CN212211510U - Circuit board fast dispels heat - Google Patents
Circuit board fast dispels heat Download PDFInfo
- Publication number
- CN212211510U CN212211510U CN202021271538.3U CN202021271538U CN212211510U CN 212211510 U CN212211510 U CN 212211510U CN 202021271538 U CN202021271538 U CN 202021271538U CN 212211510 U CN212211510 U CN 212211510U
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- China
- Prior art keywords
- heat dissipation
- heat
- circuit board
- fixedly connected
- sliding
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 122
- 239000007769 metal material Substances 0.000 claims abstract description 12
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 34
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of the circuit board and specifically relates to a quick heat dissipation circuit board is related to, include the base plate of being made by insulating material, base plate one side fixedly connected with circuit layer, a plurality of electronic component of fixedly connected with on the circuit layer, the louvre has been seted up on the base plate, base plate top sliding connection has the heat exchanger that looses by metal material makes, the heat exchanger can slide from top to bottom, the heat exchanger that looses is close to the sliding tray has been seted up to electronic component's position, sliding connection has the sliding block in the sliding tray, the sliding block can slide from top to bottom. This application has the louvre and can dispel the heat to the circuit board, through gliding sliding block and electronic component contact from top to bottom and carry out the heat conduction to the electronic component of high difference, carries out quick radiating effect with heat conduction to the heat exchanger that looses.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a quick heat dissipation circuit board.
Background
The circuit board is an important element in various electrical appliances, and generally comprises a substrate, wherein the substrate is usually made of an insulating material or is attached with an insulating layer, a circuit layer is fixedly connected onto the insulating layer, the circuit layer is usually made of a copper foil material, a printed circuit is formed by etching, electronic elements are arranged on the circuit layer through a surface mounting technology, and the electronic elements are connected through a circuit of the circuit layer; in the working process of the circuit board, the circuit board can generate heat, particularly, the electronic element part generates heat seriously, if the heat is not dissipated in time, the performance of the circuit board can be seriously influenced by overhigh temperature, but because the electronic element is uneven when being mounted, the heat dissipation plate is difficult to be attached to the electronic element for heat dissipation.
The prior art can refer to the chinese utility model patent that the grant bulletin number is CN208369933U, and it discloses a high heat dissipation circuit board, including heat dissipation channel, heating panel, air vent, components and parts, lath, extension board, plastics nut, plastics threaded rod, fagging, slider and slide rail, both sides respectively set up the lath about the heating panel, respectively are equipped with components and parts on the lath, are equipped with a plurality of air vents in the lath, and the heating panel is back font structure, and both sides respectively are equipped with a plurality of heat dissipation channels around in the heating panel, and heat dissipation channel is the big little structure of other end opening of one end opening, and heat dissipation channel is big towards the one end opening in the insulating lath outside, and heat dissipation channel is.
In view of the above-mentioned related art, the inventor believes that there is a defect that the heat dissipation effect is poor because the heat generated by the circuit board is mainly concentrated on the electronic components, and the heat dissipation effect is poor for the electronic components with higher temperature.
SUMMERY OF THE UTILITY MODEL
In order to dispel the heat fast, improve the radiating effect to electronic component, this application provides a quick heat dissipation circuit board.
The application provides a quick heat dissipation circuit board adopts following technical scheme:
the utility model provides a quick heat dissipation circuit board, includes the base plate of being made by insulating material, base plate one side fixedly connected with circuit layer, a plurality of electronic component of fixedly connected with on the circuit layer, the louvre has been seted up on the base plate, base plate top sliding connection has the heat exchanger that looses that is made by metal material, the longitudinal section of heat exchanger is the setting of "the shape of falling", the heat exchanger can slide from top to bottom, the heat exchanger is close to the perpendicular to has all been seted up to electronic component's position the sliding tray of base plate, equal sliding connection has the sliding block in the sliding tray, the perpendicular to all can be followed to the sliding block the direction of base plate slides.
Through adopting above-mentioned technical scheme, during the use, electronic component passes through the circuit layer and connects, electronic component and circuit layer produce the heat in the course of the work, the louvre can improve the air circulation nature, carry out basic heat dissipation to the circuit board, the radiator shroud can be applicable to the electronic component of co-altitude along the direction slip of perpendicular to base plate, can carry out the heat conduction through slip and electronic component contact along the gliding sliding block of direction of perpendicular to base plate, can be applicable to on the different circuit boards because the electronic component of installation error height difference, carry out the heat dissipation of pertinence to the higher electronic component of temperature, improve the heat dispersion of electric plate, realize quick heat dissipation.
Preferably, the positions of the heat dissipation cover close to the two sides of the sliding groove are both provided with first sliding grooves perpendicular to the base plate, the lengths of the first sliding grooves are smaller than the length of the sliding groove, the positions of the sliding blocks corresponding to the first sliding grooves are both fixedly connected with first sliding blocks, and the first sliding blocks can slide along the length direction of the first sliding grooves.
Through adopting above-mentioned technical scheme, the cooperation of first slider and first spout can restrict the slip direction and the position of sliding block, prevents that the sliding block from falling out in the sliding tray.
Preferably, the periphery of the substrate is fixedly connected with bumps, the periphery of the heat dissipation cover is provided with grooves corresponding to the bumps, the bumps are connected with the grooves in a sliding mode, and the bumps can slide in the direction perpendicular to the plane of the substrate.
Through adopting above-mentioned technical scheme, through the sliding fit of recess and lug, the heat exchanger that looses can slide from top to bottom, and the electronic component of laminating height unevenness increases the height-adjustable's scope.
Preferably, a second sliding groove perpendicular to the substrate is formed in a position, close to the side wall of the groove, of the heat dissipation cover, the length of the second sliding groove is smaller than that of the groove, a second sliding block is fixedly connected to a position, corresponding to the second sliding groove, of the protruding block, and the second sliding block can slide in the length direction of the second sliding groove.
Through adopting above-mentioned technical scheme, the cooperation of second slider and second spout can restrict the slip direction and the position of lug, and it is spacing to slide of protection casing, prevents that protection casing and base plate from breaking away from.
Preferably, a heat dissipation plate made of a metal material is fixedly connected to one surface of the substrate, which is far away from the electronic component, and the heat dissipation holes include vertical heat dissipation holes penetrating through the heat dissipation plate and the substrate.
Through adopting above-mentioned technical scheme, the heat conduction can be strengthened to the heating panel that the metal was made, and vertical louvre can communicate the circuit board two sides, strengthens the heat dissipation to electronic component one side.
Preferably, the two ends of the substrate are fixedly connected with heat dissipation layers made of metal materials, the heat dissipation holes further comprise transverse heat dissipation holes penetrating through the heat dissipation layers and the side walls of the substrate, and the transverse heat dissipation holes are communicated with the vertical heat dissipation holes.
Through adopting above-mentioned technical scheme, horizontal louvre and vertical louvre communicate mutually and can form the circulation of air passageway in the base plate to improve the thermal diffusivity of base plate, make it can carry out quick heat dissipation to the heat of electronic component one side.
Preferably, heat conduction pipes made of metal materials are arranged in the vertical heat dissipation holes and the transverse heat dissipation holes, the heat conduction pipes are fixedly connected with the heat dissipation plate, the heat conduction pipes are fixedly connected with the heat dissipation layer, and gaps are reserved between the heat conduction pipes and the circuit layer.
Through adopting above-mentioned technical scheme, the metal heat pipe can be with heat conduction to heating panel and heat dissipation layer fast, strengthens the heat-sinking capability on heating panel and heat dissipation layer, and the heat pipe is avoided disturbing the circuit layer in the space on heat pipe and circuit layer.
Preferably, a first heat conduction insulating layer is fixedly connected to a position, close to the circuit layer, of the heat conduction pipe, and the first heat conduction insulating layer is abutted to the bottom end of the circuit layer.
Through adopting above-mentioned technical scheme, carry out the heat conduction through first heat conduction insulating layer between heat pipe and the circuit layer, avoid metal heat pipe interference circuit when strengthening the heat conduction effect.
Preferably, the position of the heat dissipation cover, which avoids the electronic element, is provided with a heat dissipation through hole.
Through adopting above-mentioned technical scheme, strengthen the heat dissipation of heat exchanger through the through-hole, avoid hot-air to gather in heat exchanger, through-hole and louvre can form the passageway of circulation of air.
Preferably, one surface of the heat dissipation cover close to the circuit layer is fixedly connected with a second heat conduction insulating layer.
Through adopting above-mentioned technical scheme, second heat conduction insulating layer can prevent that heat exchanger and circuit layer contact from disturbing the circuit.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the heat dissipation cover above the electronic element can slide along the direction vertical to the substrate, and is suitable for electronic elements with different heights;
2. the heat of one side of the circuit board close to the electronic element is conducted to the heat dissipation plate and the heat dissipation layer through the heat conduction pipe to dissipate heat;
3. the cavity in louvre and the heat conduction pipe can form the passageway of circulation of air, strengthens the radiating effect of circuit board.
Drawings
FIG. 1 is an overall schematic view of the present embodiment;
FIG. 2 is a cross-sectional view of the protruded heat dissipation hole and the heat dissipation cover in the present embodiment;
FIG. 3 is a partial cross-sectional view of the protruding bumps and grooves in this embodiment;
fig. 4 is a partial sectional view of the protruding slide block and the slide groove in the present embodiment.
Description of reference numerals: 1. a substrate; 11. a circuit layer; 12. an electronic component; 13. a heat dissipation plate; 14. heat dissipation holes; 141. transverse heat dissipation holes; 142. vertical heat dissipation holes; 15. a heat dissipation layer; 16. a heat conducting pipe; 161. a first thermally conductive insulating layer; 17. a bump; 171. a second slider; 2. a heat dissipation cover; 21. a heat dissipating through hole; 22. a sliding groove; 221. a first chute; 23. a slider; 232. a first slider; 24. a second thermally conductive insulating layer; 25. a groove; 251. a second runner.
Detailed Description
The present application is described in further detail below with reference to figures 1-4.
The embodiment of the application discloses quick heat dissipation circuit board. Referring to fig. 1 and 2, the printed circuit board includes a substrate 1 made of an insulating material, a circuit layer 11 made of a conductive material such as copper is fixedly connected to one surface of the substrate 1, and the circuit layer 11 is etched to form a printed circuit. An electronic component 12 is fixedly connected to the circuit layer 11. When the printed circuit board is used, the electronic element 12 is welded on the circuit layer 11 on the surface of the substrate 1, the circuit layer 11 is a special printed circuit, and the electronic element 12 can be connected through a circuit to realize the basic function of the circuit board.
Referring to fig. 1 and 2, a heat dissipation plate 13 made of a metal material such as copper is fixedly connected to a surface of the substrate 1 away from the electronic component 12, a vertical heat dissipation hole 142 is formed in the surface of the substrate 1, the vertical heat dissipation hole 142 can penetrate through the substrate 1 and the heat dissipation plate 13, heat dissipation layers 15 made of a metal material such as copper are fixedly connected to two ends of the substrate 1, a horizontal heat dissipation hole 141 is formed in the side surface of the substrate 1, the horizontal heat dissipation hole 141 penetrates through the heat dissipation layers 15 and the substrate 1, and the horizontal heat dissipation hole 141 is communicated with the. The vertical heat dissipation holes 142 penetrating the circuit board and the horizontal heat dissipation holes 141 communicating with the vertical heat dissipation holes can form an air circulation channel, so that heat can be dissipated from the side of the circuit board close to the electronic component 12, and the circuit board of the heat dissipation plate 13, which can be reinforced, can dissipate heat.
Referring to fig. 2 and 3, a heat pipe 16 made of a metal material such as copper is fixedly connected to each of the horizontal heat dissipation hole 141 and the vertical heat dissipation hole 142, a first heat conduction insulating layer 161 is fixedly connected to a position of the heat pipe 16 close to the circuit board, and the first heat conduction insulating layer 161 is in contact with the bottom end of the circuit layer 11. The heat pipe 16 can preferably conduct the heat of the circuit layer 11 to the heat dissipation plate 13 and the heat dissipation layer 15, and the heat dissipation layer 15 dissipates the heat, and the heat pipe 16 can dissipate the heat of the circuit layer 11 by allowing air to flow therethrough. The first heat conductive insulating layer 161 can prevent the heat conductive pipe 16 from interfering with the circuit board operation.
Referring to fig. 2 and 3, one side sliding connection that base plate 1 is connected with electronic component 12 has heat exchanger 2 that makes by heat conduction materials such as copper, heat exchanger 2 all sets up the recess 25 that perpendicular to base plate 1 set up all around, the equal fixedly connected with lug 17 in position that base plate 1 corresponds recess 25, lug 17 all with recess 25 sliding connection, lug 17 all can slide along the direction of perpendicular to base plate 1, heat dissipation through-hole 21 has been seted up to the position that heat exchanger 2 top was kept away from electronic component 12, heat exchanger 2 is close to one side fixedly connected with second heat conduction insulation layer 24 of circuit layer 11. The insulation between the heat dissipation cover 2 and the circuit layer 11 is achieved by the heat conductive insulation layer 24, preventing the heat dissipation cover 2 from interfering with the circuit. The heat dissipation cover 2 can slide up and down to adapt to the electronic elements 12 with different heights, and the heat of the electronic elements 12 is conducted to the heat dissipation cover 2 through contact, so that the heat dissipation function is realized.
Referring to fig. 2 and 3, the positions of the heat dissipation cover 2 close to the two sides of the groove 25 are both provided with a second sliding groove 251 perpendicular to the substrate 1, the length of the second sliding groove 251 is smaller than that of the groove 25, the position of the bump 17 corresponding to the second sliding groove 251 is fixedly connected with a second sliding block 171, the second sliding block 171 is connected with the second sliding groove 251 in a sliding manner, and the second sliding block 171 can slide along the length direction of the second sliding groove 251. When the heat dissipation cover 2 slides along the direction perpendicular to the substrate 1, the cooperation of the second sliding groove 251 and the second sliding block 171 can limit the heat dissipation cover 2, so as to prevent the heat dissipation cover 2 from being separated from the substrate 1.
Referring to fig. 2 and 4, sliding grooves 22 perpendicular to the substrate 1 are formed in the positions of the heat dissipation cover 2 close to the electronic component 12, sliding blocks 23 are connected in the sliding grooves 22 in a sliding manner, and the sliding blocks 23 can slide in the direction perpendicular to the substrate 1. The position that heat exchanger 2 is close to sliding tray 22 both sides all sets up the first spout 221 that perpendicular to base plate 1 set up, and the length of first spout 221 all is less than the length of sliding tray 22, and the first slider 232 of the equal fixedly connected with in position of sliding block 23 corresponding first spout 221, the equal sliding connection of first slider 232 in first spout 221, and first slider 232 all slides along the length direction of first spout 221. During the use, heat exchanger 2 conducts heat through gliding sliding block 23 and electronic component 12 contact from top to bottom, can be applicable to on the different circuit boards because the electronic component 12 of installation error height difference, carries out the pertinence heat dissipation to the higher electronic component 12 of temperature, improves the heat dispersion of electric plate, realizes dispelling the heat fast, and the cooperation of first slider 232 and first spout 221 can restrict sliding direction and the position of sliding block 23, prevents that sliding block 23 from falling out in sliding tray 22.
The implementation principle of the circuit board capable of rapidly dissipating heat in the embodiment of the application is as follows: the electronic element 12 is arranged on one side of the insulating substrate 1, the circuit layer 11 is fixedly connected to one side of the substrate 1 close to the electronic element 12, the circuit layer 11 is connected with each electronic element 12, the heat conducting pipe 16 can conduct the heat of the circuit layer 11 and the electronic element 12 to the heat dissipation plate 13 and the heat dissipation layer 15, and the heat dissipation is carried out through the heat dissipation plate 13 and the heat dissipation layer 15; the heat conduction pipe 16 can form an air circulation channel inside, and the air circulation channel can dissipate heat of the circuit layer 11 and the electronic component 12 through air circulation; the heat dissipation cover 2 above the electronic element 12 can slide along the direction perpendicular to the substrate 1, and is used for electronic elements 12 with different heights, and through the sliding of the sliding block 23, each electronic element 12 can contact the sliding block 23, so that heat can be conducted to the heat dissipation cover 2, the electronic elements 12 with higher heat on the circuit board can be subjected to targeted heat dissipation, and the purpose of rapid heat dissipation is achieved.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. The utility model provides a quick heat dissipation circuit board, includes base plate (1) made by insulating material, base plate (1) one side fixedly connected with circuit layer (11), a plurality of electronic component (12) of fixedly connected with on circuit layer (11), its characterized in that: the heat dissipation device is characterized in that the heat dissipation holes (14) are formed in the substrate (1), the top end of the substrate (1) is connected with a heat dissipation cover (2) made of a metal material in a sliding mode, the longitudinal section of the heat dissipation cover (2) is arranged in an inverted "" shape, the heat dissipation cover (2) can slide up and down, the position, close to the electronic element (12), of the heat dissipation cover (2) is provided with a sliding groove (22) perpendicular to the substrate (1), sliding blocks (23) are connected in the sliding groove (22) in a sliding mode, and the sliding blocks (23) can slide in the direction perpendicular to the substrate (1).
2. The circuit board of claim 1, wherein: the heat dissipation cover (2) is close to the position of sliding tray (22) both sides all sets up the perpendicular to first spout (221) that base plate (1) set up, the length of first spout (221) all is less than the length of sliding tray (22), sliding block (23) correspond the equal fixedly connected with first slider (232) in position of first spout (221), first slider (232) all can be followed the length direction of first spout (221) slides.
3. The circuit board of claim 1, wherein: equal fixedly connected with lug (17) all around base plate (1), heat exchanger (2) correspond all around the position of lug (17) all sets up fluted (25), equal sliding connection in lug (17) recess (25), lug (17) all can be followed the perpendicular to base plate (1) planar direction slides.
4. The circuit board of claim 3, wherein: the position of the heat dissipation cover (2) close to the two sides of the groove (25) is provided with a second sliding groove (251) perpendicular to the base plate (1), the length of the second sliding groove (251) is smaller than that of the groove (25), the position of the lug (17) corresponding to the second sliding groove (251) is fixedly connected with a second sliding block (171), and the second sliding block (171) can slide along the length direction of the second sliding groove (251).
5. The circuit board of claim 1, wherein: the heat dissipation plate (13) made of metal materials is fixedly connected to one surface, far away from the electronic element (12), of the substrate (1), and the heat dissipation holes (14) comprise vertical heat dissipation holes (142) penetrating through the heat dissipation plate (13) and the substrate (1).
6. The circuit board of claim 5, wherein: the heat dissipation structure is characterized in that heat dissipation layers (15) made of metal materials are fixedly connected to two ends of the base plate (1), the heat dissipation holes (14) further comprise transverse heat dissipation holes (141) penetrating through the heat dissipation layers (15) and the side walls of the base plate (1), and the transverse heat dissipation holes (141) are communicated with the vertical heat dissipation holes (142).
7. The circuit board of claim 6, wherein: the heat dissipation device is characterized in that heat conduction pipes (16) made of metal materials are arranged in the vertical heat dissipation holes (142) and the transverse heat dissipation holes (141), the heat conduction pipes (16) are fixedly connected with the heat dissipation plate (13), the heat conduction pipes (16) are fixedly connected with the heat dissipation layer (15), and gaps are reserved between the heat conduction pipes (16) and the circuit layer (11).
8. The circuit board of claim 7, wherein: the position of the heat conduction pipe (16) close to the circuit layer (11) is fixedly connected with a first heat conduction insulating layer (161), and the first heat conduction insulating layer (161) is abutted to the bottom end of the circuit layer (11).
9. The circuit board of claim 1, wherein: and a heat dissipation through hole (21) is formed in the position, which avoids the electronic element (12), on the heat dissipation cover (2).
10. The circuit board of claim 1, wherein: and a second heat conduction insulating layer (24) is fixedly connected to one surface, close to the circuit layer (11), of the heat dissipation cover (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021271538.3U CN212211510U (en) | 2020-07-01 | 2020-07-01 | Circuit board fast dispels heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021271538.3U CN212211510U (en) | 2020-07-01 | 2020-07-01 | Circuit board fast dispels heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212211510U true CN212211510U (en) | 2020-12-22 |
Family
ID=73818056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021271538.3U Expired - Fee Related CN212211510U (en) | 2020-07-01 | 2020-07-01 | Circuit board fast dispels heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212211510U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950223A (en) * | 2021-09-17 | 2022-01-18 | 杭州电子科技大学 | Heat dissipation end cover under airtight space |
| CN117156662A (en) * | 2023-11-01 | 2023-12-01 | 北京睿塔智能科技有限公司 | Metal substrate, preparation method and heat dissipation circuit board |
-
2020
- 2020-07-01 CN CN202021271538.3U patent/CN212211510U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950223A (en) * | 2021-09-17 | 2022-01-18 | 杭州电子科技大学 | Heat dissipation end cover under airtight space |
| CN117156662A (en) * | 2023-11-01 | 2023-12-01 | 北京睿塔智能科技有限公司 | Metal substrate, preparation method and heat dissipation circuit board |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201222 |
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| CF01 | Termination of patent right due to non-payment of annual fee |