CN115003032B - Motor drive control circuit board and manufacturing process thereof - Google Patents
Motor drive control circuit board and manufacturing process thereof Download PDFInfo
- Publication number
- CN115003032B CN115003032B CN202210705138.6A CN202210705138A CN115003032B CN 115003032 B CN115003032 B CN 115003032B CN 202210705138 A CN202210705138 A CN 202210705138A CN 115003032 B CN115003032 B CN 115003032B
- Authority
- CN
- China
- Prior art keywords
- control module
- central control
- temperature
- copper
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention relates to a motor drive control circuit board and a manufacturing process thereof, relating to the technical field of control circuit boards and comprising the following steps of S1, cutting a double-sided copper-clad plate to form a base plate, polishing the edge of the base plate and arranging positioning nails; s2, drilling the foundation plate by an automatic drilling machine according to a proofing scheme diagram arranged inside the foundation plate; s3, performing copper deposition on the foundation plate through a copper deposition device, and controlling the temperature of an activator solution in the copper deposition device and the moving speed of the movable hanging plate arm; s4, performing film covering exposure on the base plate according to the line pattern of the proofing scheme diagram, and performing electroplating of a tin layer and cleaning of a non-line pattern copper layer; and S5, carrying out ultrasonic washing and drying on the foundation plate, carrying out power-on test and packaging, and finishing the manufacture. According to the invention, through the accurate control of the circuit board copper deposition, the copper ion permeation and adsorption in the hole wall are increased, and the conductivity between the circuits on two sides of the circuit board is improved.
Description
Technical Field
The invention relates to the technical field of control circuit boards, in particular to a motor drive control circuit board and a manufacturing process thereof.
Background
The control circuit board is also called as a printed circuit board, is an important electronic component and is a carrier for electrical connection of electronic components, and after the electronic equipment adopts the printed boards, because of the consistency of the similar printed boards, the error of manual wiring is avoided, automatic insertion or mounting, automatic tin soldering and automatic detection of the electronic components can be realized, the quality of the electronic equipment is ensured, the labor productivity is improved, the cost is reduced, and the maintenance is convenient.
The existing motor drive control circuit board mostly adopts a double-layer copper-clad plate, and the process requirements on punching and copper deposition are low during the manufacture of the control circuit board, so that the conductivity between copper layer circuits on two surfaces of the control circuit board is poor, the fault of poor conductivity easily occurs in the control circuit board, and the service life of the motor drive control circuit board is greatly reduced.
Disclosure of Invention
Therefore, the invention provides a motor drive control circuit board and a manufacturing process thereof, which are used for overcoming the problem of poor conductivity between copper layer circuits on two surfaces of the control circuit board in the prior art.
In order to achieve the above object, the present invention provides a manufacturing process of a motor driving control circuit board, comprising,
the method comprises the following steps of S1, placing the double-sided copper-clad plate in a cutting machine for cutting to form a base plate, polishing the edge of the base plate, and fixing a plurality of positioning nails on the polished base plate;
s2, placing the foundation plate with the positioning nails in an automatic drilling machine, wherein the automatic drilling machine identifies the positioning nails on the foundation plate, adjusts the placing angle and the position of the foundation plate according to an identification result, and drills the foundation plate according to a sampling scheme arranged inside the automatic drilling machine;
s3, placing the foundation plate after drilling in a copper deposition device for copper deposition, wherein the copper deposition device is provided with a copper deposition groove, an activator solution is arranged in the copper deposition groove, the copper deposition groove can control the temperature of the activator solution, the copper deposition device soaks the foundation plate after drilling in the activator solution, and the foundation plate is subjected to movable copper deposition through a movable hanger plate arm arranged in the copper deposition device, the copper deposition device is provided with a central control module, and the temperature of the activator solution in the copper deposition groove and the moving speed of the movable hanger plate arm are adjusted through the central control module according to the size and the number of holes in the foundation plate;
s4, carrying out exposure film covering on the foundation plate subjected to copper deposition, carrying out circuit exposure on the foundation plate according to a circuit pattern of a proofing scheme drawing to form an exposure area corresponding to the circuit pattern, cleaning the exposure film of the exposure area to leak a copper layer on the surface of the foundation plate, electroplating a tin layer on the copper layer on the surface of the foundation plate, cleaning the exposure film on the surface of the foundation plate subjected to tin layer electroplating to leak a copper layer on the surface of a non-circuit drawing, cleaning the copper layer on the surface of the non-circuit drawing, carrying out detinning cleaning on the tin layer of the foundation plate subjected to copper layer cleaning, and leaking a copper layer corresponding to the circuit pattern of the proofing scheme drawing;
and S5, carrying out ultrasonic water washing and drying on the base plate subjected to detinning and cleaning, carrying out power-on test and packaging, and finishing the manufacturing of the motor drive control circuit board.
Further, the step S3 is provided with the copper deposition device, a central control module is arranged in the copper deposition device, the central control module can obtain the size diameters A1, A2 and A3 of the holes of the foundation plate A1, A2 and A3 8230An, wherein A1 is more than A2 and more than A3 8230An, A is less than A, the central control module is internally provided with the minimum constant temperature hole diameter Ax, the central control module is also internally provided with the minimum constant temperature Tx, when the copper deposition device performs copper deposition on the foundation plate, the central control module compares the size diameter A1 with the minimum constant temperature hole diameter Ax,
when A1 is less than or equal to Ax, the central control module judges that the size diameter A1 does not exceed the minimum fixed-temperature hole diameter, the central control module sets the control temperature for controlling the copper precipitation tank as Tx, and the copper precipitation tank controls the temperature of the activator solution at the control temperature Tx;
when A1 is larger than Ax, the central control module judges that the size diameter A1 exceeds the minimum constant temperature hole diameter, and the central control module judges the size diameter An so as to set the control temperature of the copper precipitation tank.
Furthermore, the central control module is provided with a maximum constant temperature hole diameter Ad and a maximum constant temperature Td, when the central control module judges that the size diameter A1 exceeds the minimum constant temperature hole diameter, the central control module compares the size diameter An with the maximum constant temperature hole diameter Ad,
when An is less than Ad, the central control module judges that the maximum size diameter An in the foundation plate is lower than the maximum constant-temperature hole diameter, the central control module judges that the size diameter of each hole of the foundation plate is within the range of the standard size diameter, and the central control module judges the number of the size diameters of each hole of the foundation plate so as to set the control temperature of the copper precipitation tank;
and when An is larger than or equal to Ad, the central control module judges that the maximum size diameter An in the base plate reaches the maximum constant temperature hole diameter standard, the central control module sets the control temperature for controlling the copper precipitation tank as Td, and the copper precipitation tank controls the temperature of the activating agent solution by the control temperature Td.
Further, a standard size Ab and a standard temperature control temperature Tb are arranged in the central control module, the central control module can obtain the number HA1, HA2 and HA3 8230of holes corresponding to each size diameter, the HAN can calculate the total size diameter Am and Am = (A1 × HA 1) + (A2 × HA 2) + (A3 × HA 3) \8230 + (An × HAN) of the base plate when the central control module judges that the maximum size diameter An in the base plate is lower than the maximum constant temperature hole diameter, the central control module calculates the total hole number HS of the base plate, HS = HA1+ HA2+ 8230, and HS + HAN, the average hole diameter Ap, ap = Am/HS is calculated according to the total size diameter Am and the total hole number HS of the base plate, the central control module calculates the average hole diameter Ap, ap = Am/HS, the central control module controls the temperature Tb and Tp by setting the temperature of the copper sink (Tp).
Further, a temperature detection device is arranged in the copper precipitation tank, the temperature detection device can detect the real-time temperature Ts of the activator solution in the copper precipitation tank, a standard temperature difference Delta Te is arranged in the central control module, when the central control module sets the control temperature of the copper precipitation tank as Ti, wherein i = p, d and x, the central control module calculates a loss temperature difference Delta Ti and Delta Ti = | Ti-Ts | according to the real-time temperature Ts and the set control temperature Ti, the central control module compares the loss temperature difference Delta Ti with the standard temperature difference Delta Te,
when delta Ti is less than or equal to delta Te, the central control module judges that the loss temperature difference does not exceed the standard temperature difference, and the central control module adjusts the moving speed of the movable hanging plate arm according to the real-time temperature Ts of the activator solution;
and when delta Ti is larger than delta Te, the central control module judges that the loss temperature difference exceeds the standard temperature difference, and the central control module adjusts the set control temperature Ti.
Further, when the central control module determines that the loss temperature difference Δ Ti exceeds the standard temperature difference Δ Te, the central control module adjusts the control temperature of the copper deposition bath to Ti ', ti' = Ti + Ti [ (Ts-Ti)/Ts ], the temperature detection device detects the real-time temperature Ts 'of the activator solution in the copper deposition bath again, and the central control unit repeats the determination of the standard temperature difference and the operation of controlling the temperature adjustment until the calculated loss temperature difference Δ Ti' reaches Δ Ti ≦ Δ Te, and the central control module stops adjusting the control temperature of the copper deposition bath.
Further, a set temperature Tr corresponding to an initial moving speed Vc and an initial moving speed of the movable hanger plate arm is set in the central control module, when the central control module determines that the loss temperature difference does not exceed the standard temperature difference, the central control module adjusts the initial moving speed of the movable hanger plate arm to Vc ', vc' = Vc × (Ts/Tr), and the copper deposition device performs copper deposition on the base plate.
Furthermore, the central control module is provided with the upper limit moving speed Vf of the movable hanging plate arm, when the copper deposition device performs copper deposition on the foundation plate, the central control module compares the moving speed Vc' of the movable hanging plate arm with the upper limit moving speed Vf,
when Vc' is less than or equal to Vf, the central control module judges that the moving speed of the movable hanging plate arm does not exceed the upper limit moving speed, and the central control module does not adjust the copper deposition device;
and when Vc' is greater than Vf, the central control module judges that the moving speed of the movable hanging plate arm exceeds the upper limit moving speed, and the central control unit adjusts the control temperature of the copper precipitation tank according to the moving speed of the movable hanging plate arm.
Further, when the central control module judges that the moving speed of the movable hanging plate arm exceeds the upper limit moving speed, the central control module adjusts the moving speed of the movable hanging plate arm to the upper limit moving speed Vf, and the central control module sets the control temperature of the copper deposition groove to be Ti ', ti ' = Ti ' -Ti ' (Vc ' -Vf)/Vf.
A motor drive control circuit board is manufactured by the manufacturing process of any one of the motor drive control circuit boards, copper layers with the thickness of 0.035 mm are arranged on two sides of a double-sided copper-clad plate, and epoxy resin and glass fiber cloth are used as middle materials.
Compared with the prior art, the method has the advantages that the copper ions in the activator solution fully permeate the hole wall of the control circuit board by judging according to the hole size of the surface of the control circuit board and selecting the corresponding temperature of the activator solution, so that the conductivity between copper layer circuits on two sides of the control circuit board is improved, meanwhile, the penetration depth can be influenced, the influence on the conduction range due to excessive penetration is avoided, the short circuit of the control circuit board is brought, the moving speed of the control circuit board is controlled according to the temperature of the activator solution, the penetration duration is controlled, the penetration of the copper ions in the hole wall of the control circuit board is further accurately influenced, the conductivity between the copper layer circuits on two sides of the control circuit board is improved, and the service life of the control circuit board is prolonged.
Particularly, the size diameter of each hole of the foundation plate is obtained through the central control module, the design state of the foundation plate can be clearly obtained, the minimum constant temperature hole diameter is arranged in the central control module, the minimum constant temperature corresponding to the minimum constant temperature hole diameter is arranged, the problem that when the foundation plate has small holes, the control temperature of a copper precipitation tank is low, when the foundation plate has small holes, small bubbles possibly remain in the holes when the foundation plate is placed in an activator solution, and due to the fact that the hole wall is small, the relative tension of the bubbles in the foundation plate is large, if the copper precipitation operation is carried out at the low temperature at the moment, the bubbles in the hole wall are not easy to discharge, so that copper ion adsorption in the hole wall is influenced, and under the low temperature environment, the activity of the copper ions in the solution is low, the adsorption is not easy, so that the minimum constant temperature hole diameter and the minimum constant temperature are arranged, and the circuit conduction performance of the small holes of the circuit board is guaranteed.
Further, through setting up the biggest temperature hole diameter and the biggest temperature of deciding in well accuse module, on the one hand, when the hole of foundatin plate is great, can set up the infiltration of higher temperature reinforcing copper ion in the pore wall, nevertheless because when the thickness of the infiltration of pore wall normal direction is higher, very easy and circuit pattern contact with other holes or in the circuit board, under specific environment, produce the condition of circuit board short circuit easily, on the other hand, can destroy the activity of activator solution when the temperature is higher, can not reach the effect of heavy copper even, the hole condition to the foundatin plate is judged according to the biggest temperature hole diameter of deciding who sets for and the biggest temperature of deciding, the production quality of very big degree improvement circuit board.
Furthermore, the average state of the contact area of each hole on the foundation plate and the activating agent solution can be embodied to the greatest extent by calculating the total size diameter of each hole on the foundation plate and calculating the average hole diameter according to the total hole number, the control temperature of the copper precipitation tank is set through the average hole diameter, the integral copper precipitation effect is guaranteed, and the copper precipitation quality of the circuit board is further improved.
Particularly, when the copper deposition groove is used for controlling the temperature of the activator solution inside, the operation of the part is performed under a normal working environment, and the indoor temperature can influence the heat loss of the activator solution inside the copper deposition groove, so that the temperature detection device is arranged in the copper deposition groove to detect the real-time temperature of the activator solution, the set control temperature is judged according to the real-time temperature of the activator solution through the central control module, whether the temperature is within a standard temperature difference is judged, and the accuracy of temperature control in the copper deposition process is guaranteed.
Further, when the central control module judges that the loss temperature difference exceeds the standard temperature difference, the temperature of the activator solution in the copper precipitation tank is not the optimal temperature for copper precipitation, so that the control temperature of the copper precipitation tank is adjusted according to the real-time temperature of the activator solution to resist the temperature loss of the activator solution in the operation process, and the copper precipitation effect of the hole wall of the foundation plate is improved.
Furthermore, because the copper deposition operation is in a production line type, the moving speed of the movable hanging plate arm is adjusted to control the staying time of the foundation plate in the activating agent solution, when the real-time temperature of the activating agent solution is low, the moving speed of the movable hanging plate arm is reduced, the staying time of the foundation plate in the activating agent solution is increased, so that the copper deposition effect of the inner hole wall of the foundation plate is guaranteed, when the real-time temperature of the activating agent solution is high, the movable hanging plate arm adopts a fast moving speed, and the copper deposition efficiency of the foundation plate is improved.
Furthermore, the upper limit moving speed of the movable hanging plate arm is set in the central control module, the adjusted moving speed of the movable hanging plate arm is judged, the movable hanging plate arm is prevented from exceeding the moving speed, when the moving speed is too high, the staying time of the base plate in an activator solution is reduced, and the infiltration of copper ions in the activator solution is not facilitated, so that the upper limit moving speed of the movable hanging plate arm is set, the balance is carried out by controlling the control temperature of the copper precipitation groove when the moving speed is exceeded, the copper precipitation quality of the hole wall of the base plate is further guaranteed, and the conductivity between copper layer circuits on two sides of the control circuit board is improved.
Drawings
Fig. 1 is a flowchart of a manufacturing process of the motor drive control circuit board according to the embodiment.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described below with reference to examples; it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and do not limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1, which is a flow chart of a manufacturing process of a motor driving control circuit board according to the present embodiment, the present invention discloses a manufacturing process of a motor driving control circuit board, including,
the method comprises the following steps of S1, placing the double-sided copper-clad plate in a cutting machine for cutting to form a base plate, polishing the edge of the base plate, and fixing a plurality of positioning nails on the polished base plate;
s2, placing the foundation plate with the positioning nails in an automatic drilling machine, wherein the automatic drilling machine identifies the positioning nails on the foundation plate, adjusts the placing angle and the position of the foundation plate according to an identification result, and drills the foundation plate according to a sampling scheme arranged inside the automatic drilling machine;
s3, placing the foundation plate after drilling in a copper deposition device for copper deposition, wherein the copper deposition device is provided with a copper deposition groove, an activator solution is arranged in the copper deposition groove, the copper deposition groove can control the temperature of the activator solution, the foundation plate after drilling is soaked in the activator solution by the copper deposition device, the foundation plate is subjected to movable copper deposition through a movable hanger plate arm arranged in the copper deposition device, the copper deposition device is provided with a central control module, and the temperature of the activator solution in the copper deposition groove and the moving speed of the movable hanger plate arm are adjusted through the central control module according to the size and the number of holes in the foundation plate;
s4, carrying out exposure film covering on the foundation plate subjected to copper deposition, carrying out circuit exposure on the foundation plate according to a circuit pattern of a proofing scheme drawing to form an exposure area corresponding to the circuit pattern, cleaning the exposure film of the exposure area to leak a copper layer on the surface of the foundation plate, electroplating a tin layer on the copper layer on the surface of the foundation plate, cleaning the exposure film on the surface of the foundation plate subjected to tin layer electroplating to leak a copper layer on the surface of a non-circuit drawing, cleaning the copper layer on the surface of the non-circuit drawing, carrying out detinning cleaning on the tin layer of the foundation plate subjected to copper layer cleaning, and leaking a copper layer corresponding to the circuit pattern of the proofing scheme drawing;
and S5, carrying out ultrasonic washing and drying on the base plate subjected to detinning and cleaning, carrying out power-on test and packaging, and finishing the manufacture of the motor drive control circuit board.
The hole size of the control circuit board surface is judged, the corresponding temperature of the activator solution is selected, copper ions in the activator solution fully permeate the hole wall of the control circuit board, the conductivity between copper layer circuits on the two sides of the control circuit board is improved, meanwhile, the depth of permeation can be influenced, excessive permeation is avoided, the influence on the conduction range is avoided, the control circuit board is short-circuited, the moving speed of the control circuit board is controlled according to the temperature of the activator solution, the permeation is long, the permeation of the copper ions in the hole wall of the control circuit board is further accurately influenced, the conductivity between the copper layer circuits on the two sides of the control circuit board is improved, and the service life of the control circuit board is prolonged.
Specifically, the step S3 is provided with the copper deposition device, a central control module is arranged in the copper deposition device, the central control module can obtain the size diameters A1, A2 and A3 of the holes of the foundation plate A1, A2 and A3A 8230An, A1 is more than A2 and is more than A3A 8230An, A is less than A, the central control module is internally provided with the minimum constant temperature hole diameter Ax and is also internally provided with the minimum constant temperature Tx, when the copper deposition device performs copper deposition on the foundation plate, the central control module compares the size diameter A1 with the minimum constant temperature hole diameter Ax,
when A1 is not more than Ax, the central control module judges that the size diameter A1 does not exceed the minimum fixed-temperature hole diameter, the central control module sets the control temperature for controlling the copper precipitation tank as Tx, and the copper precipitation tank controls the temperature of the activator solution at the control temperature Tx;
when A1 is larger than Ax, the central control module judges that the size diameter A1 exceeds the minimum constant temperature hole diameter, and the central control module judges the size diameter An so as to set the control temperature of the copper precipitation tank.
The size diameter of each hole of the foundation plate is obtained through the central control module, the design state of the foundation plate can be clearly obtained, the minimum constant temperature hole diameter is set in the central control module, the minimum constant temperature corresponding to the minimum constant temperature hole diameter is set, the problem that when the foundation plate has small holes, the control temperature of a copper precipitation groove is low is avoided, when the foundation plate has the small holes, small bubbles possibly remain in the foundation plate when the foundation plate is placed in an activator solution, the relative tension of the bubbles inside the foundation plate is large due to small hole walls, if the copper precipitation operation is carried out at the lower temperature, the bubbles in the hole walls are not easy to discharge, so that the copper ion adsorption in the hole walls is influenced, and under the lower temperature environment, the activity of the copper ions in the solution is low, the adsorption is not easy, the minimum constant temperature hole diameter and the minimum constant temperature are set, and the circuit conduction performance of the small holes of the circuit board is guaranteed.
Specifically, the central control module is provided with a maximum constant temperature hole diameter Ad and a maximum constant temperature Td, when the central control module determines that the size diameter A1 exceeds the minimum constant temperature hole diameter, the central control module compares the size diameter An with the maximum constant temperature hole diameter Ad,
when An is less than Ad, the central control module judges that the maximum size diameter An in the foundation plate is lower than the maximum constant-temperature hole diameter, the central control module judges that the size diameter of each hole of the foundation plate is within the range of the standard size diameter, and the central control module judges the number of the size diameters of each hole of the foundation plate so as to set the control temperature of the copper precipitation tank;
and when An is larger than or equal to Ad, the central control module judges that the maximum size diameter An in the base plate reaches the maximum constant temperature hole diameter standard, the central control module sets the control temperature for controlling the copper precipitation groove as Td, and the copper precipitation groove controls the temperature of the activating agent solution by the control temperature Td.
Through set up in well accuse module and set up maximum temperature hole diameter and maximum temperature, on the one hand, when the hole of foundatin plate is great, can set up the infiltration of copper ion in the higher temperature reinforcing pore wall, nevertheless because when the thickness of the infiltration of pore wall normal direction is higher, other hole or circuit figure contact in very easy and the circuit board, under specific environment, produce the condition of circuit board short circuit easily, on the other hand, can destroy the activity of activator solution when the temperature is higher, can not reach the effect of heavy copper even, according to the biggest temperature hole diameter of deciding who sets for and the hole condition of maximum temperature to the foundatin plate and judge, the production quality of circuit board has been improved to a great extent.
Specifically, a standard size diameter Ab and a standard temperature control temperature Tb are arranged in the central control module, the central control module can obtain the number HA1, HA2 and HA3 8230of holes corresponding to each size diameter, the HAN, when the central control module judges that the maximum size diameter An in the base plate is lower than the maximum constant temperature hole diameter, the central control module calculates the total size diameter Am and Am = (A1 × HA 1) + (A2 × HA 2) + (A3 × HA 3) \8230 + (An × HAN) of the base plate, the central control module calculates the total hole number HS of the base plate, HS = HA1+ HA2+ HA3 8230, and + HAn, calculates the average hole diameter Ap, ap = Am/Ab according to the total size diameter Am and the total hole number HS of the base plate, sets the Tp = Am/Ab, and controls the temperature of a copper sink groove according to the average hole diameter Ap, the standard size diameter Ab and the Tp = Am/Tb, and the Tp = Tb, and the Tp/Tb to control the copper sink temperature, and controls the copper sink temperature.
Through calculating the total size diameter of each hole on the foundatin plate, calculate average hole diameter according to total hole number, can embody the average state of the area of contact of each hole and activator solution on the foundatin plate to the at utmost, set for the controlled temperature who sinks the copper groove through average hole diameter, ensured holistic heavy copper effect, further improved the heavy copper quality of circuit board.
Specifically, a temperature detection device is arranged in the copper precipitation tank, the temperature detection device can detect the real-time temperature Ts of the activator solution in the copper precipitation tank, a standard temperature difference Δ Te is arranged in the central control module, when the central control module sets the control temperature of the copper precipitation tank as Ti, wherein i = p, d, and x, the central control module calculates a loss temperature difference Δ Ti and Δ Ti = | Ti-Ts | according to the real-time temperature Ts and the set control temperature Ti, and the central control module compares the loss temperature difference Δ Ti with the standard temperature difference Δ Te,
when delta Ti is less than or equal to delta Te, the central control module judges that the loss temperature difference does not exceed the standard temperature difference, and the central control module adjusts the moving speed of the movable hanging plate arm according to the real-time temperature Ts of the activator solution;
and when delta Ti is larger than delta Te, the central control module judges that the loss temperature difference exceeds the standard temperature difference, and the central control module adjusts the set control temperature Ti.
When heavy copper tank carries out temperature control to inside activator solution, because the operation of this part is gone on under normal operating environment, indoor temperature can influence the calorific loss of the inside activator solution of heavy copper tank, consequently sets up temperature-detecting device and detects the real-time temperature of activator solution in heavy copper tank, judges the control temperature who sets for through the real-time temperature of well accuse module according to activator solution, judges whether it is in standard temperature difference, has ensured heavy copper in-process temperature control's accuracy.
Specifically, when the central control module determines that the loss temperature difference Δ Ti exceeds the standard temperature difference Δ Te, the central control module adjusts the control temperature of the copper precipitation bath to Ti ', ti' = Ti + Ti [ (Ts-Ti)/Ts ], the temperature detection device detects the real-time temperature Ts 'of the activator solution in the copper precipitation bath again, and the central control unit repeats the determination of the standard temperature difference and the control temperature adjustment until the calculated loss temperature difference Δ Ti' reaches Δ Ti ≦ Δ Te, and the central control module stops the control temperature adjustment of the copper precipitation bath.
When the central control module judges that the loss temperature difference exceeds the standard temperature difference, the temperature of the activating agent solution in the copper precipitation tank is not the optimal temperature for copper precipitation, so that the control temperature of the copper precipitation tank is adjusted according to the real-time temperature of the activating agent solution to resist the temperature loss of the activating agent solution in the operation process, and the copper precipitation effect of the hole wall of the foundation plate is improved.
Specifically, the central control module is provided with an initial moving speed Vc of the movable hanger arm and a set temperature Tr corresponding to the initial moving speed, when the central control module determines that the loss temperature difference does not exceed the standard temperature difference, the central control module adjusts the initial moving speed of the movable hanger arm to Vc ', vc' = Vc × (Ts/Tr), and the copper deposition device performs copper deposition on the base plate.
The copper deposition operation is in a production line type, so that the residence time of the foundation plate in the activating agent solution is controlled by adjusting the moving speed of the movable hanging plate arm, when the real-time temperature of the activating agent solution is low, the moving speed of the movable hanging plate arm is reduced, the residence time of the foundation plate in the activating agent solution is increased, the copper deposition effect of the inner hole wall of the foundation plate is guaranteed, when the real-time temperature of the activating agent solution is high, the movable hanging plate arm adopts a fast moving speed, and the copper deposition efficiency of the foundation plate is improved.
Specifically, the central control module is provided with an upper limit moving speed Vf of the movable hanging plate arm, when the copper deposition device deposits copper on the foundation plate, the central control module compares the moving speed Vc' of the movable hanging plate arm with the upper limit moving speed Vf,
when Vc' is less than or equal to Vf, the central control module judges that the moving speed of the movable hanging plate arm does not exceed the upper limit moving speed, and the central control module does not adjust the copper deposition device;
and when Vc' is greater than Vf, the central control module judges that the moving speed of the movable hanging plate arm exceeds the upper limit moving speed, and the central control unit adjusts the control temperature of the copper precipitation tank according to the moving speed of the movable hanging plate arm.
Specifically, when the central control module determines that the moving speed of the movable hanger arm exceeds the upper limit moving speed, the central control module adjusts the moving speed of the movable hanger arm to the upper limit moving speed Vf, and the central control module sets the control temperature of the copper deposition bath to be Ti ', ti ' = Ti ' -Ti ' (Vc ' -Vf)/Vf.
The upper limit moving speed of the movable hanging plate arm is set in the central control module, the moving speed of the adjusted movable hanging plate arm is judged, the movable hanging plate arm is prevented from exceeding the moving speed, the residence time of the foundation plate in an activator solution is reduced due to the fact that the moving speed is too high, and the infiltration of copper ions in the activator solution is not facilitated, therefore, the upper limit moving speed of the movable hanging plate arm is set, the balance is carried out by controlling the control temperature of the copper precipitation groove when the upper limit moving speed exceeds the moving speed, the copper precipitation quality of the hole wall of the foundation plate is further guaranteed, and the conductivity between copper layer circuits on two sides of the control circuit board is improved.
The invention also discloses a motor drive control circuit board which is manufactured by the manufacturing process of any one of the motor drive control circuit boards, wherein copper layers with the thickness of 0.035 mm are arranged on two sides of the double-sided copper-clad plate, and the middle material is epoxy resin and glass fiber cloth.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention; various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. A manufacturing process of a motor drive control circuit board is characterized by comprising the following steps,
the method comprises the following steps that S1, the double-sided copper-clad plate is placed in a cutting machine to be cut to form a base plate, the edge of the base plate is polished, and a plurality of positioning nails are fixed on the polished base plate;
s2, placing the foundation plate with the positioning nails in an automatic drilling machine, wherein the automatic drilling machine identifies the positioning nails on the foundation plate, adjusts the placing angle and the placing position of the foundation plate according to an identification result, and drills the foundation plate by the automatic drilling machine according to a sampling scheme picture arranged inside the automatic drilling machine;
s3, placing the foundation plate after drilling in a copper deposition device for copper deposition, wherein the copper deposition device is provided with a copper deposition groove, an activator solution is arranged in the copper deposition groove, the copper deposition groove can control the temperature of the activator solution, the copper deposition device soaks the foundation plate after drilling in the activator solution, and the foundation plate is subjected to movable copper deposition through a movable hanger plate arm arranged in the copper deposition device, the copper deposition device is provided with a central control module, and the temperature of the activator solution in the copper deposition groove and the moving speed of the movable hanger plate arm are adjusted through the central control module according to the size and the number of holes in the foundation plate;
step S4, carrying out exposure film covering on the foundation plate subjected to copper deposition, carrying out circuit exposure on the foundation plate according to a circuit pattern of the proofing scheme diagram to form an exposure area corresponding to the circuit pattern, cleaning the exposure film in the exposure area to leak a copper layer on the surface of the foundation plate, carrying out electroplating on a tin layer on the copper layer on the surface of the foundation plate, cleaning the exposure film on the surface of the foundation plate subjected to tin layer electroplating to leak a copper layer on the surface of a non-circuit diagram, cleaning the copper layer on the surface of the non-circuit diagram, carrying out detinning cleaning on the tin layer of the foundation plate subjected to copper layer cleaning, and leaking a copper layer corresponding to the circuit pattern of the proofing scheme diagram;
s5, carrying out ultrasonic washing and drying on the base plate subjected to detinning and cleaning, carrying out power-on test and packaging, and finishing the manufacturing of the motor drive control circuit board;
the step S3 is provided with the copper deposition device, a central control module is arranged in the copper deposition device, the central control module can obtain the size diameters A1, A2 and A3 of the holes of the foundation plate, the size diameters A1 are A2 and A3 are 8230An, the size diameters A1 are more than A2 and less than A3 is 8230An, the minimum constant temperature hole diameter Ax is arranged in the central control module, the minimum constant temperature Tx is also arranged in the central control module, when the copper deposition device performs copper deposition on the foundation plate, the size diameter A1 is compared with the minimum constant temperature hole diameter Ax by the central control module,
when A1 is less than or equal to Ax, the central control module judges that the size diameter A1 does not exceed the minimum fixed-temperature hole diameter, the central control module sets the control temperature for controlling the copper precipitation tank as Tx, and the copper precipitation tank controls the temperature of the activator solution at the control temperature Tx;
when A1 is larger than Ax, the central control module judges that the size diameter A1 exceeds the minimum fixed temperature hole diameter, and the central control module judges the size diameter An so as to set the control temperature of the copper precipitation tank;
the central control module is internally provided with a maximum constant temperature hole diameter Ad and a maximum constant temperature Td, when the central control module judges that the size diameter A1 exceeds the minimum constant temperature hole diameter, the central control module compares the size diameter An with the maximum constant temperature hole diameter Ad,
when An is less than Ad, the central control module judges that the maximum size diameter An in the foundation plate is lower than the maximum constant-temperature hole diameter, the central control module judges that the size diameter of each hole of the foundation plate is within the range of the standard size diameter, and the central control module judges the number of the size diameters of each hole of the foundation plate so as to set the control temperature of the copper precipitation tank;
when An is larger than or equal to Ad, the central control module judges that the maximum size diameter An in the base plate reaches the maximum constant temperature hole diameter standard, the central control module sets the control temperature for controlling the copper precipitation tank as Td, and the copper precipitation tank controls the temperature of the activating agent solution at the control temperature of Td;
the method comprises the steps that a standard size diameter Ab and a standard temperature control temperature Tb are arranged in a central control module, the central control module can obtain the number HA1, HA2 and HA3 \8230ofholes corresponding to each size diameter, the central control module calculates the total size diameter Am and Am = (A1 xHA 1) + (A2 xHA 2) + (A3 xHA 3) \8230 + (An xHAN) of a base plate when the central control module judges that the maximum size diameter An in the base plate is lower than the maximum temperature-fixed hole diameter, the central control module calculates the total hole number HS of the base plate, HS = HA1+ HA2+ HA3 \8230, + HAN, the central control module calculates the average hole diameter Ap, ap = Am/HS according to the total size diameter Am and the total hole number HS of the base plate, the central control module calculates the average hole diameter Ap, ap = Am/HS, the central control module controls the temperature Tp = Tp and the temperature of a copper sink groove, and controls the temperature of a copper sink groove (Tp/Tp);
the copper precipitation tank is internally provided with a temperature detection device which can detect the real-time temperature Ts of the activating agent solution in the copper precipitation tank, the central control module is internally provided with a standard temperature difference Delta Te, when the central control module sets the control temperature of the copper precipitation tank as Ti, i = p, d and x, the central control module calculates the loss temperature difference Delta Ti according to the real-time temperature Ts and the set control temperature Ti, delta Ti = | Ti-Ts |, the central control module compares the loss temperature difference Delta Ti with the standard temperature difference Delta Te,
when delta Ti is less than or equal to delta Te, the central control module judges that the loss temperature difference does not exceed the standard temperature difference, and the central control module adjusts the moving speed of the movable hanging plate arm according to the real-time temperature Ts of the activator solution;
when delta Ti is larger than delta Te, the central control module judges that the loss temperature difference exceeds the standard temperature difference, and the central control module adjusts the set control temperature Ti;
when the central control module judges that the loss temperature difference delta Ti exceeds the standard temperature difference delta Te, the central control module adjusts the control temperature of the copper precipitation tank to Ti ', ti' = Ti + Ti [ (Ts-Ti)/Ts ], the temperature detection device detects the real-time temperature Ts 'of the activator solution in the copper precipitation tank again, and the central control unit repeats the judgment of the standard temperature difference and the operation of adjusting the control temperature until the calculated loss temperature difference delta Ti' reaches delta Ti to be less than or equal to delta Te, and stops adjusting the control temperature of the copper precipitation tank;
the central control module is internally provided with an initial moving speed Vc of the movable hanging plate arm and a set temperature Tr corresponding to the initial moving speed, when the central control module judges that the loss temperature difference does not exceed the standard temperature difference, the central control module adjusts the initial moving speed of the movable hanging plate arm to Vc ', vc' = Vc x (Ts/Tr), and the copper deposition device performs copper deposition on the foundation plate;
the central control module is provided with the upper limit moving speed Vf of the movable hanging plate arm, when the copper deposition device deposits copper on the foundation plate, the central control module compares the moving speed Vc' of the movable hanging plate arm with the upper limit moving speed Vf,
when Vc' is less than or equal to Vf, the central control module judges that the moving speed of the movable hanging plate arm does not exceed the upper limit moving speed, and the central control module does not adjust the copper deposition device;
when Vc' is larger than Vf, the central control module judges that the moving speed of the movable hanging plate arm exceeds the upper limit moving speed, and the central control unit adjusts the control temperature of the copper precipitation tank according to the moving speed of the movable hanging plate arm;
when the central control module judges that the moving speed of the movable hanging plate arm exceeds the upper limit moving speed, the central control module adjusts the moving speed of the movable hanging plate arm to be the upper limit moving speed Vf, and the central control module sets the control temperature of the copper deposition tank to be Ti ', ti ' = Ti ' -Ti ' (Vc ' -Vf)/Vf.
2. A motor drive control circuit board is manufactured by the manufacturing process of the motor drive control circuit board as claimed in claim 1, and is characterized in that copper layers with the thickness of 0.035 mm are arranged on two sides of the double-sided copper-clad plate, and epoxy resin and glass fiber cloth are arranged in the middle of the double-sided copper-clad plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210705138.6A CN115003032B (en) | 2022-06-21 | 2022-06-21 | Motor drive control circuit board and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210705138.6A CN115003032B (en) | 2022-06-21 | 2022-06-21 | Motor drive control circuit board and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115003032A CN115003032A (en) | 2022-09-02 |
| CN115003032B true CN115003032B (en) | 2023-03-07 |
Family
ID=83037505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210705138.6A Active CN115003032B (en) | 2022-06-21 | 2022-06-21 | Motor drive control circuit board and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115003032B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378924A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | PCB two-sided copper deposition system |
| CN104540327A (en) * | 2015-01-06 | 2015-04-22 | 江西科技学院 | Computer circuit board manufacturing method |
| CN104661448A (en) * | 2013-11-25 | 2015-05-27 | 深圳崇达多层线路板有限公司 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
| CN207109083U (en) * | 2017-08-22 | 2018-03-16 | 福建奇丰电子有限公司 | A kind of multilayer printed wiring board copper precipitation unit |
| CN207646287U (en) * | 2017-11-30 | 2018-07-24 | 莆田市涵江区华光电子有限公司 | A kind of printed wiring board copper precipitation unit |
| CN108633189A (en) * | 2018-05-22 | 2018-10-09 | 苏州福莱盈电子有限公司 | Shake motor line plate whole plate packaging technology |
| CN211047455U (en) * | 2020-01-12 | 2020-07-17 | 惠州市创盈电路板有限公司 | PCB copper deposition device |
| CN113710012A (en) * | 2021-08-30 | 2021-11-26 | 广东盈硕电子有限公司 | Processing method of Mini LED printed circuit board with high thickness-to-diameter ratio |
| CN114071890A (en) * | 2020-08-05 | 2022-02-18 | 深南电路股份有限公司 | Circuit board and copper deposition method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3594894B2 (en) * | 2000-02-01 | 2004-12-02 | 新光電気工業株式会社 | Via filling plating method |
| CN101951735B (en) * | 2010-09-17 | 2012-10-17 | 深圳市崇达电路技术股份有限公司 | Coppering and porefilling process for circuit board |
-
2022
- 2022-06-21 CN CN202210705138.6A patent/CN115003032B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378924A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | PCB two-sided copper deposition system |
| CN104661448A (en) * | 2013-11-25 | 2015-05-27 | 深圳崇达多层线路板有限公司 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
| CN104540327A (en) * | 2015-01-06 | 2015-04-22 | 江西科技学院 | Computer circuit board manufacturing method |
| CN207109083U (en) * | 2017-08-22 | 2018-03-16 | 福建奇丰电子有限公司 | A kind of multilayer printed wiring board copper precipitation unit |
| CN207646287U (en) * | 2017-11-30 | 2018-07-24 | 莆田市涵江区华光电子有限公司 | A kind of printed wiring board copper precipitation unit |
| CN108633189A (en) * | 2018-05-22 | 2018-10-09 | 苏州福莱盈电子有限公司 | Shake motor line plate whole plate packaging technology |
| CN211047455U (en) * | 2020-01-12 | 2020-07-17 | 惠州市创盈电路板有限公司 | PCB copper deposition device |
| CN114071890A (en) * | 2020-08-05 | 2022-02-18 | 深南电路股份有限公司 | Circuit board and copper deposition method thereof |
| CN113710012A (en) * | 2021-08-30 | 2021-11-26 | 广东盈硕电子有限公司 | Processing method of Mini LED printed circuit board with high thickness-to-diameter ratio |
Non-Patent Citations (2)
| Title |
|---|
| PTH化学沉铜的稳定性;翁毅志;《印制电路信息》;20030630;全文 * |
| 印制电路板化学镀铜中钯的催化机理与溶液管控;陈金文;《印制电路信息》;20200910(第09期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115003032A (en) | 2022-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101185194B1 (en) | Improved plating method | |
| CA2549314C (en) | Method of manufacturing a circuit carrier and the use of the method | |
| US6875950B2 (en) | Automated laser trimming of resistors | |
| CN108521726A (en) | A kind of production method of super-thick copper PCB multilayer board | |
| CN115003032B (en) | Motor drive control circuit board and manufacturing process thereof | |
| CN111741617B (en) | Production process of multi-layer stepped blind slot high-frequency microwave antenna board | |
| CN113473716A (en) | Printed circuit board manufacturing method and printed circuit board | |
| CN109413858B (en) | Preparation method of microwave ceramic substrate | |
| CN111836468A (en) | Manufacturing process flow of rigid bent plate | |
| CN110839320A (en) | Processing method of countersunk PCB | |
| CN117198891A (en) | Manufacturing method of multi-layer HDI packaging substrate | |
| CN104219898A (en) | Multilayer rigid-flex board plated filled through-hole manufacturing process | |
| KR102045821B1 (en) | Current control method of electric planting line | |
| CN100444709C (en) | Multilayer printed-wiring board mfg. method and multilayer printed-wiring board | |
| CN109413857B (en) | Manufacturing process of high-frequency high-speed plate | |
| CN113709985A (en) | Method for manufacturing circuit board by selectively plating via and pad, laser-made resist pattern, and chemically etching conductive pattern | |
| CN114615833A (en) | Outer layer circuit board and preparation method thereof | |
| JPH10242621A (en) | Smoothed printed wiring board and its manufacture | |
| CN112911835A (en) | Production method of multilayer mixed-pressing stepped back-pressing metal-based high-frequency circuit board | |
| CN113518505A (en) | Circuit board drilling processing method | |
| CN108055769A (en) | The processing technology and wiring board in non-metallic hole | |
| CN113271727B (en) | PCB manufacturing method for improving through hole rate and preventing copper-free hole | |
| CN115915646A (en) | Processing method for thickening conducting hole of circuit board | |
| KR100619325B1 (en) | Apparatus and method for manufacturing metal clad laminate | |
| Angstenberger | Desmear—The Key Processes for Reliable Through‐plating of Printed Circuitry |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |