CN201569340U - Flat heating pipe type heat dissipater - Google Patents
Flat heating pipe type heat dissipater Download PDFInfo
- Publication number
- CN201569340U CN201569340U CN 200920236751 CN200920236751U CN201569340U CN 201569340 U CN201569340 U CN 201569340U CN 200920236751 CN200920236751 CN 200920236751 CN 200920236751 U CN200920236751 U CN 200920236751U CN 201569340 U CN201569340 U CN 201569340U
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- aluminum substrate
- pipe type
- heat pipe
- flat plate
- plate heat
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Abstract
The utility model provides a flat heating pipe type heat dissipater which comprises an aluminum base plate and further comprises a heat source connecting zone and more than one heat dissipation fins, wherein a sealed cavity is arranged inside the aluminum base plate, heat transfer working fluid is filled in the sealed cavity, the heat dissipation fins are connected on the outer surface of the aluminum base plate, and the heat source connecting zone is located outside the aluminum base plate. The flat heating pipe type heat dissipater has simple structure and high heat dissipation efficiency, and can lower the energy consumption of products using electronic devices. The flat heating pipe type heat dissipater is particularly suitable for being used in thermoelectric cooling devices, according to test in thermoelectric cooling semiconductor devices, compared with common aluminum heat sink, the energy conservation efficiency can be improved by about 30%. Since the flat heating pipe type heat dissipater adopts a hollow aluminum base plate, the weight is light, the volume is small, and additionally since the technique is simple, the cost is low.
Description
Technical field
The utility model belongs to the heat dissipation technology field, is specifically related to a kind of flat plate heat pipe type radiator that is applicable to the semiconductor components and devices heat radiation.
Background technology
Along with modern power electronic great-leap-forward development with rapid changepl. never-ending changes and improvements, semiconductor application is more extensive, make electronic installation integrated semiconductor element number in the confined space get more and more, thereupon at the inner high heat flux that produces of device, becoming influences the machine product Performance And Reliability and restricts the major obstacles that semiconductor chip develops towards miniaturization, microminiaturized direction, and the key that solves this bottleneck is to adopt heat abstractor efficiently, the maximized discharge of heat that the thermal source of high heat flux is produced.Particularly adopt the TEC of being made up of semiconductor device, can the heat of its generation in time distribute, and directly determined the performance performance of refrigerator, also having a strong impact on the quality of the refrigeration of electronic refrigerator or wine cabinet simultaneously.And usually all be to adopt to conduct than the big a lot of Aluminum Heat Sink of electronic installation and combination of fans to add heat loss through convection, but heat sink bigger diffusion thermal resistance that has and the uneven characteristic of heat flow density distributed pole on the cross section thereof, make the radiating effect of electronic installation be subjected to certain influence, directly limited the raising of its performance, also strengthened simultaneously form the energy consumption of product, people are actively seeking radiating mode more efficiently for this reason.Particularly advocate under the energy-conservation overall background in country, more seeming particularly needs.
Heat pipe is as a kind of efficient heat transfer medium that utilizes phase-change heat transfer, it is little to have (one) thermal resistance, heat transfer coefficient big (its heat transfer property is higher two more than the order of magnitude than copper/aluminum), (2) good isothermal, (3) changeability of heat flow density, (4) good characteristics such as direction of heat flow invertibity, so the more common heat sink radiator of heat-pipe radiator have higher heat-sinking capability with and energy-efficient advantage, used widely in high power semiconductor component heat radiation field and developed.
The general at present heat-pipe radiator that uses is made up of circular heat pipe, radiating fin and pedestal, perhaps plate-type heat-pipe, Aluminum Heat Sink and substrate are formed, its weak point is that its circular heat pipe or plate-type heat-pipe be connected with substrate with radiating fin or Aluminum Heat Sink is a kind of assembly structure, its thermal contact resistance is bigger, be subjected to the influence of manufacture craft simultaneously, make its radiating efficiency be subjected to certain restriction.And employed circular heat pipe or plate-type heat-pipe adopt copper material, cost an arm and a leg, and popularity rate is restricted.
Utility model 200720049757.5 screen type heat-pipe radiators: be meant a kind of by radiating tube, the screen type heat-pipe radiator that some heat radiation silks and liquid storage box are formed, this radiating tube is a gravity-type heat pipe, one end links to each other with the escape pipe of liquid storage box, one end links to each other with the return duct of liquid storage box, the fin of some screen types is connected with the radiating tube of coiling is vertical, carry out heat in the unidirectional cyclic process of cooling fluid in radiating tube and distribute in the hope of reaching, its radiating effect in the device of semiconductor refrigerating effect significantly better than common Aluminum Heat Sink, but its weak point: the shared space of one is excessive; Its two heat pipe and some heat radiations silk adopt and are welded to connect, complex process, and easy sealing-off; It causes its cost to be higher than conventional aluminium heat sink about 30% three owing to above-mentioned two kinds of reasons.
Summary of the invention
The purpose of this utility model is to provide a kind of flat plate heat pipe type radiator, and is simple in structure, and the radiating efficiency height can reduce the product energy consumption that uses electronic device.
The technical scheme that its technical problem that solves the utility model adopts is:
The flat plate heat pipe type radiator comprises aluminum substrate, wherein, also comprises the radiating fin that thermal source join domain and a slice are above; The inside of described aluminum substrate is a closed cavity, is perfused with heat-transfer working medium in the described closed cavity; Described radiating fin is connected on the outer surface of aluminum substrate, and described thermal source join domain is positioned on the outside wall surface of described aluminum substrate or is outside.
Described flat plate heat pipe type radiator also comprises a radiator fan, and the air-out direction of described radiator fan is towards described radiating fin.
Described radiating fin and described aluminum substrate adopt one-body molded or be welded to connect, the riveted joint mode links into an integrated entity.
Described aluminum substrate adopts the extrusion modling mode to process, and two ends adopts the welding manner close encapsulation.
The enclose inside cavity of described aluminum substrate is provided with the dowel position.
To sum up, the beneficial effects of the utility model are:
Flat plate heat pipe type radiator of the present utility model owing to comprise the radiating fin that aluminum substrate, thermal source join domain and a slice are above, is perfused with heat-transfer working medium in the closed cavity of aluminum substrate, and radiating fin is connected on the outer surface of aluminum substrate.The thermal source that semiconductor elec-tronic device produces during use is by the thermal source join domain, the feasible liquid working substance that is positioned at flat plate heat pipe type radiator inside upwards is delivered to heat on the aluminum substrate after being heated and vaporizing, and then go in the surrounding environment of distributing by described aluminum substrate and outside some radiating fins thereof, and cooled liquid working substance is under the effect of gravitational field, be back to thermal source join domain vicinity again circulates next time, the heat that circulation continuously will make electronic installation produce is distributed endlessly, make its surface keep a rational temperature scope simultaneously, strengthen air by the fan that adds in case of necessity and flow, so that reach more good radiating effect.
Therefore, use flat plate heat pipe type radiator of the present utility model, have following advantage:
One: the utility model flat plate heat pipe type radiator heat-dissipation effect is good, the radiating efficiency height;
Its two: the utility model is particularly suitable for thermoelectric cooling unit, and through at the semiconducter device testing of thermoelectric cooling, its more common Aluminum Heat Sink energy-saving efficiency improves about 30%;
Its three: the utility model can adopt aluminum substrate extrusion modling processing, and its hollow interior surface can be strengthened structure the reinforcement position, has not only strengthened the stability of aluminum substrate, can also alleviate the thickness of aluminium base simultaneously;
Its four: aluminum substrate of the present utility model and some radiating fins can one-body moldedly be made, and simple in structure, technological operation is strong;
They are five years old; The utility model is owing to adopt the aluminum substrate of hollow, and is in light weight, volume is little, and technology is simple in addition, so with low cost.
Description of drawings
Fig. 1 is the perspective view of the embodiment one of the utility model flat plate heat pipe type radiator;
Fig. 2 is the A-A cross-sectional schematic of Fig. 1;
Fig. 3 is the B-B cross-sectional schematic of Fig. 1;
Fig. 4 is the perspective view of the embodiment two of the utility model flat plate heat pipe type radiator.
Description of reference numerals:
1, aluminum substrate, 2, radiating fin, 3, upper end cover, 4, bottom end cover 5, tube connector, 6, radiator fan, 11, the thermal source join domain, 12, the dowel position, 13, the air pressure balance passage, 14, boiling-house, 15, the aluminum substrate inner surface, 16, the aluminum substrate outer surface.
The specific embodiment
The utility model discloses a kind of flat plate heat pipe type radiator,, comprise aluminum substrate 1, wherein, also comprise the radiating fin 2 that thermal source join domain and a slice are above as Fig. 1,2,3; The inside of described aluminum substrate 1 is a closed cavity, is perfused with heat-transfer working medium in the described closed cavity; Described radiating fin 2 is connected on the outer surface of aluminum substrate 1, and described thermal source join domain is positioned on the outside wall surface of described aluminum substrate 1 or is outside.
Described flat plate heat pipe type radiator also comprises a radiator fan 6, and the air-out direction of described radiator fan 6 is towards described radiating fin 2.
Described radiating fin 2 adopt one-body molded with described aluminum substrate 1 or be welded to connect, the riveted joint mode links into an integrated entity.
Described aluminum substrate 1 adopts the extrusion modling mode to process, and two ends adopts the welding manner close encapsulation.
The enclose inside cavity of described aluminum substrate 1 is provided with dowel position 12.
Embodiment one:
As shown in Figures 1 to 3, the utility model flat plate heat pipe type radiator comprises aluminum substrate 1, some radiating fins 2, every described radiating fin 2 all adopts the planar sheet structure perpendicular to the outer surface of coupled described aluminum substrate, has identical spacing between the adjacent radiating fin 2; Described aluminum substrate 1 adopts the extrusion modling mode to process, two ends are respectively arranged with bottom end cover 4 and upper end cover 3, enclose inside cavity to described aluminum substrate 1 carries out seal welding, makes described aluminum substrate 1 form inside and outside two surfaces: aluminum substrate inner surface 15 and aluminum substrate outer surface 16.In described aluminum substrate inner surface 15, be filled with liquid working substance, as the phase-change heat transfer medium of flat plate heat pipe type radiator of the present utility model; Described some radiating fins 2 are connected in aluminum substrate outer surface 16, for reducing thermal contact resistance, strengthen heat transfer coefficient, described some radiating fins 2 adopt one-body molded (or the part of aluminum substrate 2 with described aluminum substrate 1, make moulding as teeth), perhaps adopt welding manner to link together, it also is a kind of selection that mutually warm fully riveted joint connects.
For guaranteeing the dimensional stability of described aluminum substrate 1 in forming process, and prevent from being made into the process of heat pipe, deformation to take place, inner surface 15 at described aluminum substrate 1 also is provided with dowel position 12, the thickness of the simultaneously all right described aluminum substrate 1 of maximized attenuate is to reduce material cost; And described dowel position 12 is divided into plural chamber with the inside of described aluminum substrate 1 very naturally, and each chamber is communicated with; In order to make the maximized performance heat pipe of the utility model effect, the liquid working substance that is filled must arrive each cavity, so on the dowel position 12 at the both ends of described aluminum substrate 1, be provided with breach, formed the boiling-house 14 and air pressure balance passage 13 that are communicated with respectively.
The outer surface 16 of described boiling-house 14 corresponding described aluminum substrates 1 is provided with the thermal source join domain 11 that contacts and conduct heat with thermal source, generally is positioned at the lower middle position of described aluminum substrate 1.
During work, the liquid working substance that is close to thermal source join domain 11 reaches boiling and the vaporization rising at first, and be positioned at both sides or will be in time replenished at the boiling-house 14 that is communicated with apart from the thermal source liquid working substance that does not also reach boiling far away, make liquid working substance obtain carburation by evaporation continuously, saturated vapor after the rising makes each chamber saturation vapor pressure unanimity in the described aluminum substrate 1 by air pressure balance passage 13 just, thereby makes that each cavity temperature is even.The heat described aluminum substrate 1 of process that the while saturated vapor is entrained and the release of the some radiating fins 2 on the outer surface, inner surface at described aluminum substrate 2 condenses immediately, and under the effect of gravitational field, be back in the boiling-house 14 circulation of seething with excitement once more-condense, and finished the phase-change heat transfer process of working medium, and the heat that thermal source produced is discharged into space outerpace of the present utility model continuously just through the distributing of circulating phase-change constantly, described aluminum substrate 1 and some radiating fins 2 of working medium.
And in the phase-change heat transfer process, adopting vertical the placement just because of described aluminum substrate 2 ordinary prioritys, described heat transfer route mainly is to carry out along the length of described aluminum substrate and width.
For the maximal efficiency of performance working medium in phase transition process, the heat on described some radiating fins 2 surfaces is in time promptly distributed, therefore at least also be provided with a radiator fan 6 in its outside, flow to accelerate its surperficial air, accelerated heat is distributed.
Even just because of described aluminum substrate 1 temperature inside, make that its surperficial heat flow density is of slight difference, make that just the utility model radiating effect is good, the radiating efficiency height, not only making electronic devices such as semiconductor be stabilized in a rational temperature works after the match, simultaneously energy-saving effect is very apparent, and more common Aluminum Heat Sink was energy-conservation about 30% when the utility model used on thermoelectric cooling device, was exactly tangible example.
Embodiment two:
As shown in Figure 4, because described aluminum substrate 1 structure is limit, its length-width ratio reduces, perhaps thermal source and described aluminum substrate 1 distance are far away, phase-change working substance height in vertical direction in the boiling-house 14 thereon of feasible position reduces, be not enough to contact fully or can't directly contact with the semiconductor elec-tronic device that produces thermal source, being easy to generate heat pipe burns to death or is difficult to produce the heat pipe effect, so also comprise an enclosed box body 7 that is connected with described aluminum substrate 1 in the present embodiment of the present utility model, its inside is perfused with liquid working substance, described thermal source join domain " be positioned on the end face of described enclosed box body 7; working medium is when undergoing phase transition; be; evaporate-condense the circulation canal that provides necessary for working medium by being connected in the tube connector 5 between described enclosed box body 7 and the aluminum substrate 1; or employing and the similar connecting path of described tube connector, category of the present utility model belonged to equally.The internal structure of described aluminum substrate 1 and composition and all the other necessary structures and embodiment 1 are identical, narration no longer one by one herein, and the effect that it produced is also identical with embodiment 1 after tested.
Above-mentioned listed specific implementation is nonrestrictive, and to one skilled in the art, in not departing from the utility model scope, various improvement and the variation carried out all belong to protection domain of the present utility model.
Claims (10)
1. the flat plate heat pipe type radiator comprises aluminum substrate (1), it is characterized in that: also comprise the radiating fin (2) that thermal source join domain and a slice are above; The inside of described aluminum substrate (1) is a closed cavity, is perfused with heat-transfer working medium in the described closed cavity; Described radiating fin (2) is connected on the outer surface of aluminum substrate (1), and described thermal source join domain is positioned on the outside wall surface of described aluminum substrate (1) or is outside.
2. flat plate heat pipe type radiator according to claim 1 is characterized in that: described flat plate heat pipe type radiator also comprises a radiator fan (6), and the air-out direction of described radiator fan (6) is towards described radiating fin (2).
3. flat plate heat pipe type radiator according to claim 1 is characterized in that: described radiating fin (2) and described aluminum substrate (1) adopt one-body molded or be welded to connect, the riveted joint mode links into an integrated entity.
4. flat plate heat pipe type radiator according to claim 1 is characterized in that: described aluminum substrate (1) adopts the extrusion modling mode to process, and two ends adopts the welding manner close encapsulation.
5. according to any one described flat plate heat pipe type radiator in the claim 1 to 4, it is characterized in that: the enclose inside cavity of described aluminum substrate (1) is provided with dowel position (12).
6. flat plate heat pipe type radiator according to claim 5, it is characterized in that: every described radiating fin (2) all adopts the planar sheet structure perpendicular to the outer surface of coupled described aluminum substrate, and adjacent radiating fin has identical spacing between (2); Described aluminum substrate (1) two ends are respectively arranged with bottom end cover (4) and upper end cover (3), and described aluminum substrate (1) forms inside and outside two surfaces: aluminum substrate inner surface (15) and aluminum substrate outer surface (16).
7. flat plate heat pipe type radiator according to claim 6 is characterized in that: be filled with liquid working substance in described aluminum substrate inner surface (15), described some radiating fins (2) are connected in aluminum substrate outer surface (16).
8. flat plate heat pipe type radiator according to claim 7, it is characterized in that: the inner surface (15) in described aluminum substrate (1) is provided with dowel position (12), described dowel position (12) is divided into plural chamber with the inside of described aluminum substrate (1), and each chamber is communicated with; On the dowel position (12) at the both ends of described aluminum substrate (1), be provided with breach, formed the boiling-house (14) and air pressure balance passage (13) that are communicated with respectively.
9. flat plate heat pipe type radiator according to claim 8, it is characterized in that: the outer surface (16) of the corresponding described aluminum substrate of described boiling-house (14) (1) is provided with the thermal source join domain (11) that contacts and conduct heat with thermal source, is positioned at the lower middle position of described aluminum substrate (1).
10. flat plate heat pipe type radiator according to claim 8, it is characterized in that: also comprise an enclosed box body (7) that is connected with described aluminum substrate (1), its inside is perfused with liquid working substance, described thermal source join domain (11) is positioned on the end face of described enclosed box body (7), and tube connector (5) is connected between described enclosed box body (7) and the aluminum substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920236751 CN201569340U (en) | 2009-09-30 | 2009-09-30 | Flat heating pipe type heat dissipater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920236751 CN201569340U (en) | 2009-09-30 | 2009-09-30 | Flat heating pipe type heat dissipater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201569340U true CN201569340U (en) | 2010-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920236751 Expired - Fee Related CN201569340U (en) | 2009-09-30 | 2009-09-30 | Flat heating pipe type heat dissipater |
Country Status (1)
| Country | Link |
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| CN (1) | CN201569340U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
| CN106091764A (en) * | 2016-08-11 | 2016-11-09 | 广东兆瓦热能科技股份有限公司 | Heat transmitter |
| RU196009U1 (en) * | 2019-09-19 | 2020-02-13 | Акционерное общество "ЭМЗ "АВАНГАРД-КОНВЕРСИЯ" | Subway Car DC Voltage Converter |
| CN111895523A (en) * | 2020-07-20 | 2020-11-06 | 青岛海尔空调电子有限公司 | Radiator and air condensing units |
-
2009
- 2009-09-30 CN CN 200920236751 patent/CN201569340U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
| CN106091764A (en) * | 2016-08-11 | 2016-11-09 | 广东兆瓦热能科技股份有限公司 | Heat transmitter |
| RU196009U1 (en) * | 2019-09-19 | 2020-02-13 | Акционерное общество "ЭМЗ "АВАНГАРД-КОНВЕРСИЯ" | Subway Car DC Voltage Converter |
| CN111895523A (en) * | 2020-07-20 | 2020-11-06 | 青岛海尔空调电子有限公司 | Radiator and air condensing units |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Bengbu Dehao Photoelectric Science & Technology Co., Ltd. Assignor: Guangdong Electech International Inc. Contract record no.: 2012340000308 Denomination of utility model: Flat heating pipe type heat dissipater Granted publication date: 20100901 License type: Exclusive License Record date: 20120816 |
|
| ASS | Succession or assignment of patent right |
Owner name: BENGBU DEHAO PHOTOELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: GUANGDONG ELECTECH INTERNATIONAL INC. Effective date: 20131114 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 519000 ZHUHAI, GUANGDONG PROVINCE TO: 233000 BENGBU, ANHUI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131114 Address after: 233000, No. 1599, Yanshan Road, Bengbu, Anhui (8 floor of China Merchants Building) Patentee after: Bengbu Dehao Photoelectric Science & Technology Co., Ltd. Address before: Xiangzhou District 519000 of Guangdong city of Zhuhai Province Tang Jia Wan Jin Feng Lu No. 1 Patentee before: Guangdong Electech International Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100901 Termination date: 20160930 |