CN212970535U - Heat radiation structure of space high heat consumption photoelectric equipment - Google Patents
Heat radiation structure of space high heat consumption photoelectric equipment Download PDFInfo
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Abstract
The utility model relates to a heat radiation structure of space high heat consumption optoelectronic equipment, include: the device comprises a case shell, a common function module, a thermoelectric refrigerator, a laser module, a PCB, common components, high-heating components, a heat conduction elastic pad and a heat dissipation panel. The case is used as a main path for heat dissipation, and the functional modules packaged into an integrated structure are divided into a common functional module and a functional module with a precise temperature control requirement; the conduction and heat dissipation path between the PCB and the case shell is strengthened, and the layout of high-heat-generation components is optimized; and the heat dissipation of the high-heating element on the PCB is enhanced, so that the heat dissipation effect of the high-heating element is improved. To modern electronic equipment integrated level higher and higher, the thermal current of components and parts is bigger and bigger, and overall arrangement and installation space are limited, use the big condition of restraint limiting condition, the utility model discloses be suitable for the thermal design task of the limited high thermal current device heat dissipation of space random distribution overall arrangement and installation space and temperature precision control.
Description
Technical Field
The utility model relates to a heat radiation structure of high heat dissipation photoelectric equipment in space belongs to space equipment thermal design technical field.
Background
Along with the rapid development of a load technology, the integration level of electronic equipment is higher and higher, the performance requirement is also higher and higher, the structural size of an electronic device in the equipment is smaller and smaller, the power consumption is also higher and higher, and the difficulty of heat dissipation design and temperature control of the device is obviously increased. If the thermal design method is improper, the performance index and the service life of the equipment are seriously affected, especially the space electronic equipment, such as the electronic equipment used by the GEO spacecraft, generally needs to operate in an in-orbit space for more than 15 years, and the reliability of the thermal design method is very important. In electronic products, the effects of high temperature on the electronic products include degradation of insulation properties, damage of components, thermal aging of materials, cracking of low-melting-point welds, and falling off of welds, resulting in a decrease in the performance of the entire product to complete failure. Statistically, 55% of electronic equipment failures are caused by high temperature, and as the temperature rises, the failure rate increases exponentially. The electronic components are basic products of electronic and electrical systems, the temperature of the electronic components is an important factor influencing the working reliability of the electronic equipment, and therefore, the electronic equipment and the components are subjected to thermal design, the temperature of the selected electronic components is controlled within a specified allowable working temperature range, and the method is a technical means for effectively ensuring and improving the reliability of the electronic equipment and the components.
The main heat dissipation path of the electronic equipment is to dissipate heat to the outside by means of an equipment case, a common thermal design method is that the heat dissipation of components is conducted to a case shell (a PCB is mechanically connected with the case shell) through a PCB (printed circuit board) mounted on the electronic equipment, the PCB mainly comprises glass fiber reinforced plastics or ceramics, the heat conductivity is low, the heat transfer effect is limited, for high-heat-consumption and high-heat-flow devices, heat dissipation is strengthened by adopting a heat-conducting metal strip, a micro heat pipe and the like to lap-joint the components and the case shell except for heat dissipation of the PCB, and the heat dissipation design brings strong limiting conditions such as layout, enough mounting space and the like, and is not suitable for precise temperature range control. In summary, modern electronic equipment has higher and higher integration level, larger and larger heat flow of components, and very limited layout and installation space, and the existing thermal design technology of electronic equipment has large use constraint conditions and high design cost, cannot meet the thermal design task requirements of heat dissipation and temperature precision control of high heat flow devices with randomly distributed layout in space and limited installation space, and needs to develop a new efficient thermal design method urgently.
SUMMERY OF THE UTILITY MODEL
The technical solution problem of the utility model is that: the defects of the prior art are overcome, and the heat dissipation structure of the space high-heat-consumption photoelectric equipment is provided, so that the defects and the defects that the prior art is not suitable for random layout heat dissipation and precise temperature control of high-heat-flow components are overcome.
The utility model adopts the technical proposal that:
a heat dissipation structure of a space high heat consumption photoelectric device comprises: the device comprises a case shell, a common function module, a thermoelectric refrigerator, a laser module, a PCB (printed circuit board), common components, high-heating components, a heat-conducting elastic pad and a heat-radiating panel;
the casing of the case comprises a bottom plate, side plates and a cover plate, wherein the bottom plate and the side plates are connected together and milled into an integral structure, and the cover plate is fixed on the upper sides of the side plates to seal the case; mounting surfaces on the inner side and the outer side of the chassis bottom plate are full contact surfaces and have no weight reduction grooves;
the common function module is arranged on the mounting surface on the inner side of the chassis bottom plate, heat dissipation is directly carried out through the chassis, and heat conducting filler is filled between the common function module and the mounting surface on the inner side of the chassis;
the thermoelectric refrigerator is fixedly arranged on the mounting surface on the inner side of the chassis base plate, the laser module is arranged on the thermoelectric refrigerator, and the laser module is heated or cooled by the thermoelectric refrigerator; the laser module is fixedly arranged on the thermoelectric refrigerator through screws or metal hoops, the thermoelectric refrigerator is arranged on the mounting surface on the inner side of the chassis bottom plate through screws, and heat conducting fillers are filled between the mounting surfaces;
the PCB is arranged in the case shell, a copper-clad layer of the PCB extends to the edge of a circuit board mounting frame, the outer surface of the circuit board mounting frame is coated with copper, common components and high-heat-generation components are arranged on the PCB, and the high-heat-generation components are distributed at the edge of the PCB;
heat conduction fillers are filled in contact surfaces between the common components and the high-heat-generation components and the PCB, and the heat conduction fillers are filled in contact surfaces between the common components and the high-heat-generation components and the PCB, and are installed and fixed by screws;
the heat dissipation panel is mechanically connected with the case shell through screws, and heat conduction fillers are filled between contact surfaces; the heat dissipation panel is provided with a structural boss, and the structural boss is in surface contact with the heating surface of the high-heating element; a heat conduction elastic pad is arranged between the structural boss and the contact surface of the high-heating element; the PCB board around the high-heating device and the heat dissipation panel are uniformly provided with screw mounting interfaces, and the heat dissipation panel structure boss, the heat conduction elastic pad and the high-heating device are pressed by screws to be in contact with each other.
Furthermore, the surface of the case shell is provided with a black paint coating or a black anodized layer, and the case shell is processed by adopting an aluminum alloy material.
Furthermore, the wall thickness of the side plate of the case shell is not less than 2.5mm, the thickness of the bottom plate is not less than 3.5mm, and the flatness error of the mounting surface on the inner side of the bottom plate is required to be less than 0.1mm within the range of any 100mm multiplied by 100 mm.
Further, the common functional module is a functional module with the lowest working temperature lower than 0 ℃ and the highest working temperature higher than 50 ℃, and the working temperature interval of the laser module is 35 +/-1 ℃; common functional modules include power supply modules and EDFA (erbium doped fiber amplifier) modules.
Furthermore, the copper-clad area and the thickness of the copper-clad layer are locally increased in a region where the high-heat-generation component is mounted on the PCB.
Furthermore, the width of the installation contact surface of the PCB installation frame and the chassis shell is not less than 5 mm.
Furthermore, the high-heating component is a component with heat loss more than or equal to 0.3W, and the common component is a component with heat loss less than 0.3W.
Further, the heat dissipation panel is made of an aluminum alloy 6063 material.
Furthermore, the width of a connecting contact surface between the heat dissipation panel and the case shell is not less than 5 mm.
Furthermore, the thickness of the heat conduction elastic pad after compression is less than 0.3 mm.
Compared with the prior art, the utility model beneficial effect be:
(1) the utility model provides a thermal design of equipment high heat flow device under suitable space environment, the general commonality of adapting is good, extensively is applicable to the thermal design of space equipment.
(2) The utility model provides a heat radiation structure design can effectively solve the high heat flow spare heat collection of space multiple spot random distribution, transmission and the difficult problem of dispelling, has advantages such as heat transfer capacity is strong, structural assembly is simple, high reliable, design restraint is little, with low costs.
(3) The utility model provides a TEC (thermoelectric cooler) has solved the accurate accuse temperature difficult problem of the module and components and parts that require to the high accuracy of temperature, can realize the interval precision control of 35 1 ℃ of temperature, has that accuse temperature precision is high, low-power consumption, small, light in weight, easy-to-use advantage. Meanwhile, the design interface is simplified, and the thermal design resource is obviously saved.
(4) The module classification heat dissipation design method provided by the invention adopts corresponding heat control measures according to the module temperature interval, and can obviously save the design cost.
(5) The heat dissipation design method provided by the invention is based on passive heat control technologies such as material selection, heat control coating, structural design and the like, has high heat dissipation efficiency and high reliability, and is suitable for heat dissipation design of long-life space equipment.
Drawings
Fig. 1 is a schematic view of the heat dissipation design of the space high heat dissipation photovoltaic device of the present invention;
Detailed Description
High heat current spare heat dissipation and accurate accuse temperature problem to space equipment random distribution, the utility model discloses design the heat dissipation of the high heat consumption optoelectronic equipment in space to satisfy space random distribution overall arrangement and the limited high heat current spare heat dissipation of installation space and temperature accurate control's thermal design task demand.
The utility model discloses mainly follow several aspects below and dispel the heat optimal design:
on the first hand, the case is used as a main path for heat dissipation of the equipment functional module, the PCB and the components, and the optimized heat dissipation design of the case is carried out;
the casing of the machine box is made of materials with low specific gravity and high thermal conductivity, the casing structure of the machine box comprises a bottom plate, side plates and a cover plate, the bottom plate and the side plates are connected together and milled into an integral structure, and the thermal resistance of a heat transfer path is reduced; the mounting surfaces of the inner side and the outer side of the chassis bottom plate are full contact surfaces without weight reduction grooves, and the surface of the chassis is subjected to high-emissivity surface treatment (black paint spraying or black anodizing) to enhance space radiation heat dissipation.
In a second aspect, the functional modules packaged as an integrated structure are divided into a common functional module and a functional module (such as a laser module) with a precise temperature control requirement, and the optimized heat dissipation design of the functional modules packaged as an integrated structure in the case is performed.
And for the common functional module, the common functional module is directly arranged and installed on the installation surface at the inner side of the chassis bottom plate, heat conducting filler is filled between the common functional module and the installation surface at the inner side of the chassis to strengthen contact heat transfer, and the common functional module directly radiates heat through the chassis.
For the functional module with the requirement of precise temperature control, a thermoelectric cooler (TEC) is firstly installed on the installation surface on the inner side of the bottom plate of the machine box, then the functional module with the requirement of precise temperature control is fixed on the TEC, and the thermoelectric cooler is used for carrying out bidirectional heat flow control of heating or refrigerating on the functional module with the requirement of precise temperature control, so that precise control of a temperature interval is realized; the functional module with the requirement of precise temperature control is fixedly arranged on the thermoelectric refrigerator through screws or metal hoops, the thermoelectric refrigerator is arranged on the mounting surface on the inner side of the bottom plate of the machine box through the screws, all contact surfaces are ensured to be in close contact, and heat conducting fillers are filled among all the mounting surfaces to strengthen contact heat transfer.
The utility model discloses well whole operational environment temperature of optoelectronic device is between 0 deg.C ~ 50 deg.C region, and the ordinary function module of machine incasement generally indicates that the operational temperature region is greater than the whole operational environment temperature range of optoelectronic device 0 deg.C ~ 50 deg.C, and ordinary function module indicates that the operational region is wider than, for example minimum operating temperature is less than 0 deg.C, and the highest operating temperature is higher than 50 deg.C's function module, the function module that has the accurate temperature control demand, for example laser instrument (LD) module, its operational temperature region is very strict, generally is 35 +/-1 deg.C.
And in the third aspect, the PCB arranged in the machine box is subjected to optimized heat dissipation design, the conduction heat dissipation path between the PCB and the machine box shell is strengthened, and the layout of high-heat-generating components is optimized.
The components and parts transmit heat to the case shell by means of the PCB installed on the components and parts, the number of copper-clad layers and the thickness of the copper-clad layer of the PCB are increased on the premise of meeting the electrical performance design, the equivalent heat conductivity of the PCB is improved, the copper-clad layer extends to the edge of the circuit board installation frame, and copper is clad on the outer surface of the circuit board installation frame. Particularly, the local copper-clad area or the thickness of a copper-clad layer in a mounting area of the high-heating component (more than or equal to 0.3W) is enhanced, and the copper-clad layer extends to a circuit board mounting frame.
And a conduction heat dissipation path between the PCB and the case shell is strengthened. The components are reasonably distributed, and when the components are distributed, the components with high power and high heat productivity are distributed at the edge of the PCB, so that the heat transfer path between the high-heat-production components and the case shell is shortened. The high-power components are distributed as dispersedly as possible, so that the heat source concentration is avoided, and the layout of the high-heating components is optimized.
In the fourth aspect, the heat dissipation enhancement design of the high-heating component on the PCB is carried out, and the heat dissipation effect of the high-heating component is improved.
Aiming at the components with high heat consumption and high heat flow which are randomly distributed on the PCB, a special radiating panel is designed to be used as a heat collecting and transmitting device, so that the remote high-efficiency heat dissipation of the components with high heat consumption and high heat flow which are randomly distributed in space is realized.
According to above-mentioned heat dissipation design, the utility model discloses a heat radiation structure of high heat consumption optoelectronic device in space, as shown in FIG. 1, include: the device comprises a case shell 1, a common function module 2, a thermoelectric refrigerator 3, a laser module 4, a PCB 5, a common component 6, a high-heating component 7, a heat-conducting elastic pad 8 and a heat-radiating panel 9;
the chassis shell 1 comprises a bottom plate, side plates and a cover plate which are all made of aluminum alloy materials, the bottom plate and the side plates are connected together and milled into an integral structure, the thermal resistance of a heat transfer path is reduced, and the cover plate is fixed on the upper sides of the side plates and used for sealing the chassis; mounting surfaces on the inner side and the outer side of a chassis bottom plate are full contact surfaces without weight reduction grooves, and the surface of the chassis is subjected to high-emissivity surface treatment (the surface of a chassis shell is provided with a black paint coating or a black anodized layer) to strengthen space radiation heat dissipation;
the wall thickness of the side plate of the casing of the machine case is not less than 2.5mm, the thickness of the bottom plate is not less than 3.5mm, and the flatness error of the mounting surface on the inner side of the bottom plate is required to be less than 0.1mm within the range of any 100mm multiplied by 100 mm.
The common functional module 2 is directly arranged on the mounting surface on the inner side of the chassis bottom plate, heat dissipation is directly carried out through the chassis, and heat conducting fillers are filled between the common functional module and the mounting surface on the inner side of the chassis to strengthen contact heat transfer;
the thermoelectric refrigerator 3 is fixedly arranged on the mounting surface on the inner side of the bottom plate of the machine box, the laser module 4 is arranged on the thermoelectric refrigerator 3, and the thermoelectric refrigerator 3 is used for carrying out bidirectional heat flow control on heating or refrigerating of the laser module 4 to realize precise control of a temperature interval; the laser module 4 is fixedly arranged on the thermoelectric refrigerator 3 through screws or metal hoops, the thermoelectric refrigerator 3 is arranged on the mounting surface on the inner side of the chassis base plate through screws, all contact surfaces are ensured to be in close contact, and heat conducting fillers are filled between the mounting surfaces to strengthen contact heat transfer;
the common functional module is a functional module with the lowest working temperature lower than 0 ℃ and the highest working temperature higher than 50 ℃, and the working temperature range of the laser module is 35 +/-1 ℃; the common functional modules comprise a power supply module and an EDFA module.
The PCB 5 is arranged in the case shell 1, a copper-clad layer of the PCB 5 extends to the edge of a circuit board mounting frame, copper is coated on the outer surface of the circuit board mounting frame, and the region of the PCB 5 where high-heating components are arranged is subjected to treatment of locally increasing the copper-clad area and increasing the thickness of the copper-clad layer;
the common component 6 and the high-heating component 7 are arranged on the PCB 5 and are in contact heat transfer with the PCB 5 through component pins, heat-conducting fillers are filled in contact surfaces between the components and the PCB, the width of the contact surfaces between a mounting frame of the PCB 5 and a housing of the chassis is not less than 5mm, the heat-conducting fillers are filled in the contact surfaces, and the contact surfaces are mounted and fixed by screws;
the high-heat-generation component 7 is arranged at the edge of the PCB 5, so that a heat transfer path between the high-heat-generation component 7 and the chassis shell 1 is shortened; meanwhile, the high-heating components 7 are distributed, so that the heat source concentration is avoided;
the high-heating component is a component with heat loss more than or equal to 0.3W, and the common component is a component with heat loss less than 0.3W.
The high-heating component 7 on the PCB is reinforced and radiated through the radiating panel 9, the radiating panel 9 and the case shell 1 are mechanically connected through screws, and heat conducting fillers are filled between contact surfaces; according to the space geometric distribution position of the high heating element 7 on the PCB, a structure boss is arranged on the heat dissipation panel 9 corresponding to the projection position, so that the structure boss is in surface contact with the heating surface of the high heating element 7; a heat conduction elastic pad 8 is arranged between the contact surface of the structural boss and the high-heating component 7, and the heat conduction elastic pad 8 is elastically compressed to ensure that the three are in close contact, so that the thermal contact resistance is reduced; screw installation interfaces are uniformly distributed on the PCB 5 and the heat dissipation panel 9 around the high-heat-generation device 7, and the contact among the boss of the structure of the heat dissipation panel 9, the heat conduction elastic pad 8 and the heat generation surface of the high-heat-generation device 7 is compressed again through screws. The width of the connecting contact surface between the heat dissipation panel and the case shell is not less than 5mm, and the thickness of the compressed heat conduction elastic pad is less than 0.3 mm.
Example (b):
use the utility model discloses heat radiation structure carries out thermal design to certain satellite optoelectronic equipment, and equipment mainly comprises power module, EDFA module (erbium-doped fiber amplifier), LD module (laser), data processing board, light signal transceiver control board, high-power FPGA electronic components etc.. The heat dissipation structure is implemented as follows:
(1) thermal design of chassis
The case shell structure material is aluminum alloy material (6063 aluminum alloy plate), adopts six box structural design, and quick-witted case mounting plate thickness is 3.5mm, and other 5 panel thickness are 2.5 mm. Except the top cover plate, 4 other side panels and the bottom plate are milled into an integral structure, so that the heat transfer resistance between the side panels and the bottom plate is reduced, the mounting surface of the bottom plate is a full-contact surface without weight reduction grooves, and the flatness error of the mounting surface is required to be less than 0.1mm within the range of any 100mm multiplied by 100 mm. The lapping width of the top cover plate and each side panel connected with the top cover plate is 10mm, and the top cover plate and each side panel are connected and installed through screws. And heat conducting grease is coated between all the mutually connected panel contact surfaces of the casing structure of the machine case so as to reduce the contact heat resistance.
The outer surface of the case is anodized in black or sprayed with black paint (the surface emissivity is more than or equal to 0.85), so that the radiation heat dissipation is enhanced.
(2) Modular thermal design
The power module, the EDFA module and other modules are directly installed on the upper surface of the bottom panel of the chassis through screws, and heat conducting grease is coated between installation contact surfaces of all the modules so as to reduce contact thermal resistance. Black anodization or black paint spraying (the surface emissivity is more than or equal to 0.85) is carried out on the outer surface (except the installation surface) of the module, so that the radiation heat dissipation is enhanced.
The LD module (laser) has the requirement of precise control (35 +/-1 ℃) on the temperature, the TEC (thermoelectric refrigerator) is adopted to control the temperature, the hot surface of the LD module is arranged on the upper surface (cold surface) of the TEC, the lower surface (heat dissipation surface) of the TEC is directly arranged on the inner surface of the bottom panel of the case through screws, the LD module is tightly pressed and fixed on the upper surface of the TEC through a red copper clamp, the two ends of the red copper clamp are fixed on the bottom panel of the case through screws, and heat conduction grease is coated between all installation contact surfaces to reduce the contact thermal resistance.
(3) PCB thermal design
The thickness of the PCB (data processing board, optical signal receiving and transmitting control board) is about 2mm, and the board is epoxy glass cloth. In order to improve the heat conduction path between the PCB and the casing of the chassis and provide a good heat dissipation channel for components, the following measures are taken when the circuit board is designed:
1) on the premise of meeting the electrical performance design, 8 copper layers with different thicknesses are coated in the PCB board, and the details are shown in Table 1.
TABLE 1 copper-clad layer in PCB
2) The inner copper-clad layer extends to the edge of the circuit board mounting frame, and copper is clad on the outer surface of the circuit board mounting frame.
3) The local copper-clad area or the thickness of a copper-clad layer in a high-heating component (not less than 0.3W) mounting area is increased, the copper-clad layer extends to a circuit board mounting frame, and the high-heating component is an FPGA chip in the embodiment.
4) The width of the contact surface of the PCB mounting frame and the chassis structure mounting boss is 10mm, the PCB mounting frame and the chassis structure mounting boss are fixedly mounted through screws, and the mounting contact surface is coated with heat conduction grease.
(4) Component thermal design
When the components are arranged and designed on the PCB, the high-power and high-heat-productivity components (FPGA chips) are arranged on the edge of the frame of the PCB on the premise of circuit design permission, and a heat transfer path between the FPGA chips and the case shell is shortened. The components should be distributed uniformly as much as possible, and especially the components with high power and large heat productivity avoid the concentration of heat sources. When the components are installed on the PCB, the length of the installation pins is as short as possible, and heat-conducting silicon rubber is coated between the installation surface of the heating components and the PCB to reduce heat transfer resistance.
Aiming at high-heating components randomly distributed on a PCB, a radiating panel is designed to serve as a heat collecting and transmitting reinforcing device, and the remote heat dissipation of point heat sources randomly distributed in space is realized. Adopt the components and parts heating surface design a cooling panel structure on the PCB board, cooling panel adopts low proportion, high thermal conductivity aluminum alloy (6063 aluminum alloy plate) material processing to form, and cooling panel structure and chassis shell structure carry out mechanical connection through the screw, and it is 10mm to connect the contact surface width, fills heat conduction fat between the contact surface.
According to the spatial geometric distribution position of the high-heating components on the PCB, structural boss shaping design is carried out on the corresponding projection position on the radiating panel, the geometric center of the structural boss coincides with the geometric center of the high-heating components connected with the structural boss, the outline of the boss is expanded by 5mm beyond the outline of the heating surface of the components, and the height of the boss is matched with the height of the high-heating components connected with the boss.
Considering the processing and assembly, a gap of 0.2 mm-0.3 mm is left, when in assembly, a Sil-Pad 2000 series heat-conducting elastic Pad with the thickness less than 0.3mm (after compression) is arranged between the structural lug boss and the contact surface of the component, and the elastic compression of the heat-conducting elastic Pad ensures the close contact of the three, thereby reducing the thermal contact resistance. In order to ensure that the structure boss, the heat conduction elastic pad and the component are in tight and stable contact, 2 screw installation interfaces are uniformly distributed on the PCB around the component and the corresponding heat dissipation panel, and the close contact among the structure boss, the heat conduction elastic pad and the heating surface of the component is compressed again through screws, so that the heat transfer resistance is reduced.
After the thermal design and implementation are completed, simulating a device space flight working environment (cold black, vacuum and thermal environment) and a working mode in a space environment simulator, and performing thermal test verification on the thermal design method, wherein the verification result shows that: all modules meet the working temperature range, and the temperature of an LD module (laser) is controlled within 35 +/-1 ℃; all components meet the requirement of first-level derating of temperature, and the allowance is more than 20%, wherein the temperature of the high-heating FPGA (heat dissipation 10W) is about 15 ℃ of allowance away from the first-level derating temperature, and the heat dissipation structure has a good heat dissipation effect.
Those skilled in the art will appreciate that the details of the present invention not described in detail herein are well within the skill of those skilled in the art.
Claims (10)
1. A heat radiation structure of a space high heat consumption photoelectric device is characterized by comprising: the device comprises a case shell (1), a common function module (2), a thermoelectric refrigerator (3), a laser module (4), a PCB (printed circuit board) board (5), a common component (6), a high-heat-generation component (7), a heat-conducting elastic pad (8) and a heat-radiating panel (9);
the case shell (1) comprises a bottom plate, side plates and a cover plate, wherein the bottom plate and the side plates are connected together and milled into an integral structure, and the cover plate is fixed on the upper sides of the side plates to seal the case; mounting surfaces on the inner side and the outer side of the chassis bottom plate are full contact surfaces and have no weight reduction grooves;
the common function module (2) is arranged on the mounting surface on the inner side of the chassis bottom plate, heat dissipation is directly carried out through the chassis, and heat conducting filler is filled between the common function module and the mounting surface on the inner side of the chassis;
the thermoelectric refrigerator (3) is fixedly arranged on the mounting surface on the inner side of the bottom plate of the machine box, the laser module (4) is arranged on the thermoelectric refrigerator (3), and the laser module (4) is heated or cooled through the thermoelectric refrigerator (3); the laser module (4) is fixedly arranged on the thermoelectric refrigerator (3) through screws or metal hoops, the thermoelectric refrigerator (3) is arranged on the mounting surfaces on the inner side of the bottom plate of the machine box through screws, and heat-conducting fillers are filled between the mounting surfaces;
the PCB (5) is arranged in the chassis shell (1), a copper-clad layer of the PCB (5) extends to the edge of a circuit board mounting frame, copper is coated on the outer surface of the circuit board mounting frame, a common component (6) and a high-heat-generation component (7) are arranged on the PCB (5), and the high-heat-generation component (7) is arranged at the edge of the PCB (5);
the common component (6), the high-heat-generation component (7) and the PCB (5) are in contact heat transfer through component pins, heat-conducting fillers are filled in contact surfaces between the common component (6), the high-heat-generation component (7) and the PCB, and the heat-conducting fillers are filled between a mounting frame of the PCB (5) and a mounting contact surface of a case shell and are mounted and fixed by screws;
the heat dissipation panel (9) is mechanically connected with the case shell (1) through screws, and heat conduction fillers are filled between contact surfaces; a structural boss is arranged on the heat dissipation panel (9) and is in surface contact with the heating surface of the high-heating element (7); a heat conduction elastic pad (8) is arranged between the contact surface of the structural boss and the high-heat-generation component (7); screw installation interfaces are uniformly distributed on the PCB (5) and the heat dissipation panel (9) on the periphery of the high-heat-generation component (7), and the contact among the structural boss of the heat dissipation panel (9), the heat conduction elastic pad (8) and the heat generation surface of the high-heat-generation component (7) is compressed through screws.
2. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the surface of the machine case shell (1) is provided with a black paint coating or a black anodized layer, and the machine case shell (1) is processed by adopting an aluminum alloy material.
3. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 2, wherein: the wall thickness of a side plate of the case shell (1) is not less than 2.5mm, the thickness of the bottom plate is not less than 3.5mm, and the flatness error of the mounting surface of the inner side and the outer side of the bottom plate is required to be less than 0.1mm within the range of any 100mm multiplied by 100 mm.
4. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the common functional module (2) is a functional module with the lowest working temperature lower than 0 ℃ and the highest working temperature higher than 50 ℃, and the working temperature range of the laser module (4) is 35 +/-1 ℃; the common function module (2) comprises a power supply module and an EDFA module.
5. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the area of the PCB (5) where the high-heat-generation component (7) is mounted locally increases the copper-clad area and increases the thickness of the copper-clad layer.
6. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the width of the installation contact surface of the installation frame of the PCB (5) and the casing of the case is not less than 5 mm.
7. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the high-heating component is a component with heat loss more than or equal to 0.3W, and the common component (6) is a component with heat loss less than 0.3W.
8. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the radiating panel is made of aluminum alloy 6063.
9. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the width of the connecting contact surface between the heat dissipation panel and the case shell is not less than 5 mm.
10. The heat dissipation structure of a photovoltaic device with high heat dissipation capacity in space of claim 1, wherein: the thickness of the compressed heat-conducting elastic pad is less than 0.3 mm.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114088244A (en) * | 2021-11-15 | 2022-02-25 | 西安微电子技术研究所 | Heat dissipation and temperature measurement integrated structure of high-power component |
| CN116142000A (en) * | 2022-12-31 | 2023-05-23 | 上海大学 | GaN charger for electric automobile |
-
2020
- 2020-07-31 CN CN202021566203.4U patent/CN212970535U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114088244A (en) * | 2021-11-15 | 2022-02-25 | 西安微电子技术研究所 | Heat dissipation and temperature measurement integrated structure of high-power component |
| CN116142000A (en) * | 2022-12-31 | 2023-05-23 | 上海大学 | GaN charger for electric automobile |
| CN116142000B (en) * | 2022-12-31 | 2023-10-27 | 上海大学 | GaN charger for electric automobile |
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