CN220523396U - High-temperature electromagnetic valve driving module suitable for oil well - Google Patents
High-temperature electromagnetic valve driving module suitable for oil well Download PDFInfo
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- CN220523396U CN220523396U CN202322005507.3U CN202322005507U CN220523396U CN 220523396 U CN220523396 U CN 220523396U CN 202322005507 U CN202322005507 U CN 202322005507U CN 220523396 U CN220523396 U CN 220523396U
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- 239000003129 oil well Substances 0.000 title claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000006243 chemical reaction Methods 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910000799 K alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a high temperature solenoid valve drive module suitable for oil well relates to oil well technical field. The application solves the technical problem that the prior high-temperature electromagnetic valve driver module can not well discharge heat generated in the high-temperature electromagnetic valve driver module, and influences the service life. The high-temperature electromagnetic valve driving module suitable for the oil well comprises a fixing frame, a driving module body and a heat dissipation mechanism arranged on the driving module body; the fixing frame is connected with the pipeline and provided with at least one mounting hole; the heat dissipation mechanism is arranged in the mounting hole; the driving module body is arranged in the fixing frame and corresponds to the cold face of the heat dissipation mechanism. The heat generated by the driving module body can be effectively discharged in time through the corresponding heat dissipation mechanism, so that the thermal resistance of the driving module body can be reduced, and the heat conduction performance of the driving module body can be improved. Therefore, the high-temperature electromagnetic valve driving module applicable to the oil well has the advantages of simple structure and good heat dissipation effect, and prolongs the service life of the driving module body.
Description
Technical Field
The application relates to the technical field of oil wells, in particular to a high-temperature electromagnetic valve driving module suitable for an oil well.
Background
In underground wells, there are many occasions when high temperature solenoid valve drive modules are required. The inside of the high-temperature electromagnetic valve driving module is integrated with a large number of electronic devices, so that more heat can be generated in the operation process, and the temperature of an underground oil well is higher, so that the heat generated by the high-temperature electromagnetic valve driving module is not easy to discharge. If the heat inside the solenoid valve driver module cannot be timely discharged, electronic devices are easily damaged, and the service life of the solenoid valve driver module is affected.
Disclosure of Invention
According to the high-temperature electromagnetic valve driving module applicable to the oil well, the technical problem that the service life of the existing high-temperature electromagnetic valve driving module is affected because the heat generated in the high-temperature electromagnetic valve driving module cannot be well discharged is solved.
The embodiment of the application provides a high-temperature electromagnetic valve driving module suitable for an oil well, which comprises a fixing frame, a driving module body and a heat dissipation mechanism arranged on the driving module body; the fixing frame is connected with the pipeline and provided with at least one mounting hole; the heat dissipation mechanism is arranged in the mounting hole; the driving module body is arranged in the fixing frame and corresponds to the cold face of the heat dissipation mechanism.
In one possible implementation, the heat dissipation mechanism includes a base plate, a cooling fin, and a heat sink; the base plate is arranged in the mounting hole, and a mounting groove is formed in the direction of the base plate, facing the driving module body; the refrigerating sheet is arranged in the mounting groove, and the cold face of the refrigerating sheet faces the driving module body; the radiating fin is located at one side of the base plate, which is away from the refrigerating fin.
In one possible implementation, the heat sink includes a plurality of heat sink fins perpendicular to the surface of the substrate.
In one possible implementation, the drive module body includes a first housing, a second housing, and a circuit board; the first shell and the second shell are covered to form an accommodating space; the circuit board is arranged in the accommodating space.
In one possible implementation, the drive module body further includes a thermally conductive layer; the heat conducting layer is arranged between the first shell and the circuit board, and/or between the second shell and the circuit board.
In one possible implementation, the first housing and the second housing are both alloy materials, and the circuit board is a high temperature sheet material.
In one possible implementation manner, the high-temperature electromagnetic valve driving module suitable for the oil well further comprises a buck-boost conversion circuit, a temperature detection circuit and a main control chip; the control end of the main control chip is connected with the control end of the buck-boost conversion circuit, the detection end of the main control chip is connected with the temperature detection circuit and the refrigerating sheet, the temperature detection circuit is configured to detect temperature information at the refrigerating sheet and send the temperature information to the main control chip, and the main control chip generates a power supply control signal and sends the power supply control signal to the buck-boost conversion circuit; the input end of the buck-boost conversion circuit is connected with an external power supply, the output end of the buck-boost conversion circuit is connected with the refrigerating sheet, and the buck-boost conversion circuit is configured to control the voltage output to the refrigerating sheet according to a power supply control signal.
In one possible implementation, the mount includes a first mounting plate, a second mounting plate, and a third mounting plate; the first mounting plate, the second mounting plate and the third mounting plate are enclosed to form a U-shaped structure; the second mounting plate is connected to the pipeline; the first mounting plate and/or the third mounting plate are/is respectively provided with the mounting holes.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
the embodiment of the application provides a high temperature solenoid valve drive module suitable for oil well includes mount, drive module body and sets up the cooling mechanism on the drive module body. The heat generated by the driving module body can be effectively discharged in time through the corresponding heat dissipation mechanism, so that the thermal resistance of the driving module body can be reduced, and the heat conduction performance of the driving module body can be improved. Therefore, the high-temperature electromagnetic valve driving module applicable to the oil well has the advantages of simple structure and good heat dissipation effect, and prolongs the service life of the driving module body.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a high-temperature electromagnetic valve driving module applicable to an oil well according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a heat dissipation mechanism according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a driving module body according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a power supply system for a refrigeration sheet according to an embodiment of the present application.
Reference numerals: 10-fixing frame; 11-mounting holes; 12-a first mounting plate; 13-a second mounting plate; 14-a third mounting plate; 20-a heat dissipation mechanism; 21-a substrate; 211-mounting slots; 22-refrigerating sheets; 23-cooling fins; 231-heat radiating fins; 30-a drive module body; 31-a first housing; 32-a second housing; 33-a circuit board; 34-a thermally conductive layer; 40-buck-boost conversion circuit; 50-a temperature detection circuit; 60-a main control chip.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present application. The terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The embodiment of the application provides a high-temperature electromagnetic valve driving module suitable for an oil well, as shown in fig. 1 to 4. The high-temperature electromagnetic valve driving module suitable for the oil well comprises a fixing frame 10, a driving module body 30 and a heat dissipation mechanism 20 arranged on the driving module body 30. The fixing frame 10 is connected to the pipeline and is provided with at least one mounting hole 11. The heat dissipation mechanism 20 is mounted to the mounting hole 11. The driving module body 30 is disposed in the fixing frame 10 and corresponds to the cold surface of the heat dissipation mechanism 20.
As shown in fig. 1, two mounting holes 11 are provided in the embodiment of the present application, two heat dissipation mechanisms 20 are correspondingly provided, the driving module body 30 is installed along the direction perpendicular to the ground plane, and the cold surfaces of the two heat dissipation mechanisms 20 respectively correspond to two sides of the driving module body 30, so that the heat dissipation efficiency of the high-temperature electromagnetic valve driving module applicable to the oil well can be further improved.
It should be noted that, the heat generated by the driving module body 30 can be effectively discharged in time through the corresponding heat dissipation mechanism 20, so that the thermal resistance of the driving module body 30 can be reduced, and the heat conduction performance of the driving module body can be increased. Therefore, the high-temperature electromagnetic valve driving module suitable for the oil well is simple in structure and good in heat dissipation effect, and the service life of the driving module body 30 is prolonged.
As shown in fig. 2, the heat dissipation mechanism 20 includes a base plate 21, a cooling fin 22, and a heat dissipation fin 23. The substrate 21 is mounted in the mounting hole 11, and the mounting groove 211 is formed in the substrate 21 toward the driving module body 30. The cooling plate 22 is disposed in the mounting groove 211, and the cold surface of the cooling plate 22 faces the driving module body 30. The heat sink 23 is located on the side of the base plate 21 facing away from the cooling fins 22. Specifically, the cross-sectional area of the cooling fin 23 is larger than that of the cooling fin 22, so that heat of the hot surface of the cooling fin 22 can be rapidly discharged, and the cooling effect of the cold surface of the cooling fin 22 is improved.
With continued reference to fig. 2, the heat sink 23 includes a plurality of heat sink fins 231 perpendicular to the surface of the base plate 21, and the heat sink fins 231 can increase heat dissipation efficiency. Specifically, the plurality of heat dissipation fins 231 are arranged in parallel at equal intervals.
As shown in fig. 3, the driving module body 30 includes a first housing 31, a second housing 32, and a circuit board 33. The first housing 31 and the second housing 32 are covered to form an accommodating space. The circuit board 33 is disposed in the accommodation space.
Specifically, both sides of the first housing 31 are provided with open grooves, and the second housing 32 is provided with a plurality of connection holes through which the first housing 31 and the second housing 32 are connected.
In one implementation of the present embodiment, the drive module body 30 further includes a thermally conductive layer 34. The heat conductive layer 34 is disposed between the first housing 31 and the circuit board 33, and/or between the second housing 32 and the circuit board 33. The heat-conducting layer 34 is adapted to the accommodation space between the first housing 31 and the circuit board 33, and/or between the second housing 32 and the circuit board 33.
Further, the heat conductive layer 34 is disposed between the first housing 31 and the circuit board 33 or the heat conductive layer 34 is disposed between the second housing 32 and the circuit board 33 and between the first housing 31 and the circuit board 33. Specifically, the heat conducting layer 34 tightly connects the circuit board 33 and the first housing 31, or the heat conducting layer 34 tightly connects the circuit board 33 and the second housing 32, or the heat conducting layer 34 tightly connects the circuit board 33, the first housing 31 and the second housing 32, so that the heat generated by the circuit board 33 is quickly transferred to the first housing 31 and/or the second housing 32, and the heat dissipation mechanism 20 timely discharges the heat of the first housing 31 and/or the second housing 32, thereby reducing the thermal resistance of the driving module body 30 and increasing the heat conduction performance thereof. In addition, the heat conductive layer 34 may also increase the shock resistance of the driving module body 30.
Specifically, the thermally conductive layer 34 is a low thermal resistance silicone gel having a thermal conductivity of 2.6W/m.K. According to the embodiment of the application, the heat radiating area is increased through the low-thermal-resistance silica gel, so that the heat conducting efficiency of the driving module body 30 can be enhanced, the heat radiating performance of the driving module body is improved, and the heat accumulation caused by the operation of local high-power devices is avoided.
Further, the first shell 31 and the second shell 32 are both made of alloy materials, and the first shell 31 and the second shell 32 are made of 205W/m.K alloy materials, and the tensile strength of the alloy materials is 260MPa, so that the overall structural strength is ensured. The circuit board 33 is made of high-temperature plates, components with large heating value are reasonably distributed, and high-temperature areas are reasonably dispersed.
As shown in fig. 4, the high temperature solenoid valve driving module for oil well further includes a buck-boost conversion circuit 40, a temperature detection circuit 50 and a main control chip 60. The control end of the main control chip 60 is connected with the control end of the buck-boost conversion circuit 40, the detection end of the main control chip 60 is connected with the temperature detection circuit 50 and the refrigerating sheet 22, the temperature detection circuit 50 is configured to detect temperature information at the refrigerating sheet 22 and send the temperature information to the main control chip 60, and the main control chip 60 generates a power supply control signal and sends the power supply control signal to the buck-boost conversion circuit 40. The input end of the buck-boost conversion circuit 40 is connected with an external power supply, the output end of the buck-boost conversion circuit 40 is connected with the refrigerating sheet 22, and the buck-boost conversion circuit 40 is configured to control the voltage output to the refrigerating sheet 22 according to the power supply control signal. The main control chip 60 may generate a current control relation including a corresponding supply current according to temperature information, and input the temperature information into the current control relation to determine the magnitude of the supply current input into the cooling fin 22 by the buck-boost converter circuit 40. Specifically, the above-mentioned power supply control signal may include a power supply current value determined according to temperature information, when the temperature value included in the temperature information is read by the main control chip 60, the determined power supply current value may be smaller than the current power supply current, so as to reduce the power supply voltage of the buck-boost conversion circuit 40 to the refrigerating sheet 22 according to the corresponding power supply control signal, and when the temperature value included in the temperature information is read too low, the determined power supply current value may be larger than the current power supply current, so as to increase the power supply voltage of the buck-boost conversion circuit 40 to the refrigerating sheet 22 according to the corresponding power supply control signal. In a severe environment of an underground oil well, the input power or input current to the cooling fin 22 may be unstable, resulting in poor cooling effect thereof. The embodiment of the application makes the refrigerating effect of the refrigerating sheet 22 better through the structure.
As shown in fig. 1, the mount 10 includes a first mounting plate 12, a second mounting plate 13, and a third mounting plate 14. The first mounting plate 12, the second mounting plate 13 and the third mounting plate 14 enclose to form a U-shaped structure. The second mounting plate 13 is connected to the pipe. The first mounting plate 12 and/or the third mounting plate 14 are each provided with a mounting hole 11. Specifically, the mounting holes 11 may be provided to the first mounting plate 12 or the second mounting plate 13 or the first and second mounting plates 12 and 13.
In this specification, each embodiment is described in a progressive manner, and the same or similar parts of each embodiment are referred to each other, and each embodiment is mainly described as a difference from other embodiments.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the present application; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions.
Claims (8)
1. The high-temperature electromagnetic valve driving module suitable for the oil well is characterized by comprising a fixing frame (10), a driving module body (30) and a heat dissipation mechanism (20) arranged on the driving module body (30);
the fixing frame (10) is connected with the pipeline and provided with at least one mounting hole (11);
the heat dissipation mechanism (20) is arranged in the mounting hole (11);
the driving module body (30) is arranged in the fixing frame (10) and corresponds to the cold face of the heat dissipation mechanism (20).
2. The high-temperature solenoid valve driving module for oil well according to claim 1, wherein the heat radiation mechanism (20) comprises a base plate (21), a cooling fin (22) and a heat radiation fin (23);
the base plate (21) is mounted on the mounting hole (11), and a mounting groove (211) is formed in the direction of the base plate (21) towards the driving module body (30);
the refrigerating sheet (22) is arranged in the mounting groove (211), and the cold surface of the refrigerating sheet (22) faces the driving module body (30);
the heat sink (23) is located on the side of the base plate (21) facing away from the cooling plate (22).
3. A high temperature solenoid valve drive module for oil wells according to claim 2 wherein said heat sink (23) comprises a plurality of heat sink fins (231) perpendicular to the surface of said base plate (21).
4. The high temperature solenoid valve drive module for an oil well according to claim 1, wherein the drive module body (30) comprises a first housing (31), a second housing (32) and a circuit board (33);
the first shell (31) and the second shell (32) are covered to form an accommodating space;
the circuit board (33) is disposed in the accommodation space.
5. The high temperature solenoid valve drive module for an oil well according to claim 4, wherein said drive module body (30) further comprises a thermally conductive layer (34);
the heat-conducting layer (34) is arranged between the first housing (31) and the circuit board (33), and/or between the second housing (32) and the circuit board (33).
6. The high-temperature solenoid valve driving module for oil well according to claim 5, wherein the first housing (31) and the second housing (32) are both made of alloy materials, and the circuit board (33) is a high-temperature plate material.
7. The high-temperature solenoid valve driving module for oil well according to claim 2, further comprising a buck-boost conversion circuit (40), a temperature detection circuit (50) and a main control chip (60);
the control end of the main control chip (60) is connected with the control end of the buck-boost conversion circuit (40), the detection end of the main control chip (60) is connected with the temperature detection circuit (50) and the refrigerating sheet (22), the temperature detection circuit (50) is configured to detect temperature information at the refrigerating sheet (22) and send the temperature information to the main control chip (60), and the main control chip (60) generates a power supply control signal and sends the power supply control signal to the buck-boost conversion circuit (40);
the input end of the buck-boost conversion circuit (40) is connected with an external power supply, the output end of the buck-boost conversion circuit (40) is connected with the refrigerating sheet (22), and the buck-boost conversion circuit (40) is configured to control the voltage output to the refrigerating sheet (22) according to a power supply control signal.
8. The high temperature solenoid valve drive module for oil wells according to claim 1 wherein said mount (10) comprises a first mounting plate (12), a second mounting plate (13) and a third mounting plate (14);
the first mounting plate (12), the second mounting plate (13) and the third mounting plate (14) are enclosed to form a U-shaped structure;
the second mounting plate (13) is connected to the pipeline;
the first mounting plate (12) and/or the third mounting plate (14) are/is provided with the mounting holes (11) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322005507.3U CN220523396U (en) | 2023-07-28 | 2023-07-28 | High-temperature electromagnetic valve driving module suitable for oil well |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322005507.3U CN220523396U (en) | 2023-07-28 | 2023-07-28 | High-temperature electromagnetic valve driving module suitable for oil well |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220523396U true CN220523396U (en) | 2024-02-23 |
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ID=89932243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322005507.3U Active CN220523396U (en) | 2023-07-28 | 2023-07-28 | High-temperature electromagnetic valve driving module suitable for oil well |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220523396U (en) |
-
2023
- 2023-07-28 CN CN202322005507.3U patent/CN220523396U/en active Active
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