranged in a staggered mode in the first direction; make radiating fin not receive the obstructed restriction in extending direction space through dislocation set to radiating fin can follow the second direction and extend to the direction of keeping away from first board, thereby increase radiating fin's heat transfer area is in order to improve radiating efficiency, and the application of this technical scheme has solved the technical problem that can't reach good radiating effect when the thermosiphon radiator among the prior art dispels the heat to the heat source that radiating end (for example radiating fin) need the extending direction to receive the restriction.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Wherein:

FIG. 1 illustrates a schematic diagram of an overall structure of a thermosiphon heat sink in one embodiment;

FIG. 2 shows a right side view of FIG. 1;

FIG. 3 shows a front view of FIG. 1;

FIG. 4 shows a top view of FIG. 1;

FIG. 5 illustrates an exploded view of a thermosiphon heat sink in one embodiment;

FIG. 6 shows an exploded view of a thermosiphon heat sink in another embodiment;

FIG. 7 is a schematic diagram showing the overall structure of a thermosiphon heat sink in another embodiment;

fig. 8 shows an exploded view of fig. 7.

Description of the main element symbols:

100. a thermosiphon heat sink; 10. a substrate; 10a, a first plate surface; 10b, a second plate surface; 11. a first plate portion; 111. a first receiving cavity; 112. a heat dissipation station; 12. a second plate portion; 121. a first portion; 1211. a second receiving cavity; 122. a second portion; 13. a third plate portion; 131. a third accommodating cavity; 20. a heat source; 30. a heat dissipating fin; 31. a gas-liquid channel; 40. a heat sink; 50. and (4) phase change working medium.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 5, in an embodiment of the present invention, a thermosiphon heat sink 100 is provided, where the thermosiphon heat sink 100 cools a heating component through heat conduction, convection, and phase change heat exchange of a phase change working medium 50, such as a central processing unit, a chip, and the like of a power electronic device, so as to ensure that the power electronic device stably operates within a rated temperature range.

In addition, the extending direction of the heat radiating end of the heat sink, i.e., the extending direction of the heat radiating fin in the present embodiment, includes the right above, the side above, and the like of the heat source, and the extending direction of the heat radiating end of the heat sink can be considered to be blocked as long as the projection of the blocking object in the vertical direction partially overlaps with the heat source.

In order to solve the above technical problem, the present embodiment provides a thermosiphon heat sink, wherein, referring to fig. 1 to 4, the heat sink includes a base plate 10 and heat dissipation fins 30; the base plate 10 is divided into a first plate portion 11 and a second plate portion 12 in a first direction (horizontal direction, X direction shown in fig. 2), the first plate portion 11 having a first accommodation cavity 111 for accommodating a phase-change working medium 50 (see fig. 5); a heat dissipation station 112 for installing the heat source 20 is arranged on the outer surface of the first plate part 11 corresponding to the first accommodating cavity 111; the heat radiation fins 30 are provided in the second plate portion 12 and extend in the second direction away from the first plate portion 11, and gas-liquid passages 31 communicating with the first housing chamber 111 are formed in the heat radiation fins 30. It should be noted that when the phase change working medium 50 in the first accommodating cavity 111 absorbs the heat of the heat source 20 on the heat dissipation station 112 and is heated and gasified, the phase change working medium can flow into the gas-liquid channel 31 to be dissipated and condensed and liquefied, and the liquefied phase change working medium 50 flows back into the first accommodating cavity 111 along the gas-liquid channel 31.

As a preferred embodiment, the first direction and the second direction are perpendicular to each other. Wherein the first direction is an X direction shown in fig. 2 or 7, and the second direction is a Y direction shown in fig. 2 or 7. Of course, the X direction and the Y direction in fig. 2 or fig. 7 refer to the horizontal direction and the vertical direction, respectively, which only refers to the case that the substrate 10 is vertically placed, and it can be understood that when the substrate 10 is placed in other states, the first direction and the second direction are correspondingly changed, for example, when the substrate 10 is placed obliquely relative to the horizontal plane and the bottom surface of the substrate 10 forms a certain angle with the horizontal plane, the first direction also forms a certain angle with the horizontal plane, and the second direction forms a certain angle with the vertical direction.

In the present invention, the substrate 10 is divided into the first plate portion 11 and the second plate portion 12 along the first direction (horizontal direction), the first containing cavity 111 of the first plate portion 11 is communicated with the gas-liquid channel 31 of the heat dissipation fin 30 arranged on the second plate portion 12, so that when the phase change working medium 50 in the first containing cavity 111 absorbs the heat of the heat source 20 and is heated and gasified, the phase change working medium can flow into the gas-liquid channel 31 to dissipate heat and condense to be liquefied, and then flow back into the first containing cavity 111; the heat dissipation station 112 is disposed on the outer surface of the first plate 11 corresponding to the first receiving cavity 111, and the heat dissipation fins 30 are disposed on the second plate 12, so that the heat dissipation fins 30 and the heat source 20 are disposed in a staggered manner in the first direction; make radiating fin 30 can not receive the restriction in space above heat source 20 through dislocation set, radiating fin 30 can follow the second direction (vertical direction) promptly and extend to the direction of keeping away from first board 11 to increase radiating fin 30's heat transfer area is in order to improve the radiating efficiency, and application this technical scheme has solved the technical problem that can't reach good radiating effect when thermosiphon radiator 100 among the prior art dispels the heat to heat source 20 that the end (for example radiating fin) of dispelling the heat need extending direction to receive the restriction.

In some embodiments, a cavity or a flow passage communicating the first receiving cavity 111 and the gas-liquid passage 31 is provided in the second plate portion 12 to allow the gaseous phase-change working medium 50 to flow to the gas-liquid passage 31 and the liquid phase-change working medium 50 to flow back to the first receiving cavity 111.

Specifically, referring to fig. 2-6, a second receiving cavity 1211 is formed in the second plate portion 12, and the gas-liquid channel 31, the second receiving cavity 1211 and the first receiving cavity 111 are sequentially connected. So as to ensure that the gaseous phase-change working medium 50 formed by the evaporation by heating can be rapidly diffused into the gas-liquid channel 31 of the heat dissipation fin 30 through the second containing cavity 1211, and at the same time, provide a sufficient backflow space for the liquid phase-change working medium 50 formed by condensation in the gas-liquid channel 31.

It should be noted that a plurality of the heat dissipating fins 30 may be provided, and each of the heat dissipating fins 30 has the gas-liquid passage 31 formed therein. In this technical solution, the gas-liquid channel 31 of each heat dissipating fin 30 may be communicated with the first receiving cavity 111, for example, the second receiving cavity 1211 of the second plate portion 12 is communicated with the first receiving cavity 111, so that heat may be rapidly transferred to each heat dissipating fin 30 through the phase change heat transfer of the phase change working medium 50 and the diffusion motion of the steam, and then the heat may be released to the environment through natural convection heat transfer or strong convection. The phase change heat exchange can realize the exchange of large heat under small temperature difference, and the steam diffusion is very rapid, so the temperature difference between the heat source 20 and the radiating fin 30 assembly is very small, the thermal resistance from the heat source 20 to the radiating fin 30 assembly is greatly reduced, and the radiating efficiency of the thermosiphon radiator 100 for aligning the heat source 20 above or limiting the space above is improved.

In an embodiment, referring to fig. 6, in the second direction (e.g., the vertical direction), the bottom surface of the second receiving cavity 1211 is on the same plane as the bottom surface of the first receiving cavity 111, so that the phase-change material 50 in the first receiving cavity 111 can flow into the second receiving cavity 1211, that is, the phase-change material 50 is also received in the second receiving cavity 1211. When the heat source 20 is disposed on the heat dissipation station 112 and contacts the first plate portion 11 for conducting heat, the phase change working medium 50 is heated and can flow between the first containing cavity 111 and the second containing cavity 1211 for transferring heat, meanwhile, the liquid phase change working medium 50 is heated and evaporated into the gaseous phase change working medium 50 which can be diffused into the gas-liquid channel 31 of the heat dissipation fin 30, the gaseous phase change working medium 50 is cooled and condensed into the liquid phase change working medium 50 in the gas-liquid channel 31 and flows back into the second containing cavity 1211, and the heat of the heat source 20 is continuously received based on connectivity between the first containing cavity 111 and the second containing cavity 1211.

In an embodiment, referring to fig. 5, a cavity defined by the first receiving cavity 111 and the second receiving cavity 1211 is L-shaped. At this time, the bottom surfaces of the first receiving cavity 111 and the second receiving cavity 1211 may not be on the same plane, and in the second direction, the height of the bottom surface of the second receiving cavity 1211 is greater than the height of the bottom surface of the first receiving cavity 111, and of course, the bottom surface of the second receiving cavity 1211 may be inclined toward the first receiving cavity 111, that is, the height of the end of the bottom surface of the second receiving cavity 1211 away from the first receiving cavity 111 in the second direction is greater than the height of the end of the bottom surface of the second receiving cavity 1211 close to the first receiving cavity 111, so that the liquid phase-change working medium flows back into the first receiving cavity 111 to continuously absorb heat, thereby improving the connectivity between the first receiving cavity 111 and the second receiving cavity 1211, and making the flow of the phase-change working medium 50 exchanged between the first receiving cavity 111 and the second receiving cavity 1211 better, thereby further improving the heat dissipation efficiency. Further, in the second direction, the height of the bottom surface of the second receiving cavity 1211 is greater than or equal to the height of the liquid level of the phase change medium 50 in the first receiving cavity 111, so that the phase change medium 50 in the first receiving cavity 111 is prevented from flowing into the gas-liquid channel 31 of the heat dissipation fin 30 through the second receiving cavity 1211, and the heat exchange area of the heat dissipation fin 30 is prevented from being affected.

In one embodiment, referring to fig. 2, the second plate portion 12 is divided into a first portion 121 and a second portion 122 along the second direction, the first portion 121 is connected to the first plate portion 11, the second receiving cavity 1211 is disposed in the first portion 121, and the heat dissipation fin 30 is disposed in the second portion 122 and partially extends to the first portion 121. Wherein the first direction is the same as the vertical direction of the substrate 10, and in this embodiment, the first direction is the Z direction shown in the figure.

In an embodiment, referring to fig. 5, one end of the gas-liquid channel 31 is communicated with the second receiving cavity 1211, and the other end extends in a direction away from the second receiving cavity 1211, and in the second direction, the height of the end of the gas-liquid channel 31 communicated with the second receiving cavity 1211 is higher than the liquid level of the phase-change working medium 50 in the first receiving cavity 111, so as to prevent the liquid phase-change working medium 50 in the first receiving cavity 111 from flowing into the gas-liquid channel 31 of the heat dissipation fin 30 to affect the flowing heat dissipation of the gaseous phase-change working medium 50.

In one embodiment, the base plate 10 has a first plate surface 10a, the heat dissipation fins 30 are disposed on a portion of the first plate surface 10a (not shown) of the second plate portion 12, and the heat dissipation station 112 is disposed on a portion of the first plate surface 10a (not shown) of the first plate portion 11. By arranging the heat dissipation fins 30 and the heat dissipation station 112 on the first plate surface 10a of the substrate 10, the heat dissipation function of the heat sink can be maintained when the space on the side opposite to the first plate surface 10a is blocked, and the applicability is wider.

In another embodiment, referring to fig. 4-5, the substrate 10 has opposing first and second plate surfaces 10a, 10 b; the heat dissipation fins 30 are arranged on part of the first plate surface 10a of the second plate portion 12, and the heat dissipation station 112 is arranged on part of the second plate surface 10b of the first plate portion 11; or the heat dissipation fins 30 are provided on a part of the second plate surface 10b of the second plate portion 12, and the heat dissipation station 112 is provided on a part of the first plate surface 10a of the first plate portion 11. The heat dissipation fins 30 and the heat dissipation stations 112 are respectively arranged on the first plate surface 10a and the second plate surface 10b opposite to the substrate 10, so that the heat source 20 and the heat dissipation fins 30 are prevented from being located on the same side of the substrate 10, the interference of the heat source 20 to the heat dissipation of the heat dissipation fins 30 is reduced, and the heat exchange efficiency of the heat dissipation fins 30 and the environment is ensured.

Referring to fig. 7 and 8, in another embodiment, the base plate 10 further includes a third plate portion 13, the third plate portion 13 is disposed on the first plate portion 11 opposite to the second plate portion 12, a third receiving cavity 131 communicated with the first receiving cavity 111 is formed in the third plate portion 13, the third plate portion 13 is also provided with a heat dissipation fin 30, and the gas-liquid channel 31, the third receiving cavity 131 and the first receiving cavity 111 in the heat dissipation fin 30 are sequentially communicated. Therefore, the heat dissipation fins 30 are disposed above the two sides of the heat source 20 to increase the number and area of the heat dissipation fins 30, thereby further solving the technical problem that the thermosiphon heat sink 100 cannot achieve a good heat dissipation effect when dissipating heat from the heat source 20 whose upper space is limited, and greatly improving the heat dissipation efficiency of the thermosiphon heat sink 100.

In one embodiment, referring to fig. 7 to 8, the first receiving cavity 111, the second receiving cavity 1211 and the third receiving cavity 131 form a U-shaped cavity. Therefore, the heat dissipation fin 30 is further extended in the horizontal direction, and the fluidity of the phase change material 50 among the first, second, and third receiving cavities 111, 1211, and 131 is ensured, so that the heat dissipation efficiency can be further improved.

The relative position relationship between the bottom surface of the third accommodating cavity 131 and the bottom surface of the first accommodating cavity 111, the position relationship between the height of the top surface of the third accommodating cavity 131 and the height of the liquid surface of the phase change medium 50 in the first accommodating cavity 111, and the arrangement position relationship between the heat dissipation fins 30 and the third accommodating cavity 131 on the third plate portion 13 may refer to the descriptions of the second accommodating cavity 1211 of the second plate portion 12 and the heat dissipation fins 30 on the second plate portion 12, which are not described herein again.

In one embodiment, the thermosiphon heat sink 100 further includes a heat sink 40, the heat sink 40 being disposed on either side of the first plate portion 11 except for the side where the heat sink station 112 is located. That is, the heat received by the phase change working medium 50 may be dissipated not only by the steam but also by the heat conduction of the heat dissipating member 40.

In one embodiment, referring to fig. 1-6, the heat sink 40 is disposed on the other side of the first board portion 11 opposite the side where the heat sink station 112 is located. So that the heat sink 40 is not interfered by the heat of the heat source 20 to ensure the heat conduction efficiency of the heat sink 40 to the phase change working medium 50.

In some specific embodiments, the heat sink 40 is a blown sheet fin or a solid fin.

In some specific embodiments, referring to fig. 3 to 4, a projection of the first receiving cavity 111 on the first board surface 10a at least partially overlaps with a projection of the heat dissipation member 40 on the first board surface 10 a. The heat transfer between the heat sink 40 and the first plate 11 increases the heat exchange area, thereby improving the heat dissipation capability of the thermosiphon heat sink 100.

In some specific embodiments, referring to fig. 5 to 6, the projection of the heat source 20 on the first board surface 10a is located in the projection of the phase-change working medium 50 in the first containing cavity 111 on the first board surface 10 a. Therefore, the heat source 20 disposed on the heat dissipation station 112 can be fully covered by the phase change material 50 in the first accommodation cavity 111, and the heat source 20 and the substrate 10 are prevented from being dried.

In one embodiment, referring to fig. 2, in the second direction, the first portion 121 of the second plate portion 12 is higher than the first plate portion 11, so that the liquid phase-change working medium 50 in the gas-liquid channel 31 can flow back into the first receiving cavity 111 under the action of gravity.

In some specific embodiments, referring to fig. 2 and 5-6, in the second direction, the liquid level of the phase-change working medium 50 is greater than the height of the heat source 20, so that even if part of the phase-change working medium 50 is heated and evaporated into gas, the remaining phase-change working medium 50 in the first receiving cavity 111 covers the whole heat source 20, thereby ensuring sufficient contact between the phase-change working medium 50 and the heat source 20 and improving the heat dissipation efficiency of the thermosiphon heat sink 100.

In other embodiments, instead of the heat sink 40, the heat sink 30 may be disposed at a position of the heat sink 40, specifically, the heat sink 30 is disposed on a surface of the first plate portion 11 on a side away from the heat dissipation station 112, the heat sink 30 is L-shaped, and the gas-liquid channel 31 in the heat sink 30 is communicated with the first receiving cavity 111 in the first plate portion 11; when the space above the heat source 20 is blocked, the heat dissipation effect of the thermosiphon heat sink 100 is improved by increasing the way that the heat dissipation fins 30 extend upward after bypassing the obstacle.

In the case where the space above the heat source 20 is blocked, the heat dissipation fins 30 may be provided around the substrate 10 except for the position of the heat source 20 to dissipate heat, and a good heat dissipation effect can be achieved.

All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (17)

1. A thermosiphon heat sink, comprising: a base plate and heat radiating fins;

the base plate is divided into a first plate part and a second plate part along a first direction, the first plate part is provided with a first containing cavity for containing a phase-change working medium, and a heat dissipation station for mounting a heat source is arranged on the outer surface of the first plate part corresponding to the first containing cavity; the radiating fins are arranged on the second plate part and extend in the direction far away from the first plate part along the second direction, and gas-liquid channels communicated with the first containing cavities are formed in the radiating fins; wherein the first direction is different from the second direction.

2. The thermosiphon heat sink of claim 1, wherein the first direction is a horizontal direction.

3. The thermosiphon heat sink of claim 2, wherein the second direction is a vertical direction.

4. The thermosiphon heat sink of one of claims 1 to 3, wherein a second receiving chamber is formed in the second plate portion, and the gas-liquid passage, the second receiving chamber, and the first receiving chamber are in communication with each other in this order.

5. The thermosiphon heat sink of claim 4, wherein a bottom surface of the second receiving cavity is on a same plane as a bottom surface of the first receiving cavity in the second direction, and the second receiving cavity receives a phase change medium therein.

6. The thermosiphon heat sink of claim 4, wherein a cavity enclosed by the first receiving cavity and the second receiving cavity is L-shaped.

7. The thermosiphon heat sink of claim 4, wherein a height of a bottom surface of the second receiving cavity is greater than or equal to a height of a liquid level of the phase change medium in the first receiving cavity in the second direction.

8. The thermosiphon heat sink of claim 4, wherein the second plate portion is divided into a first portion and a second portion along a second direction, the first portion is connected to the first plate portion, the second receiving cavity is disposed at the first portion, and the heat dissipation fin is disposed at the second portion and partially extends to the first portion.

9. The thermosiphon heat sink of claim 4, wherein one end of the gas-liquid channel is connected to the second receiving chamber, and the other end extends away from the second receiving chamber, and in the second direction, the height of the end of the gas-liquid channel connected to the second receiving chamber is higher than the liquid level of the phase-change working medium in the first receiving chamber.

10. The thermosiphon heat sink of one of claims 1-3 and 5-9, wherein the base plate has a first plate surface, the fins are disposed on a portion of the first plate surface located in the second plate portion, and the heat dissipation station is disposed on a portion of the first plate surface located in the first plate portion.

11. The thermosiphon heat sink of one of claims 1-3, 5-9, wherein the base plate has first and second opposing plate faces; the radiating fins are arranged on part of the first plate surface of the second plate part, and the radiating station is arranged on part of the second plate surface of the first plate part; or the radiating fins are arranged on the part of the second plate part on the second plate surface, and the radiating station is arranged on the part of the first plate part on the first plate surface.

12. The thermosiphon heat sink according to claim 10 or 11, wherein the base plate further includes a third plate portion, the third plate portion is provided on a side of the first plate portion opposite to the second plate portion, a third receiving chamber communicating with the first receiving chamber is formed in the third plate portion, the heat radiation fin is also provided in the third plate portion, and the gas-liquid passage in the heat radiation fin, the third receiving chamber, and the first receiving chamber are sequentially communicated with each other.

13. The thermosiphon heat sink of claim 12, wherein a cavity formed by the first receiving cavity, the second receiving cavity, and the third receiving cavity is U-shaped.

14. The thermosiphon heat sink according to claim 10 or 11, wherein the heat dissipation fin is also provided on a surface of the first plate portion on a side away from the heat dissipation station, the heat dissipation fin is L-shaped, and the gas-liquid channel in the heat dissipation fin communicates with the first receiving cavity in the first plate portion.

15. The thermosiphon heat sink of claim 10 or 11, further comprising a heat sink disposed on either side of the first plate portion except for a side where the heat sink station is located.

16. The thermosiphon heat sink of claim 15, wherein the heat sink is disposed on another side of the first plate portion opposite the side where the heat sink station is located.

17. The thermosiphon heat sink of claim 15, wherein the heat sink is an expanded plate fin or a solid fin.

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