CN202452144U

CN202452144U - Five-series-connection and sixteen-parallel-connection light-emitting diode (LED) chip integrated surface light source

Info

Publication number: CN202452144U
Application number: CN2011203771830U
Authority: CN
Inventors: 王志成
Original assignee: Shenzhen Ge Tian Photoelectric Co Ltd
Current assignee: Shenzhen Ge Tian Photoelectric Co Ltd
Priority date: 2011-09-30
Filing date: 2011-09-30
Publication date: 2012-09-26
Anticipated expiration: 2021-09-30

Abstract

The utility model discloses a five-series-connection and sixteen-parallel-connection light-emitting diode (LED) chip integrated surface light source which comprises eighty LED chips, positive wires, negative wires and a substrate, wherein the eighty LED chips are arranged in a die bonding area on the substrate and form sixteen electric serially connected branches in the mode that five LED chips are connected in series, and the sixteen electric serially connected branches are connected between the positive wires and the negative wires in parallel. The plurality of LED chips are directly bonded on the substrate so that thermal conductivity of light source radiating can be improved. In addition, a packaging glue layer is used for integrally covering all the LED chips so that the surface light source is good in light-emitting uniformity and can solve technical problems of dazzling, flaring and uneven light spots in the prior art.

Description

Five string 16 and the integrated area sources of led chip

Technical field

The utility model relates to the LED lighting field, relates in particular to a kind of five string 16 and integrated area sources of led chip.

Background technology

LED, English full name are Light Emitting Diode, and Chinese translation is a light emitting diode.LED is a kind of solid-state semiconductor devices, and it can directly convert electric energy into luminous energy, and the LED illuminating product utilizes LED as the produced ligthing paraphernalia of light source exactly.LED is as the energy-saving illumination product of a new generation, and it has low energy consumption, small size, plurality of advantages such as pollution-free and receives extensive concern.

Existing led light source product in order to realize powerful illumination needs, generally adopts the form of many particles LED lamp combination to realize.The led light source product of this many particles combination is because solder joint is many, and fault is more, and radiator can't reach requirement, and light decay accelerates, and incompatible power raisings that increases day by day need.In addition, this light source product must use lens when adopting high-power single LED lamp, when increasing cost, make that again the visual angle diminishes, and very dazzling when making high-power lamp, is not suitable for child family and uses.

The utility model content

To the weak point that exists in the above-mentioned technology, the utility model provides a kind of five string 16 and integrated area sources of led chip, can improve the thermal conductivity of light source heat radiation, and overcomes the technical problem that prior art is dazzling, dazzle light, hot spot inequality.

For realizing above-mentioned purpose; The utility model provides a kind of five string 16 and integrated area sources of led chip; Comprise 80 pieces of led chips, positive wire, negative wire and substrates; Said 80 pieces of led chips are arranged in the crystal bonding area on the substrate, and form 16 electric series arms according to the mode that five pieces of led chips are connected in series, and said 16 electric series arms are connected in parallel between said positive wire and the negative wire.

Wherein, the groove that has ccontaining said 80 pieces of led chips in the crystal bonding area on the said substrate.

Wherein, said groove is a rectangle or circular.

Wherein, said positive wire and negative wire are gold thread, silver-colored line or alloy wire.

Wherein, have specular aluminium coating or silver coating with the contact-making surface of led chip on the said substrate.

The beneficial effect of the utility model is: compared with prior art; Five string 16 and the integrated area sources of led chip that the utility model provides; The plurality of LEDs chip directly is adhered on the substrate, can improves the thermal conductivity of light source heat radiation, and with all led chips of the whole covering of encapsulation glue-line; Outgoing light homogeneity is good, can overcome the technical problem that prior art is dazzling, dazzle light, hot spot inequality.

Specifically, the utlity model has following advantage:

1, the area source astigmatism is even, the no dazzling light of dazzling;

2, the good high heat conduction of thermal conductivity, low light decay, long-life;

3, bright dipping is even, no color spot, no ghost image;

4, stable performance, easily assembled manufacturing PCB plate in addition, convenient in application;

5, promote optical efficiency (every watt more than 100LM), reduced thermal resistance;

6, luminous no stroboscopic does not have ultraviolet wave band, and environmental protection more meets the energy-conserving and environment-protective needs.

Description of drawings

Fig. 1 is the utility model five string 16 and integrated area source structure charts of led chip;

Fig. 2 is the utility model five string 16 and integrated area source circuit diagrams of led chip.

The main element symbol description is following:

10,80 pieces of led chips 11, positive wire 12, negative wire

13, substrate 14, crystal bonding area

The specific embodiment

In order more clearly to explain the utility model, the utility model is done to describe further below in conjunction with accompanying drawing.

See also Fig. 1 and Fig. 2; The utility model provides a kind of five string 16 and integrated area sources of led chip; Comprise 80 pieces of led chips 10, positive wire 11, negative wire 12 and substrate 13; 80 pieces of led chips 10 are arranged in the crystal bonding area 14 on the substrate 13, and form 16 electric series arms according to the mode that five pieces of led chips are connected in series, and 16 electric series arms are connected in parallel between positive wire 11 and the negative wire 12.In the present embodiment, have specular aluminium coating or silver coating with the contact-making surface of led chip 10 on the substrate 13.

Situation compared to prior art; Five string 16 and the integrated area sources of led chip that the utility model provides; The plurality of LEDs chip directly is adhered on the substrate, can improves the thermal conductivity of light source heat radiation, and with all led chips of the whole covering of encapsulation glue-line; Outgoing light homogeneity is good, can overcome the technical problem that prior art is dazzling, dazzle light, hot spot inequality.

Specifically, the utlity model has following advantage:

1, the area source astigmatism is even, the no dazzling light of dazzling;

3, bright dipping is even, no color spot, no ghost image;

In the present embodiment, have the groove of ccontaining said 80 pieces of led chips in the crystal bonding area 14 on the aforesaid substrate 13, the encapsulation glue-line and the said groove of the said 80 pieces of led chips of said fixedly encapsulation are suitable.

In the present embodiment, above-mentioned groove is a rectangle or circular.

In the present embodiment, above-mentioned positive wire and negative wire are gold thread, silver-colored line or alloy wire.

The utlity model has following characteristics:

1. the multiple chips naked deadens the heat conduction, and many little chips are attached to directly that heat can directly increase radiating surface through substrate heat conduction on the substrate.

2. the structural design of light source is evenly arranged on the substrate chip, and silica gel and fluorescent material mix direct capping and forms round convex shape makes bright dipping evenly astigmatic good on chip, and the no dazzling light of dazzling does not have color spot.

3. the white light optical efficiency can be improved well for the mirror face aluminum material reflecting effect in aluminium base crystal bonding area surface.

4. minute surface aluminium lamination or silver coating thermal conductivity promote heat transfer efficiency reduction resistance well.

It should be noted that when making the area source of the utility model, specifically comprise following process: at first, surround with integrated enclosure wall glue in the periphery of LED aluminium base chip crystal bonding area; Then, in LED aluminium base chip crystal bonding area, the ED chip directly is attached on the circuit aluminium base that has designed, then chip is connected with the circuit of aluminium base, confirm that circuit design realizes that with the lead-in wire bonding series and parallel mode is connected with chip P, the N utmost point; To encapsulate silica gel and fluorescent material at last mixes in proportion evenly to be coated in chip surface and to fixed temperature colloid to be solidified according to required colour temperature and realizes the chip encapsulation.

Through above-mentioned technical scheme and making flow process, the utility model has overcome following technical problem:

1. traditional led light source poor thermal conductivity influences the technical problem of light source life.

2. traditional led light source dazzling, dazzle the uneven technical problem of light, hot spot.

3. traditional led light source light efficiency not enough, the technical problem of bringing that wastes energy.

More than the disclosed several specific embodiments that are merely the utility model, but the utility model is not limited thereto, any those skilled in the art can think variation all should fall into the protection domain of the utility model.

Claims

1. string 16 and the integrated area source of led chip; It is characterized in that; Comprise 80 pieces of led chips, positive wire, negative wire and substrates; Said 80 pieces of led chips are arranged in the crystal bonding area on the substrate, and form 16 electric series arms according to the mode that five pieces of led chips are connected in series, and said 16 electric series arms are connected in parallel between said positive wire and the negative wire.

2. five string 16 and the integrated area sources of led chip according to claim 1 is characterized in that having the groove of ccontaining said 80 pieces of led chips in the crystal bonding area on the said substrate.

3. five string 16 and the integrated area sources of led chip according to claim 2 is characterized in that, said groove is a rectangle or circular.

4. according to each described five string 16 and integrated area sources of led chip of claim 1-3, it is characterized in that said positive wire and negative wire are gold thread, silver-colored line or alloy wire.

5. five string 16 and the integrated area sources of led chip according to claim 1 is characterized in that the contact-making surface with led chip on the said substrate has specular aluminium coating or silver coating.