CN203523231U - Integrated radiator - Google Patents
Integrated radiator Download PDFInfo
- Publication number
- CN203523231U CN203523231U CN201320663319.3U CN201320663319U CN203523231U CN 203523231 U CN203523231 U CN 203523231U CN 201320663319 U CN201320663319 U CN 201320663319U CN 203523231 U CN203523231 U CN 203523231U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- fit
- pcb board
- radiator body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003292 glue Substances 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 235000006708 antioxidants Nutrition 0.000 claims description 4
- 238000002048 anodisation reaction Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract 3
- 238000007743 anodising Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated radiator which comprises a heat radiating body that is made of aluminum alloy or copper section bar with high heat conductivity. The heat radiating body covers the PCB through a fixing component. Furthermore the inner top wall of the heat radiating body is provided with a plurality of bosses or grooves correspondingly to heating devices on the PCB. The bosses or grooves abut against corresponding heating devices through heat conducting glue. Additionally, the surface of the heat radiating body is provided with a processing layer with insulation, oxidation resisting and corrosion preventing functions through insulation anodizing. The heat radiating body of the integrated radiator covers the PCB. The bosses abut against corresponding heat devices through heat conducting components. Heat radiation is performed through the heat radiating body and heat radiating fins. While high heat radiation efficiency is ensured, the PCB and the heating devices are protected, and the strength of the PCB is improved. The heat conducting glue has advantages of high vibration resistance and fine space adjustment.
Description
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of fit radiator for the upper components and parts heat radiation of PCB.
Background technology
Since silicon integrated circuit comes out, the integrated level of circuit has increased several magnitudes, corresponding, and the heat that each chip produces also increases considerably.Increased power, volume-diminished, heat density sharply rises, and the temperature of electronic equipment increases rapidly, thereby makes the fault of electronic equipment more and more.Today, the heat dissipation problem of integrated circuit has become the key of computer microminiaturization.Electronic equipment, because crossing pyrogenetic fault, makes equipment (or system) hydraulic performance decline, particularly huge on the impact of Military Electronics system and equipment dependability, even causes catastrophic effect.Therefore, the heat dissipation technology developing rapidly for adapting to the cooling needs of modern electronic equipment, has been subject to extensive attention.
At present, traditional radiator for the upper components and parts heat radiation of PCB adopts planar heat spreader more, and planar heat spreader can only cannot be used Surface Mount class device for plug-in mounting class device, and planar heat spreader and air contact-making surface less, radiating effect is bad.
Utility model content
The purpose of this utility model is to provide a kind of fit radiator, the problems referred to above that exist to solve prior art midplane radiator.
For reaching this object, the utility model by the following technical solutions:
A kind of fit radiator, it comprises heat radiator body, wherein, described heat radiator body covers in outside pcb board by fixed part, and the heater members on the inner roof wall of described heat radiator body on corresponding pcb board is provided with several heat transfer structure bodies, described heat transfer structure body is close to corresponding heater members by conducting-heat elements.
Especially, the section bar that described heat radiator body adopts aluminium alloy or copper to have high heat conductance is made, and the surface of described heat radiator body is by anodization formation processing layer, and described processing layer has insulation, anti-oxidant, etch-proof effect.
Especially, described conducting-heat elements is heat-conducting glue, and its thickness is 0.05～5 ㎜.
Especially, described heat transfer structure body is any one or two kinds of combination of boss or groove.
Especially, the arranged outside of described heat radiator body has a plurality of radiating fins.
Especially, in described heat radiator body, corresponding pcb board offers several location holes.
Especially, described fixed part comprises that correspondence is opened in the fixing hole on heat radiator body and pcb board, passes fixing hole heat radiator body is fixed on outside pcb board or on cabinet by hold-down screw.
The beneficial effects of the utility model are that compared with prior art described fit radiator has following advantage:
1) heat radiator body of described fit radiator covers in outside pcb board, heat transfer structure body is close to corresponding heater members by conducting-heat elements, heat transfer structure body passes to heat radiator body by conducting-heat elements by the heat of heater members, by heat radiator body and radiating fin, dispel the heat, when guaranteeing radiating efficiency, pcb board and heater members are played a protective role, strengthened the intensity of pcb board;
2) conducting-heat elements adopts heat-conducting glue, prevents the in use direct collision of heat radiator body and heater members, has improved the anti-seismic performance of heater members, can finely tune gap between heat radiator body and heater members simultaneously;
3) heat radiator body surface through insulated male polarization process form there is insulation, the processing layer of anti-oxidant, corrosion-resisting function, the electronic device on pcb board is played to shield effectiveness simultaneously.
Accompanying drawing explanation
Fig. 1 is the positive perspective view of the fit radiator that provides of the utility model embodiment 1;
Fig. 2 is the back side perspective view of the fit radiator that provides of the utility model embodiment 1;
Fig. 3 is the heat conduction schematic diagram of the fit radiator that provides of the utility model embodiment 1.
Embodiment
Below in conjunction with accompanying drawing and by embodiment, further illustrate the technical solution of the utility model.
Refer to shown in Fig. 1 to Fig. 3, in the present embodiment, a kind of fit radiator comprises the heat radiator body 1 of being made by aluminium alloy extrusions, described heat radiator body 1 integral body is the box body structure of opening, on it, be provided with a plurality of fixing holes 2, corresponding described fixing hole 2 also offers fixing hole on pcb board, hold-down screw covers in outside pcb board through described fixing hole 2, and the heater members on the inner roof wall of described heat radiator body 1 on corresponding pcb board 4 is provided with several boss 3, described boss 3 is close on corresponding heater members 4 by heat-conducting glue 5.The thickness of described heat-conducting glue 5 is 1 ㎜, and in described heat radiator body 1, coordinates the components and parts of pcb board to offer several location holes 6,
The arranged outside of described heat radiator body 1 has a plurality of radiating fins 7, improve its heat dispersion, and the surface of described heat radiator body 1 through insulated male polarization process form there is insulation, the processing layer of anti-oxidant, corrosion-resisting function, the electronic device on pcb board is played to shield effectiveness simultaneously.
The height of described each boss 3 is according to the height setting of corresponding heater members 4, certainly also can be according to heater members 4 need to be set to groove.After only need making heat radiator body 1 install, the boss in heat radiator body 1 or groove and heater members 4 can fit tightly by heat-conducting glue 5.
Above embodiment has just set forth basic principle of the present utility model and characteristic; the utility model is not limited by above-mentioned example; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various variations and change, and these variations and change all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (7)
1. a fit radiator, it comprises heat radiator body, it is characterized in that, described heat radiator body covers in outside pcb board by fixed part, and the heater members on the inner roof wall of described heat radiator body on corresponding pcb board is provided with several heat transfer structure bodies, described heat transfer structure body is close to corresponding heater members by conducting-heat elements.
2. fit radiator according to claim 1, is characterized in that, described heat radiator body adopts any of aluminium alloy or copper section bar, and its surface is formed for insulation, anti-oxidant or etch-proof processing layer by anodization.
3. fit radiator according to claim 1, is characterized in that, described conducting-heat elements is heat-conducting glue, and its thickness is 0.05～5 ㎜.
4. fit radiator according to claim 1, is characterized in that, described heat transfer structure body is any one or two kinds of combination of boss or groove.
5. according to the fit radiator described in claim 1 or 2 any one, it is characterized in that, the arranged outside of described heat radiator body has a plurality of radiating fins.
6. fit radiator according to claim 1, is characterized in that, in described heat radiator body, corresponding pcb board offers several location holes.
7. fit radiator according to claim 1, is characterized in that, described fixed part comprises that correspondence is opened in the fixing hole on heat radiator body and pcb board, passes fixing hole heat radiator body is fixed on outside pcb board or on cabinet by hold-down screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320663319.3U CN203523231U (en) | 2013-10-25 | 2013-10-25 | Integrated radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320663319.3U CN203523231U (en) | 2013-10-25 | 2013-10-25 | Integrated radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203523231U true CN203523231U (en) | 2014-04-02 |
Family
ID=50382093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320663319.3U Expired - Lifetime CN203523231U (en) | 2013-10-25 | 2013-10-25 | Integrated radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203523231U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533812A (en) * | 2013-10-25 | 2014-01-22 | 无锡市同步电子科技有限公司 | Integrated radiator |
| CN106455461A (en) * | 2016-12-27 | 2017-02-22 | 成都芯通科技股份有限公司 | PCB (printed circuit board) cooling device and case |
| CN108135116A (en) * | 2018-01-26 | 2018-06-08 | 杭州迪普科技股份有限公司 | Radiator structure localization method and electronic equipment |
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
-
2013
- 2013-10-25 CN CN201320663319.3U patent/CN203523231U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533812A (en) * | 2013-10-25 | 2014-01-22 | 无锡市同步电子科技有限公司 | Integrated radiator |
| CN106455461A (en) * | 2016-12-27 | 2017-02-22 | 成都芯通科技股份有限公司 | PCB (printed circuit board) cooling device and case |
| CN106455461B (en) * | 2016-12-27 | 2019-09-06 | 成都芯通软件有限公司 | A kind of PCB circuit board radiator and cabinet |
| CN108135116A (en) * | 2018-01-26 | 2018-06-08 | 杭州迪普科技股份有限公司 | Radiator structure localization method and electronic equipment |
| CN108135116B (en) * | 2018-01-26 | 2020-10-09 | 杭州迪普科技股份有限公司 | Heat dissipation structure positioning method and electronic equipment |
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |
|
| CX01 | Expiry of patent term |