CN213816104U - Wafer pre-positioning device - Google Patents
Wafer pre-positioning device Download PDFInfo
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- CN213816104U CN213816104U CN202023328655.1U CN202023328655U CN213816104U CN 213816104 U CN213816104 U CN 213816104U CN 202023328655 U CN202023328655 U CN 202023328655U CN 213816104 U CN213816104 U CN 213816104U
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Abstract
The utility model relates to a wafer pre-positioning device, which comprises a rotating mechanism, a translation mechanism, a lifting mechanism, an induction mechanism, a telescopic piece, a controller and a positioning piece for positioning a wafer; when the wafer is to be positioned, the wafer to be positioned is arranged on the positioning piece, the rotating mechanism drives the wafer to rotate, and the notch or mark on the wafer is detected through laser induction so as to judge whether the wafer placement position is accurate. If the position of the wafer needs to be adjusted, the lifting mechanism lifts the wafer through the telescopic piece, the wafer is put down after the position of the positioning piece is adjusted through the translation mechanism, and then the position adjustment of the wafer is completed. The technical scheme has the advantages of high positioning speed and accurate wafer position positioning.
Description
Technical Field
The utility model relates to a semiconductor processing equipment technical field especially relates to a wafer pre-positioning device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. As the feature size of semiconductor devices becomes smaller and smaller, the processing and measuring equipment becomes more and more advanced, and the precision requirement for wafer processing becomes more and more severe. Before various types of processing, the wafer needs to be pre-positioned, and the pre-positioning is accurate or not, so that the subsequent processing is greatly influenced. The existing wafer pre-positioning device judges whether the wafer is accurately positioned or not by detecting a mark or a notch reserved on the wafer and comparing the mark or the notch with a pre-stored standard position. However, the precision is often not sufficient, and the wafer position cannot be adjusted quickly according to the detection result, which affects the processing efficiency and precision of the wafer.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a wafer pre-positioning device for solving the problems of inaccurate positioning and low efficiency of the conventional wafer positioning device.
A wafer pre-positioning device comprising: the wafer positioning device comprises a rotating mechanism, a translation mechanism, a lifting mechanism, an induction mechanism, a telescopic piece, a controller and a positioning piece for positioning a wafer, wherein the plane parallel to the plane on which the wafer is placed is a horizontal plane;
a rotating shaft of the rotating mechanism is in transmission connection with the positioning piece and drives the positioning piece to rotate on a horizontal plane; the moving part of the translation mechanism is in transmission connection with the positioning piece and drives the positioning piece to do translation motion on the horizontal plane; the action part of the lifting mechanism is in transmission connection with the telescopic piece and drives the telescopic piece to do reciprocating motion with a straight line track in the vertical direction; the telescopic piece is arranged below the wafer, and the wafer on the positioning piece can be lifted when the telescopic piece rises; the induction mechanism comprises a rack and a laser sensor fixed on the rack and used for measuring the position of the wafer, wherein the laser sensor comprises a transmitting end and a receiving end which are oppositely arranged; the output end of the laser sensor is connected with the input end of the controller, and the controlled ends of the rotating mechanism, the translation mechanism, the lifting mechanism and the induction mechanism are respectively connected with one control end of the controller.
The wafer lifting device comprises a lifting mechanism, a telescopic piece, a supporting piece and a lifting mechanism, wherein the telescopic piece comprises a plurality of ejector pins, all the ejector pins are erected on a top plate, a supporting piece is arranged at one end, close to the wafer, of each ejector pin, the top plate is in transmission connection with an action part of the lifting mechanism, and the ejector pins are driven by the lifting mechanism to move up and down.
In order to make the structure of the lifting mechanism more compact and improve the reliability of the equipment, the lifting mechanism comprises a first motor and a cam sleeved on a rotating shaft of the motor; the controlled end of the first motor is connected with a control end of the controller, the cam is abutted to the top plate through a transmission block, and the cam drives the ejector pin on the top plate to reciprocate up and down.
The moving part of the translation mechanism is in transmission connection with the positioning piece and drives the positioning piece to do reciprocating motion with a straight track on a horizontal plane, so that the translation mechanism is simpler and the size of the equipment is reduced.
In order to accurately control the displacement distance of the rack and improve the positioning accuracy of the equipment, the translation mechanism comprises a second motor and a first screw rod which is horizontally arranged; the controlled end of the second motor is connected with one control end of the controller, and the second motor of the translation mechanism is in transmission connection with the first screw rod; the first screw rod is connected with the rotating mechanism and drives the rotating mechanism to do linear reciprocating motion on a horizontal plane.
In order to guide and limit the moving track of the positioning part, the translation mechanism further comprises a first slide rail and a first slide block, and the first slide block is fixedly connected with the rotating mechanism; the first screw rod is also fixedly connected with the first sliding block and drives the first sliding block to slide on the first sliding rail.
In order to improve the accuracy of the equipment and carry out automatic position control on the positioning piece, the translation mechanism further comprises an in-place switch of which the output end is connected with one input end of the controller, and when the action part of the translation mechanism reaches a preset position, the in-place switch is triggered.
The in-place switch comprises a positioning blocking piece and a positioning laser sensor, the output end of the positioning laser sensor is connected with one input end of the controller, the positioning blocking piece is in transmission connection with the action part of the translation mechanism, and when the action part moves to a preset position, the positioning blocking piece shields the laser signal of the positioning laser sensor.
In order to adapt to wafers of different sizes, the distance between the rack and the positioning piece is adjusted according to the size of the wafer, the wafer pre-positioning device further comprises a rack translation mechanism, the action part of the rack translation mechanism is in transmission connection with the rack, and the rack translation mechanism drives the laser sensor on the rack to do reciprocating motion relative to the positioning piece.
Wherein, in order to can be convenient, stable fix a position the wafer, and can not fish tail wafer, the setting element is vacuum chuck, the last gas pocket of vacuum chuck switches on with an trachea.
According to the technical scheme, the wafer to be positioned is arranged on the positioning piece, the rotating mechanism drives the wafer to rotate, and the notch or mark on the wafer is detected through laser induction so as to judge whether the wafer placement position is accurate. If the position of the wafer needs to be adjusted, the lifting mechanism lifts the wafer through the telescopic piece, the wafer is put down after the position of the positioning piece is adjusted through the translation mechanism, and then the position adjustment of the wafer is completed. The technical scheme has the advantages of high positioning speed and accurate wafer position positioning.
Drawings
Fig. 1 is an overall schematic view of an embodiment of a wafer pre-positioning device according to the present invention;
FIG. 2 is a front view of one embodiment of the wafer pre-positioning device shown in FIG. 1;
FIG. 3 is a top view of one embodiment of the wafer pre-positioning device shown in FIG. 1;
fig. 4 is a schematic diagram illustrating a wafer pre-positioning device according to an embodiment of the present invention;
fig. 5 is a schematic view of an embodiment of a wafer pre-positioning device according to the present invention after a wafer is placed thereon;
fig. 6 is a front view of a translation mechanism according to an embodiment of the present invention;
fig. 7 is a top view of a translation mechanism according to an embodiment of the present invention;
fig. 8 is an exploded view of a translation mechanism according to an embodiment of the present invention;
fig. 9 is a front view of a lifting mechanism of an embodiment of the wafer pre-positioning device of the present invention;
fig. 10 is a top view of a lifting mechanism of an embodiment of the wafer pre-positioning device of the present invention;
fig. 11 is an exploded view of a lifting mechanism of an embodiment of the wafer pre-positioning device of the present invention;
fig. 12 is a front view of a table translation mechanism according to an embodiment of the present invention;
fig. 13 is a side view of a table translation mechanism according to an embodiment of the present invention;
fig. 14 is an exploded view of a stage translation mechanism according to an embodiment of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a transmitting end; 2. a frame; 21. a third motor; 22. a second lead screw; 3. a receiving end; 4. a rotation mechanism; 5. a translation mechanism; 51. a second motor; 52. a first lead screw; 53. a first slider; 54. a first slide rail; 55. positioning a baffle plate; 56. positioning a laser sensor; 6. a telescoping piece 61, a top plate; 62. a support sheet; 63. a thimble; 7. a positioning member; 8. a wafer; 9. a lifting mechanism; 91. a first motor; 92. a cam.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It is apparent that the specific details set forth in the following description are merely exemplary of the invention, which can be practiced in many other embodiments that depart from the specific details disclosed herein. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In an embodiment, referring to fig. 1 to 5, a wafer pre-positioning device includes a rotation mechanism 4, a translation mechanism 5, a lifting mechanism 9, a sensing mechanism, a telescopic member 6, a controller, and a positioning member 7 for positioning a wafer 8; a rotating shaft of the rotating mechanism 4 is vertically arranged, is in transmission connection with the positioning piece 7 and drives the positioning piece 7 to rotate on a horizontal plane; the moving part of the translation mechanism 5 is in transmission connection with the positioning part 7 and drives the positioning part 7 to move on the horizontal plane; the action part of the lifting mechanism 9 is in transmission connection with the telescopic piece 6 and drives the telescopic piece 6 to do reciprocating motion with a straight line track in the vertical direction; the telescopic piece 6 is arranged below the wafer 8, and the wafer 8 on the positioning piece 7 can be lifted when the telescopic piece 6 is lifted; the induction mechanism comprises a frame 2 and a laser sensor fixed on the frame 2 and used for measuring the position of the wafer, wherein the laser sensor comprises a transmitting end 1 and a receiving end which are oppositely arranged in the vertical direction; the output end of the laser sensor is connected with the input end of the controller, and the controlled ends of the rotating mechanism 4, the translation mechanism 5, the lifting mechanism 9 and the induction mechanism are respectively connected with one control end of the controller. Wherein, the surfaces parallel to the plane on which the wafer is placed are all horizontal surfaces.
According to the technical scheme, the wafer 8 to be positioned is arranged on the positioning part 7, the rotating mechanism 4 drives the wafer 8 to rotate, and the notch or mark on the wafer 8 is detected through laser induction so as to judge whether the placement position of the wafer 8 is accurate. If the position of the wafer 8 needs to be adjusted, the lifting mechanism 9 lifts the wafer 8 through the telescopic piece 6, then adjusts the position of the positioning piece 7 through the translation mechanism 5, and then puts down the wafer 8, thereby completing the position adjustment of the wafer 8. The method has the advantages of high positioning speed and accurate positioning of the wafer 8.
In this embodiment, the translation mechanism 5 drives the positioning member 7 to perform a linear reciprocating motion in one direction, and the rotation mechanism 4 and the translation mechanism 5 are matched to complete the positioning of the wafer. In another embodiment, the translation mechanism 5 may be replaced by a mechanism that drives the positioning member 7 to perform X, Y two-directional movements on the horizontal plane, so as to complete the positioning of the wafer more quickly.
Wherein, in order to be convenient, stable with wafer 8 location, and can not fish tail wafer 8, setting element 7 is vacuum chuck, and the gas pocket on the vacuum chuck switches on with an trachea. When the wafer sucking device is used, the wafer is sucked on the sucking pipe through the vacuum chuck. The rotating mechanism can be realized by using a motor, and the vacuum chuck is fixed with a rotating shaft of the motor so as to drive the wafer to rotate and realize the position detection of the wafer. The rotating shaft can also be arranged horizontally, and the wafer is driven to rotate horizontally through the gear structure.
Referring to fig. 9, 10 and 11, based on the embodiment of the present invention, further, the retractable member 6 includes a plurality of pins 63, all the pins 63 are vertically disposed in parallel on a top plate 61, the needles of the pins are disposed on the same horizontal plane so as to horizontally support the wafer, a horizontally disposed supporting sheet 62 is disposed at one end of the pin 63 close to the wafer 8, the top plate 61 is in transmission connection with the moving portion of the lifting mechanism 9, and the lifting mechanism 9 drives the pins 63 to move up and down.
The plurality of ejector pins 63 are simultaneously jacked up through the top plate 61, the wafer 8 can be stably and horizontally supported, and the supporting sheet 62 is additionally arranged at the contact position of the ejector pins 63 and the wafer 8, so that the wafer 8 is prevented from being scratched by the ejector pins 63. Of course, the wafer 8 may be held up by the telescopic member 6 using other shapes.
In order to make the structure of the lifting mechanism 9 more compact and improve the reliability of the equipment, the lifting mechanism 9 includes a first motor with a horizontally-arranged rotating shaft and a cam 92 sleeved on the rotating shaft of the motor; the controlled end of the first motor is connected with a control end of the controller, the cam 92 is abutted to the top plate 61 through a transmission block, and the cam 92 drives the thimble 63 on the top plate 61 to reciprocate up and down.
Through the cooperation of the cam 92 and the first motor, the telescopic piece 6 is jacked up, and then the wafer 8 is supported. Of course, the lifting mechanism 9 can also be realized by a structure such as a screw rod and a motor, a linear motor, etc.
Referring to fig. 6, 7 and 9, in an embodiment of the present invention, the translation mechanism 5 includes a second motor and a horizontally disposed first screw 52; the controlled end of the second motor is connected with one control end of the controller, and the second motor of the translation mechanism 5 is in transmission connection with the first screw rod 52; the first screw 52 is connected to the rotating mechanism 4 and drives the rotating mechanism 4 to perform linear reciprocating motion on a horizontal plane. The translation mechanism 5 further comprises a first slide rail 54 and a first slide block 53, and the first slide block 53 is fixedly connected with the rotation mechanism 4; the first lead screw 52 is also fixedly connected with the first slide block 53, and drives the first slide block 53 to slide on the sliding first rail.
Furthermore, the translation mechanism 5 further comprises an in-place switch with an output end connected with an input end of the controller, and when the action part of the translation mechanism 5 reaches a preset position, the in-place switch is triggered. The in-place switch in this embodiment includes a positioning blocking piece 55 and a positioning laser sensor 56, an output end of the positioning laser sensor 56 is connected to an input end of the controller, the positioning blocking piece is in transmission connection with the action portion of the translation mechanism 5, and when the action portion moves to a predetermined position, the positioning blocking piece blocks a laser signal of the positioning laser sensor 56. In addition, the in-place switch can be implemented by using a non-contact switch such as a positioning laser sensor, and other trigger switches such as a contact switch, which is not limited to the examples listed in the embodiments.
In this embodiment, the second motor and the first lead screw 52 are matched to precisely control the displacement distance of the rack 2, so as to improve the positioning accuracy of the device. The first slide rail 54 and the first slide block 53 can guide and limit the moving track of the positioning part 7, and the accuracy of the device is improved. The positioning stop 55 and the positioning laser sensor 56 can improve the accuracy of the device and perform automatic position control on the positioning member 7. When the device is used, when the screw rod rotates to a required position, the blocking piece blocks laser of the positioning laser sensor 56, and the controller judges that the translation mechanism 5 reaches the required position or reaches the maximum limit position.
Referring to fig. 12, 13 and 14, the wafer pre-positioning device further includes a frame translation mechanism 5, a moving portion of the frame translation mechanism 5 is in transmission connection with the frame 2, and the frame translation mechanism 5 drives the laser sensor on the frame 2 to reciprocate relative to the positioning member 7.
The rack translation mechanism 5 comprises a third motor, a second screw rod 22, a second slide block and a second slide rail; the second screw rod 22 is horizontally arranged, the controlled end of the third motor is connected with one control end of the controller, the third motor of the rack translation mechanism 5 is in transmission connection with the second screw rod 22, and the second sliding block is fixedly connected with the rack 2; the second lead screw 22 is fixedly connected with the second slide block and drives the second slide block to slide on the second slide rail.
For wafers 8 with different sizes, the position of the rack 2 is adjusted by the equipment through the third motor, the second lead screw 22, the second slide block and the second slide rail, and then the detection of the wafer 8 is realized. The use of the second screw rod 22 can improve the accuracy of the device, and the cooperation of the second slide block and the second slide rail can play the roles of limiting, guiding and the like. In addition, in another embodiment of the present disclosure, in order to make the structure of the translation mechanism 5 simpler and increase the translation speed, the translation mechanism 5 includes a linear motor, and a moving end of the linear motor is fixedly connected to the rotating mechanism 4 and drives the rotating mechanism 4 to perform a linear reciprocating motion on a horizontal plane.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes, substitutions and improvements can be made, and all of them should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the claims.
Claims (10)
1. A wafer pre-positioning device, comprising: the wafer positioning device comprises a rotating mechanism, a translation mechanism, a lifting mechanism, an induction mechanism, a telescopic piece, a controller and a positioning piece for positioning a wafer, wherein the plane parallel to the plane on which the wafer is placed is a horizontal plane;
a rotating shaft of the rotating mechanism is in transmission connection with the positioning piece and drives the positioning piece to rotate on a horizontal plane; the moving part of the translation mechanism is in transmission connection with the positioning piece and drives the positioning piece to do translation motion on the horizontal plane; the action part of the lifting mechanism is in transmission connection with the telescopic piece and drives the telescopic piece to do reciprocating motion with a straight line track in the vertical direction; the telescopic piece is arranged below the wafer, and the wafer on the positioning piece can be lifted when the telescopic piece rises; the induction mechanism comprises a rack and a laser sensor fixed on the rack and used for measuring the position of the wafer, wherein the laser sensor comprises a transmitting end and a receiving end which are oppositely arranged; the output end of the laser sensor is connected with the input end of the controller, and the controlled ends of the rotating mechanism, the translation mechanism, the lifting mechanism and the induction mechanism are respectively connected with one control end of the controller.
2. The wafer pre-positioning device according to claim 1, wherein the retractable member includes a plurality of pins, all the pins stand on a top plate, a supporting plate is disposed at one end of each pin close to the wafer, and the top plate is in transmission connection with the moving part of the lifting mechanism and drives the pins to move up and down through the lifting mechanism.
3. The wafer pre-positioning device according to claim 2, wherein the lifting mechanism includes a first motor and a cam sleeved on a rotating shaft of the motor; the controlled end of the first motor is connected with a control end of the controller, the cam is abutted to the top plate through a transmission block, and the cam drives the ejector pin on the top plate to reciprocate up and down.
4. The wafer pre-positioning device according to claim 1, wherein the moving part of the translation mechanism is in transmission connection with the positioning member and drives the positioning member to reciprocate linearly on a horizontal plane.
5. The wafer pre-positioning device according to claim 4, wherein the translation mechanism comprises a second motor and a first screw rod horizontally arranged; the controlled end of the second motor is connected with one control end of the controller, and the second motor of the translation mechanism is in transmission connection with the first screw rod; the first screw rod is connected with the rotating mechanism and drives the rotating mechanism to do linear reciprocating motion on a horizontal plane.
6. The wafer pre-positioning device according to claim 5, wherein the translation mechanism further comprises a first slide rail and a first slide block, and the first slide block is fixedly connected with the rotation mechanism; the first screw rod is also fixedly connected with the first sliding block and drives the first sliding block to slide on the first sliding rail.
7. The wafer pre-positioning device according to claim 1, wherein the translation mechanism further comprises an in-place switch having an output connected to an input of the controller, the in-place switch being activated when the moving portion of the translation mechanism reaches a predetermined position.
8. The wafer pre-positioning device according to claim 7, wherein the in-place switch includes a positioning blocking piece and a positioning laser sensor, an output end of the positioning laser sensor is connected with an input end of the controller, the positioning blocking piece is in transmission connection with the action portion of the translation mechanism, and when the action portion moves to a predetermined position, the positioning blocking piece blocks a laser signal of the positioning laser sensor.
9. The wafer pre-positioning device according to claim 1, further comprising a frame translation mechanism, wherein a moving portion of the frame translation mechanism is in transmission connection with the frame, and the frame translation mechanism drives the laser sensor on the frame to reciprocate relative to the positioning member.
10. The wafer pre-positioning device according to claim 1, wherein the positioning member is a vacuum chuck, and an air hole of the vacuum chuck is communicated with an air pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023328655.1U CN213816104U (en) | 2020-12-30 | 2020-12-30 | Wafer pre-positioning device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202023328655.1U CN213816104U (en) | 2020-12-30 | 2020-12-30 | Wafer pre-positioning device |
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| CN213816104U true CN213816104U (en) | 2021-07-27 |
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| CN202023328655.1U Active CN213816104U (en) | 2020-12-30 | 2020-12-30 | Wafer pre-positioning device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361093A (en) * | 2022-03-11 | 2022-04-15 | 立川(深圳)智能科技设备有限公司 | Feeding and pre-positioning device on wafer |
| CN117471865A (en) * | 2023-11-03 | 2024-01-30 | 江苏雷博微电子设备有限公司 | Silicon wafer placement device for prealignment system of photoetching machine |
-
2020
- 2020-12-30 CN CN202023328655.1U patent/CN213816104U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361093A (en) * | 2022-03-11 | 2022-04-15 | 立川(深圳)智能科技设备有限公司 | Feeding and pre-positioning device on wafer |
| CN114361093B (en) * | 2022-03-11 | 2022-05-27 | 立川(深圳)智能科技设备有限公司 | Feeding and pre-positioning device on wafer |
| CN117471865A (en) * | 2023-11-03 | 2024-01-30 | 江苏雷博微电子设备有限公司 | Silicon wafer placement device for prealignment system of photoetching machine |
| CN117471865B (en) * | 2023-11-03 | 2024-04-30 | 江苏雷博微电子设备有限公司 | Silicon wafer placement device for prealignment system of photoetching machine |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A wafer pre positioning device Effective date of registration: 20230816 Granted publication date: 20210727 Pledgee: Bank of China Limited Xiamen Xiang'an sub branch Pledgor: XIAMEN FUQI AUTOMATIC EQUIPMENT CO.,LTD. Registration number: Y2023980052438 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |