CN219478432U - Power supply conversion device with heat radiation structure - Google Patents

Abstract

The utility model provides a power supply conversion device with a heat dissipation structure, which relates to the field of power supplies and comprises: the PCB comprises a first surface and a second surface, wherein the first surface is opposite to the second surface; the at least one heat dissipation structure comprises a heat dissipation plate and a heat conduction material attached to the heat dissipation plate, wherein the at least one heat dissipation structure is assembled on the second surface of the PCB; at least one electronic device is assembled on the first surface of the PCB, wherein the area of the second surface of the PCB opposite to the area where each electronic device is assembled on the first surface of the PCB is at least partially covered by a heat dissipation structure. The insulation heat dissipation effect of the electronic device in the power conversion device with the heat dissipation structure is improved, and meanwhile the miniaturization design requirement of the product is met.

Description

Power supply conversion device with heat radiation structure

Technical Field

The utility model relates to the field of power supplies, in particular to a power supply conversion device with a heat dissipation structure.

Background

In the new energy industry, power products generally operate at higher power. During normal operation, a temperature increase may occur, resulting in an increase in the temperature of the electronic device. Therefore, heat dissipation is required to be carried out on the electronic device so as to ensure the normal operation of the electronic device.

The heat dissipation mode commonly used at present is to fill heat conduction interface materials such as heat conduction mud, heat conduction gaskets, heat conduction silicone grease and the like between the power device and the radiator. In order to improve the insulation performance between the power device and the radiator to meet the safety requirements, a layer of insulation material is generally required to be filled between the power device and the radiator, and the heat conductivity coefficient of the insulation material is generally far smaller than that of the heat conduction interface material, so that the heat conduction effect is greatly reduced. And because the insulating material is usually a lamellar flexible material, the automatic assembly is inconvenient, and the manual operation cost is higher.

When the heat transfer and dissipation scheme is designed, the heat transfer and dissipation of the module can be increased by combining various mediums, the complexity of the process can be increased, and the cost of a single piece can be greatly increased. If the heat source is conducted from top to bottom through the heat radiating device and is contacted with the cooling liquid through the bottom water channel shell, the heat radiation of the device is realized, and the traditional heat transfer and radiation combined module has larger heat resistance and influences the heat radiation because of more heat conducting mediums (heat conducting mud, ceramic plates and heat conducting gaskets) passing through; in the production and installation process, at least two different heat conducting media are required to be smeared for meeting the heat dissipation of the device, and the total smeared thickness is only 0.2mm-0.4mm, so that the material is difficult to control in the production process. Conventional heat transfer modules require more heat transfer medium and also result in higher cost for a single piece.

The heat conduction and dissipation modes such as heat conduction mud and a heat conduction silica gel gasket are low in efficiency, and sometimes in order to meet the electrical insulation distance, thicker heat conduction mud and heat conduction silica gel gasket are needed, so that the volume of the power conversion device is increased, the heat dissipation efficiency is low, and the power density of the power conversion device is low.

Disclosure of Invention

The application provides a power conversion device with heat radiation structure, including: the PCB comprises a first surface and a second surface, wherein the first surface is opposite to the second surface; the at least one heat dissipation structure comprises a heat dissipation plate and a heat conduction material attached to the heat dissipation plate, wherein the at least one heat dissipation structure is assembled on the second surface of the PCB; at least one electronic device is assembled on the first surface of the PCB, wherein the area of the second surface of the PCB opposite to the area where each electronic device is assembled on the first surface of the PCB is at least partially covered by a heat dissipation structure.

Further, the at least one heat dissipation structure is assembled on the second surface of the PCB board through an SMD process.

Further, the heat dissipation plate is a heat conduction insulating plate, and the heat conduction material attached to the heat dissipation plate is a metal material.

Further, the heat dissipation plate has an area larger than that of the heat conductive material attached thereto, and a distance is provided between an edge position of the heat dissipation plate and an edge position of the heat conductive material.

Further, the heat dissipation structure is a metal-clad ceramic.

Further, the heat dissipation plate is a ceramic plate.

Further, the area covered by each of the at least one heat dissipation structure entirely covers an area covered by an electronic device.

Still further, still include casing and heat dissipation material, at least one heat dissipation structure passes through heat dissipation material contact with the casing.

Still further, a housing is included, the at least one heat dissipating structure being in direct contact with the housing.

Still further, the PCB includes a plurality of mounting holes, the housing includes a plurality of mounting holes, and a plurality of mounting members pass through the mounting holes on the PCB and the mounting holes on the housing, fix the PCB with the housing, so that the at least one heat dissipation structure contacts with the housing.

Drawings

Fig. 1 is a schematic diagram of a power conversion device with a heat dissipation structure according to an embodiment of the present application.

Fig. 2 is an exploded view of a power conversion device with a heat dissipation structure according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a power conversion device with a heat dissipation structure according to an embodiment of the disclosure.

Fig. 4 is a schematic diagram of a heat dissipation structure according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present utility model will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

An embodiment of the present application provides a power conversion device with a heat dissipation structure, including: the PCB comprises a first surface and a second surface, wherein the first surface is opposite to the second surface; the at least one heat dissipation structure comprises a heat dissipation plate and a heat conduction material attached to the heat dissipation plate, wherein the at least one heat dissipation structure is assembled on the second surface of the PCB; at least one electronic device is assembled on the first surface of the PCB, wherein the area of the second surface of the PCB opposite to the area where each electronic device is assembled on the first surface of the PCB is at least partially covered by a heat dissipation structure.

Please refer to the schematic diagram of the power conversion device with heat dissipation structure shown in fig. 1, and refer to fig. 2, 3 and 4, wherein fig. 2 is an exploded view of the power conversion device with heat dissipation structure, fig. 3 is a schematic diagram of the power conversion device with heat dissipation structure not shown in the housing, and fig. 4 is a schematic diagram of the heat dissipation structure. The power conversion device with heat radiation structure includes:

the PCB board 100 includes a first surface 110 and a second surface 120, the first surface 110 being opposite to the second surface 120;

at least one heat dissipation structure, such as the heat dissipation structures 510 and 520 in fig. 1 to 4, each including a heat dissipation plate and a heat conductive material attached to the heat dissipation plate, such as the heat dissipation structure 510 in fig. 4 including a heat dissipation plate 511 and a heat conductive material 512 attached to the heat dissipation plate 511, the heat dissipation structure 520 including a heat dissipation plate 521 and a heat conductive material 522 attached to the heat dissipation plate 521, wherein the heat dissipation structures 510 and 520 are assembled to the second face 120 of the PCB 100;

at least one electronic device, such as electronic devices 310 and 320 in fig. 1-3, is assembled to the first side 110 of the PCB board 100, wherein a region of the second side of the PCB board opposite to a region of each electronic device assembled to the first side 110 of the PCB board is at least partially covered by a heat dissipating structure, such as a region of the second side 120 of the PCB board opposite to a region of the first side 110 of the PCB board assembled to the electronic device 310 in fig. 1-3 is at least partially covered by a heat dissipating structure 510, and a region of the second side 120 of the PCB board opposite to a region of the first side 110 of the PCB board assembled to the electronic device 320 is at least partially covered by a heat dissipating structure 520.

As described above, in the solution provided herein, heat generated by electronic devices such as electronic devices 310 and 320 (typically power semiconductor devices or chips) may be conducted through the PCB to a heat dissipating structure located on the opposite side of the PCB board, thereby dissipating the heat of the electronic devices. The heat dissipation path from the electronic device to the heat dissipation structure does not need to pass through heat conduction mud, heat conduction silicone grease or heat conduction silica gel gaskets, so that the heat dissipation effect is good.

In an embodiment, the heat dissipation plate is a heat conductive insulating plate, so that thicker heat conductive mud and heat conductive silica gel gaskets are needed to meet the electric insulation distance, the electric insulation performance is ensured under the condition of smaller space, the safety problem is solved, the volume of the power conversion device can be reduced, and the power density of the power conversion device is improved.

In one embodiment, thermally conductive materials 512 and 522 are metallic materials, such as copper. The specific materials of the thermally conductive material are not limited in this application.

In one embodiment, the heat dissipation plate has an area larger than an area of the heat conductive material attached thereto, and a distance is provided between an edge position of the heat dissipation plate and an edge position of the heat conductive material. As shown in fig. 4, the area of the heat dissipation plate 511 is larger than that of the heat conductive material 512, and a certain distance is provided between the edge position of the heat dissipation plate 511 and the edge position of the heat conductive material 512; the area of the heat dissipation plate 521 is larger than that of the heat conductive material 522, and there is a certain distance between the edge position of the heat dissipation plate 521 and the edge position of the heat conductive material 522. Therefore, the edge position of the side, to which the heat conducting material is attached, of the heat radiating structure still has insulating property, the safety regulation problem can not be generated, and the safety regulation requirement can be met on the premise that the volume of the power conversion device can not be increased.

In one embodiment, the heat dissipation structures 510 and 520 are cermet.

In one embodiment, heat sinks 511 and 521 are ceramic sheets.

In an embodiment, the heat dissipation plate of the partial heat dissipation structure is a ceramic plate, and the partial heat dissipation structure is a metal-clad ceramic.

In particular, the heat-conducting mud or the heat-conducting silica gel gasket has the advantages of good fit, but needs to be coated with certain thickness. The heat-conducting silica gel has lower temperature resistance than ceramic material, and has lower insulation pressure resistance than heat-conducting ceramic material. At normal temperature, the high heat conduction silica gel sheet has a heat conduction coefficient of 2-3W/m.K and above, the common heat conduction silica gel sheet has a heat conduction coefficient of 1-2W/m.K, and the ceramic (DCB) has a heat conduction coefficient as high as 18W/m.K-30W/m.K, which is far higher than that of heat conduction mud and the like, and is an insulating material, and the PCB is contacted with one surface of the ceramic material by utilizing the good heat conduction and heat dissipation characteristics of the ceramic material, so that the heat dissipation path is shortened, and the heat dissipation efficiency is increased.

In an embodiment, the at least one heat dissipation structure is assembled on the second surface of the PCB board through an SMD (surface mounted device) process. In an embodiment, the electronic device is also assembled on the PCB board by an SMD (surface mounted) process, and after the electronic device and the heat dissipation structure are prepared, the electronic device is positioned at a corresponding assembly position on the PCB, and then assembled on the PCB board at one time by an SMD process, so as to form the PCB assembly shown in fig. 3. Convenient automatic installation and convenient assembly, improves production efficiency, reduces the manual assembly cost.

In one embodiment, the heat conductive material is integrally formed with the heat sink such that the heat conductive material is attached to the heat sink.

In one embodiment, after the heat dissipation plate is formed, the heat conductive material is attached to the heat dissipation plate by other processes, such as a copper-clad process commonly used in the industry, which is not limited in this application.

In an embodiment, the at least one electronic device is assembled on the first surface side of the PCB board in a different shape. As shown in fig. 2, the electronic device 320 has a cylindrical structure, and the shape of the electronic device assembled on the first surface 110 of the PCB board 100 is circular, and the electronic device may be a capacitor, a resistor, or the like. As shown in fig. 2, the electronic device 310 is a hexahedral structure, and the shape of the electronic device assembled on the first surface 110 of the PCB board 100 is square, and the electronic device may be a power semiconductor device, a resistor, a chip, or the like.

In one embodiment, the heights between the electronic devices may be the same or different. The areas of the electronic devices covering the first side 110 of the PCB board 100 may be the same or different. As shown in fig. 1 to 3, the area of the electronic device 310 covering the first face 110 of the PCB board 100 is larger than the area of the electronic device 320 covering the first face 110 of the PCB board 100.

That is, the solution provided by the present application can simultaneously dissipate heat for a plurality of electronic devices with different specifications and sizes.

In an embodiment, the area covered by each of the at least one heat dissipation structure entirely covers an area covered by an electronic device. That is, the heat dissipation structure of the electronic device corresponding to heat dissipation is larger than or equal to the area covered by the corresponding electronic device, so that heat dissipation of the electronic device is conducted out through the heat dissipation structure. As shown in fig. 1 to 3, the heat dissipation structure 510 covers an area equal to that of the electronic device 310, and the heat dissipation structure 520 covers an area equal to that of the electronic device 320, and all overlap. Of course, the heat dissipation structure 510 may cover an area larger than the electronic device 310, and the heat dissipation structure 520 may cover an area larger than the electronic device 320. Or the area covered by the partial heat dissipation structure is larger than the corresponding area covered by the electronic device, and the area covered by the partial heat dissipation structure is equal to the area covered by the electronic device.

In an embodiment, the shape of the second surface 120 of each of the at least one heat dissipation structure assembled on the PCB board 100 is the same as the shape of the first surface 110 of the corresponding electronic device assembled on the PCB board 100. As shown in fig. 2, the heat dissipation structure 510 is a hexahedral structure, the second surface 120 of the PCB board 100 is rectangular, and the first surface 110 of the PCB board 100 is also rectangular for the electronic device 310 to dissipate heat, so that heat generated by the electronic device 310 can be dissipated through the heat dissipation structure 510, and the surface connection of the PCB board 100 is not wasted. The particular electronic device 310 is also hexahedral in configuration. Similarly, as shown in fig. 2, the electronic device 320 and the heat dissipation structure 520 for dissipating heat from the electronic device are circular, and the specific electronic device 320 and the heat dissipation structure 520 for dissipating heat from the electronic device are cylindrical.

In one embodiment, as shown in fig. 1 and 2, the power conversion device having the heat dissipation structure further includes a housing 200, and the at least one heat dissipation structure is in contact with the housing. The heat of the corresponding electronic device can be transferred to the case 200 in contact with the heat dissipation structure to achieve a good heat dissipation effect.

In one embodiment, the heat dissipation structures 510 and 520 are in contact with the housing 200 through a heat dissipation material, such as a heat conductive paste, and then in contact with the housing 200, thereby forming a solid heat dissipation path and increasing the reliability of heat dissipation.

In one embodiment, the heat dissipating structures 510 and 520 are in direct contact with the housing 200.

In one embodiment, the housing 200 is a metal housing.

In one embodiment, as shown in fig. 1 and 2, the PCB board 100 includes a plurality of mounting holes 130, the case 200 includes a plurality of mounting holes 210, and a plurality of mounting members 400 pass through the mounting holes 130 on the PCB board and the mounting holes 210 on the case to fix the PCB board 100 with the case 200 and to contact the heat dissipation structure with the case 200. A solid heat dissipation path is formed between the heat dissipation structure and the housing 200.

In an embodiment, the thickness of each heat dissipation structure is the same, so that when the PCB board 100 and the housing 200 shown in fig. 3 are assembled together, the heat dissipation structures all contact the housing 200.

In an embodiment, the shape of the electronic device may be different from each other, that is, a plurality of electronic devices with different specifications and sizes, which may be the same, so long as the heat dissipation structure on the second side of the PCB 100 is also changed according to the shape of the electronic device. That is, the power conversion device with the heat dissipation structure can dissipate heat for a plurality of electronic devices with different specifications and sizes at the same time.

At present, with the development of ceramic materials, the heat conductivity coefficient of the ceramic materials is further improved and can reach 18W/m.K to 30W/m.K, and the heat conduction, heat convection and heat radiation capacities of the ceramic materials are greatly enhanced. The ceramic substrate and the ceramic sheet derived therefrom have also been infinitely developed. Meanwhile, the ceramic material also has good insulating property, and can ensure the electrical insulating property and solve the safety problem under the condition of smaller space.

The scheme of the sample application is adopted, and in the power conversion device product with compact design space, the heat conduction and heat dissipation requirements are met, and meanwhile, the electrical insulation requirements are also met.

The technical scheme that this application provided can adopt the SMD technology to assemble electronic device and heat radiation structure once only on the PCB board, and automatic installation and assembly of being convenient for are convenient, improve production efficiency, reduce artifical assembly cost, compromise the miniaturized design demand of product when promoting the insulating radiating effect of electronic device in the power conversion equipment.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (10)

1. A power conversion device having a heat dissipation structure, comprising:

the PCB comprises a first surface and a second surface, wherein the first surface is opposite to the second surface;

the at least one heat dissipation structure comprises a heat dissipation plate and a heat conduction material attached to the heat dissipation plate, wherein the at least one heat dissipation structure is assembled on the second surface of the PCB;

at least one electronic device is assembled on the first surface of the PCB, wherein the area of the second surface of the PCB opposite to the area where each electronic device is assembled on the first surface of the PCB is at least partially covered by a heat dissipation structure.

2. The power conversion device with heat dissipation structure according to claim 1, wherein the at least one heat dissipation structure is assembled on the second surface of the PCB board by an SMD process.

3. The power conversion device with a heat dissipation structure according to claim 1, wherein the heat dissipation plate is a heat conductive insulating plate, and the heat conductive material attached to the heat dissipation plate is a metal material.

4. A power conversion device having a heat dissipating structure according to claim 3, wherein the heat dissipating plate has an area larger than an area of the heat conductive material attached thereto, and a distance is provided between an edge position of the heat dissipating plate and an edge position of the heat conductive material.

5. The power conversion device with heat dissipation structure as recited in claim 4, wherein the heat dissipation structure is a metal-clad ceramic.

6. The power conversion device with a heat dissipation structure as recited in claim 1, wherein the heat dissipation plate is a ceramic plate.

7. The power conversion device with heat dissipation structure as recited in claim 1, wherein each of the at least one heat dissipation structure covers an area covered by an electronic device.

8. The power conversion device with heat dissipating structure of claim 1, further comprising a housing and a heat dissipating material, wherein the at least one heat dissipating structure is in contact with the housing through the heat dissipating material.

9. The power conversion device with heat dissipation structure of claim 1, further comprising a housing, the at least one heat dissipation structure being in direct contact with the housing.

10. The power conversion device with heat dissipation structure according to claim 8 or 9, wherein the PCB board includes a plurality of mounting holes, the housing includes a plurality of mounting holes, and a plurality of mounting pieces pass through the mounting holes on the PCB board and the mounting holes on the housing to fix the PCB board with the housing such that the at least one heat dissipation structure is in contact with the housing.