CN220422316U - Heat abstractor and consumer - Google Patents

Abstract

The utility model discloses a heat dissipation device and electric equipment, the heat dissipation device comprises: a heat dissipating body; the wave absorbing body is used for absorbing electromagnetic wave radiation and fixedly arranged on the radiating body, and the heat conducting body is used for conducting heat and fixedly arranged on the radiating body. Therefore, the radiating main body is arranged, the wave-absorbing main body and the heat-conducting main body are in contact with the radiating main body, the radiating device can simultaneously meet the requirements of electromagnetic wave radiation absorption and radiation, the problems of electromagnetic compatibility and radiation are effectively solved, and the service life of a high-power-consumption device is prolonged.

Description

Heat abstractor and consumer

Technical Field

The utility model relates to the field of electric equipment, in particular to a heat dissipation device and electric equipment with the heat dissipation device.

Background

In the related art, a heat-conducting structure is generally used for solving the heat dissipation problem of the high-power-consumption device, however, the heat-conducting effect of the existing heat-conducting structure on the high-power-consumption device is not ideal, the high-heat-area rapid cooling requirement of the high-power-consumption device cannot be met, the heat dissipation problem of the high-power-consumption device cannot be solved, and the service life of the high-power-consumption device is reduced.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a heat dissipating device, which can simultaneously meet the requirements of electromagnetic radiation absorption and heat dissipation, effectively solve the problems of electromagnetic compatibility and heat dissipation, and prolong the service life of high-power devices.

The utility model also provides electric equipment with the heat dissipation device.

According to an embodiment of the present utility model, a heat dissipating device includes: a heat dissipating body; the wave absorbing body is used for absorbing electromagnetic wave radiation and fixedly arranged on the radiating body, and the heat conducting body is used for conducting heat and fixedly arranged on the radiating body.

Therefore, the radiating main body is arranged, the wave-absorbing main body and the heat-conducting main body are contacted with the radiating main body, so that the radiating device can simultaneously meet the requirements of electromagnetic wave radiation absorption and radiation, the problems of electromagnetic compatibility and radiation are effectively solved, and the service life of a high-power-consumption device is prolonged.

In some embodiments of the utility model, the wave absorbing body and the heat conducting body are provided on the same outer surface of the heat dissipating body.

In some embodiments of the utility model, the thermally conductive body is at least one, and the wave-absorbing body is disposed around at least one thermally conductive body.

In some embodiments of the present utility model, the wave-absorbing body is formed with a mounting hole, and the heat-conductive body is fitted in the mounting hole.

In some embodiments of the present utility model, the end surface of the heat conductive body remote from the heat dissipating body protrudes from the wave absorbing body in the thickness direction of the heat conductive body.

In some embodiments of the present utility model, the outer surface of the heat dissipating body is formed with a first mounting groove recessed toward the inside of the heat dissipating body, and at least a portion of the wave absorbing body is mounted in the first mounting groove.

In some embodiments of the utility model, the outer surface of the heat dissipating body is formed with a second mounting groove recessed into the heat dissipating body, and a portion of the heat conducting body is mounted in the second mounting groove.

In some embodiments of the utility model, the first mounting groove and the second mounting groove communicate to form a groove body structure, and the wave absorbing body and the heat conducting body are both mounted within the groove body structure.

In some embodiments of the utility model, the thermally conductive body has a thickness D1, satisfying the relationship 0.5 mm.ltoreq.D1.ltoreq.5 mm.

In some embodiments of the present utility model, the thickness of the wave-absorbing body is D2, satisfying the relationship 0.1 mm.ltoreq.D2.ltoreq.1 mm.

In some embodiments of the utility model, the wave absorbing body is a flexible member.

The electric equipment comprises the heat dissipation device.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and additional aspects and advantages of the utility model will be apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

fig. 1 is an assembly schematic diagram of a heat dissipating device and a motherboard according to a first embodiment of the present utility model;

fig. 2 is a sectional view of a heat dissipating device according to a first embodiment of the present utility model;

FIG. 3 is a top view of a heat sink according to a first embodiment of the present utility model;

fig. 4 is a sectional view of a heat dissipating device according to a second embodiment of the present utility model.

Fig. 5 is a top view of a heat dissipating device according to a second embodiment of the present utility model.

Reference numerals:

a heat sink 100;

a heat dissipation body 1; a first mounting groove 111; a second mounting groove 112;

a wave-absorbing body 2; a mounting hole 21;

a heat conductive body 3;

a main board 4; and a circuit device 5.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

The heat dissipation device 100 according to the embodiment of the present utility model is described below with reference to fig. 1 to 5, where the heat dissipation device 100 may dissipate heat and absorb electromagnetic radiation from the circuit device 5 of the motherboard 4 of the electrical device. In the application, the electric equipment is taken as a notebook computer for illustration, a plurality of circuit devices 5 are arranged on a main board 4 of the notebook computer, the circuit devices 5 can be high-power-consumption devices, and the circuit devices 5 are provided with high-radiation devices (such as power capacitors and the like) and high-temperature devices (such as switch power supplies, power inductors and the like).

The heat dissipating device 100 according to an embodiment of the present utility model includes: a heat dissipation body 1; the wave-absorbing body 2 and the heat conduction body 3, the wave-absorbing body 2 is used for absorbing electromagnetic wave radiation and fixedly arranged on the heat dissipation body 1, and the heat conduction body 3 is used for conducting heat and fixedly arranged on the heat dissipation body 1.

Specifically, as shown in fig. 1, the wave-absorbing body 2 and the heat-conducting body 3 are fixedly arranged on the heat-dissipating body 1, for example, the wave-absorbing body 2 may be fixedly arranged on the outer surface of the heat-dissipating body 1, and the wave-absorbing body 2 and the heat-dissipating body 1 may be connected by means of bolts, adhesion, bayonet, embedding, etc., and this application describes an example in which the wave-absorbing body 2 is embedded on the outer surface of the heat-dissipating body 1. The heat conduction main body 3 can be fixedly arranged on the outer surface of the heat dissipation main body 1, and the heat conduction main body 3 and the heat dissipation main body 1 can be connected in a bolt, bonding, bayonet, embedding and other modes, and the heat conduction main body 3 is embedded on the outer surface of the heat dissipation main body 1 for illustration. Further, the wave-absorbing body 2 may protrude from the outer surface of the heat dissipating body 1, and the heat conducting body 3 may also protrude from the outer surface of the heat dissipating body 1, so that the heat conducting body 3 is in contact with a corresponding high-temperature device.

When the heat sink 100 is used, the heat sink 100 and the main board 4 are assembled in cooperation, the heat conductive body 3 is in contact with the corresponding high temperature device, the wave absorbing body 2 is disposed corresponding to the corresponding high radiation device, the wave absorbing body 2 may be in contact with the high radiation device, or the wave absorbing body 2 may be spaced apart from the high radiation device. The heat conduction main body 3 can transfer the heat of the circuit device 5 to the heat dissipation main body 1, so that the heat of the circuit device 5 is dissipated, and the heat dissipation main body 1 has very strong heat conduction and heat dissipation effects, so that the heat can be rapidly dissipated, the circuit device 5 is rapidly cooled, and the heat dissipation problem of the circuit device 5 is solved. The wave-absorbing body 2 can absorb electromagnetic wave radiation and reduce stray interference, so as to solve the problem of electromagnetic compatibility, wherein "electromagnetic compatibility" refers to the ability of a device or a system to operate in its electromagnetic environment as required without intolerable electromagnetic disturbance to any device in its environment. Therefore, by using the heat dissipation device 100 of the application to absorb electromagnetic wave radiation and dissipate heat, the electromagnetic wave radiation problem of the main board 4 can be solved, the heat dissipation problem of the main board 4 can be solved, the main board 4 can be guaranteed to effectively dissipate heat when working at high power, and meanwhile, interference to peripheral devices and equipment can not be caused, so that the notebook computer can be guaranteed to continuously and stably work, and problems can not occur due to heat dissipation or electromagnetic interference.

In some embodiments of the present utility model, the heat-conducting body 3 may be made of a heat-conducting silica gel, so that the heat-conducting body 3 may have high heat-conducting property, and the heat-conducting property of the heat-conducting body 3 may be improved, so that the surface of the heat-conducting body 3 has natural micro-viscosity and flexibility, and the heat-conducting body 3 may better fill the air gap. However, the present utility model is not limited thereto, and the heat conductive body 3 may be made of other heat conductive materials as long as the heat conductive body 3 has a heat conductive effect, for example: the heat conductive body 3 may also be made of heat conductive plastic, heat conductive silicone grease, or the like.

In some embodiments of the present utility model, the material for manufacturing the wave-absorbing body 2 is a mixed material having electromagnetic wave absorption properties, mainly comprising metal powder and other compounds such as iron, silicon, aluminum, polyurethane, etc., and the wave-absorbing body 2 is manufactured by mixing and molding.

Therefore, by arranging the heat dissipation main body 1 and fixedly arranging the wave-absorbing main body 2 and the heat conduction main body 3 on the heat dissipation main body 1, the heat dissipation device 100 can simultaneously meet the requirements of electromagnetic wave radiation absorption and heat dissipation, the problems of electromagnetic compatibility and heat dissipation are effectively solved, and the service life of the circuit device 5 is prolonged.

In some embodiments of the present utility model, as shown in fig. 1, the wave-absorbing body 2 and the heat-conducting body 3 may be provided on the same outer surface of the heat-dissipating body 1. When the heat dissipating device 100 is placed at the position shown in fig. 1, the wave-absorbing body 2 and the heat-conducting body 3 are both disposed on the lower surface of the heat dissipating body 1 and connected to the motherboard 4. Through locating the same surface of heat dissipation main part 1 with absorbing wave main part 2 and heat conduction main part 3, after heat abstractor 100 and the mainboard 4 assembly, be convenient for make absorbing wave main part 2 and heat conduction main part 3 correspond the setting with the high-temperature device and the high-temperature device on the mainboard 4 respectively, can make absorbing wave main part 2 effectively absorb electromagnetic wave radiation, also be convenient for heat conduction main part 3 will heat transfer to heat dissipation main part 1.

In some embodiments of the present utility model, as shown in fig. 1, the heat conductive body 3 may be at least one, and the wave absorbing body 2 is disposed around at least one heat conductive body 3. Through the arrangement of the wave-absorbing body 2 at least around one heat-conducting body 3, the whole structure of the heat-conducting body 3 and the wave-absorbing body 2 can be more compact, and the heat dissipation device 100 is beneficial to reducing the volume.

In some embodiments of the present utility model, as shown in fig. 1, the wave-absorbing body 2 may be formed with a mounting hole 21, and the heat-conductive body 3 is fitted into the mounting hole 21, for example: the heat conduction main body 3 is embedded in the mounting hole 21 so that the heat conduction main body 3 is fixed on the wave-absorbing main body 2, so that the whole assembly space of the heat conduction main body 3 and the wave-absorbing main body 2 can be saved, and the effect that the wave-absorbing main body 2 surrounds the heat conduction main body 3 is realized.

In some embodiments of the present utility model, as shown in fig. 1, an end surface of the heat conductive body 3 away from the heat dissipating body 1 may protrude from the wave absorbing body 2 in a thickness direction of the heat absorbing body 3. When the heat dissipating device 100 is assembled with the main board 4, because the circuit devices 5 on the main board 4 are different in size and shape, the surface of the circuit devices 5 is uneven, and the heat conducting main body 3 is far away from the end face of the heat dissipating main body 1 along the thickness direction of the heat conducting main body 3 to protrude out of the wave absorbing main body 2, so that the heat conducting main body 3 is more attached to the corresponding circuit devices 5, the heat conducting main body 3 is more convenient to conduct heat, and the heat dissipation of the circuit devices 5 is facilitated.

In some embodiments of the present utility model, as shown in fig. 2 and 4, the outer surface of the heat dissipating body 1 may be formed with a first mounting groove 111 recessed toward the inside of the heat dissipating body 1, and at least a portion of the wave absorbing body 2 is mounted in the first mounting groove 111. In the present application, the case where the part of the structure of the wave-absorbing body 2 is mounted in the first mounting groove 111 is taken as an example, and when the heat dissipating device 100 is placed in the direction shown in fig. 2, the mounting groove 111 recessed inward is provided on the upper surface of the heat dissipating body 1, and the lower part of the wave-absorbing body 2 is mounted in the first mounting groove 111. The dimensions and positions of the first mounting groove 111 and the absorbing body 2 may be flexibly set according to the circuit device 5, so long as the high-radiation device position of the absorbing body 2 corresponding to the circuit device 5 is satisfied. Through set up sunken first mounting groove 111 at heat dissipation main part 1 surface, the at least part of wave-absorbing body 2 is installed in first mounting groove 111, can make wave-absorbing body 2 part imbed heat dissipation main part 1, and the wave-absorbing body 2 of being convenient for assembles in heat dissipation main part 1, can make wave-absorbing body 2 set firmly in heat dissipation main part 1, also can reduce heat abstractor 100 volume to save heat abstractor 100 whole assembly space.

In some embodiments of the present utility model, as shown in fig. 2, the outer surface of the heat dissipating body 1 may be formed with a second mounting groove 112 recessed toward the inside of the heat dissipating body 1, and a portion of the heat conducting body 3 is mounted in the second mounting groove 112. In the present application, the heat dissipation device 100 is placed at the position shown in fig. 2, where the heat dissipation device 1 is provided with an inwardly recessed mounting groove 112 on the upper surface, and the lower portion of the heat dissipation body 3 is mounted in the second mounting groove 112, by taking the case that the heat dissipation device 3 is mounted in the second mounting groove 112 as an example. The dimensions and positions of the second mounting groove 112 and the heat conducting body 3 may be flexibly set according to the positions of the circuit devices 5, so long as the positions of the heat conducting body 3 corresponding to the high-temperature devices of the circuit devices 5 are satisfied. Through set up sunken second mounting groove 112 at heat dissipation main part 1 surface, the part of heat conduction main part 3 is installed in second mounting groove 112, can make heat conduction main part 3 part imbed heat dissipation main part 1, and the heat conduction main part 3 of being convenient for assembles in heat dissipation main part 1, can make heat conduction main part 3 set firmly in heat dissipation main part 1, also can further reduce heat abstractor 100 volume to further save heat abstractor 100 whole assembly space.

In some embodiments of the present utility model, as shown in fig. 2, the first mounting groove 111 and the second mounting groove 112 may communicate to form a groove structure in which the wave-absorbing body 2 and the heat-conducting body 3 are both mounted. Through with first mounting groove 111 and second mounting groove 112 intercommunication in order to form the cell body structure, wave-absorbing body 2 and heat conduction body 3 are all installed in the cell body structure, and the heat dissipation body 1 fluting of being convenient for can reduce manufacturing cost, and wave-absorbing body 2 and heat conduction body 3 of also being convenient for assemble in heat dissipation body 1.

In some embodiments of the present utility model, the thickness of the heat conductive body 3 is D1, satisfying the relationship 0.5 mm.ltoreq.D1.ltoreq.5 mm, for example: the thickness of the heat conductive body 3 is 0.5mm, 0.7mm, 3mm, 5mm, etc. Through setting the thickness of heat conduction main part 3 to D1, and satisfy relational expression 0.5mm and be less than or equal to D1 and be less than or equal to 5mm, can guarantee the heat conduction effect of heat conduction main part 3, when circuit device 5 needs the heat dissipation, heat conduction main part 3 can be with the heat quick conduction on the circuit device 5 to heat dissipation main part 1, reduces circuit device 5 temperature, reduces the risk that causes circuit device 5 to damage because the high temperature, extension circuit device 5 life.

In some embodiments of the present utility model, the thickness of the wave-absorbing body 2 is D2, satisfying the relation 0.1 mm.ltoreq.D2.ltoreq.1 mm, for example: the thickness of the absorber body 2 is 0.1mm, 0.7mm, 1mm, etc. Through setting the thickness of the wave-absorbing main body 2 to be D2, and satisfy the relation 0.1mm and be less than or equal to D2 and be less than or equal to 1mm, the effect of absorbing electromagnetic waves by the wave-absorbing main body 2 can be ensured, the wave-absorbing main body 2 can absorb electromagnetic radiation generated by the circuit device 5, the electromagnetic compatibility problem can be solved, and the service life of the circuit device 5 is prolonged.

In some embodiments of the utility model, the wave-absorbing body 2 may be a flexible member. Due to strong plasticity of the flexible memberDifferent sizes and shapes can be made according to actual demands, the wave-absorbing main body 2 is arranged to be a flexible piece, the wave-absorbing main body 2, the heat-conducting main body 3 and the heat-dissipating main body 1 are more convenient to assemble, and the wave-absorbing main body 2 is not fragile and difficult to generate dust and fragments. Further, the permeability of the wave-absorbing body 2 may be 120+/-10, the higher the permeability, the stronger the electromagnetic wave-absorbing capacity, the wave-absorbing frequency range of the wave-absorbing body 2 may be 10MHz-6GHz, and the surface resistance of the wave-absorbing body 2 is greater than 10 ⁶ Omega, the working temperature of the wave-absorbing main body 2 is-40-120 ℃.

In some embodiments of the present utility model, the thermal conductivity of the thermal conductive body 3 may be 1-10W/(m×k), and the higher the thermal conductivity of the thermal conductive body 3, the better the thermal conductive effect, and the temperature resistance of the thermal conductive body 3 may be in the range of-40 ℃ to 150 ℃.

In some embodiments of the present utility model, the heat dissipating body 1 may be made of a metal material, for example: the heat dissipation body 1 may be made of copper material, so that the heat dissipation body 1 may have oxidation resistance, and heat dissipation performance of the heat dissipation body 1 may be improved.

It should be noted that fig. 2 is a sectional view of a heat dissipating device 100 according to a first embodiment of the present utility model, and fig. 4 is a sectional view of the heat dissipating device 100 according to a second embodiment of the present utility model. The main difference between the heat dissipating device 100 of the first embodiment and the heat dissipating device 100 of the second embodiment is that: the heat dissipating body 1 of the heat dissipating device 100 of the first embodiment is provided with a first mounting groove 111 and a second mounting groove 112, and the first mounting groove 111 and the second mounting groove 112 form a groove body structure. The heat dissipating body 1 of the heat dissipating device 100 of the second embodiment is provided with only the first mounting groove 111.

The electric device according to the embodiment of the present utility model includes the heat dissipating device 100, and it should be noted that the explanation of the embodiment and the beneficial effects of the heat dissipating device 100 described above is also applicable to the electric device according to the embodiment of the present utility model, and is not developed in detail herein to avoid redundancy.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. The meaning of "plurality" is two or more.

Other structures such as a motherboard and the like and operation of the heat sink 100 and the electrical device according to the embodiments of the present utility model are known to those skilled in the art, and will not be described in detail herein.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A heat sink, comprising:

a heat dissipating body;

the wave absorbing body is used for absorbing electromagnetic wave radiation and fixedly arranged on the radiating body, and the heat conducting body is used for conducting heat and fixedly arranged on the radiating body.

2. The heat dissipating device of claim 1, wherein said wave absorbing body and said heat conducting body are disposed on a same outer surface of said heat dissipating body.

3. The heat sink of claim 2, wherein the heat conductive body is at least one, and the wave absorbing body is disposed around at least one of the heat conductive bodies.

4. The heat dissipating device of claim 2, wherein the wave absorbing body is formed with a mounting hole, and the heat conducting body is fitted into the mounting hole.

5. The heat dissipating device of claim 2, wherein an end surface of said heat conducting body remote from said heat dissipating body protrudes from said wave absorbing body in a thickness direction of said heat conducting body.

6. The heat dissipating device of any of claims 1-5, wherein an outer surface of the heat dissipating body is formed with a first mounting groove recessed into the heat dissipating body, at least a portion of the wave absorbing body being mounted in the first mounting groove.

7. The heat dissipating device of claim 6, wherein an outer surface of said heat dissipating body is formed with a second mounting groove recessed into said heat dissipating body, and wherein a portion of said thermally conductive body is mounted into said second mounting groove.

8. The heat sink of claim 7 wherein the first mounting groove and the second mounting groove communicate to form a groove structure, the wave absorbing body and the thermally conductive body both being mounted within the groove structure.

9. The heat sink according to any one of claims 1 to 5, wherein the heat conductive body has a thickness D1 satisfying the relation 0.5 mm-D1-5 mm.

10. The heat sink according to any one of claims 1 to 5, wherein the thickness of the wave-absorbing body is D2, satisfying the relation 0.1 mm-D2-1 mm.

11. The heat sink of any one of claims 1-5, wherein the wave-absorbing body is a flexible member.

12. A powered device comprising a heat dissipation device according to any one of claims 1-11.