CN211780270U

CN211780270U - Pixel module and plant growth lamp applying same

Info

Publication number: CN211780270U
Application number: CN202020247759.0U
Authority: CN
Inventors: 陈鸣; 邢永超; 帅迪楼; 李闪; 韩敏
Original assignee: Shanghai Sansi Technology Co Ltd; Shanghai Sansi Electronic Engineering Co Ltd; Jiashan Sansi Photoelectric Technology Co Ltd; Pujiang Sansi Optoelectronics Technology Co Ltd
Current assignee: Shanghai Sansi Technology Co Ltd; Shanghai Sansi Electronic Engineering Co Ltd; Jiashan Sansi Photoelectric Technology Co Ltd; Pujiang Sansi Optoelectronics Technology Co Ltd
Priority date: 2020-03-03
Filing date: 2020-03-03
Publication date: 2020-10-27
Anticipated expiration: 2030-03-03

Abstract

The application provides a pair of pixel module and vegetation lamp of using thereof, pixel module includes in proper order: the LED chip comprises a lens, a contact pin type PCB, an LED chip, a radiator assembly and a PCB mounting groove; the LED chip and the radiator component are respectively provided with a central hole site; the contact pin type PCB is electrically connected with the LED chip; the pin type PCB penetrates through the LED chip and the central hole position of the radiator assembly through a pin, and is inserted into the PCB mounting groove for connecting a power line so as to fix the LED chip and the radiator assembly; the heat sink assembly includes: a ceramic radiator, heat conducting glue and a metal radiator; the lens is provided with a buckling column, and the metal radiator is provided with a corresponding buckling hole; the lens is inserted into the buckling hole of the metal radiator through the buckling column so as to fix the contact pin type PCB, the LED chip, the ceramic radiator and the heat conducting glue. This application has improved the radiating effect to simple structure makes things convenient for dismouting and maintenance.

Description

Pixel module and plant growth lamp applying same

Technical Field

The application relates to the field of lamps, in particular to a pixel module and a plant growth lamp using the same.

Background

Plant growth lamps are artificial light sources, usually electric light sources, intended to stimulate plant growth by emitting electromagnetic spectrum suitable for photosynthesis. Plant lamps are used in applications where there is no natural glow or where light supplementation is required. For example: in winter, lamps are used to extend the time that plants receive light when the possible daylight time may not be sufficient to achieve the desired plant growth. If plants do not get enough light, they will grow in vain.

The spectral wavelength required for photosynthesis of plants is usually in the range of 400-720 nm. While the blue light of 400-520 nm and the red light of 610-720 nm contribute the most to the photosynthesis of plants. The red and blue wavelengths of the LED plant lamp are just in the range, so that the plant can be provided with the spectral wavelength suitable for the growth of the plant, and the growth of the plant can be promoted. Meanwhile, the LED plant lamp has the characteristics of energy saving (high photoelectric conversion efficiency, power consumption of 1/4 of fluorescent lamps and 1/10 of sodium lamps), spectrum adjustability, good point light source property, cold light property (low heat generation), good moisture resistance, small volume, long service life (more than 30000 hours) and the like. The LED plant lamp light supplement technology is a new trend and development direction of IT agriculture (scientific and technological agriculture) and urban facility agriculture.

The time for supplementing light is different according to different growth periods and growth environments of plants. The light is not strong but can shine into a room with scattered sun light, and the light supplementing time is not less than 5 hours; in balconies which can illuminate for less than 4 hours (can illuminate only in the morning or in the afternoon for half a day), the light supplementing time is not less than 4 hours; the light supplement is carried out at shady place and in the room without sunlight for not less than 10 hours. The light supplement time of the general plants in the growing period needs to be longer, and the rest period is less. Light supplement is carried out for not less than 10 hours in cloudy days, rainy days and foggy days.

Based on the working requirements of the plant growth lamp, the plant growth lamp has higher requirements on heat dissipation performance, however, most of the plant growth lamps are usually placed in a shell with a radiator or a built-in fan for heat dissipation, and the heat dissipation efficiency is low and the heat dissipation effect is poor; in addition, most of the existing devices also have the problems of complex structure, troublesome disassembly and maintenance and the like.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by the present application is to provide a pixel module and a plant growth lamp using the same, which is used for solving at least one problem in the prior art.

To achieve the above and other related objects, the present application provides a pixel module, which comprises: the LED chip comprises a lens, a contact pin type PCB, an LED chip, a radiator assembly and a PCB mounting groove; the LED chip and the radiator component are respectively provided with a central hole site; the contact pin type PCB is electrically connected with the LED chip; the pin type PCB penetrates through the central hole positions of the LED chip and the radiator assembly through a pin, and is inserted into the PCB mounting groove for connecting a power line, so that the LED chip and the radiator assembly are fixed between the pin type PCB and the PCB mounting groove; the heat sink assembly includes: a ceramic radiator, heat conducting glue and a metal radiator; the lens is provided with a buckling column, and the metal radiator is provided with a corresponding buckling hole; the lens is inserted into the buckling hole of the metal radiator through the buckling column so as to fix the contact pin type PCB, the LED chip, the ceramic radiator and the heat conducting glue between the lens and the metal radiator.

In an embodiment of the present application, the LED chip is pre-mounted on the ceramic heat sink; the LED chip is preassembled by pasting.

In an embodiment of the present application, the lens is made of PC material.

In an embodiment of the present application, the PCB mounting groove adopts a PC material mounting groove main body, a PCB keysets is provided in the mounting groove main body, and the keysets are used for electrically connecting the contact pin type PCB board and the power line.

In an embodiment of the present application, the metal heat sink is an aluminum heat sink; and/or the heat-conducting glue is a heat-conducting filling bonding medium with heat conductivity.

To achieve the above and other related objects, there is provided a plant growth lamp, comprising: the pixel modules are arranged in the pixel module, and the power supply box is electrically connected with the pixel modules; the heat sink assembly of the pixel module includes: a ceramic radiator, heat conducting glue and a metal radiator; the metal radiators of the pixel modules are sequentially arranged and fixedly connected to form a group of bearing arms; the PCB mounting grooves of the plant growth lamp pixel modules are sequentially arranged and integrally connected to form a group of PCB mounting strips corresponding to a group of bearing arms; one or more side parts of the power supply box are fixedly connected with one end of the bearing arm.

In an embodiment of the present application, the metal heat sinks of the carrying arm are integrally connected; or, each metal radiator of the bearing arm is detachably and fixedly connected; the detachable fixed connection mode comprises: any one of a screw, a magnetic force, and a snap assembly.

In an embodiment of the present application, one end of the bearing arm and the side portion of the power supply box are fixed by welding or detachably; the detachable fixed connection mode comprises: any one of a screw, a magnetic force, and a snap assembly.

In an embodiment of the present application, the carrying arm can rotate relative to the power supply box with a central axis of the carrying arm as a rotation center; or, the bearing arm can rotate relative to the power supply box by taking the power supply box as a rotation center.

In an embodiment of the present application, the PCB pinboard of each PCB mounting groove in the PCB mounting bar is connected in series and connected to the power supply box.

As described above, a pixel module and plant growth lamp that uses thereof of this application, pixel module includes in proper order: the LED chip comprises a lens, a contact pin type PCB, an LED chip, a radiator assembly and a PCB mounting groove; the LED chip and the radiator component are respectively provided with a central hole site; the contact pin type PCB is electrically connected with the LED chip; the pin type PCB penetrates through the central hole positions of the LED chip and the radiator assembly through a pin, and is inserted into the PCB mounting groove for connecting a power line, so that the LED chip and the radiator assembly are fixed between the pin type PCB and the PCB mounting groove; the heat sink assembly includes: a ceramic radiator, heat conducting glue and a metal radiator; the lens is provided with a buckling column, and the metal radiator is provided with a corresponding buckling hole; the lens is inserted into the buckling hole of the metal radiator through the buckling column so as to fix the contact pin type PCB, the LED chip, the ceramic radiator and the heat conducting glue between the lens and the metal radiator.

This application has improved the radiating effect to simple structure makes things convenient for dismouting and maintenance.

Drawings

Fig. 1 is an exploded schematic view of a pixel module in an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a heat sink assembly in an embodiment of the present application.

Fig. 3 is an exploded view of a plant growth lamp according to an embodiment of the present invention.

Fig. 4A-4B are schematic diagrams illustrating the overall structure of the plant growth lamp in the embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Embodiments of the present application will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily carry out the present application. The present application may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly explain the present application, components that are not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.

Throughout the specification, when a component is referred to as being "connected" to another component, this includes not only the case of being "directly connected" but also the case of being "indirectly connected" with another element interposed therebetween. In addition, when a component is referred to as "including" a certain constituent element, unless otherwise stated, it means that the component may include other constituent elements, without excluding other constituent elements.

When an element is referred to as being "on" another element, it can be directly on the other element, or intervening elements may also be present. When a component is referred to as being "directly on" another component, there are no intervening components present.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are described. Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" include plural forms as long as the words do not expressly indicate a contrary meaning. The terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or components.

Terms indicating "lower", "upper", and the like relative to space may be used to more easily describe a relationship of one component with respect to another component illustrated in the drawings. Such terms are intended to include not only the meanings indicated in the drawings, but also other meanings or operations of the device in use. For example, if the device in the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "under" and "beneath" all include above and below. The device may be rotated 90 or other angles and the terminology representing relative space is also to be interpreted accordingly.

It is known that plants require light for nutrient uptake and that they use light energy for photosynthesis to obtain nutrients necessary for growth and development. Therefore, photosynthesis is the key to plant survival. The LED plant lamp is a special lamp with specific spectral wavelength, which is designed by replacing sunlight with light emitted by an LED light-emitting element, specially promotes plant photosynthesis and creates a light environment suitable for plant growth and development.

The LED plant lamp light supplementing technology is a new technology which is developed along with the development of LEDs in recent years, and a large amount of research and application of the LED plant growth lamp in a facility cultivation environment show that the LED plant lamp light supplementing technology can solve the problems of impure light quality, inconsistent light intensity, low light source irradiation energy efficiency and the like in spectral components of other artificial light sources. By adopting the LED light supplement technology, the growth of spinach, radish and lettuce can be remarkably promoted, the morphological index is improved, and the growth rate and the photosynthetic rate are improved by more than 20%. Can maximize the biological accumulation of betalain in beet, and produce the highest accumulation of sugar and starch in hairy root. Can obviously change the shapes of the stems and leaves of the pepper and the perilla, and obviously improve the photosynthetic rate of plants. When the flower preservative is used on flowers, the number of flower buds and the number of blossoms can be increased, the quality of the flowers can be improved, and the flowering period can be prolonged. Can cause the number of stomata of marigold and sage plants to increase, and the increase of stomata means the improvement of photosynthesis. The LED plant lamp light supplement technology is a development direction of urban facility agriculture and IT agriculture (scientific and technological agriculture). The current situation is that the flower and vegetable planting in Japan and Taiwan is popular.

Generally, according to different growth periods and growth environments of plants, a plant growth lamp needs to provide light supplement for a long time, which puts high requirements on heat dissipation performance, however, most plant growth lamps are usually placed in a shell with a radiator or a built-in fan for heat dissipation, and the heat dissipation efficiency is low and the heat dissipation effect is poor; in addition, most of the existing devices also have the problems of complex structure, troublesome disassembly and maintenance and the like. In order to solve at least one of the above problems, the present application provides a pixel module and a plant growth lamp using the same.

Fig. 1 shows a schematic structural diagram of a pixel module in the embodiment of the present application. As shown in the figure, the pixel module sequentially includes: lens 11, pin type PCB board 12, LED chip 13, heat sink assembly 14, and PCB mounting groove 15.

The lens 11 is an optical member, and the light emission angle, the irradiation area, and the like of light can be adjusted by the structure of the lens 11. Preferably, the lens 11 is made of PC (plastic).

The LED chip 13 is a light source of the pixel module of the present application, and can adjust the brightness and color of light according to requirements to provide different spectral components required by different plant growth.

The contact pin type PCB 12 is an electronic component, and the PCB is also called a printed circuit board, and can realize circuit connection between different electronic components. In the present application, the pin-type PCB board 12 is used to electrically connect the LED chip 13 on one hand and fix the LED chip 13 and the heat sink assembly 14 on the other hand by snap-fitting with the PCB mounting groove 15.

It should be noted that, in the present application, the pixel module performs heat dissipation by penetrating the pin-type PCB 12 and releasing the heat sink assembly 14, and further enhances heat dissipation by combining multiple layers of different heat dissipation materials.

Specifically, the LED chip 13 and the heat sink assembly 14 are respectively provided with a central hole. Preferably, the LED chip 13 and the heat sink assembly 14 are configured as a circular disc with a hole in the center for the pin 121 of the pin-type PCB board 12 to pass through.

As shown in fig. 1, the pin 121 of the pin-type PCB board 12 may be a plurality of pins, and the length of the pin 121 is preferably capable of passing through the heat sink assembly 14 and being inserted into the PCB mounting groove 15. The pins 121 are spaced apart to allow the pins 121 to contact the heat sink assembly 14, so that heat generated by the pins 121 during operation can be quickly conducted to the heat sink assembly 14.

The contact pin type PCB 12 is electrically connected with the LED chip 13; the pin-type PCB 12 passes through the central holes of the LED chip 13 and the heat sink assembly 14 via pins 121, and is inserted into the PCB mounting groove 15 for connecting a power line, so as to fix the LED chip 13 and the heat sink assembly 14 between the pin-type PCB and the PCB mounting groove 15.

In this embodiment, the PCB mounting groove 15 is a PC mounting groove main body, a PCB adapter plate is disposed in the mounting groove main body, and the adapter plate is used for electrically connecting the contact pin type PCB 12 and the power line.

In the present application, the heat sink assembly 14 includes: a ceramic heat sink 141, a thermal conductive paste 142, and a metal heat sink 143. The combined structure of the heat sink assembly 14 can be seen with reference to fig. 2.

The ceramic heat sink 141 is made of ceramic. Preferably, the LED chip 13 is pre-mounted on the ceramic heat sink 141; the LED chip 13 is pre-mounted in a sticking manner. The ceramic heat sink 141 is a circular base, and a plurality of LED chips 13 can be attached to the upper surface thereof, so that the ceramic heat sink has a good heat dissipation effect on the temperature of the LED chips 13 after long-time operation.

In this embodiment, it is luminous that present most LED adopts the lamp strip form, and this application adopts LED chip 13 directly attached on ceramic radiator 141, compares with the bar lamp, and the heat-sinking capability obtains great promotion.

Preferably, the thermal conductive paste 142 is a thermal conductive filling adhesive medium having excellent thermal conductivity. The ceramic heat sink 141 and the metal heat sink 143 act as a larger carrier to allow for a more rapid temperature reduction.

The material of the metal heat sink 143 is preferably metal aluminum, that is, an aluminum heat sink, which has a good heat dissipation effect even after the LED chip 13 operates for a long time. In addition, the metal heat sink 143 may be replaced by other heat dissipating metals in some embodiments, and is not limited to aluminum metal.

It should be noted that, in the present application, the heat sink assembly 14 combined by using the above three structures has better heat conductivity compared with an independent ceramic heat sink, and the heat dissipation capability is improved by more than 30% compared with that of the independent ceramic heat sink 141; in addition, compared with a single metal radiator, the radiator has smaller system thermal resistance, for example, the heat dissipation capacity is improved by more than 35% compared with that of an independent aluminum radiator; compared with a single metal radiator, the combined radiator assembly 14 adopted by the application has better insulating capability; in addition, the LED chip 13 is directly attached to the ceramic radiator, and the problem of insulation and voltage resistance of the traditional PCB is not considered.

The lens 11 is provided with a buckling column 111, and the metal heat radiator 143 is provided with a corresponding buckling hole 1431; the lens 11 is inserted into the fastening hole 1431 of the metal heat sink 143 through the fastening column 111, so as to fix the pin-type PCB board 12, the LED chip 13, the ceramic heat sink 141, and the thermal conductive adhesive 142 between the lens 11 and the metal heat sink 143.

As shown in fig. 3, a schematic structural diagram of a plant growth lamp in the embodiment of the present application is shown. As shown in the figure, the pixel module sequentially includes: a plurality of pixel modules 1 as shown in fig. 1, and a power box 2 electrically connected to the pixel modules.

The heat sink assembly 14 of the pixel module includes: a ceramic heat sink 141, a thermal conductive paste 142, and a metal heat sink 143.

The metal heat sinks 143 of the pixel modules are sequentially arranged and fixedly connected to form a set of carrying arms. Since the metal material (e.g. aluminum) of the metal heat sink 143 in the heat sink assembly 14 can be more plastic and rigid than the materials of the ceramic heat sink 141 and the heat conductive adhesive 142, it is convenient for the integrated process or the disassembly and connection.

Fig. 4A is a schematic view showing the overall structure of the front surface of the plant growth lamp in the embodiment of the present application; fig. 4B is a schematic view showing the overall structure of the back of the plant growth lamp in the embodiment of the present application.

It is a plurality of vegetation lamp pixel module PCB mounting groove 15 arranges in proper order and body coupling to constitute and correspond a set of bear a set of PCB mounting bar of arm. The PCB mounting grooves 15 are sequentially arranged and integrally connected to form a set of PCB mounting bar, the PCB mounting grooves 15 are still matched and fixed with the pin type PCB 12 of the pixel modules, therefore, the PCB mounting bar is not only used for realizing the PCB serial connection of each pixel module, but also further strengthens the stability of each pixel module on a set of bearing arms.

One or more side parts of the power supply box are fixedly connected with one end of the bearing arm. Preferably, two opposite side portions of the power supply box are fixedly connected with one end of one bearing arm respectively.

In this embodiment, the metal heat sinks 143 of the carrying arm are integrally connected; or, each metal heat sink 143 of the carrying arm is detachably and fixedly connected; the detachable fixed connection mode comprises: any one of a screw, a magnetic force, and a snap assembly. For example, the metal heat sinks 143 may be fixed by a combination of a gasket and a screw, or may be fixed by magnetic strips that are attached to each other, or may be fixed by various types of snap assemblies.

Preferably, when each of the metal heat sinks 143 of the carrying arms is detachably and fixedly connected, a group of carrying arms can be combined into one or more rows.

In this embodiment, one end of the bearing arm and the side of the power box are fixed by welding or detachable; the detachable fixed connection mode comprises: any one of a screw, a magnetic force, and a snap assembly.

In this embodiment, the bearing arm can rotate relative to the power supply box with the central axis of the bearing arm as a rotation center; or, the bearing arm can rotate relative to the power supply box by taking the power supply box as a rotation center.

When the bearing arm can rotate, the bearing arm can adapt to more working scenes with different situations, and plant growth lamp groups with different combination forms can be formed.

In this embodiment, the PCB pinboard of each PCB mounting groove 15 in the PCB mounting bar is connected in series and connected to the power box. Preferably, the power supply mode of the power supply box may include: and an external power supply, a rechargeable power supply, a lithium battery, a dry battery and the like are connected.

The application provides a pair of pixel module and vegetation lamp of using thereof, pixel module includes in proper order: the LED chip comprises a lens, a contact pin type PCB, an LED chip, a radiator assembly and a PCB mounting groove; the LED chip and the radiator component are respectively provided with a central hole site; the contact pin type PCB is electrically connected with the LED chip; the pin type PCB penetrates through the LED chip and the central hole position of the radiator assembly through a pin, and is inserted into the PCB mounting groove for connecting a power line so as to fix the LED chip and the radiator assembly; the heat sink assembly includes: a ceramic radiator, heat conducting glue and a metal radiator; the lens is provided with a buckling column, and the metal radiator is provided with a corresponding buckling hole; the lens is inserted into the buckling hole of the metal radiator through the buckling column so as to fix the contact pin type PCB, the LED chip, the ceramic radiator and the heat conducting glue. This application has greatly improved the radiating effect of vegetation lamp to simple structure makes things convenient for dismouting and maintenance.

In summary, the present application effectively overcomes various disadvantages of the prior art and has a high industrial utility value.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. A pixel module, comprising in order: the LED chip comprises a lens, a contact pin type PCB, an LED chip, a radiator assembly and a PCB mounting groove;

the LED chip and the radiator component are respectively provided with a central hole site;

the contact pin type PCB is electrically connected with the LED chip; the pin type PCB penetrates through the central hole positions of the LED chip and the radiator assembly through a pin, and is inserted into the PCB mounting groove for connecting a power line, so that the LED chip and the radiator assembly are fixed between the pin type PCB and the PCB mounting groove;

the heat sink assembly includes: a ceramic radiator, heat conducting glue and a metal radiator;

the lens is provided with a buckling column, and the metal radiator is provided with a corresponding buckling hole; the lens is inserted into the buckling hole of the metal radiator through the buckling column so as to fix the contact pin type PCB, the LED chip, the ceramic radiator and the heat conducting glue between the lens and the metal radiator.

2. The pixel module of claim 1, wherein the LED chip is pre-mounted on the ceramic heat sink; the LED chip is preassembled by pasting.

3. The pixel module of claim 1, wherein the lens is made of PC material.

4. The pixel module according to claim 1, wherein the PCB mounting groove is formed in a PC mounting groove body, and a PCB adapter plate is disposed in the mounting groove body and electrically connected to the pin-type PCB and the power line.

5. The pixel module of claim 1, wherein the metal heat spreader is an aluminum heat spreader; and/or the heat-conducting glue is a heat-conducting filling bonding medium with heat conductivity.

6. A plant growth lamp, comprising: a plurality of pixel modules according to any one of claims 1 to 5, and a power supply box electrically connected thereto;

the heat sink assembly of the pixel module includes: a ceramic radiator, heat conducting glue and a metal radiator;

the metal radiators of the pixel modules are sequentially arranged and fixedly connected to form a group of bearing arms; the PCB mounting grooves of the plant growth lamp pixel modules are sequentially arranged and integrally connected to form a group of PCB mounting strips corresponding to a group of bearing arms;

one or more side parts of the power supply box are fixedly connected with one end of the bearing arm.

7. The plant growth lamp of claim 6, wherein each of the metal heat sinks of the carrying arms are integrally connected; or, each metal radiator of the bearing arm is detachably and fixedly connected;

the detachable fixed connection mode comprises: any one of a screw, a magnetic force, and a snap assembly.

8. The plant growth lamp as claimed in claim 6, wherein one end of the bearing arm is fixed with the side of the power supply box by welding or can be fixed detachably;

9. The plant growth lamp of claim 6, wherein the carrying arm is rotatable relative to the power supply box with the central axis of the carrying arm as a rotation center; or, the bearing arm can rotate relative to the power supply box by taking the power supply box as a rotation center.

10. The plant growth lamp of claim 6, wherein the PCB pinboard of each of the PCB mounting slots in the PCB mounting bar is connected in series and to the power supply box.