CN214676229U - Thermosiphon radiator - Google Patents

Abstract

The embodiment of the utility model discloses thermosiphon radiator, include: the heat dissipation device comprises a base plate and heat dissipation fins, wherein the base plate is provided with an accommodating cavity and a first plate surface, a phase change working medium is filled in the accommodating cavity, and a plurality of heat dissipation stations which are arranged at intervals and correspond to the accommodating cavity are arranged on the first plate surface; the radiating fins are arranged on the base plate and provided with gas-liquid channels communicated with the containing cavities; the projection of the gas-liquid channel on the first plate surface is at least partially overlapped with the containing cavity, and in the vertical direction of the substrate, the containing cavity and the gas-liquid channel are arranged in a staggered mode and the gas-liquid channel is located on the upper side of the containing cavity. By the technical scheme, the technical problem that a good uniform temperature radiating effect cannot be achieved when the thermosiphon radiator in the prior art radiates a plurality of heat sources deviated from the horizontal direction is solved.

Description

Thermosiphon radiator

Technical Field

The utility model relates to a radiating technical field especially relates to a thermosiphon radiator.

Background

In recent decades, with the rapid development of communication equipment, super computing, data mining, electronic commerce, artificial intelligence and other fields, the total heat dissipation capacity demand has increased dramatically. Device miniaturization further increases power density, while also exacerbating the need for efficient cooling solutions.

In the prior art, the heat of the high heat flux density component can be dissipated through a thermosiphon radiator. When a plurality of heat sources are distributed in the horizontal direction and are arranged in a way of deviating from the horizontal direction, particularly when the heat sources are arranged vertically, the heat sources which deviate from the horizontal direction cannot achieve good uniform temperature heat dissipation effect when the existing thermosiphon heat dissipater is used for dissipating heat, and further the normal working environment of the heat sources can be influenced.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a thermosiphon heat sink to solve the technical problem that the prior art thermosiphon heat sink cannot achieve a good uniform temperature heat dissipation effect when dissipating heat from a plurality of heat sources deviated from the horizontal direction.

To this end, in one embodiment there is provided a thermosiphon heat sink comprising:

the heat dissipation device comprises a substrate, a heat dissipation device and a heat dissipation device, wherein the substrate is provided with an accommodating cavity and a first plate surface, phase change working media are filled in the accommodating cavity, and a plurality of heat dissipation stations which are arranged at intervals and correspond to the accommodating cavity are arranged on the first plate surface;

the heat radiating fins are arranged on the base plate and are provided with gas-liquid channels communicated with the accommodating cavities; the projection of the gas-liquid channel on the first plate surface is at least partially overlapped with the containing cavity, and in the vertical direction of the substrate, the containing cavity and the gas-liquid channel are arranged in a staggered mode and the gas-liquid channel is located on the upper side of the containing cavity.

In some embodiments of the thermosiphon heat sink, the substrate is divided into a first portion and a second portion along a first direction, the first portion is provided with the accommodating cavity, a plurality of heat dissipation stations are arranged on the first portion along a second direction, and the first direction is perpendicular to the second direction;

the heat dissipation fins are arranged on the second portion and can partially extend to the first portion.

In some embodiments of the thermosiphon heat sink, the heat sink further comprises a plurality of heat sources, the plurality of heat sources are correspondingly arranged on the plurality of heat dissipation stations, and the liquid level of the phase-change working medium is higher than the tops of the plurality of heat sources.

In some embodiments of the thermosiphon heat sink, projections of the plurality of heat sources on the first plate surface are all located within a projection of the phase change working medium on the first plate surface.

In some embodiments of the thermosiphon heat sink, the substrate is provided with a first communication hole for communicating the gas-liquid channel with the accommodating cavity, and a hole wall of the first communication hole, which is close to one side of the heat dissipation station, is higher than or flush with the liquid level of the phase-change working medium.

In some embodiments of the thermosiphon heat sink, the substrate further has a second plate surface disposed opposite to the first plate surface, and the heat dissipation fin is disposed on the second plate surface.

In some embodiments of the thermosiphon heat sink, the thermosiphon heat sink further includes a heat dissipation member disposed corresponding to the phase change working medium, and the heat dissipation member is disposed on the second plate surface.

In some embodiments of the thermosiphon heat sink, a projection of the phase change working medium on the first plate surface at least partially overlaps a projection of the heat sink on the first plate surface.

In some embodiments of the thermosiphon heat sink, the heat sink is an expansion plate fin or a solid fin.

In some embodiments of the thermosiphon heat sink, the heat dissipation fin has a liquid injection hole communicating with the gas-liquid channel;

or the base plate is provided with a liquid injection hole communicated with the containing cavity.

Adopt the embodiment of the utility model provides a, following beneficial effect has:

in the utility model, the projection of the gas-liquid channel on the first plate surface is at least partially overlapped with the containing cavity, and the gas-liquid channel is communicated with the containing cavity, so that the gaseous phase-change working medium formed by thermal evaporation is diffused to the gas-liquid channel for condensation and heat release; in the vertical direction of the base plate, the accommodating cavity and the gas-liquid channel are arranged in a staggered mode, and the gas-liquid channel is located on the upper side of the accommodating cavity, so that the gas-liquid channel is higher than the accommodating cavity to prevent phase change working media from flowing into the gas-liquid channel, the using amount of the phase change working media is reduced, and the heat dissipation efficiency of the thermosiphon heat sink is improved through the combined action of two-phase heat exchange and steam movement; and a plurality of heat dissipation stations are arranged on the first plate surface at intervals, therefore, a plurality of heat sources can be correspondingly arranged on a plurality of heat dissipation stations of the first plate surface, the heat sources can be contacted with the phase change working medium for heat conduction through the base plate at the same time, the phase change working medium can freely flow in the containing cavity, the phase change working medium corresponding to the heat sources can take away the heat through phase change heat exchange, and the heat can be uniformly distributed in the heat dissipation fins for heat dissipation along with the diffusion of steam, so that the temperature equalization effect is good. The technical problem that a good uniform temperature radiating effect cannot be achieved due to the fact that a thermosiphon radiator in the prior art radiates a plurality of heat sources deviating from the horizontal direction is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

fig. 1 is a schematic view illustrating an overall structure of a thermosiphon heat sink according to the present invention;

FIG. 2 illustrates a left side view of a thermosiphon heat sink of an embodiment;

FIG. 3 illustrates a left side view of a thermosiphon heat sink of another embodiment;

fig. 4 shows a schematic view of the operation of a thermosiphon heat sink according to the present invention;

fig. 5 is a top view of fig. 1.

Description of the main element symbols:

100. a thermosiphon heat sink; 10. a substrate; 11. a first portion; 12. a second portion; 10a, a containing cavity; 10b, a first plate surface; 10c, a second plate surface; 10d, a first communication hole; 10e, a heat dissipation station; 20. a heat source; 30. a heat dissipating fin; 31. a gas-liquid channel; 32. an inner bottom surface; 40. phase change working medium; 50. a heat sink.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-5, in the embodiment of the present invention, a thermosiphon heat sink 100 is provided, in which the thermosiphon heat sink 100 cools down heat sources 20 such as power electronic devices through self heat conduction, phase change heat exchange and convection, for example, a central processing unit, a chip, etc. of the power electronic device are cooled down, so as to ensure that the power electronic device stably operates within a rated temperature range.

The thermosiphon heat sink 100 comprises a substrate 10 and heat dissipation fins 30, wherein the substrate 10 is provided with an accommodating cavity 10a and a first plate surface 10b, the accommodating cavity 10a is filled with a phase change working medium 40, and the first plate surface 10b is provided with a plurality of heat dissipation stations 10e which are arranged at intervals and correspond to the accommodating cavity 10 a; the heat radiating fins 30 are arranged on the base plate 10, and the heat radiating fins 30 are provided with gas-liquid channels 31 communicated with the accommodating cavities 10 a; the projection of the gas-liquid channel on the first plate surface 10b at least partially overlaps the housing cavity 10a, and the housing cavity 10a and the gas-liquid channel 31 are arranged in a staggered manner in the vertical direction of the substrate 10, and the gas-liquid channel 31 is located above the housing cavity 10 a. Wherein the heat source 20 is disposed on the heat radiating station 10 e.

It should be noted that the phase change working medium 40 filled in the accommodating cavity 10a is in a saturated pressure and saturated temperature state, and when the phase change working medium 40 is heated, the phase change working medium 40 can be evaporated from the liquid phase change working medium 40 and converted into the gaseous phase change working medium 40; when the phase change working medium 40 is cooled, the gaseous phase change working medium 40 can be converted into the liquid phase change working medium 40. Therefore, after being heated by the plurality of heat sources 20, the phase-change working medium 40 in the accommodating cavity 10a absorbs heat of the heat sources 20 through rapid vaporization and is converted from a liquid state to a gaseous state; the gaseous phase-change working medium 40 is heated and diffused into the gas-liquid channel 31, the gaseous phase-change working medium 40 is condensed on the inner wall surface of the radiating fin 30 and releases a large amount of heat simultaneously, the heat is transmitted to the outer surface of the radiating fin 30 through the inner wall surface of the radiating fin 30, the heat on the outer surface of the radiating fin 30 is released into the environment through various heat exchange modes such as natural convection heat exchange, forced convection heat exchange or evaporation heat exchange and the like with the environment, the liquid phase-change working medium 40 formed by condensation flows back to the accommodating cavity 10a from the gas-liquid channel 31 under the action of gravity and continues to be heated and evaporated, so that the phase-change circulation between the accommodating cavity 10a and the gas-liquid channel 31 through the phase-change working medium 40 is completed, and the heat is transmitted to the radiating fin 30 from the heat source 20. A plurality of the heat radiation fins 30 are provided, and each of the heat radiation fins 30 has a gas-liquid passage 31 formed therein. According to the technical scheme, heat generated by the heat sources 20 is rapidly transferred to the radiating fins 30 through phase change heat transfer of the phase change working medium 40 and diffusion movement of steam, and then is released to the environment through heat in multiple heat transfer modes such as natural convection heat transfer, forced convection heat transfer or evaporation heat transfer, and the like, and the specific reference is made to fig. 3. Since the phase change heat exchange can realize the exchange of large heat under small temperature difference and the steam diffusion is very rapid, the temperature difference between the heat sources 20 and the radiating fins 30 is very small, the thermal resistance from the heat sources 20 to the radiating fins 30 is greatly reduced, and the heat exchange efficiency of the thermosiphon radiator 100 is improved.

In the utility model, the projection of the gas-liquid channel 31 on the first plate surface 10b is at least partially overlapped on the containing cavity 10a, and the gas-liquid channel 31 is communicated with the containing cavity 10a, so that the gaseous phase-change working medium 40 formed by thermal evaporation is diffused to the gas-liquid channel 31 for condensation and heat release; in the vertical direction of the substrate 10, the accommodating cavity 10a and the gas-liquid channel 31 are arranged in a staggered manner and the gas-liquid channel 31 is located on the upper side of the accommodating cavity 10a, so that, as shown in fig. 2 or fig. 3, the gas-liquid channel 31 is higher than the accommodating cavity 10a to prevent the phase change working medium 40 from flowing into the gas-liquid channel 31, thereby reducing the usage amount of the phase change working medium 40 and improving the heat dissipation effect of the thermosiphon heat sink 100 through the combined action of two-phase heat exchange and steam movement; and a plurality of heat dissipation stations are arranged at the first plate surface 10b at intervals, therefore, a plurality of heat sources 20 can be correspondingly arranged on a plurality of heat dissipation stations 10e of the first plate surface 10b, the plurality of heat sources 20 can simultaneously contact with the phase change working medium 40 through the substrate 10 for heat conduction, because the phase change working medium 40 can freely flow in the accommodating cavity 10a, the phase change working medium 40 corresponding to the heat sources 20 can take away heat through phase change heat exchange, and heat can be uniformly distributed in the heat dissipation fins 30 along with the diffusion of steam for heat dissipation, so that a good temperature equalization effect is achieved. The technical problem that a good uniform temperature radiating effect cannot be achieved due to the fact that a plurality of heat sources 20 deviating from the horizontal direction are radiated by the thermosiphon radiator in the prior art is solved.

It should be noted that, as shown in fig. 1-2, the plurality of heat dissipation stations 10e correspond to the accommodating cavity 10a, which means that the plurality of heat dissipation stations 10e are all disposed on the surface of the first board surface 10b of the substrate 10 at the same position as the accommodating cavity 10a, so that the heat of the plurality of heat sources 20 on the plurality of heat dissipation stations 10e can be directly transferred to the phase-change working medium 40 in the accommodating cavity 10a through the thin wall between the first board surface 10b and the accommodating cavity 10a, and the phase-change working medium 40 absorbs heat and vaporizes to take away the heat. In addition, the vertical direction of the base plate 10 is only one reference direction for describing the offset arrangement of the gas-liquid channel 31 and the accommodating cavity 10a, as shown in fig. 1 to 3, when the base plate 10 is vertically placed, the vertical direction of the base plate 10 is the same as the Z direction shown in fig. 1, and the heat dissipation fins 30 are offset in the Z direction shown in fig. 1 with respect to the accommodating cavity 10a and the heat source on the heat dissipation station 10 e; it is understood that when the substrate 10 is horizontally placed, the vertical direction is also changed accordingly, and the vertical direction is the same as the horizontal direction; when the substrate 10 is placed obliquely, the vertical direction at this time is also inclined with respect to the horizontal plane.

In order to prevent the heat sources 20 from being dried when the heat sources 20 are radiated in a direction away from the horizontal direction, the phase change material 40 filled in the housing chamber 10a needs to sufficiently contact the plurality of heat sources 20. However, the accommodating cavity 10a needs to be communicated with the gas-liquid channel 31 of the heat dissipation fin 30 to diffuse the gaseous phase-change working medium 40, when sufficient filling amount of the phase-change working medium 40 is ensured, the condition that the liquid phase-change working medium 40 flows into the gas-liquid channel 31 can occur, on one hand, the filling amount of the phase-change working medium 40 can be increased, and unnecessary waste of the phase-change working medium 40 is caused, on the other hand, the liquid phase-change working medium 40 flowing into the gas-liquid channel 31 can occupy the space of the gas-liquid channel 31, the condensation area of the gaseous phase-change working medium 40 is reduced, and the heat exchange efficiency of the heat dissipation fin 30 is limited. Therefore, the gas-liquid channel 31 and the phase change working medium 40 in the technical scheme are arranged in a staggered mode, namely the gas-liquid channel 31 is located right above or laterally above the phase change working medium 40, so that the phase change working medium 40 is fully contacted with the heat sources 20 to improve the heat transfer efficiency, and the condensation space of steam is also ensured.

It should be noted that the base plate 10 may be disposed off the horizontal direction, that is, the base plate 10 may be disposed vertically or obliquely with respect to the horizontal direction. Specifically, the base plate 10 further has a second plate surface 10c opposite to the first plate surface 10b, and the heat dissipation fins 30 are disposed on the second plate surface 10c of the base plate 10, so as to prevent heat of the plurality of heat sources 20 from interfering with heat dissipation of the heat dissipation fins 30 when the plurality of heat sources 20 and the heat dissipation fins 30 are located on the same side of the base plate 10, and ensure heat exchange efficiency between the heat dissipation fins 30 and the environment.

The substrate 10 may be formed of two metal substrates 10 to ensure thermal conductivity of the substrate 10, and the two metal substrates 10 form the substrate 10 having the receiving cavity 10 a.

Specifically, the substrate 10 is divided into a first part 11 and a second part 12 along a first direction, the first part 11 is provided with a containing cavity 10a, the plurality of heat dissipation stations 10e are arranged on the first part 11 along a second direction, and the first direction is perpendicular to the second direction; the heat dissipating fins 30 are disposed at the second portion 12 and may partially extend to the first portion 11. In this embodiment, the first direction is a Z direction shown in fig. 1, the second direction is an X direction shown in fig. 1, that is, the substrate 10 is divided into a first portion 11 and a second portion 12 along a height extending direction thereof, and the plurality of heat dissipation stations 10e are arranged at intervals along a width extending direction of the substrate 10.

The thermosiphon heat sink 100 further includes a plurality of heat sources 20, preferably, the plurality of heat sources 20 are correspondingly disposed on the plurality of heat dissipation stations 10e, and the liquid level of the phase change working medium 40 is higher than the tops of the plurality of heat sources 20, so as to ensure that the filling amount of the phase change working medium 40 is sufficient, prevent the remaining phase change working medium 40 in the accommodating cavity 10a from not completely covering the plurality of heat sources 20 on the heat dissipation stations 10e due to the fact that a part of the phase change working medium 40 is heated and evaporated, and avoid the plurality of heat sources 20 from being partially burned.

In one embodiment, the projections of the plurality of heat sources on the first plate surface 10b are all located within the projection of the phase-change medium 40 on the first plate surface 10 b. Therefore, the heat sources 20 arranged on the heat dissipation stations 10e on the first plate surface 10b can fully and indirectly contact with the phase change working medium 40, and the heat sources 20 and the substrate 10 are prevented from being dried.

In some embodiments, when the plurality of heat sources 20 arranged on the substrate 10 are uneven, in order to cover the plurality of uneven heat sources 20, the space of the accommodating cavity 10a is increased, and the filling amount of the phase-change working medium 40 is increased; therefore, the tops of the plurality of heat sources 20 correspondingly arranged on the heat dissipation stations 10e are flush with each other, and the liquid level of the phase change working medium 40 is only higher than the top of any heat source 20, so that all the heat sources 20 arranged on the heat dissipation stations 10e can be covered, the heat sources 20 are fully contacted with the phase change working medium 40, and the size of the substrate 10 is reduced.

In some specific embodiments, the bottoms of the plurality of heat sources 20 correspondingly disposed at the plurality of heat dissipation stations 10e are all flush with the bottom surface of the phase change medium 40. That is, under the condition of ensuring the phase change working medium 40 to fully cover the plurality of heat sources 20, the filling amount of the phase change working medium 40 can be reduced by further limiting the relative specific positions of the plurality of heat sources 20 and the phase change working medium 40.

In some specific embodiments, the bottoms of the plurality of heat sources 20 arranged corresponding to the plurality of heat dissipation stations 10e are all higher than the bottom surface of the phase change working medium 40, so that the phase change working medium 40 can conduct heat integrally to the plurality of heat sources 20 arranged at the heat dissipation stations 10 e.

As shown in fig. 2 or fig. 3, the substrate 10 is provided with a first communicating hole 10d communicating the gas-liquid channel 31 and the accommodating cavity 10a, and the liquid level of the phase-change working medium 40 may be higher than or lower than or flush with the hole wall of the first communicating hole 10d on the side close to the heat dissipation station 10 e. When the liquid level of the phase change working medium 40 is higher than the hole wall of the first communication hole 10d on the side close to the heat dissipation station 10e, namely, the phase change working medium 40 overflows to the gas-liquid channel 31 through the first communication hole 10d, the filling amount of the phase change working medium 40 is ensured to be sufficient.

When the liquid level of the phase change working medium 40 is lower than the hole wall of the first through hole 10d close to the side of the heat dissipation station 10e, that is, the hole wall of the first through hole 10d close to the side of the heat dissipation station 10e is higher than the liquid level of the phase change working medium 40, the liquid level of the phase change working medium 40 in the accommodating cavity 10a is away from the lower hole wall of the first through hole 10d by a certain distance, so that the phase change working medium 40 does not flow into the gas-liquid channel 31 of the heat dissipation fin 30, and the condensation area of the gas-liquid channel 31 is not affected.

Preferably, as shown in fig. 2, a hole wall of the first communication hole 10d on a side close to the heat dissipation station 10e is flush with a liquid level of the phase change working medium 40, that is, the liquid level of the phase change working medium 40 is flush with a lower hole wall of the first communication hole 10d, which not only ensures that the phase change working medium 40 does not overflow to the gas-liquid channel 31 to prevent the condensation area from decreasing, but also ensures that the filling amount of the phase change working medium 40 is sufficient.

In one embodiment, the thermosiphon heat sink 100 further includes a heat sink 50 disposed corresponding to the phase change medium 40, the heat sink 50 being disposed on the second plate surface 10 c. The heat dissipation capability of the thermosiphon heat sink 100 is increased by the heat conduction of the heat sink 50 with the substrate 10.

In some specific embodiments, the heat sink 50 is an expansion plate fin, a solid fin, or other types of heat sink fins 30. The heat sink 50 and the heat sink fins 30 may be integrated or separated, as shown in fig. 2 and 3.

In one embodiment, the projection of the phase change working medium 40 on the first plate surface 10b at least partially overlaps the projection of the heat sink 50 on the first plate surface 10 b. That is, the heat of the phase change working medium 40 may be dissipated not only by the steam but also by the heat conduction of the heat dissipating member 50.

In some embodiments, the heat dissipation fins 30 are flush with one end of the substrate 10, and the heat dissipation member 50 is flush with the other end of the substrate 10. That is, when the occupied space of the thermosiphon heat sink 100 is predetermined, the heat radiation area of the heat radiation fins 30 and the heat conduction area of the heat radiation member 50 are sufficiently increased, and the heat radiation efficiency is improved.

In some embodiments, the heat dissipation fins 30 may protrude from one end of the substrate 10, and/or the heat dissipation member 50 may protrude from the other end of the substrate 10, so as to improve the heat dissipation efficiency.

In some embodiments, referring to fig. 2 or fig. 3, the receiving cavity 10a is opened in the first portion 11 of the substrate 10, and the receiving cavity 10a extends to an end of the first portion 11 away from the second portion 12, that is, the receiving cavity 10a extends to a bottom end of the first portion 11, so as to fully utilize the volume of the substrate 10, that is, the volume of the thermosiphon heat sink 100 can be reduced, and the applicability thereof can be improved. The position of the accommodating cavity 10a is not limited to this, and the gas-liquid channel 31 is always located above the phase change working medium 40 in the height extending direction of the substrate 10.

In addition, the heat dissipating fin 30 may have a rectangular structure, the heat dissipating fin 30 has an inner bottom surface 32 forming the gas-liquid channel 31, the heat dissipating fin 30 is provided with a second communicating hole (not shown) communicating the gas-liquid channel 31 and the first communicating hole 10d, that is, the gas-liquid channel 31 and the accommodating chamber 10a are communicated through the first communicating hole 10d and the second communicating hole, and the hole walls of the second communicating hole are connected to the inner bottom surface 32 and the hole walls of the first communicating hole 10d, so that the condensed phase-change working medium 40 may flow back to the accommodating chamber 10a through the inner bottom surface 32, the second communicating hole and the first communicating hole 10 d.

It should be noted that the shape of the heat dissipating fin 30 includes, but is not limited to, for example, the inner bottom surface 32 of the heat dissipating fin 30 for forming the gas-liquid channel 31 may be configured as an inclined surface, an arc-shaped inclined surface, or the like, and the inclined surface or the arc-shaped inclined surface is made to contact with the hole wall of the second communication hole of the heat dissipating fin 30, so that the condensed liquid may flow through the inclined surface or the arc-shaped inclined surface and then flow back to the accommodating chamber 10 a.

In some specific embodiments, there are a plurality of heat dissipation fins 30, and since the plurality of heat dissipation fins 30 are all communicated with the accommodating cavity 10a, that is, the plurality of heat dissipation fins 30 are communicated with each other through the accommodating cavity 10 a; therefore, the steam generated by the phase change working medium 40 in the accommodating cavity 10a through thermal evaporation can be rapidly diffused into the gas-liquid channels 31 of the radiating fins 30, and all the radiating fins 30 are fully utilized for heat dissipation to improve the heat dissipation efficiency. Meanwhile, the plurality of radiating fins 30 are arranged in parallel at intervals, and the outer surfaces of the radiating fins 30 can exchange heat with the environment in a fully balanced manner, so that the radiating effect of the radiating fins 30 is ensured. Therefore, the problem that the whole radiator cannot be used for radiating because the substrate 10 of the traditional radiator has weak diffusion capacity when the heat source 20 is small in size in the prior art is solved.

In addition, the heat dissipation fins 30 are fixed on the base plate 10 by welding, so as to ensure that the heat dissipation fins 30 and the base plate 10 are relatively stable.

In one embodiment, the heat dissipating fins 30 are provided with liquid injection holes (not shown) communicating with the gas-liquid passages 31. The liquid injection hole may be opened at an end of the heat dissipating fin 30 away from the housing cavity 10a, that is, the liquid injection hole is opened at a top end of the heat dissipating fin 30, the phase change working medium 40 is injected into the gas-liquid passage 31 from the liquid injection hole, and the phase change working medium 40 flows through the inner bottom surface 32, the second communication hole, and the first communication hole 10d in sequence under the action of gravity and then is stored in the housing cavity 10 a.

In one embodiment, the base plate 10 is provided with an injection hole (not shown) communicating with the receiving cavity 10a, and the phase-change working medium 40 is injected into the receiving cavity 10a from the injection hole.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples are merely illustrative of several embodiments of the present invention, which are described in more detail and detail, but are not to be construed as limiting the scope of the claims. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (9)

1. A thermosiphon heat sink, comprising:

the heat dissipation device comprises a substrate, a heat dissipation device and a heat dissipation device, wherein the substrate is provided with an accommodating cavity and a first plate surface, phase change working media are filled in the accommodating cavity, and a plurality of heat dissipation stations which are arranged at intervals and correspond to the accommodating cavity are arranged on the first plate surface;

the heat radiating fins are arranged on the base plate and are provided with gas-liquid channels communicated with the accommodating cavities; the projection of the gas-liquid channel on the first plate surface is at least partially overlapped with the accommodating cavity, and in the vertical direction of the substrate, the accommodating cavity and the gas-liquid channel are arranged in a staggered mode and the gas-liquid channel is located on the upper side of the accommodating cavity;

the substrate is divided into a first part and a second part along a first direction, the first part is provided with the accommodating cavity, the plurality of heat dissipation stations are arranged on the first part along a second direction, and the first direction is perpendicular to the second direction;

the heat dissipation fins are disposed on the second portion and may extend partially to the first portion.

2. The thermosiphon heat sink of claim 1, further comprising a plurality of heat sources, the plurality of heat sources being correspondingly disposed on the plurality of heat dissipation stations, the level of the phase change medium being above the tops of the plurality of heat sources.

3. The thermosiphon heat sink of claim 2, wherein the projections of the plurality of heat sources on the first plate surface are all located within the projection of the phase change working medium on the first plate surface.

4. The thermosiphon heat sink of claim 1, wherein the base plate has a first communication hole communicating the gas-liquid channel with the receiving cavity, and a wall of the first communication hole on a side close to the heat dissipation station is higher than or flush with a liquid level of the phase change working medium.

5. The thermosiphon heat sink of one of claims 1 to 4, wherein the base plate further has a second plate surface disposed opposite the first plate surface, the fins being disposed on the second plate surface.

6. The thermosiphon heat sink of claim 5, further comprising a heat sink disposed in correspondence with the phase change working medium, the heat sink being on the second plate surface.

7. The thermosiphon heat sink of claim 6, wherein a projection of the phase change working medium onto the first plate surface at least partially overlaps a projection of the heat sink onto the first plate surface.

8. The thermosiphon heat sink of claim 7, wherein the heat sink is an expanded plate fin or a solid fin.

9. The thermosiphon heat sink of claim 1, wherein the heat sink fins have liquid injection holes that communicate with the gas-liquid channel;

or the base plate is provided with a liquid injection hole communicated with the containing cavity.

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