CN218512919U

CN218512919U - Liquid cooling plate assembly structure for server CPU

Info

Publication number: CN218512919U
Application number: CN202222847318.6U
Authority: CN
Inventors: 华俊峰
Original assignee: Shanghai Sungiant Information Technology Co ltd
Current assignee: Shanghai Sungiant Information Technology Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-02-21
Anticipated expiration: 2032-10-27

Abstract

The application belongs to the technical field of servers and discloses a liquid cooling plate assembly structure for a server CPU (central processing unit), which comprises a mounting frame, wherein a CPU chip is arranged at the top of a first substrate, and a liquid cooling mechanism is arranged at the top of a second substrate; a temperature sensor is arranged inside the liquid cooling box, an electromagnetic valve is arranged inside the liquid inlet pipe, a display card is arranged at the top of the liquid cooling box, and both ends of the top of the display card are connected with a cooling fan through adjusting components; when the temperature sensor detects that the temperature is too high, the signal is fed back to an external monitoring system, so that a user can know the situation in time and carry out the next operation; the electromagnetic valve can be started to adjust the water flow of the cooling liquid and reduce the temperature, so that people can conveniently detect the temperature of the CPU of the server in time, and the service life is prevented from being influenced by overhigh temperature; the user can adjust the height of radiator fan and CPU chip and display card, increases the area of radiator fan and outside air contact, is favorable to thermal to giving off heat all around, improves the radiating efficiency.

Description

Liquid cooling plate assembly structure for server CPU

Technical Field

The application relates to the technical field of servers, in particular to a liquid cooling plate assembly structure for a server CPU.

Background

With the rapid development of information technology, the service volume of a data center is enlarged, and the number and the power density of electronic components in a server are steadily improved, so that the heating value of the server is increased by multiple times, the heat in the server is effectively removed, the efficient work of the server can be ensured, and the service life of the server is prolonged; the main board is called as a main board, a system board or a mother board, and is one of the most basic and important components in a computer, along with the development of computer technology, the functions of the CPU and the display card are stronger and stronger, and the heat generated by the CPU and the display card during operation is also larger and larger, so that in order to ensure the working efficiency of the CPU and the display card, an efficient heat dissipation device for the CPU and the display card needs to be arranged on the main board.

Through the retrieval of publication numbers: CN217386273U discloses a high performance server motherboard, which comprises: a first substrate on which a CPU chip and a first connection port are mounted; a second substrate on which a display card and a second connector are mounted; a flexible connection line connected between the first connection port and the second connection port; a liquid cooling component attached to the display card is arranged on the second substrate and communicated with a liquid cooling assembly; according to the utility model discloses a high performance server mainboard is through setting up CPU chip and display card respectively on first base plate and second base plate to set up the liquid cooling component on the second base plate and dispel the heat to the display card, thereby guarantee that the display card can high-efficient heat dissipation, and reduce the influence of the heat that the display card produced to other electronic components.

In the above patent, the CPU chip and the graphics card are respectively disposed on the first substrate and the second substrate, and the liquid cooling member is disposed on the second substrate to dissipate heat of the graphics card; the liquid cooling component that this device set up structure is comparatively simple, does not have any sensor or monitoring software system on it, if the high temperature, probably burns out the CPU chip, and people can not in time discover and solve, reduce its life, and can not adjust the rivers of coolant liquid.

In order to solve the above problems, the present application provides a liquid cooling board assembly structure for a server CPU.

SUMMERY OF THE UTILITY MODEL

The application provides a liquid cooling plate subassembly structure for server CPU adopts following technical scheme:

a liquid cooling plate assembly structure for a server CPU comprises a mounting frame, wherein a first base plate and a second base plate are respectively arranged at the bottom and the top of the mounting frame, a CPU chip is arranged at the top of the first base plate, and a liquid cooling mechanism is arranged at the top of the second base plate;

the liquid cooling mechanism comprises a liquid cooling box arranged at the top of the second substrate, a temperature sensor is arranged inside the liquid cooling box, a liquid inlet pipe and a liquid outlet pipe are respectively arranged on two sides of the outside of the liquid cooling box, an electromagnetic valve is arranged inside the liquid inlet pipe, a display card is arranged at the top of the liquid cooling box, and both ends of the top of the display card are connected with a cooling fan through adjusting components.

Through above-mentioned technical scheme, temperature sensor can in time detect out the liquid temperature in the liquid cold box, and the flow velocity of battery valve steerable liquid.

Furthermore, the adjusting component comprises a fixing plate arranged at the top of the display card, and a connecting plate is connected inside the fixing plate.

Through above-mentioned technical scheme, connecting plate sliding connection is connected in the fixed plate, and the top of connecting plate is connected with radiator fan.

Furthermore, the connecting blocks are installed on two sides of the outer portion of the connecting plate, and the connecting grooves are formed in two sides of the inner portion of the fixing plate.

Furthermore, the connecting block is located inside the connecting groove and is of a sliding connection structure.

Through above-mentioned technical scheme, the connecting plate slides from top to bottom through the inside that spread groove and connecting block's effect are located the fixing base.

Furthermore, a plurality of groups of clamping holes with equal distance are formed in one side of the outer portion of the fixing plate, and notches are formed in one side of the outer portion of the connecting plate.

Further, telescopic link and spring are installed respectively to the inside of notch, the spring is located the outside of telescopic link, the fixture block is installed jointly to the one end of telescopic link and spring.

Through above-mentioned technical scheme, the fixture block can get into the notch completely, and the flexible end and the fixture block of telescopic link are to being connected.

Furthermore, the size of the clamping block is matched with that of the notch, and the clamping block is clamped with the clamping hole.

Through above-mentioned technical scheme, when the fixture block was located the card hole, connecting plate and fixed plate were fixed, and when anti-sticking piece was located the notch, can reciprocate the connecting plate.

To sum up, the application comprises the following beneficial technical effects:

(1) A temperature sensor is arranged in the liquid cooling box, when the temperature sensor detects that the temperature is too high, a signal is fed back to an external monitoring system, and a user can know the situation in time and carry out next operation; and the user can start the solenoid valve, adjusts the rivers of coolant liquid, and the cooling temperature, and this device is convenient for people in time to detect the temperature of server CPU, prevents that the high temperature from influencing life.

(2) When two radiator fan dispel the heat to CPU chip and display card respectively, the user can adjust radiator fan and CPU chip and display card's height respectively according to actual conditions, increases radiator fan and outside air contact's area, is favorable to thermal to giving off the heat all around, improves the radiating efficiency, and the regulation mode is simple convenient.

Drawings

FIG. 1 is a schematic overall structure of the present application;

FIG. 2 is an internal view of a liquid cooling mechanism of the present application;

fig. 3 is an exploded view of the conditioning assembly of the present application.

The reference numbers in the figures illustrate:

1. a mounting frame; 2. a first substrate; 3. a second substrate; 4. a CPU chip; 5. a liquid cooling mechanism; 51. a liquid cooling tank; 52. a temperature sensor; 53. a liquid inlet pipe; 54. a liquid outlet pipe; 55. an electromagnetic valve; 56. a display card; 57. an adjustment assembly; 58. a heat radiation fan; 571. a fixing plate; 572. a connecting plate; 573. connecting blocks; 574. connecting grooves; 575. a clamping hole; 576. a notch; 577. a telescopic rod; 578. a spring; 579. and (6) clamping blocks.

Detailed Description

The technical solution in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments, and all other embodiments obtained by those of ordinary skill in the art without any inventive work based on the embodiments in the present application belong to the protection scope of the present application.

In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Example (b):

the embodiment of the application discloses a liquid cooling plate assembly structure for a server CPU, please refer to FIG. 1, which comprises an installation frame 1, wherein a first substrate 2 and a second substrate 3 are respectively arranged at the bottom and the top of the installation frame 1, a CPU chip 4 is arranged at the top of the first substrate 2, and a liquid cooling mechanism 5 is arranged at the top of the second substrate 3;

referring to fig. 2, the liquid cooling mechanism 5 includes a liquid cooling box 51 disposed on the top of the second substrate 3, a temperature sensor 52 is disposed inside the liquid cooling box 51, a liquid inlet pipe 53 and a liquid outlet pipe 54 are disposed on two sides of the outside of the liquid cooling box 51, respectively, an electromagnetic valve 55 is disposed inside the liquid inlet pipe 53, a display card 56 is disposed on the top of the liquid cooling box 51, and both ends of the top of the display card 56 are connected to a cooling fan 58 through an adjusting assembly 57;

referring to fig. 3, the adjusting assembly 57 includes a fixing plate 571 installed on the top of the display card 56, a connecting plate 572 is connected inside the fixing plate 571, connecting blocks 573 are installed on both sides of the outside of the connecting plate 572, connecting grooves 574 are installed on both sides of the inside of the fixing plate 571, the connecting blocks 573 are located inside the connecting grooves 574 and are of a sliding connection structure, a plurality of sets of equidistant clamping holes 575 are installed on one side of the outside of the fixing plate 571, a notch 576 is installed on one side of the outside of the connecting plate 572, a telescopic rod 577 and a spring 578 are installed inside the notch 576, the spring 578 is located outside the telescopic rod 577, a clamping block 579 is installed at both ends of the telescopic rod 577 and the spring 578, the size of the clamping block 579 is matched with the size of the notch 576, and the clamping block 579 is clamped with the clamping holes 575;

the solenoid valve 55 is connected to an external controller, and can be remotely operated to control the flow rate of the cooling liquid, the connecting plate 572 is located inside the fixing plate 571 through the connecting groove 574 and the connecting block 573 to slide up and down, and the connecting groove 574 is not completely opened to prevent the connecting plate 572 from being separated from the fixing plate 571, and the position of each clamping hole 575 is at a different height.

The implementation principle of the embodiment is as follows: (in publication No. CN217386273U, it is mentioned that the first substrate 2 and the second substrate 3 can be electrically connected through a flexible connecting line, and a containing space for containing cooling liquid is arranged in the liquid cooling component. Meanwhile, the liquid cooling component comprises a liquid cooling pipe communicated with the liquid cooling component, a heat dissipation component for liquid cooling heat dissipation and a driving water pump component for driving the cooling liquid to circulate among the liquid cooling pipe, the heat dissipation component and the liquid cooling component. The first substrate 2 is provided with a heat dissipation fan 58 for dissipating heat of the CPU chip 4. The second substrate 3 is also provided with a heat dissipation fan 58 for dissipating heat of the graphics card 56, so that the heat dissipation efficiency of the graphics card 56 is improved);

the liquid cooling pipe is respectively connected with the liquid inlet pipe 53 and the liquid outlet pipe 54, so that cooling liquid circularly flows to play a role in heat dissipation, the temperature sensor 52 is arranged in the liquid cooling box 51, the temperature sensor 52 is connected with an external monitoring system, when the temperature is detected to be overhigh, a signal is fed back to the external monitoring system, and a user can know the situation in time and carry out next step operation; the electromagnetic valve 55 can be started by a user to adjust the water flow of the cooling liquid and reduce the temperature, so that the device is convenient for people to detect the temperature of the CPU of the server in time and prevents the service life from being influenced by overhigh temperature;

when the two cooling fans 58 respectively cool the CPU chip 4 and the graphics card 56, in order to prevent the contact area between the cooling fans 58 and the outside air from being small, which is not favorable for heat dissipation to the periphery, and reduces the cooling efficiency, the user can adjust the height of the cooling fans 58 according to the actual situation; only need press fixture block 579, fixture block 579 extrudes telescopic link 577 and spring 578 simultaneously, make fixture block 579 be located the inside of notch 576, fixture block 579 breaks away from the position of card hole 575 this moment, can reciprocate the inside that connecting plate 572 is located fixed plate 571, after removing radiator fan 58 to suitable height, telescopic link 577 and spring 578 reset forward, make fixture block 579 be located the inside of card hole 575, can fix radiator fan 58's height this moment.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A liquid cooling plate assembly structure for a server CPU comprises a mounting frame (1), and is characterized in that: a first substrate (2) and a second substrate (3) are respectively arranged at the bottom and the top of the mounting frame (1), a CPU chip (4) is arranged at the top of the first substrate (2), and a liquid cooling mechanism (5) is arranged at the top of the second substrate (3);

liquid cooling mechanism (5) are including setting up liquid cooling box (51) at second base plate (3) top, the inside of liquid cooling box (51) is provided with temperature sensor (52), the outside both sides of liquid cooling box (51) are provided with feed liquor pipe (53) and drain pipe (54) respectively, the inside of feed liquor pipe (53) is provided with solenoid valve (55), the top of liquid cooling box (51) is provided with display card (56), the top both ends of display card (56) all are connected with radiator fan (58) through adjusting part (57).

2. A liquid cooling plate assembly structure for a server CPU as set forth in claim 1, wherein: the adjusting component (57) comprises a fixing plate (571) arranged at the top of the display card (56), and a connecting plate (572) is connected inside the fixing plate (571).

3. A liquid cooling board assembly structure for a server CPU according to claim 2, wherein: connecting blocks (573) are mounted on two sides of the outer portion of the connecting plate (572), and connecting grooves (574) are formed in two sides of the inner portion of the fixing plate (571).

4. A liquid cooling plate assembly structure for a server CPU as set forth in claim 3, wherein: the connecting block (573) is positioned inside the connecting groove (574) and is in a sliding connection structure.

5. A liquid cooling plate assembly structure for a server CPU according to claim 2, wherein: a plurality of groups of clamping holes (575) with equal distance are formed in one side of the outer part of the fixing plate (571), and notches (576) are formed in one side of the outer part of the connecting plate (572).

6. The liquid cooling board assembly structure for the server CPU as set forth in claim 5, wherein: telescopic link (577) and spring (578) are installed respectively to the inside of notch (576), spring (578) are located the outside of telescopic link (577), fixture block (579) are installed jointly to the one end of telescopic link (577) and spring (578).

7. A liquid cooling plate assembly structure for a server CPU as set forth in claim 6, wherein: the size of the clamping block (579) is matched with that of the notch (576), and the clamping block (579) is clamped with the clamping hole (575).