CN212463338U - Radiator and camera - Google Patents
Radiator and camera Download PDFInfo
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- CN212463338U CN212463338U CN202021637767.2U CN202021637767U CN212463338U CN 212463338 U CN212463338 U CN 212463338U CN 202021637767 U CN202021637767 U CN 202021637767U CN 212463338 U CN212463338 U CN 212463338U
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Abstract
The application relates to the technical field of heat exchange devices, in particular to a radiator and a camera, which comprise a radiating assembly, a heat transfer substrate and a semiconductor refrigerating sheet; the heat transfer substrate is provided with a first plate surface, the semiconductor refrigeration sheet is installed on the first plate surface, and the heat dissipation assembly is installed on one side, away from the first plate surface, of the heat transfer substrate; a first heat source mounting portion is formed on the semiconductor cooling sheet, and a second heat source mounting portion is formed on the heat transfer substrate. The present application is directed to a heat sink and a camera, which are used to adjust the temperature of a heat sink that is required to dissipate heat from a computer chip and other heat sources.
Description
Technical Field
The application relates to the technical field of heat exchange devices, in particular to a radiator and a camera.
Background
The core computing chip and the sensor of a precision instrument such as a high-end camera, medical equipment and the like have high temperature precision in the using process, and accurate data computation and data acquisition are required, so that the computing chip and the sensor need to work in a proper temperature range with very small temperature value tolerance fluctuation, and a radiator for radiating a computer chip and other heat sources is required to have a temperature adjusting function.
SUMMERY OF THE UTILITY MODEL
The present application is directed to a heat sink and a camera, which are used to adjust the temperature of a heat sink that is required to dissipate heat from a computer chip and other heat sources.
In order to achieve the purpose, the following technical scheme is adopted in the application:
one aspect of the present application provides a heat sink, including a heat dissipation assembly, a heat transfer substrate, and a semiconductor chilling plate; the heat transfer substrate is provided with a first plate surface, the semiconductor refrigeration sheet is installed on the first plate surface, and the heat dissipation assembly is installed on one side, away from the first plate surface, of the heat transfer substrate; a first heat source mounting portion is formed on the semiconductor cooling sheet, and a second heat source mounting portion is formed on the heat transfer substrate.
Optionally, the second heat source mounting part is a second heat source slot, the heat transfer substrate has a second plate surface, the second plate surface deviates from the first plate surface, a boss is formed on the second plate surface, and the second heat source slot is formed in the boss.
The technical scheme has the beneficial effects that: in order to adapt the second heat source slot to the size of the heat source, the heat transfer substrate is required to have a certain thickness, and the bosses are only formed at partial positions of the heat transfer substrate to further form the second heat source slot instead of increasing the thickness of the whole heat transfer substrate, so that the material is saved, the production cost is reduced, and the radiator can keep smaller volume to adapt to the limited case space in a precision instrument.
Optionally, the notch of the second heat source slot is located at the edge of the heat transfer substrate, and the orientation of the notch of the second heat source slot is parallel to the second plate surface.
The technical scheme has the beneficial effects that: the edge heat source member is removed and installed.
Optionally, the heat dissipation assembly includes a first temperature-uniforming plate and a second temperature-uniforming plate, the boss has an end face parallel to the second plate face, the first temperature-uniforming plate is mounted on the second plate face, and the second temperature-uniforming plate is mounted on the end face.
The technical scheme has the beneficial effects that: because the boss is outstanding in the second face, if through same temperature-uniforming plate then temperature-uniforming plate need make into the dysmorphism board, increased the processing degree of difficulty, and adopt two temperature-uniforming plates to install in heat transfer base plate, then can reduce the processing degree of difficulty of temperature-uniforming plate when obtaining better effect, improve production efficiency.
Optionally, the heat dissipation assembly includes a first fin, a first heat conduction member and a second heat conduction member, the first heat conduction member is fixed to the first temperature equalization plate, the second heat conduction member is fixed to the second temperature equalization plate, and the first heat conduction member and the second heat conduction member are both connected to the first fin.
The technical scheme has the beneficial effects that: through setting up first heat-conducting piece and second heat-conducting piece, can be with the heat transfer of first samming board to first heat-conducting piece, the heat transfer of second samming board is to the second heat-conducting piece, through first heat-conducting piece and the heat dissipation of second heat-conducting piece promotion heat dispersion, through first fin connection first heat-conducting piece and second heat-conducting piece, through the radiating while of first fin, can also reach the effect of further samming.
Optionally, the first heat conducting member and the second heat conducting member are heat pipes, a plurality of first mounting holes are formed in the first fin, the first mounting holes are correspondingly sleeved on the heat pipes, and first notches for injecting solder are formed in edges of the first mounting holes.
The technical scheme has the beneficial effects that: the notch makes it possible to pour solder between the heat pipe and the first mounting hole, thereby realizing the connection between the first fin and the heat pipe.
Optionally, the heat dissipation assembly further includes a second fin, the second fin is connected to the first heat conduction member, and the second fin is located between the first fin and the second plate surface.
The technical scheme has the beneficial effects that: the second fins are only connected with the first heat-conducting piece, so that heat of the first heat-conducting piece and the first temperature-equalizing plate can be dissipated, and meanwhile, the space enclosed among the first fins, the boss and the second plate surface is effectively utilized, so that the heat dissipation performance is improved as far as possible in the limited space.
Optionally, the first heat conducting member is a heat pipe, a plurality of second mounting holes are formed in the second fin, the second mounting holes are sleeved on the first heat conducting members in a one-to-one correspondence manner, and second notches for injecting a flux are formed at edges of the second mounting holes.
The technical scheme has the beneficial effects that: the notch enables welding flux to be poured between the first heat-conducting member and the second mounting hole, and therefore connection between the second fin and the first heat-conducting member is achieved.
Optionally, the first heat-conducting member and the second heat-conducting member are provided in plurality, and the first heat-conducting member and the second heat-conducting member extend perpendicularly to the second plate surface.
The technical scheme has the beneficial effects that: therefore, proper intervals can be kept between the first heat conducting pieces and between the second heat conducting pieces, so that proper quantities of the first heat conducting pieces can be arranged on the first temperature equalizing plate, proper quantities of the second heat conducting pieces can be arranged on the second temperature equalizing plate, and further ideal heat dissipation and heat uniformity can be achieved.
Another aspect of the present application provides a camera, including a memory card, a chip and the heat sink provided by the present application, the chip being mounted in the first heat source mounting portion, the memory card being mounted in the second heat source mounting portion.
The technical scheme provided by the application can achieve the following beneficial effects:
the application provides a radiator and camera has utilized and has stopped the semiconductor refrigeration piece that opens through current control, when heat source spare temperature is higher, can make the operation of semiconductor refrigeration piece refrigerate, when the temperature reduces certain limit, can stop the operation of semiconductor refrigeration piece, adjusts heat source spare temperature, controls the temperature of heat source spare in certain extent.
Additional features of the present application and advantages thereof will be set forth in the description which follows, or may be learned by practice of the present application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It should be apparent that the drawings in the following description are embodiments of the present application and that other drawings may be derived from those drawings by a person of ordinary skill in the art without inventive step.
Fig. 1 is a schematic perspective view of an angle of an embodiment of a heat sink according to an embodiment of the present disclosure;
fig. 2 is a schematic perspective view of another angle of an embodiment of a heat sink according to an embodiment of the present disclosure;
fig. 3 is a schematic partial perspective view of an embodiment of a heat sink provided in an embodiment of the present application;
fig. 4 is a schematic partial perspective view of an embodiment of a heat sink provided in an embodiment of the present application;
FIG. 5 is a schematic perspective view of one embodiment of a heat transfer substrate provided in an example of the present application;
FIG. 6 is a schematic perspective view of an embodiment of a first fin provided in an example of the present application;
fig. 7 is a schematic perspective view of an embodiment of a second fin provided in an example of the present application.
Reference numerals:
100-a first fin;
110-a via;
120-a first mounting hole;
121-a first notch;
200-a heat transfer substrate;
210-a boss;
211-a second heat source socket;
300-semiconductor refrigerating sheet;
310-a first heat source mount;
400-a second temperature-uniforming plate;
500-a second thermally conductive member;
600-a second fin;
610-a second mounting hole;
611-a second recess;
700-a first thermally conductive member;
800-first vapor chamber.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
As shown in fig. 1 to 7, one aspect of the present application provides a heat sink including a heat dissipation assembly, a heat transfer substrate 200, and a semiconductor chilling plate 300; the heat transfer substrate 200 is provided with a first plate surface, the semiconductor refrigeration sheet 300 is installed on the first plate surface, and the heat dissipation assembly is installed on one side of the heat transfer substrate 200, which is far away from the first plate surface; a first heat source mounting portion 310 is formed on the semiconductor cooling fin 300, and a second heat source mounting portion is formed on the heat transfer substrate 200.
The radiator that this application provided has adopted and to have opened the semiconductor refrigeration piece 300 that stops through current control, when heat source spare temperature was higher, can make the operation of semiconductor refrigeration piece 300 refrigerate, when the temperature reduced certain limit, can stop the operation of semiconductor refrigeration piece 300, adjusts heat source spare temperature, with the temperature control of heat source spare in certain extent. The temperature of the heat source piece can be manually collected, the on-off current is manually controlled to start and stop the semiconductor refrigerating piece 300, the temperature of the heat source piece can be collected through a sensor, and the start and stop of the semiconductor refrigerating piece 300 are controlled through a controller. The hot end of the semiconductor chilling plate 300 is connected with the heat transfer substrate 200, and the cold end of the semiconductor chilling plate 300 is connected with the heat source. The semiconductor refrigeration chip 300 is similar to a micro air conditioner in use, and can accurately control the temperature of a heating element.
Optionally, the second heat source mounting portion is a second heat source slot 211, the heat transfer substrate 200 has a second plate surface, the second plate surface deviates from the first plate surface, a boss 210 is formed on the second plate surface, and the second heat source slot 211 is formed in the boss 210. The second heat source device slot 211 is used to mount a removable heat source device, which may be, for example, an SD card or an MMC card. In order to adapt the second heat source slot 211 to the size of the heat source, the heat transfer substrate 200 is required to have a certain thickness, and the bosses 210 are formed only at a portion of the heat transfer substrate 200 to further form the second heat source slot 211, instead of increasing the thickness of the entire heat transfer substrate 200, so that the material can be saved, the production cost can be reduced, and the heat sink can be kept small in size to adapt to the limited case space in the precision instrument. Of course, instead of forming the bosses 210, the entire thickness of the heat transfer substrate 200 may be increased, and then the second heat source insertion grooves 211 may be formed in the heat transfer substrate 200.
Optionally, the notch of the second heat source slot 211 is located at the edge of the heat transfer substrate 200, and the notch of the second heat source slot 211 is oriented parallel to the second plate surface. The edge heat source member is removed and installed.
Optionally, the heat dissipation assembly includes a first temperature-uniforming plate 800 and a second temperature-uniforming plate 400, the boss 210 has an end surface parallel to the second plate surface, the first temperature-uniforming plate 800 is mounted on the second plate surface, and the second temperature-uniforming plate 400 is mounted on the end surface. Because the boss 210 protrudes out of the second plate surface, if the same temperature-uniforming plate needs to be made into a special-shaped plate, the processing difficulty is increased, and two temperature-uniforming plates are arranged on the heat transfer base plate 200, so that the processing difficulty of the temperature-uniforming plates can be reduced and the production efficiency can be improved while better effect is achieved. The semiconductor chilling plate 300, the first temperature-uniforming plate 800 and the second temperature-uniforming plate 400 may be fixed on the heat transfer substrate 200 by solder paste.
Optionally, the heat dissipation assembly includes a first fin 100, a first heat conduction member 700, and a second heat conduction member 500, the first heat conduction member 700 is fixed on the first temperature equalizing plate 800, the second heat conduction member 500 is fixed on the second temperature equalizing plate 400, and the first heat conduction member 700 and the second heat conduction member 500 are both connected to the first fin 100. Through setting up first heat-conducting member 700 and second heat-conducting member 500, can be with the heat transfer of first samming board 800 to first heat-conducting member 700, the heat transfer of second samming board 400 is to second heat-conducting member 500, through first heat-conducting member 700 and the heat dissipation of second heat-conducting member 500 promotion heat dispersion, connect first heat-conducting member 700 and second heat-conducting member 500 through first fin 100, through the radiating while of first fin 100, can also reach the effect of further samming.
Optionally, the first heat conducting member 700 and the second heat conducting member 500 are heat pipes, a plurality of first mounting holes 120 are formed in the first fin 100, the first mounting holes 120 are correspondingly sleeved on the heat pipes, and first recesses 121 for injecting solder are formed at edges of the first mounting holes 120. The first recess 121 makes it possible to pour solder between the heat pipe and the first mounting hole 120, thereby achieving the connection between the first fin 100 and the heat pipe. The first fin 100 farthest from the heat transfer substrate 200 is formed with a through hole 110, the through hole 110 may be used to avoid a component in precision equipment, or have other functions, the through hole 110 near the first mounting hole 120 is formed to avoid the first mounting hole 120 so as to avoid punching edge breakage, and the edge of the through hole 110 near the first mounting hole 120 is formed in a concave arc shape.
Optionally, the heat dissipation assembly further includes a second fin 600, the second fin 600 is connected to the first heat conduction member 700, and the second fin 600 is located between the first fin 100 and the second plate surface. The heat of the first heat conducting member 700 and the first temperature equalizing plate 800 can be dissipated by only connecting the second fin 600 with the first heat conducting member 700, and meanwhile, the space enclosed among the first fin 100, the boss 210 and the second plate surface is effectively utilized, so that the heat dissipation performance is improved as much as possible in the limited space.
Optionally, the first heat conducting member 700 is a heat pipe, a plurality of second mounting holes 610 are formed in the second fin 600, the second mounting holes 610 are correspondingly sleeved on the first heat conducting member 700, and second recesses 611 for injecting solder are formed at edges of the second mounting holes 610. The second recess 611 makes it possible to fill solder between the first heat conducting member 700 and the second mounting hole 610, and further to achieve connection between the second fin 600 and the first heat conducting member 700, the solder is preferably tin paste, and the semiconductor chilling plate 300, the first temperature equalizing plate 800, and the second temperature equalizing plate 400 can be fixed on the heat transfer substrate 200 by tin paste and then welded in a furnace.
Alternatively, there are a plurality of the first heat-conducting members 700 and the second heat-conducting members 500, and the first heat-conducting members 700 and the second heat-conducting members 500 extend perpendicularly to the second plate surface. This allows the first heat-conducting members 700 and the second heat-conducting members 500 to be spaced apart from each other at a proper distance, so that the first heat-conducting members 700 can be disposed on the first vapor chamber 800 in a proper amount, and the second heat-conducting members 500 can be disposed on the second vapor chamber 400 in a proper amount, thereby achieving desirable heat dissipation and vapor uniformity.
Another aspect of the present application provides a camera, which includes a memory card, a chip and the heat sink provided in the embodiment of the present application, wherein the chip is installed in the first heat source installation portion 310, and the memory card is installed in the second heat source installation portion.
The camera that this application embodiment provided has adopted the radiator that this application embodiment provided, has utilized and has stopped the semiconductor refrigeration piece 300 that opens through current control, when heat source spare temperature is higher, can make the operation of semiconductor refrigeration piece 300 refrigerate, when the temperature reduces certain limit, can stop the operation of semiconductor refrigeration piece 300, adjusts heat source spare temperature, controls the temperature of heat source spare in certain extent.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. The radiator is characterized by comprising a radiating assembly, a heat transfer substrate and a semiconductor refrigerating sheet; the heat transfer substrate is provided with a first plate surface, the semiconductor refrigeration sheet is installed on the first plate surface, and the heat dissipation assembly is installed on one side, away from the first plate surface, of the heat transfer substrate; a first heat source mounting portion is formed on the semiconductor cooling sheet, and a second heat source mounting portion is formed on the heat transfer substrate.
2. The heat sink as claimed in claim 1, wherein the second heat source mounting portion is a second heat source slot, the heat transfer substrate has a second plate surface, the second plate surface is disposed away from the first plate surface, a boss is formed on the second plate surface, and the second heat source slot is formed on the boss.
3. The heat sink of claim 2, wherein the notches of the second heat source element slots are located at the edge of the heat transfer substrate, the notches of the second heat source element slots being oriented parallel to the second plate surface.
4. The heat sink as claimed in claim 2, wherein the heat dissipating assembly comprises a first temperature-uniforming plate and a second temperature-uniforming plate, the boss has an end surface parallel to the second plate surface, the first temperature-uniforming plate is mounted on the second plate surface, and the second temperature-uniforming plate is mounted on the end surface.
5. The heat sink of claim 4, wherein the heat dissipation assembly comprises a first fin, a first heat-conducting member and a second heat-conducting member, the first heat-conducting member is fixed to the first vapor chamber, the second heat-conducting member is fixed to the second vapor chamber, and the first heat-conducting member and the second heat-conducting member are connected to the first fin.
6. The heat sink of claim 5, wherein the first heat conducting member and the second heat conducting member are heat pipes, a plurality of first mounting holes are formed in the first fins, the first mounting holes are correspondingly sleeved on the heat pipes, and first recesses for injecting solder are formed at edges of the first mounting holes.
7. The heat sink of claim 5, wherein the heat dissipation assembly further comprises a second fin coupled to the first heat conductive member, the second fin positioned between the first fin and the second plate surface.
8. The heat sink as claimed in claim 7, wherein the first heat-conducting member is a heat pipe, the second fin has a plurality of second mounting holes formed therein, the second mounting holes are correspondingly fitted to the first heat-conducting members, and a second recess for injecting solder is formed at an edge of the second mounting hole.
9. The heat sink according to claim 5, wherein a plurality of the first heat-conducting members and a plurality of the second heat-conducting members are provided, and the first heat-conducting members and the second heat-conducting members extend perpendicularly to the second plate surface.
10. A camera comprising a memory card, a chip and the heat sink of any of claims 1-9, the chip being mounted to the first heat source mounting portion and the memory card being mounted to the second heat source mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021637767.2U CN212463338U (en) | 2020-08-07 | 2020-08-07 | Radiator and camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021637767.2U CN212463338U (en) | 2020-08-07 | 2020-08-07 | Radiator and camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212463338U true CN212463338U (en) | 2021-02-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021637767.2U Active CN212463338U (en) | 2020-08-07 | 2020-08-07 | Radiator and camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212463338U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099707A (en) * | 2021-05-21 | 2021-07-09 | 苏州格曼斯温控科技有限公司 | Heat dissipation device and equipment |
| WO2022206568A1 (en) * | 2021-03-30 | 2022-10-06 | 华为技术有限公司 | Thermoelectric refrigeration module, heat dissipation component, chip packaging structure, and electronic device |
-
2020
- 2020-08-07 CN CN202021637767.2U patent/CN212463338U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022206568A1 (en) * | 2021-03-30 | 2022-10-06 | 华为技术有限公司 | Thermoelectric refrigeration module, heat dissipation component, chip packaging structure, and electronic device |
| CN113099707A (en) * | 2021-05-21 | 2021-07-09 | 苏州格曼斯温控科技有限公司 | Heat dissipation device and equipment |
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